CN105810439A - Matrix arrangement type stack solid electrolytic capacitor packaging structure and manufacturing method thereof - Google Patents
Matrix arrangement type stack solid electrolytic capacitor packaging structure and manufacturing method thereof Download PDFInfo
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Abstract
The invention discloses a matrix arrangement type stack solid electrolytic capacitor packaging structure. The structure comprises a lead configuration member, multiple capacitive units and one packaging unit. The lead configuration member comprises multiple conductive supports arranged in a matrix mode and one connection frame body connected with the conductive supports. Each conductive support comprises a first conductive terminal and a second conductive terminal. The multiple capacitive units are respectively arranged on the multiple conductive supports. Each capacitive unit comprises multiple first stack type capacitors sequentially stacked together. Each first stack type capacitor is provided with a first anode portion in electrical connection with the first conductive terminal of a corresponding conductive support and a first cathode portion in electrical connection with the second conductive terminal of the corresponding conductive support. The packaging unit comprises multiple packaging colloids respectively completely wrapping the multiple capacitive units. The invention also provides a manufacturing method of a matrix arrangement type stack solid electrolytic capacitor packaging structure.
Description
Technical field
Present invention is directed to a kind of capacitor packaging structure and preparation method thereof, espespecially a kind of matrix array type stacked-type solid electrolytic capacitor encapsulating structure and preparation method thereof.
Background technology
Capacitor has been widely used for the basic module of consumer electrical home appliances, computer motherboard and periphery, power supply unit, communication product and automobile etc., and its main effect includes: filtering, bypass, rectification, coupling, decoupling, phase inversion etc..It it is one of indispensable assembly in electronic product.Capacitor, according to different materials and purposes, has different kenels.Including aluminum matter electrochemical capacitor, tantalum matter electrochemical capacitor, laminated ceramic electric capacity, thin-film capacitor etc..In look-ahead technique, solid electrolytic capacitor has the advantages such as small size, high capacitance, frequency characteristic be superior, and the decoupling of power circuit that can be used in central processing unit is used.Generally speaking, the storehouse of available multiple capacitor cells, and form the solid electrolytic capacitor of high-capacitance, known stack-type solid electrolytic capacitor includes multiple capacitor cell and lead frame, each of which capacitor cell includes anode portion, negative pole part and insulation division, and this insulation division makes anode portion and negative pole part be electrically insulated from.Particularly, the negative pole part of capacitor cell storehouse each other, and conductor layer is set by between adjacent capacitor cell, so that being electrically connected to each other between multiple capacitor cell.
But, known solid electrolytic capacitor nevertheless suffers from many restrictions in mass-produced design.Therefore, how by the improvement of structural design, overcome above-mentioned disappearance, it has also become this cause is intended to one of important topic of solution.
Summary of the invention
The technical problem to be solved is in that, a kind of matrix array type stacked-type solid electrolytic capacitor encapsulating structure and preparation method thereof is provided for the deficiencies in the prior art, it can the utilization rate of effective lifting lead wire frame member, and reduce encapsulation consumptive material (saving the packaging adhesive material in runner), be conducive to a large amount of production.
A kind of matrix array type stacked-type solid electrolytic capacitor encapsulating structure that a present invention wherein embodiment provides, comprising: a lead frame component, multiple capacitor cell and an encapsulation unit.Described lead frame component includes multiple conducting bracket arranged in a matrix fashion and and is connected to the connection framework of multiple described conducting bracket, and conducting bracket described in each of which includes first conducting terminal and being connected to described connection framework and is connected to described connection framework and the second conducting terminal with a described first conducting terminal preset distance separated from one another；Multiple described capacitor cells are separately positioned on multiple described conducting bracket, capacitor cell described in each of which includes multiple the first stacked-type capacitor being sequentially stacked together and being electrically connected to each other, and each described first stacked-type capacitor has the first negative pole portion that the first positive pole portion and of described first conducting terminal being electrically connected at corresponding described conducting bracket is electrically connected at described second conducting terminal of corresponding described conducting bracket；Described encapsulation unit includes multiple difference and is coated with the packing colloid of multiple described capacitor cell completely；Wherein, described first conducting terminal of each described conducting bracket has the described first positive pole portion of a described first stacked-type capacitor being electrically connected at corresponding described capacitor cell and is covered by first in corresponding described packing colloid and buries portion and is connected in described first and buries portion and the first exposed portion being exposed to outside corresponding described packing colloid；Wherein, described second conducting terminal of each described conducting bracket has the described first negative pole portion of a described first stacked-type capacitor being electrically connected at corresponding described capacitor cell and is covered by second in corresponding described packing colloid and buries portion and is connected in described second and buries portion and the second exposed portion being exposed to outside corresponding described packing colloid.
