CN106024687B - A kind of wafer disk driving means - Google Patents
A kind of wafer disk driving means Download PDFInfo
- Publication number
- CN106024687B CN106024687B CN201610629437.0A CN201610629437A CN106024687B CN 106024687 B CN106024687 B CN 106024687B CN 201610629437 A CN201610629437 A CN 201610629437A CN 106024687 B CN106024687 B CN 106024687B
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- Prior art keywords
- wafer disk
- hand basket
- wafer
- workbench
- fixed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Specific Conveyance Elements (AREA)
Abstract
The invention discloses a kind of wafer disk driving means, it includes workbench, and it is fixed on delivery device on workbench, delivery device includes being mounted at least one hand baskets of multiple wafer disks jacking cylinder below the hand basket is arranged in, it is arranged in front of the hand basket, push cylinder for releasing the wafer disk in the hand basket, the wafer disk driving means further includes fixed positioning component and feeding mechanism on the working platform, the rear of the hand basket is arranged in the positioning component, wafer disk for the push cylinder to be pushed out from the hand basket positions, the rear of the positioning component is arranged in the feeding mechanism, material is conveyed for the wafer disk on the positioning component.The wafer disk driving means of the invention can be automatically performed push and the feeding of wafer disk, do not need manual operation, thereby reduce labor intensity, improve working efficiency.
Description
Technical field
The present invention relates to wafer fab more particularly to a kind of wafer disk driving means.
Background technique
Diode wafer is the main raw material(s) of diode, and in the production process of diode, diode wafer welding is
One necessary process, however, current diode production producer is when carrying out diode wafer welding, mainly by manually come
It completes, great work intensity, product defect rate is higher, assembly efficiency is low.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of wafer disk driving means, can be realized wafer disk
Automatic push and automatic charging do not need manually to be operated, so that the labor intensity of staff is reduced, the work also improved
Make efficiency.
In order to solve the above-mentioned technical problems, the present invention provides a kind of wafer disk driving means, comprising:
Workbench, and fixed delivery device, positioning component and feeding mechanism on the working platform, wherein institute
Stating delivery device includes at least one hand basket for being mounted with multiple wafer disks, and the jacking cylinder below the hand basket is arranged in, with
And the push cylinder for releasing wafer disk out of described hand basket, the push cylinder, the hand basket, the positioning component and
The feeding mechanism is arranged successively along the wafer disk Y direction.
Further, the positioning component includes fixed positioning installation frame on the working platform, and is fixed on
At least a pair of of locating piece in the positioning installation frame, each pair of locating piece correspond to a hand basket, and on the locating piece
The guide rail being moved forward and backward for the wafer disk is provided with along the wafer disk Y direction.
Further, the feeding mechanism includes fixed first conveyer belt mechanism on the working platform, and setting exists
First conveyer belt mechanism one end is arranged in magazine in the first conveyer belt mechanism, defeated for accepting described first
The hopper for the material that tape-feed conveying comes and one end are arranged in below the hopper, and second for accepting material is defeated
Tape-feed, and second conveyer belt mechanism side is set, for the material on the second conveyor structure to be inhaled
The mechanical arm mechanism being attached on the wafer disk on the positioning component.
Further, the positioning component further includes the push cylinder being arranged between each pair of locating piece, and is located at
The second jacking cylinder below the push cylinder, the push cylinder are fixed in the positioning installation frame, and being used for will be described
Wafer disk pushes back the hand basket.
Further, the first conveyer belt mechanism includes the conveyer belt for being parallel to the wafer disk Y-axis, is respectively set
Driven wheel at the conveyer belt both ends supports the support base of the driven wheel shaft, and the driving driving wheel
Driving cylinder, the driving cylinder is fixed on the support base, and the support base is fixed on the working platform；With/
Or,
Second conveyer belt mechanism includes the synchronous belt for being parallel to the wafer disk X-axis, is separately positioned on the synchronization
Driven wheel with both ends supports the support base of the driven wheel, drives the drive motor of the driving wheel, and fixed institute
The motor mount plate of drive motor is stated, the motor mount plate is fixed on the working platform.
Further, second conveyer belt mechanism further includes the material baffle that the synchronous belt two sides are arranged in, and/
Or,
The material baffle is provided with multiple limit material blocks close to one end of the hopper.
