CN106077966A - 激光加工装置 - Google Patents

激光加工装置 Download PDF

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CN106077966A
CN106077966A CN201610265485.6A CN201610265485A CN106077966A CN 106077966 A CN106077966 A CN 106077966A CN 201610265485 A CN201610265485 A CN 201610265485A CN 106077966 A CN106077966 A CN 106077966A
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laser light
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reflecting mirror
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CN106077966B (zh
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名雪正寿
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Disco Corp
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Abstract

提供激光加工装置，能够重复地照射激光光线且能够高效地实施烧蚀加工。激光加工装置的激光光线照射机构具有：脉冲激光振荡器，其振荡出脉冲激光光线；聚光器，其对从脉冲激光振荡器振荡出的激光光线进行会聚而对保持在卡盘工作台上的被加工物进行照射；多面镜，其配设在脉冲激光振荡器与聚光器之间，呈同心状地配设有多个反射镜，该多个反射镜使从该脉冲激光振荡器振荡出的脉冲激光光线分散；以及引导构件，其配设在脉冲激光振荡器与多面镜之间，对脉冲激光光线进行引导以便脉冲激光光线不会照射到相邻的反射镜的角部。

Description

激光加工装置
技术领域
本发明涉及激光加工装置，其对保持在卡盘工作台上的半导体晶片等被加工物施加激光加工。
背景技术
在半导体器件制造工艺中，在作为大致圆板形状的半导体晶片的正面上通过排列成格子状的分割预定线划分出多个区域，在该划分出的区域中形成IC、LSI等器件。并且，通过沿着分割预定线切断半导体晶片而对形成有器件的区域进行分割从而制造出各个半导体器件。
近年来，为了提高IC、LSI等半导体芯片的处理能力而将以如下的形式形成的半导体晶片实用化：在硅等基板的正面上层叠有由SiOF、BSG(SiOB)等无机物类的膜或聚酰亚胺类、聚对二甲苯类等作为聚合物膜的有机物类的膜构成的低介电常数绝缘体被膜(Low-k膜)的功能层而形成的半导体器件。
对这样的半导体晶片的沿着分割预定线的分割通常由被称为划片带的切削装置进行。该切削装置具有：卡盘工作台，其对作为被加工物的半导体晶片进行保持；切削构件，其用于对保持在该卡盘工作台上的半导体晶片进行切削；以及移动构件，其使卡盘工作台与切削构件相对地移动。切削构件包含高速旋转的旋转主轴和装配于该主轴的切削刀具。切削刀具由圆盘状的基台和装配于该基台的侧面外周部的环状的切削刃构成，切削刃例如通过电铸固定粒径3μm左右的金刚石磨粒而形成。
但是，上述的Low-k膜很难通过切削刀具来切削。即，由于Low-k膜像云母那样非常脆，因此如果通过切削刀具沿着分割预定线进行切削，则存在如下的问题：Low-k膜会剥离，该剥离到达电路而给器件带来致命的损伤。