A kind of matrix array type stacked-type solid electrolytic capacitor encapsulating structure that the other embodiment of the present invention provides, comprising: a lead frame component, multiple capacitor cell and an encapsulation unit.Described lead frame component includes multiple conducting bracket arranged in a matrix fashion and and is connected to the connection framework of multiple described conducting bracket, and conducting bracket described in each of which includes first conducting terminal and being connected to described connection framework and is connected to described connection framework and the second conducting terminal with a described first conducting terminal preset distance separated from one another；Multiple described capacitor cells are separately positioned on multiple described conducting bracket, capacitor cell described in each of which includes multiple the first stacked-type capacitor being sequentially stacked together, and each described first stacked-type capacitor has the first negative pole portion that the first positive pole portion and of described first conducting terminal being electrically connected at corresponding described conducting bracket is electrically connected at described second conducting terminal of corresponding described conducting bracket；Described encapsulation unit includes multiple difference and is coated with the packing colloid of multiple described capacitor cell completely；Wherein, described first conducting terminal of each described conducting bracket have one be covered by corresponding described packing colloid first in bury the first exposed portion that portion and is exposed to outside corresponding described packing colloid；Wherein, described second conducting terminal of each described conducting bracket have one be covered by corresponding described packing colloid second in bury the second exposed portion that portion and is exposed to outside corresponding described packing colloid.
The manufacture method of a kind of matrix array type stacked-type solid electrolytic capacitor encapsulating structure that the other another embodiment of the present invention provides, comprising: provide a lead frame component, described lead frame component includes multiple conducting bracket arranged in a matrix fashion and and is connected to the connection framework of multiple described conducting bracket, and conducting bracket described in each of which includes first conducting terminal and being connected to described connection framework and is connected to described connection framework and the second conducting terminal with a described first conducting terminal preset distance separated from one another；Multiple capacitor cells are separately positioned on multiple described conducting bracket, capacitor cell described in each of which includes multiple the first stacked-type capacitor being sequentially stacked together and being electrically connected to each other, and each described first stacked-type capacitor has the first negative pole portion that the first positive pole portion and of described first conducting terminal being electrically connected at corresponding described conducting bracket is electrically connected at described second conducting terminal of corresponding described conducting bracket；And, by a mould structure, multiple packing colloids to be coated with respectively completely multiple described capacitor cell；Wherein, described first conducting terminal of each described conducting bracket has the described first positive pole portion of a described first stacked-type capacitor being electrically connected at corresponding described capacitor cell and is covered by first in corresponding described packing colloid and buries portion and is connected in described first and buries portion and the first exposed portion being exposed to outside corresponding described packing colloid；Wherein, described second conducting terminal of each described conducting bracket has the described first negative pole portion of a described first stacked-type capacitor being electrically connected at corresponding described capacitor cell and is covered by second in corresponding described packing colloid and buries portion and is connected in described second and buries portion and the second exposed portion being exposed to outside corresponding described packing colloid.
Beneficial effects of the present invention can be in that, matrix array type stacked-type solid electrolytic capacitor encapsulating structure that the embodiment of the present invention provides and preparation method thereof, it can by " described lead frame component includes multiple conducting bracket arranged in a matrix fashion and and is connected to the connection framework of multiple described conducting bracket, conducting bracket described in each of which includes first conducting terminal and being connected to described connection framework and is connected to described connection framework and the second conducting terminal with a described first conducting terminal preset distance separated from one another " and " by a mould structure, multiple packing colloids to be coated with respectively completely multiple described capacitor cell " design, utilization rate with effective lifting lead wire frame member, and reduce encapsulation consumptive material (saving the packaging adhesive material in each runner), be conducive to a large amount of production.