Further, the mechanical arm mechanism includes being fixed on workbench, is respectively parallel to the wafer disk X
The mechanical arm guide rail of the mechanical arm of axis and the wafer disk Y-axis, one end of the mechanical arm is with can be relative to the mechanical arm guide rail
The mode being moved forward and backward along the wafer disk Y-axis is mounted on the mechanical arm guide rail, is additionally provided with sliding block on the mechanical arm,
The sliding block by can relative to the mechanical arm along wafer disk X-axis move left and right in a manner of be mounted on the mechanical arm, it is described
At least two stepper motors are fixedly installed on sliding block, the suction nozzle being connected by shaft coupling with the stepper motor passes through guiding
Fixed feeding pin on the slide block, wherein the suction nozzle and the feeding pin are located at right above the synchronous belt, described to send
Material is sold, and is additionally provided with amesdial head at the top of the sliding block.
The implementation of the embodiments of the present invention has the following beneficial effects:
Implement the wafer disk driving means of the invention, by the push cylinder in delivery device by multiple crystalline substances in hand basket
Automatic push to positioning component, then by feeding mechanism carry out automatic charging to the wafer disk on the positioning component to piece disk one by one, from
And realize that the push of wafer disk and feeding are all automatically performed, manual operation is not needed, labor intensity is thereby reduced, is improved
Working efficiency.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of perspective view of an embodiment of wafer disk driving means of the invention；
Fig. 2 is the structural schematic diagram of the feeding mechanism of wafer disk driving means in response diagram 1；
Fig. 3 is the partial enlarged view of basket structure in response diagram 1；
Fig. 4 is the top view of wafer disk driving means in Fig. 1；
Fig. 5 is the partial enlarged view of structure between suction nozzle, feeding pin and sliding block in response diagram 1.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It is a kind of structural schematic diagram of an embodiment of wafer disk driving means of the invention referring to Fig. 1, specifically, this
The wafer disk driving means specifically includes workbench 1 in embodiment, and is fixed on delivery device on the workbench 1, fixed
Hyte part and feeding mechanism, wherein
Referring to Fig. 1 and Fig. 2, which includes two hand baskets 22 for being mounted with multiple wafer disks, and being used for will be brilliant
The corresponding push cylinder 24 of each hand basket 22 of two push cylinder 24(that piece disk is pushed out from hand basket 22), and be arranged at this
Jacking cylinder 23 below hand basket, the push cylinder 24, hand basket 22, positioning component and feeding mechanism are along the wafer disk Y direction
It is arranged successively；Specifically, referring to Fig. 3, the hand basket 22 is by bottom plate 222 in the present embodiment, and two side plates 223 and top plate 224 enclose
The rectangular hoop of the front and rear sides opening formed is closed, and is fixedly installed handle 225 on top plate 224, is set on the inner wall of side plate 223
Multiple grooves matched with chip plate edge are equipped with, so that the wafer disk is recessed along this under the action of push cylinder 24
Slot is pushed out in hand basket 22；Further, referring to Fig. 3, correspond to the position of hand basket 22 in the present embodiment also on workbench 1
Supporting plate 221 is set, and the supporting plate 221 can drive the hand basket 22 flat relative to the work under the push rod effect of jacking cylinder 23
Platform 1 moves up and down；Further, referring to Fig. 3, hand basket 22 slides from supporting plate 221 in order to prevent, and the present embodiment can also be at this
Multiple limited blocks 226 are set on supporting plate 221；In the present embodiment, the number of the hand basket 22 can be adjusted as needed, accordingly
The number of ground, corresponding jacking cylinder 23 and push cylinder 24 is also adaptively adjusted；
Referring to Fig. 1, which specifically includes the positioning installation frame 31 being fixed on workbench 1, and is fixed on
Two pairs of locating pieces 32 in positioning installation frame 31, and each pair of locating piece 32 corresponds to a hand basket 22, and edge on the locating piece 32
The wafer disk Y direction is provided with the guide rail being moved forward and backward for wafer disk, i.e., under the action of push cylinder 24, wafer disk quilt
It releases guide rail of the part of hand basket 22 then on the locating piece 32 and slides into certain position, when it is implemented, common Fig. 4, it can root
According to the quantity of the size adjustment locating piece of distance between adjacent hand basket, for example, see Fig. 1, due between two hand baskets distance compared with
