CN106029288A - 标印装置和图案生成装置 - Google Patents

标印装置和图案生成装置 Download PDF

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Publication number
CN106029288A
CN106029288A CN201580009197.8A CN201580009197A CN106029288A CN 106029288 A CN106029288 A CN 106029288A CN 201580009197 A CN201580009197 A CN 201580009197A CN 106029288 A CN106029288 A CN 106029288A
Authority
CN
China
Prior art keywords
head
stamp
depicting pattern
pattern
marking device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580009197.8A
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English (en)
Chinese (zh)
Inventor
田尾正则
冈部均
中谷友哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Publication of CN106029288A publication Critical patent/CN106029288A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN201580009197.8A 2014-02-27 2015-01-15 标印装置和图案生成装置 Pending CN106029288A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014-037194 2014-02-27
JP2014037194A JP6278451B2 (ja) 2014-02-27 2014-02-27 マーキング装置およびパターン生成装置
PCT/JP2015/050866 WO2015129316A1 (ja) 2014-02-27 2015-01-15 マーキング装置およびパターン生成装置

Publications (1)

Publication Number Publication Date
CN106029288A true CN106029288A (zh) 2016-10-12

Family

ID=54008645

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580009197.8A Pending CN106029288A (zh) 2014-02-27 2015-01-15 标印装置和图案生成装置

Country Status (5)

Country Link
JP (1) JP6278451B2 (ja)
KR (1) KR102192600B1 (ja)
CN (1) CN106029288A (ja)
TW (1) TWI627006B (ja)
WO (1) WO2015129316A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108025392A (zh) * 2015-10-09 2018-05-11 东丽工程株式会社 标印装置
CN111515915A (zh) * 2019-02-01 2020-08-11 株式会社迪思科 对准方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6079844B1 (ja) * 2015-09-07 2017-02-15 凸版印刷株式会社 フィルムへのレーザー加工方法
EP3348382A4 (en) 2015-09-07 2018-10-03 Toppan Printing Co., Ltd. Laser processing apparatus
EP3421225A1 (de) 2017-06-26 2019-01-02 Raylase GmbH Automatisierte kalibrierung einer vorrichtung zur vollparallelisierten additiven fertigung eines bauteils mit kombinierten arbeitsfeldern
US20210197312A1 (en) * 2017-10-25 2021-07-01 Nikon Corporation Processing apparatus, processing system, and manufacturing method of movable body
JP6740293B2 (ja) 2018-08-03 2020-08-12 ファナック株式会社 レーザ加工装置の制御装置及びレーザ加工装置
CN109014595A (zh) * 2018-09-12 2018-12-18 昆山卓研智能科技有限公司 离线全自动标识设备
JP2022129829A (ja) 2021-02-25 2022-09-06 株式会社リコー マーキング装置、媒体、収容体及びマーキング方法
JP2022130978A (ja) 2021-02-26 2022-09-07 株式会社リコー レーザ照射装置、レーザ照射方法、収容器および収容体
CN114260588B (zh) * 2022-01-10 2022-12-09 中国科学院力学研究所 一种振镜式大幅面激光飞行打标方法
CN116851929A (zh) * 2023-09-04 2023-10-10 武汉华工激光工程有限责任公司 一种运动状态下的物体视觉定位激光打标方法及***
CN117260002B (zh) * 2023-11-20 2024-02-09 西安精谐科技有限责任公司 基于激光加工的半球谐振陀螺电极及加工方法、***

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195310A (zh) * 1996-04-26 1998-10-07 标记和编辑整理工业服务有限公司 用于标记或穿孔的***和工序
CN1754694A (zh) * 2004-09-30 2006-04-05 大日本网目版制造株式会社 印刷版的制版方法以及印刷版的制版装置
JP2006224481A (ja) * 2005-02-18 2006-08-31 Dainippon Screen Mfg Co Ltd 印刷版の製版装置
CN102438787A (zh) * 2009-04-17 2012-05-02 沓名宗春 纤维强化复合材料的激光加工方法及加工构件
JP2013184171A (ja) * 2012-03-06 2013-09-19 Toray Eng Co Ltd マーキング装置及び方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4461740B2 (ja) 2003-08-21 2010-05-12 オムロン株式会社 レーザマーキング装置
JP3872462B2 (ja) 2003-09-01 2007-01-24 住友重機械工業株式会社 レーザ加工装置、及びレーザ加工方法
JP5248205B2 (ja) 2008-05-29 2013-07-31 パナソニック デバイスＳｕｎｘ株式会社 レーザマーキング装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195310A (zh) * 1996-04-26 1998-10-07 标记和编辑整理工业服务有限公司 用于标记或穿孔的***和工序
CN1754694A (zh) * 2004-09-30 2006-04-05 大日本网目版制造株式会社 印刷版的制版方法以及印刷版的制版装置
JP2006224481A (ja) * 2005-02-18 2006-08-31 Dainippon Screen Mfg Co Ltd 印刷版の製版装置
CN102438787A (zh) * 2009-04-17 2012-05-02 沓名宗春 纤维强化复合材料的激光加工方法及加工构件
JP2013184171A (ja) * 2012-03-06 2013-09-19 Toray Eng Co Ltd マーキング装置及び方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108025392A (zh) * 2015-10-09 2018-05-11 东丽工程株式会社 标印装置
CN111515915A (zh) * 2019-02-01 2020-08-11 株式会社迪思科 对准方法
CN111515915B (zh) * 2019-02-01 2023-09-26 株式会社迪思科 对准方法

Also Published As

Publication number Publication date
TWI627006B (zh) 2018-06-21
JP6278451B2 (ja) 2018-02-14
KR20160125971A (ko) 2016-11-01
WO2015129316A1 (ja) 2015-09-03
KR102192600B1 (ko) 2020-12-17
TW201532720A (zh) 2015-09-01
JP2015160235A (ja) 2015-09-07

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