It is further understood that inventive feature and technology contents for enabling, refers to the detailed description below in connection with the present invention and accompanying drawing, but institute's accompanying drawings only provides reference and use is described, is not used for the present invention person of being any limitation as.
Accompanying drawing explanation
Below by drawings and Examples, technical scheme is described in further detail.
Fig. 1 is the flow chart of the manufacture method of matrix array type stacked-type solid electrolytic capacitor encapsulating structure of the present invention.
Fig. 2 is the schematic diagram of the lead frame component of matrix array type stacked-type solid electrolytic capacitor encapsulating structure of the present invention.
Fig. 3 is the enlarged diagram of the part A of Fig. 2.
Schematic diagram is looked in the amplification that Fig. 4 is the step S102 of the manufacture method of matrix array type stacked-type solid electrolytic capacitor encapsulating structure of the present invention.
Schematic diagram is looked in the amplification that Fig. 5 is the step S104 of the manufacture method of matrix array type stacked-type solid electrolytic capacitor encapsulating structure of the present invention.
Fig. 6 is the schematic diagram of the mould structure of matrix array type stacked-type solid electrolytic capacitor encapsulating structure of the present invention.
Fig. 7 is the side elevational cross-section schematic diagram of the single first stacked-type capacitor of matrix array type stacked-type solid electrolytic capacitor encapsulating structure of the present invention or the second stacked-type capacitor.
Fig. 8 is the side elevational cross-section schematic diagram that matrix array type stacked-type solid electrolytic capacitor encapsulating structure of the present invention uses the first stacked-type capacitor of multiple sequentially storehouses.
Fig. 9 is that matrix array type stacked-type solid electrolytic capacitor encapsulating structure of the present invention uses the first stacked-type capacitor of multiple sequentially storehouses and the side elevational cross-section schematic diagram of the second stacked-type capacitor of multiple sequentially storehouse.
Detailed description of the invention
The following is and illustrate to disclosed herein the embodiment about " matrix array type stacked-type solid electrolytic capacitor encapsulating structure and preparation method thereof " by specific instantiation, those skilled in the art can be understood advantages of the present invention and effect by content disclosed in the present specification.The present invention can pass through other different specific embodiments and be implemented or apply, and the every details in this specification also based on different viewpoints and application, can carry out various modification and change under without departing from the spirit.It addition, the graphic of the present invention is only simply schematically illustrate, not according to the description of actual size, first give chat bright.Following embodiment will be explained in further detail the correlation technique content of the present invention, but disclosed content be not used to the technology category of the restriction present invention.
Referring to shown in Fig. 1 to Fig. 8, the present invention provides the manufacture method of a kind of matrix array type stacked-type (or chip-shaped) solid electrolytic capacitor encapsulating structure, and it comprises the following steps:
First, coordinate shown in Fig. 1, Fig. 2 and Fig. 3, one lead frame component 1 (that is lead frame leadframe) is provided, lead frame component 1 includes multiple conducting bracket 10 arranged in a matrix fashion and and is connected to the connection framework 11 of multiple conducting bracket 10, and each of which conducting bracket 10 includes one and is connected to the first conducting terminal 101 and connecting framework 11 and is connected to connection framework 11 and the second conducting terminal 102 (S100) with first conducting terminal 101 preset distance separated from one another.Further, connect framework 11 to have one and around shape frame portion 110 and multiple be connected to around shape frame portion 110 and by the connecting portion 111 surrounded around shape frame portion 110.Additionally, define one first predeterminated level direction X1 and one second predeterminated level direction X2 orthogonal, wherein separated from one another along the second conducting terminal 102 that the first predeterminated level direction X1 two adjacent the first conducting terminals 101 or two extended are adjacent, and can by connecting framework 11 to be connected with each other and to be arranged symmetrically in relation to each other to present relative to corresponding connecting portion 111 along the second conducting terminal 102 that the second predeterminated level direction X2 two adjacent the first conducting terminals 101 or two extended are adjacent.