为了解决上述问题而在下述专利文献1中公开了如下的晶片的分割方法：在形成于半导体晶片的分割预定线的宽度方向的两侧沿着分割预定线照射激光光线，沿着分割预定线形成2条激光加工槽而将由Low-k膜构成的层叠体隔断，在该2条激光加工槽的外侧之间定位切削刀具而使切削刀具与半导体晶片相对移动，由此沿着分割预定线将半导体晶片切断。
专利文献1：日本特开2005-64231号公报
但是，如果沿着分割预定线照射激光光线进行烧蚀加工而去除由Low-k膜构成的层叠体从而形成激光加工槽，则存在如下的问题：层叠体的发生了飞散的熔融物会重新填充激光加工槽，要想形成足够宽度的激光加工槽必须沿着分割预定线多次照射激光光线，生产性变差。
并且，在沿着分割预定线照射对于晶片具有吸收性的波长的激光光线而进行烧蚀加工从而形成分割槽而将晶片分割成各个器件的技术中，同样也存在熔融物重新填充分割槽，要想形成分割所需要的分割槽必须沿着分割预定线多次照射激光光线而生产性变差的问题。
发明内容
本发明是鉴于上述情况而完成的，其主要的技术课题在于，提供激光加工装置，能够重复地照射激光光线且高效地实施烧蚀加工。
为了解决上述主要的技术课题，根据本发明，提供一种激光加工装置，其具有：对被加工物进行保持的卡盘工作台；以及对保持在该卡盘工作台上的被加工物进行激光加工的激光光线照射机构，该激光加工装置的特征在于，该激光光线照射机构具有：脉冲激光振荡器，其振荡出脉冲激光光线；聚光器，其对从该脉冲激光振荡器振荡出的激光光线进行会聚而对保持在该卡盘工作台上的被加工物进行照射；多面镜，其配设在该脉冲激光振荡器与该聚光器之间，相对于旋转轴呈同心状地配设有多个反射镜，该多个反射镜使从该脉冲激光振荡器振荡出的脉冲激光光线分散；以及引导构件，其配设在该脉冲激光振荡器与该多面镜之间，对脉冲激光光线进行引导以便脉冲激光光线不会照射到相邻的反射镜的角部。
上述引导构件包含：光学性开关元件，其将从该脉冲激光振荡器振荡出的脉冲激光光线选择性地引导到第1路径和第2路径；偏光分束器，其将引导到该第1路径和该第2路径的脉冲激光光线引导到配设有该多面镜的第3路径；旋转位置检测构件，其对该多面镜的旋转位置进行检测；以及控制构件，其根据来自该旋转位置检测构件的检测信号而对该光学性开关元件进行控制以便脉冲激光光线不会照射到该多面镜的相邻的反射镜与反射镜的角部，对第1路径和第2路径进行定位以便该偏光分束器对引导到第1路径的脉冲激光光线和引导到该第2路径的脉冲激光光线以具有规定的间隔的方式进行分支。
根据本发明的激光加工装置，由于脉冲激光光线不会照到旋转的多面镜的反射镜与反射镜的角部，因此防止因脉冲激光光线与多面镜的反射镜和反射镜的角部接触而产生的脉冲激光光线的散乱。因此，能够消除因脉冲激光光线与多面镜的反射镜和反射镜的角部接触而散乱从而无法照射到规定的加工区域、产生加工损失，并且因脉冲激光光线的散乱而使被加工物的品质降低这样的问题。
并且，在本发明的激光加工装置的激光光线照射机构中，由于脉冲激光光线的多个脉冲重复地照射到保持在卡盘工作台上的被加工物上，因此重复地进行烧蚀加工，因此能够防止熔融物的重新填充，通过对卡盘工作台进行加工进给而能够在作为被加工物的Low-k膜或基板等上高效地形成期望的宽度的激光加工槽。
附图说明
图1是根据本发明而构成的激光加工装置的立体图。
图2是装载于图1所示的激光加工装置的激光光线照射机构的模块结构图。
图3是示出从图2所示的激光光线照射机构的脉冲激光振荡器振荡出的脉冲激光光线照射到被加工物的脉冲的状态的说明图。
标号说明