Then, coordinate shown in Fig. 1, Fig. 3 and Fig. 4, multiple capacitor cells 2 are separately positioned on multiple conducting bracket 10, each of which capacitor cell 2 includes multiple the first stacked-type capacitor 21 being sequentially stacked together and being electrically connected to each other, and each first stacked-type capacitor 21 has the first positive pole portion P1 and of first conducting terminal 101 being electrically connected at corresponding conducting bracket 10 the first negative pole portion N1 (S102) being electrically connected at the second conducting terminal 102 of corresponding conducting bracket 10.
It follows that coordinate Fig. 1, Fig. 5 and Fig. 6, by a mould structure M, multiple packing colloids 30 to be coated with respectively completely multiple capacitor cell 2 (S104).For example, as shown in Figure 6, mould structure M includes a sprue M1 and at least 4 secondary fluid course M2 being communicated in sprue M1, and each secondary fluid course M2 has multiple colloid injection channel M20 extended towards same direction.Additionally, multiple colloid injection channel M20 of each secondary fluid course M2 can correspond to corresponding lead frame component 1, so packing colloid 30(such as lighttight encapsulating material) can sequentially pass through sprue M1 and corresponding secondary fluid course M2 and multiple colloid injection channel M20 thereof, to be directed to lead frame component 1.In other words, for any one lead frame component 1, multiple colloid injection channel M20 of one of them secondary fluid course M2 can correspond to lead frame component 1, so packing colloid 30 can sequentially pass through sprue M1 and one of them secondary fluid course M2 and multiple colloid injection channel M20 thereof, to be directed to lead frame component 1.
Thereby, coordinating shown in Fig. 2, Fig. 5 and Fig. 7, the present invention still further provides a kind of matrix array type stacked-type solid electrolytic capacitor encapsulating structure, comprising: a lead frame component 1, multiple capacitor cell 2 and an encapsulation unit 3.Lead frame component 1 includes multiple conducting bracket 10 arranged in a matrix fashion and and is connected to the connection framework 11 of multiple conducting bracket 10, and each of which conducting bracket 10 includes one and is connected to the first conducting terminal 101 and connecting framework 11 and is connected to connection framework 11 and the second conducting terminal 102 with first conducting terminal 101 preset distance separated from one another.Furthermore, multiple capacitor cells 2 are separately positioned on multiple conducting bracket 10, each of which capacitor cell 2 includes multiple the first stacked-type capacitor 21 being sequentially stacked together and being electrically connected to each other, and each first stacked-type capacitor 21 has the first positive pole portion P1 and of first conducting terminal 101 being electrically connected at corresponding conducting bracket 10 the first negative pole portion N1 being electrically connected at the second conducting terminal 102 of corresponding conducting bracket 10.It addition, encapsulation unit 3 includes multiple difference is coated with the packing colloid 30 of multiple capacitor cell 2 completely.
Further, as it is shown in figure 5, the first conducting terminal 101 of each conducting bracket 10 has the first positive pole portion P1(of a first stacked-type capacitor 21 being electrically connected at corresponding capacitor cell 2 that is the first positive pole portion P1 of the first stacked-type capacitor 21 being positioned at lowermost end in electrical contact) and be covered by the first of corresponding packing colloid 30 and bury portion 101A and and be connected to first and bury portion 101A and the first exposed portion 101B being exposed to outside corresponding packing colloid 30.It addition, the second conducting terminal 102 of each conducting bracket 10 has the first negative pole portion N1(of a first stacked-type capacitor 21 being electrically connected at corresponding capacitor cell 2 that is the first negative pole portion N1 of the first stacked-type capacitor 21 being positioned at lowermost end in electrical contact) and be covered by the second of corresponding packing colloid 30 and bury portion 102A and and be connected to second and bury portion 102A and the second exposed portion 102B being exposed to outside corresponding packing colloid 30.
Further, it is coated with the oxide layer 201, of valve metal paillon foil 200 is completely coated with the rubber layer 203 of the complete coated with conductive macromolecule layer 202 of electroconductive polymer layer 202, of a part of oxide layer 201 and the elargol layer 204 of a complete carbon coated glue-line 203 as it is shown in fig. 7, each first stacked-type capacitor 21 includes a valve metal paillon foil 200,.In addition, each first stacked-type capacitor 21 include on an outer surface being arranged on oxide layer 201 and around oxide layer 201 around shape insulating barrier 205, and the length of the length of the length of electroconductive polymer layer 202 of the first stacked-type capacitor 21, rubber layer 203 and elargol layer 204 is all limited around shape insulating barrier 205.Further, the outer surface of oxide layer 201 has an encircled area 2010, and the first stacked-type capacitor 21 be arranged in the encircled area 2010 of oxide layer 201 around shape insulating barrier 205 around ground and the end 2040 of the contact end 2020 of electroconductive polymer layer 202, the end 2030 of rubber layer 203 and elargol layer 204 simultaneously.But, the first stacked-type capacitor 21 used in the present invention is not limited with above-mentioned institute illustrated example.
It is noted that coordinate shown in Fig. 5 and Fig. 8, when lead frame component 1 cuts, and after being bent along the outer surface of packing colloid 30 by the first exposed portion 101B and the second exposed portion 102B, multiple capacitor packaging structure Z can be formed.Further, multiple first stacked-type capacitors 21 can sequentially be stacked together and be electrically connected to each other, two the first negative pole portion N1 of the first stacked-type capacitor 21 that wherein each two is adjacent can pass through elargol (non-label) with the stack up that mutually changes, and two the first positive pole portion P1 of adjacent the first stacked-type capacitor 21 of each two can pass through weld layer (non-label) with the stack up that mutually changes.
It should be noted that, refer to shown in Fig. 9, each capacitor cell 2 also can further include multiple the second stacked-type capacitor 22 being sequentially stacked together and being electrically connected to each other, and each second stacked-type capacitor 22 has the second positive pole portion P2 and of first conducting terminal 101 being electrically connected at corresponding conducting bracket 10 the second negative pole portion N2 being electrically connected at the second conducting terminal 102 of corresponding conducting bracket 10, multiple first stacked-type capacitors 21 of each of which capacitor cell 2 are arranged on the upper surface of corresponding conducting bracket 10, and multiple second stacked-type capacitors 22 of each capacitor cell 2 are arranged on the lower surface of corresponding conducting bracket 10.
(feasible effect of embodiment)
nullIn sum，Beneficial effects of the present invention can be in that，Matrix array type stacked-type solid electrolytic capacitor encapsulating structure that the embodiment of the present invention provides and preparation method thereof，It can pass through, and " lead frame component 1 includes multiple conducting bracket 10 arranged in a matrix fashion and and is connected to the connection framework 11 of multiple conducting bracket 10，Each of which conducting bracket 10 includes first conducting terminal 101 and being connected to connection framework 11 and is connected to connection framework 11 and the second conducting terminal 102 with first conducting terminal 101 preset distance separated from one another " and " by a mould structure M，So that multiple packing colloids 30 are coated with multiple capacitor cell 2 respectively completely " design，Utilization rate with effective lifting lead wire frame member 1，And reduce encapsulation consumptive material (saving the packaging adhesive material in each runner)，Be conducive to a large amount of production.
The foregoing is only the preferably possible embodiments of the present invention, non-the scope of the claims therefore limiting to the present invention, therefore such as use the equivalence techniques that description of the present invention and graphic content are done to change, be both contained in protection scope of the present invention.
[symbol description]
Capacitor packaging structure Z
Lead frame component 1
Conducting bracket 10
First conducting terminal 101
Portion 101A is buried in first
First exposed portion 101B
Second conducting terminal 102
Portion 102A is buried in second
Second exposed portion 102B
Connect framework 11
Around shape frame portion 110
Connecting portion 111
Capacitor cell 2
First stacked-type capacitor 21
First positive pole portion P1
First negative pole portion N1
Second stacked-type capacitor 22
Second positive pole portion P2
Second negative pole portion N2
Valve metal paillon foil 200
Oxide layer 201
Encircled area 2010
Electroconductive polymer layer 202
End 2020
Rubber layer 203
End 2030
Elargol layer 204
End 2040
Around shape insulating barrier 205
Encapsulation unit 3
Packing colloid 30
Mould structure M
Sprue M1
Secondary fluid course M2
Colloid injection channel M20
First predeterminated level direction X1
Second predeterminated level direction X2.