2：静止基台；3：卡盘工作台机构；36：卡盘工作台；37：X轴方向移动构件；38：Y轴方向移动构件；4：激光光线照射单元；5：激光光线照射机构；51：脉冲激光振荡器；52：输出调整构件；53：聚光器；54：多面镜；55：引导构件；552：光学性开关元件；553：偏光分束器；558：旋转位置检测构件；6：拍摄构件；7：控制构件。
具体实施方式
以下，关于根据本发明构成的激光加工装置的优选的实施方式，参照附图而详细地进行说明。
图1中示出了本发明实施方式的激光加工装置1的立体图。图1所示的激光加工装置1具有：静止基台2；卡盘工作台机构3，其以能够在箭头X所示的加工进给方向(X轴方向)上移动的方式配设于该静止基台2并保持被加工物；以及作为激光光线照射构件的激光光线照射单元4，其配设在静止基台2上。
上述卡盘工作台机构3具有：一对导轨31、31，其沿着X轴方向平行地配设在静止基台2上；第1滑动块32，其以能够在X轴方向上移动的方式配设在该导轨31、31上；第2滑动块33，其以能够在与X轴方向垂直的箭头Y所示的Y轴方向上移动的方式配设在该第1滑动块32上；盖工作台35，其通过圆筒部件34支承在该第2滑动块33上；以及作为卡盘工作台的卡盘工作台36。该卡盘工作台36具有由多孔性材料形成的吸附卡盘361，通过未图示的吸引构件将作为被加工物的例如圆形状的半导体晶片保持在吸附卡盘361的作为上表面的保持面上。通过配设在圆筒部件34内的未图示的脉冲电动机使这样构成的卡盘工作台36旋转。另外，在卡盘工作台36中配设有夹具362，该夹具362用于对隔着保护带支承半导体晶片等被加工物的环状的框架进行固定。
上述第1滑动块32在其下表面设置有与上述一对导轨31、31嵌合的一对被导槽321、321，并且在其上表面设置有沿着Y轴方向平行形成的一对导轨322、322。这样构成的第1滑动块32构成为因被导槽321、321与一对导轨31、31嵌合而能够沿着一对导轨31、31在X轴方向上移动。本实施方式的卡盘工作台机构3具有用于使第1滑动块32沿着一对导轨31、31在X轴方向上移动的X轴方向移动构件37。X轴方向移动构件37包含在上述一对导轨31与31之间平行配设的外螺杆371、以及用于旋转驱动该外螺杆371的脉冲电动机372等驱动源。外螺杆371的一端旋转自如地支承于固定在上述静止基台2上的轴承块373，其另一端与上述脉冲电动机372的输出轴传动连结。另外，外螺杆371与形成在突出设置于第1滑动块32的中央部下表面的未图示的内螺纹块中的贯通内螺纹孔螺合。因此，通过脉冲电动机372对外螺杆371进行正转和反转驱动而使第1滑动块32沿着导轨31、31在X轴方向上移动。
上述第2滑动块33构成为在其下表面设置有与设置在上述第1滑动块32的上表面上的一对导轨322、322嵌合的一对被导槽331、331，通过使该被导槽331、331与一对导轨322、322嵌合而能够在Y轴方向上移动。本实施方式的卡盘工作台机构3具有用于使第2滑动块33沿着设置于第1滑动块32的一对导轨322、322在Y轴方向上移动的Y轴方向移动构件38。Y轴方向移动构件38包含在上述一对导轨322与322之间平行配设的外螺杆381以及用于旋转驱动该外螺杆381的脉冲电动机382等驱动源。外螺杆381的一端旋转自如地支承于固定在上述第1滑动块32的上表面上的轴承块383，其另一端与上述脉冲电动机382的输出轴传动连结。另外，外螺杆381与形成于突出设置在第2滑动块33的中央部下表面上的未图示的内螺纹块中的贯通内螺纹孔螺合。因此，通过脉冲电动机382对外螺杆381进行正转和反转驱动而使第2滑动块33沿着导轨322、322在Y轴方向上移动。