Claims (10)
1. a matrix array type stacked-type solid electrolytic capacitor encapsulating structure, comprising:
One lead frame component, described lead frame component includes multiple conducting bracket arranged in a matrix fashion and and is connected to the connection framework of multiple described conducting bracket, and conducting bracket described in each of which includes first conducting terminal and being connected to described connection framework and is connected to described connection framework and the second conducting terminal with a described first conducting terminal preset distance separated from one another；
Multiple capacitor cells, multiple described capacitor cells are separately positioned on multiple described conducting bracket, capacitor cell described in each of which includes multiple the first stacked-type capacitor being sequentially stacked together and being electrically connected to each other, and each described first stacked-type capacitor has the first negative pole portion that the first positive pole portion and of described first conducting terminal being electrically connected at corresponding described conducting bracket is electrically connected at described second conducting terminal of corresponding described conducting bracket；And
One encapsulation unit, described encapsulation unit includes multiple difference and is coated with the packing colloid of multiple described capacitor cell completely；
Wherein, described first conducting terminal of each described conducting bracket has the described first positive pole portion of a described first stacked-type capacitor being electrically connected at corresponding described capacitor cell and is covered by first in corresponding described packing colloid and buries portion and is connected in described first and buries portion and the first exposed portion being exposed to outside corresponding described packing colloid；
Wherein, described second conducting terminal of each described conducting bracket has the described first negative pole portion of a described first stacked-type capacitor being electrically connected at corresponding described capacitor cell and is covered by second in corresponding described packing colloid and buries portion and is connected in described second and buries portion and the second exposed portion being exposed to outside corresponding described packing colloid.
2. the matrix array type stacked-type solid electrolytic capacitor encapsulating structure as described in claims 1, wherein said connection framework have one around shape frame portion and multiple be connected to described around shape frame portion and by the described connecting portion surrounded around shape frame portion, two adjacent described first conducting terminals extended along one first predeterminated level direction or two adjacent described second conducting terminals are separated from one another, two adjacent described first conducting terminals extended along one second predeterminated level direction or two adjacent described second conducting terminals by described connection framework to be connected with each other and to be arranged symmetrically in relation to each other to present relative to corresponding described connecting portion, and described first predeterminated level direction is orthogonal with described second predeterminated level direction.
null3. the matrix array type stacked-type solid electrolytic capacitor encapsulating structure as described in claims 1，Described in each of which, the first stacked-type capacitor includes a valve metal paillon foil、One oxide layer being coated with described valve metal paillon foil completely、The electroconductive polymer layer of one part being coated with described oxide layer、One rubber layer being coated with described electroconductive polymer layer completely、And the elargol layer being coated with described rubber layer completely，First stacked-type capacitor described in each of which include on an outer surface being arranged on described oxide layer and around described oxide layer around shape insulating barrier，And the length of the described electroconductive polymer layer of described first stacked-type capacitor、The length of described rubber layer and the length of described elargol layer are all limited around shape insulating barrier by described，The described outer surface of wherein said oxide layer has an encircled area，And described the described of first stacked-type capacitor is arranged in the described encircled area of described oxide layer around shape insulating barrier around ground and contacts the end of described electroconductive polymer layer simultaneously、The end of described rubber layer and the end of described elargol layer.
4. the matrix array type stacked-type solid electrolytic capacitor encapsulating structure as described in claims 1, capacitor cell described in each of which includes multiple the second stacked-type capacitor being sequentially stacked together and being electrically connected to each other, and each described second stacked-type capacitor has the second negative pole portion that the second positive pole portion and of described first conducting terminal being electrically connected at corresponding described conducting bracket is electrically connected at described second conducting terminal of corresponding described conducting bracket, the multiple described first stacked-type capacitor of capacitor cell described in each of which is arranged on the upper surface of corresponding described conducting bracket, and the multiple described second stacked-type capacitor of each described capacitor cell is arranged on the lower surface of corresponding described conducting bracket.
null5. the matrix array type stacked-type solid electrolytic capacitor encapsulating structure as described in claims 4，Described in each of which, the second stacked-type capacitor includes a valve metal paillon foil、One oxide layer being coated with described valve metal paillon foil completely、The electroconductive polymer layer of one part being coated with described oxide layer、One rubber layer being coated with described electroconductive polymer layer completely、And the elargol layer being coated with described rubber layer completely，Second stacked-type capacitor described in each of which include on an outer surface being arranged on described oxide layer and around described oxide layer around shape insulating barrier，And the length of the described electroconductive polymer layer of described second stacked-type capacitor、The length of described rubber layer and the length of described elargol layer are all limited around shape insulating barrier by described，The described outer surface of wherein said oxide layer has an encircled area，And described the described of second stacked-type capacitor is arranged in the described encircled area of described oxide layer around shape insulating barrier around ground and contacts the end of described electroconductive polymer layer simultaneously、The end of described rubber layer and the end of described elargol layer.