上述激光光线照射单元4具有：配设在上述静止基台2上的支承部件41；由该支承部件41支承且实质上水平延伸的外壳42；配设于该外壳42的激光光线照射机构5；以及配设于外壳42的前端部且对要进行激光加工的加工区域进行检测的拍摄构件6。另外，拍摄构件6具有：对被加工物进行照明的照明构件；捕捉由该照明构件照明的区域的光学***；以及对由该光学***捕捉到的像进行拍摄的拍摄元件(CCD)等。
参照图2和图3对上述激光光线照射机构5进行说明。
激光光线照射机构5具有：脉冲激光振荡器51；输出调整构件52，其对从该脉冲激光振荡器51振荡出的脉冲激光光线的输出进行调整；聚光器53，其对由该输出调整构件52调整了输出的脉冲激光光线进行会聚而对保持在卡盘工作台36上的被加工物进行照射；多面镜(porigon mirror)54，其配设在输出调整构件52与聚光器53之间，相对于旋转轴呈同心状地配设有多个使从脉冲激光振荡器51振荡出且由输出调整构件52调整了输出的脉冲激光光线分散的反射镜；以及引导构件55，其配设在脉冲激光振荡器51与多面镜54之间，对脉冲激光光线进行引导以便脉冲激光光线不会照射到相邻的反射镜的角部。
脉冲激光振荡器51在本实施方式中振荡出波长为355nm的脉冲激光光线LB。上述聚光器53具有fθ透镜531，该fθ透镜531对从上述脉冲激光振荡器51振荡出且由输出调整构件52调整了输出的脉冲激光光线进行会聚。另外，上述脉冲激光振荡器51和输出调整构件52由控制构件7控制。
上述多面镜54中，多个反射镜541被配设为相对于旋转轴542呈同心状，并借助扫描电动机543在图2中箭头A所示的方向上旋转。另外，在本实施方式中，多面镜54的反射镜541装配于正8边形外周面。这样构成的多面镜54的扫描电动机543由控制构件7控制。
上述引导构件55具有：光学性开关元件552，其将从脉冲激光振荡器51振荡出的脉冲激光光线LB选择性地引导到第1路径551a和第2路径551b；以及偏光分束器553，其将被引导到第1路径551a和第2路径551b的脉冲激光光线引导到配设有多面镜54的第3路径551c。光学性开关元件552由声光元件(AOD)或EOD等构成，在未施加电压信号的状态下将从脉冲激光振荡器51振荡出的脉冲激光光线LB引导到第1路径551a，如果施加规定的电压信号则将从脉冲激光振荡器51振荡出的脉冲激光光线LB引导到第2路径551b，并由控制构件7控制。
在上述第1路径551a中配设有：方向转换镜554a，其将由光学性开关元件552引导到第1路径551a的第1脉冲激光光线LB1朝向偏光分束器553进行方向转换；以及1/2波长板555a，其使由该方向转换镜554a进行了方向转换的第1脉冲激光光线LB1相对于偏光分束器553将偏光面旋转到P偏光。并且，在第2路径551b中配设有：方向转换镜554b，其对由光学性开关元件552引导到第2路径551b的第2脉冲激光光线LB2进行方向转换；1/2波长板555b，其使由该方向转换镜554b进行了方向转换的第2脉冲激光光线LB2相对于偏光分束器553将偏光面旋转到S偏光；以及引导方向转换镜556b，其将借助该1/2波长板555b而偏光为S偏光的第2脉冲激光光线LB2引导到偏光分束器553。
上述偏光分束器553使偏光为P偏光的第1脉冲激光光线LB1通过而引导到第3路径551c，使偏光为S偏光的第2脉冲激光光线LB2反射而引导到第3路径551c。另外，在本实施方式中，构成为偏光为S偏光的第2脉冲激光光线LB2与偏光为P偏光的第1脉冲激光光线LB1的光路以具有规定的间隔(L)的方式入射到偏光分束器553。因此，第1脉冲激光光线LB1与第2脉冲激光光线LB2被偏光分束器553以具有规定的间隔(L)的方式在第3路径551c中分支。在第3路径551c中分支的第1脉冲激光光线LB1与第2脉冲激光光线LB2经由方向转换镜557分别引导到上述多面镜54的第1位置54a和第2位置54b。