6. a matrix array type stacked-type solid electrolytic capacitor encapsulating structure, comprising:
One lead frame component, described lead frame component includes multiple conducting bracket arranged in a matrix fashion and and is connected to the connection framework of multiple described conducting bracket, and conducting bracket described in each of which includes first conducting terminal and being connected to described connection framework and is connected to described connection framework and the second conducting terminal with a described first conducting terminal preset distance separated from one another；
Multiple capacitor cells, multiple described capacitor cells are separately positioned on multiple described conducting bracket, capacitor cell described in each of which includes multiple the first stacked-type capacitor being sequentially stacked together, and each described first stacked-type capacitor has the first negative pole portion that the first positive pole portion and of described first conducting terminal being electrically connected at corresponding described conducting bracket is electrically connected at described second conducting terminal of corresponding described conducting bracket；And
One encapsulation unit, described encapsulation unit includes multiple difference and is coated with the packing colloid of multiple described capacitor cell completely；
Wherein, described first conducting terminal of each described conducting bracket have one be covered by corresponding described packing colloid first in bury the first exposed portion that portion and is exposed to outside corresponding described packing colloid；
Wherein, described second conducting terminal of each described conducting bracket have one be covered by corresponding described packing colloid second in bury the second exposed portion that portion and is exposed to outside corresponding described packing colloid.
7. a manufacture method for matrix array type stacked-type solid electrolytic capacitor encapsulating structure, comprising:
One lead frame component is provided, described lead frame component includes multiple conducting bracket arranged in a matrix fashion and and is connected to the connection framework of multiple described conducting bracket, and conducting bracket described in each of which includes first conducting terminal and being connected to described connection framework and is connected to described connection framework and the second conducting terminal with a described first conducting terminal preset distance separated from one another；
Multiple capacitor cells are separately positioned on multiple described conducting bracket, capacitor cell described in each of which includes multiple the first stacked-type capacitor being sequentially stacked together and being electrically connected to each other, and each described first stacked-type capacitor has the first negative pole portion that the first positive pole portion and of described first conducting terminal being electrically connected at corresponding described conducting bracket is electrically connected at described second conducting terminal of corresponding described conducting bracket；And
By a mould structure, multiple packing colloids to be coated with respectively completely multiple described capacitor cell；
Wherein, described first conducting terminal of each described conducting bracket has the described first positive pole portion of a described first stacked-type capacitor being electrically connected at corresponding described capacitor cell and is covered by first in corresponding described packing colloid and buries portion and is connected in described first and buries portion and the first exposed portion being exposed to outside corresponding described packing colloid；
Wherein, described second conducting terminal of each described conducting bracket has the described first negative pole portion of a described first stacked-type capacitor being electrically connected at corresponding described capacitor cell and is covered by second in corresponding described packing colloid and buries portion and is connected in described second and buries portion and the second exposed portion being exposed to outside corresponding described packing colloid.
8. the manufacture method of the matrix array type stacked-type solid electrolytic capacitor encapsulating structure as described in claims 7, wherein said connection framework have one around shape frame portion and multiple be connected to described around shape frame portion and by the described connecting portion surrounded around shape frame portion, two adjacent described first conducting terminals extended along one first predeterminated level direction or two adjacent described second conducting terminals are separated from one another, two adjacent described first conducting terminals extended along one second predeterminated level direction or two adjacent described second conducting terminals by described connection framework to be connected with each other and to be arranged symmetrically in relation to each other to present relative to corresponding described connecting portion, and described first predeterminated level direction is orthogonal with described second predeterminated level direction.