如果参照图2继续进行说明，则引导构件55具有对多面镜54的旋转位置进行检测的旋转位置检测构件558。本实施方式的旋转位置检测构件558由发光元件558a和接受由该发光元件558a发出且由多面镜54的反射镜(反射面)541反射的光的受光元件558b构成。另外，受光元件558b被定位为接受在比多面镜54的反射镜541与反射镜541的角部541a稍微位于箭头A所示的旋转方向前侧的位置(B)发生了反射的光，并将受光信号发送给控制构件7。
本实施方式的激光加工装置以如上的方式构成，以下对上述激光光线照射机构5所进行的脉冲激光光线的照射方式进行说明。例如，当令多面镜54的旋转速度为500转/秒时，则由于多面镜54具有8面的反射镜541，因此每1个反射镜541的移动时间为1/4000秒。另一方面，当令从脉冲激光振荡器51振荡出的脉冲激光光线LB的重复频率为40kHz时，则照射到多面镜54的每1个反射镜541的脉冲激光光线为10个脉冲。
如图2所示，从脉冲激光振荡器51振荡且由输出调整构件52调整了输出的脉冲激光光线LB被引导到构成引导构件55的光学性开关元件552。当不对光学性开关元件552施加电压信号时，从脉冲激光振荡器51振荡出的脉冲激光光线LB被引导到第1路径551a。引导到第1路径551a的第1脉冲激光光线LB1经由方向转换镜554a而通过1/2波长板555a，由此相对于偏光分束器553偏光为P偏光。因此，偏光为P偏光的第1脉冲激光光线LB1通过偏光分束器553而引导到第3路径551c。引导到第3路径551c的第1脉冲激光光线LB1经由方向转换镜557而引导到上述多面镜54的第1位置54a。由于多面镜54在箭头A所示的方向上以规定的旋转速度(在本实施方式中为500转/秒)旋转，因此将脉冲激光光线的10个脉冲(LB-1～LB-10)沿着Y轴方向引导到fθ透镜531。这样引导到fθ透镜531的脉冲激光光线的10个脉冲(LB-1～LB-10)分别由fθ透镜531会聚，而像图3所示那样沿着Y轴方向照射到保持在卡盘工作台36上的被加工物W上。因此，通过在Y轴方向上在例如50μm的范围照射10个脉冲(LB-1～LB-10)，而能够实施宽度为50μm的激光加工。
像上述那样，在利用借助光学性开关元件552而被引导到第1路径551a的第1脉冲激光光线LB1实施激光加工时，存在脉冲激光光线照到多面镜54的反射镜541与反射镜541的角部541a的情况，在该情况下，存在如下的问题：脉冲激光光线散乱而无法照射到规定的加工区域，从而产生加工损耗，并且因脉冲激光光线的散乱而使被加工物的品质降低。
在本实施方式中，具有对多面镜54的比反射镜541与反射镜541的角部541a稍微位于箭头A所示的旋转方向前侧的位置进行检测的旋转位置检测构件558，当比反射镜541与反射镜541的角部541a稍微位于旋转方向前侧的位置(B)到达作为第1脉冲激光光线LB1的入射位置的多面镜54的第1位置54a，受光元件558b接受由发光元件558a发光且由反射镜541反射的光而将受光信号发送给控制构件7。从受光元件558b输入了受光信号的控制构件7对光学性开关元件552施加电压信号。其结果为，将从脉冲激光振荡器51振荡出的脉冲激光光线LB引导到第2路径551b。被引导到第2路径551b的第2脉冲激光光线LB2经由方向转换镜554b而通过1/2波长板555b，由此相对于偏光分束器553偏光为S偏光。因此，偏光为S偏光的第2脉冲激光光线LB2经由方向转换镜556b像上述那样由偏光分束器553分支而引导到第3路径551c。被引导到第3路径551c的第2脉冲激光光线LB2经由方向转换镜557引导到上述多面镜54的第2位置54b。这样引导到多面镜54的第2位置54b的第2脉冲激光光线LB2越过旋转的多面镜54的反射镜541与反射镜541的角部541a而被引导到下一反射镜541。因此，脉冲激光光线不会接触到多面镜54的反射镜541与反射镜541的角部541a。
在像上述那样将1个脉冲的第2脉冲激光光线LB2引导到多面镜54的第2位置54b之后，控制构件7停止对光学性开关元件552施加电压信号。其结果为，像上述那样从脉冲激光振荡器51振荡出的脉冲激光光线LB被引导到第1路径551a，引导到第1路径551a的第1脉冲激光光线LB1被引导到上述多面镜54的第1位置54a。此时，由于多面镜54在箭头(A)所示的方向上例如以500转/秒的旋转速度旋转，因此第1脉冲激光光线LB1被引导到与上述1个脉冲的第2脉冲激光光线LB2被引导的反射镜541相同的反射镜。这样，控制构件7根据来自旋转位置检测构件558的受光元件558b的受光信号而交互地实施对光学性开关元件552的电压信号的施加停止和施加，由此能够在脉冲激光光线不会接触到多面镜54相邻的反射镜541与反射镜541的角部541a的情况下分别对各反射镜541引导10个脉冲(LB-1～LB-10)。
像上述那样在本实施方式的激光光线照射机构5中，由于脉冲激光光线不会接触到旋转的多面镜54的相邻的反射镜541与反射镜541的角部541a，因此防止因脉冲激光光线与多面镜54的反射镜541与反射镜541的角部541a接触而产生的脉冲激光光线的散乱。因此，能够消除如下的问题：因脉冲激光光线与多面镜54的反射镜541与反射镜541的角部541a接触而散乱从而无法照射到规定的加工区域、产生加工损失并且因脉冲激光光线的散乱而使被加工物的品质降低。
并且，在本实施方式的激光光线照射机构5中，由于脉冲激光光线的10个脉冲(LB-1～LB-10)重复照射到保持在卡盘工作台36上的被加工物W，因此通过在X轴方向上对卡盘工作台36进行加工进给而能够在Y轴方向上重复地进行烧蚀加工，因此能够防止熔融物的重新填充而在作为被加工物的Low-k膜或基板等上高效地形成期望的宽度的激光加工槽。

Claims (2)

1.一种激光加工装置，其具有：对被加工物进行保持的卡盘工作台；以及对保持在该卡盘工作台上的被加工物进行激光加工的激光光线照射机构，该激光加工装置的特征在于，该激光光线照射机构具有：
脉冲激光振荡器，其振荡出脉冲激光光线；
聚光器，其对从该脉冲激光振荡器振荡出的激光光线进行会聚而对保持在该卡盘工作台上的被加工物进行照射；
多面镜，其配设在该脉冲激光振荡器与该聚光器之间，相对于旋转轴呈同心状地配设有多个反射镜，该多个反射镜使从该脉冲激光振荡器振荡出的脉冲激光光线分散；以及
引导构件，其配设在该脉冲激光振荡器与该多面镜之间，对脉冲激光光线进行引导以便脉冲激光光线不会照射到相邻的反射镜的角部。
2.根据权利要求1所述的激光加工装置，其中，
该引导构件包含：
光学性开关元件，其将从该脉冲激光振荡器振荡出的脉冲激光光线选择性地引导到第1路径和第2路径；
偏光分束器，其将引导到该第1路径和该第2路径的脉冲激光光线引导到配设有该多面镜的第3路径；
旋转位置检测构件，其对该多面镜的旋转位置进行检测；以及
控制构件，其根据来自该旋转位置检测构件的检测信号而对该光学性开关元件进行控制以便脉冲激光光线不会照射到该多面镜的相邻的反射镜与反射镜的角部，
对第1路径和第2路径进行定位以便该偏光分束器对引导到第1路径的脉冲激光光线和引导到该第2路径的脉冲激光光线以具有规定的间隔的方式进行分支。
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