null9. the manufacture method of the matrix array type stacked-type solid electrolytic capacitor encapsulating structure as described in claims 7，Described in each of which, the first stacked-type capacitor includes a valve metal paillon foil、One oxide layer being coated with described valve metal paillon foil completely、The electroconductive polymer layer of one part being coated with described oxide layer、One rubber layer being coated with described electroconductive polymer layer completely、And the elargol layer being coated with described rubber layer completely，First stacked-type capacitor described in each of which include on an outer surface being arranged on described oxide layer and around described oxide layer around shape insulating barrier，And the length of the described electroconductive polymer layer of described first stacked-type capacitor、The length of described rubber layer and the length of described elargol layer are all limited around shape insulating barrier by described，The described outer surface of wherein said oxide layer has an encircled area，And described the described of first stacked-type capacitor is arranged in the described encircled area of described oxide layer around shape insulating barrier around ground and contacts the end of described electroconductive polymer layer simultaneously、The end of described rubber layer and the end of described elargol layer.
10. the manufacture method of the matrix array type stacked-type solid electrolytic capacitor encapsulating structure as described in claims 7, wherein said mould structure includes a sprue and at least 4 secondary fluid courses being communicated in described sprue, each described secondary fluid course has multiple colloid injection channel extended towards same direction, the multiple described colloid of one of them described secondary fluid course injects channel corresponding to described lead frame component, described packing colloid is sequentially by described sprue and one of them described secondary fluid course and multiple described colloid injection channel thereof, to be directed to described lead frame component.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108133809A (en) * | 2016-12-01 | 2018-06-08 | 今展科技股份有限公司 | Inductor packaging structure with array conducting bracket and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020163775A1 (en) * | 2001-04-05 | 2002-11-07 | Masahide Maeda | Solid electrolytic capacitor and method of making the same |
| CN101300652A (en) * | 2005-11-01 | 2008-11-05 | 昭和电工株式会社 | Solid electrolytic capacitor and method for manufacturing same |
| CN101887801A (en) * | 2009-01-22 | 2010-11-17 | 阿维科斯公司 | Diced electrolytic capacitor assembly and method of production yielding improved volumetric efficiency |
| CN103426643A (en) * | 2012-07-25 | 2013-12-04 | 钰邦电子（无锡）有限公司 | Stack type solid electrolytic capacitor packaging structure with multiple negative electrode lead-out pins and manufacturing method thereof |
| US20140307365A1 (en) * | 2013-04-11 | 2014-10-16 | Apaq Technology Co., Ltd. | Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the same |
| TWI474354B (en) * | 2013-10-25 | 2015-02-21 | Apaq Technology Co Ltd | Solid electrolytic capacitor package structure and method of manufacturing the same, and conductive unit |
-
2015
- 2015-10-27 CN CN201510704553.XA patent/CN105810439A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020163775A1 (en) * | 2001-04-05 | 2002-11-07 | Masahide Maeda | Solid electrolytic capacitor and method of making the same |
| CN101300652A (en) * | 2005-11-01 | 2008-11-05 | 昭和电工株式会社 | Solid electrolytic capacitor and method for manufacturing same |
| CN101887801A (en) * | 2009-01-22 | 2010-11-17 | 阿维科斯公司 | Diced electrolytic capacitor assembly and method of production yielding improved volumetric efficiency |
| CN103426643A (en) * | 2012-07-25 | 2013-12-04 | 钰邦电子（无锡）有限公司 | Stack type solid electrolytic capacitor packaging structure with multiple negative electrode lead-out pins and manufacturing method thereof |
| US20140307365A1 (en) * | 2013-04-11 | 2014-10-16 | Apaq Technology Co., Ltd. | Solid electrolytic capacitor package structure for decreasing equivalent series resistance and method of manufacturing the same |
| TWI474354B (en) * | 2013-10-25 | 2015-02-21 | Apaq Technology Co Ltd | Solid electrolytic capacitor package structure and method of manufacturing the same, and conductive unit |
Non-Patent Citations (1)
| Title |
|---|
| "《模具设计基础 第2版》" * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108133809A (en) * | 2016-12-01 | 2018-06-08 | 今展科技股份有限公司 | Inductor packaging structure with array conducting bracket and preparation method thereof |
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