It is small, then correspond to first pair of locating piece of first hand basket and corresponds in second pair of locating piece of second hand basket, it is adjacent
Two locating pieces can synthesize a locating piece, then the guide rail corresponding to chip plate edge is respectively set in the locating piece two sides；Into
One step, for the ease of pushing back the wafer disk after feeding in hand basket 22, the present embodiment can also be between each pair of locating piece 32
Push cylinder 33, and the second jacking cylinder under the push cylinder 33, and the push cylinder 33 and the second jacking are set
Cylinder is each attached in positioning installation frame 31, since the push cylinder 33 is just used after wafer disk feeding, do not make
When with the push cylinder 33, the plane most where point of the push cylinder 33 is flat lower than two guide rails place on each pair of locating piece 32
Face, and when it is desired to be used, then the push cylinder 33 is jacked to corresponding height, then by the push gas by the second jacking cylinder
The push rod of cylinder 33 pushes back the wafer disk after feeding in hand basket；
Referring to Fig. 1 and Fig. 2, which includes the first conveyer belt mechanism being fixed on workbench 1, and setting is the
The first conveyer belt mechanism one end is arranged in magazine 43 on one conveyer belt mechanism, for accepting the first conveyer belt mechanism
The hopper 44 for the material that conveying comes and one end are arranged in below the hopper 44, the material come for accepting the conveying of hopper 44
The second conveyer belt mechanism, and the second conveyer belt mechanism side is set, for by the material on second conveyor structure
The mechanical arm mechanism being adsorbed on the wafer disk on above-mentioned positioning component；Specifically, referring to fig. 4, wherein the first conveyer belt machine
Structure includes the conveyer belt 421 for being parallel to the wafer disk Y-axis, is separately positioned on the driven wheel at 421 both ends of conveyer belt, support
The support base of driven wheel shaft, and the driving cylinder 424 of driving driving wheel, the driving cylinder 424 are fixed on support base
On, which is then fixed on workbench 1；Second conveyer belt mechanism includes the synchronization for being parallel to the wafer disk X-axis
Band 451 is separately positioned on the driven wheel at 451 both ends of synchronous belt, supports the support base of driven wheel, drives the driving of driving wheel
Motor 454, and the motor mount plate of fixed drive motor 454, and the motor mount plate is fixed on workbench 1；Referring to
Fig. 5, the mechanical arm mechanism include mechanical arm 47, and are mounted on the mechanical arm guide rail 46 on workbench 1 by fixed frame, should
Mechanical arm guide rail 46 is parallel with wafer disk Y-axis, side of the one end of mechanical arm 47 can move relative to the mechanical arm guide rail 46
Formula is mounted on mechanical arm guide rail 46, is provided with sliding block 48 on the mechanical arm 47, and the sliding block 48 along wafer disk X-direction can move
Dynamic mode is mounted on mechanical arm 47, stepper motor 49 there are two fixed settings on the sliding block 48, is arranged at the top of the sliding block 48
There is amesdial head 412, be additionally provided with feeding pin 411 on the sliding block 48, which is fixed on the cunning by guide plate 413
On block, and shaft coupling of two stepper motors 49 then by setting through the guide plate 413 is connected separately with suction nozzle 410, and
The suction nozzle 410 and feeding pin 411 are respectively positioned on the surface of synchronous belt 451, when push cylinder 24 in hand basket 22 by being pushed out, by
In the limited length of 24 push rod of push cylinder, therefore, wafer disk can not completely disengage hand basket or completely into positioning component, this
When, control mobile mechanical arm 47 makes feeding pin 411 be inserted into the jack a of wafer disk one end, then pulls the wafer disk mobile, makes
It completely disengages hand basket, and enters positioning component, and then mechanical arm 47 returns and draws the object on synchronous belt 451 by suction nozzle 410
Material, then the material of absorption is fixed on corresponding position on wafer disk along wafer disk Y-axis mobile mechanical arm, certainly if desired, also
It needs to control sliding block to move along wafer disk X-axis, and during being somebody's turn to do, then the mobile distance of sliding block is measured by amesdial head；Into one
Step the, in order to avoid the landing of material during transportation, the present embodiment can also be at 451 liang of synchronous belt of the second conveyer belt mechanism
Material baffle 456 is arranged in side, and the material baffle 456 is provided with multiple limit material blocks 457 close to one end of hopper 44.
For the ease of monitoring, the present embodiment can also pass through fixed mount setting square monitoring camera on the robotic arm.
The above disclosure is only the preferred embodiments of the present invention, cannot limit the right model of the present invention with this certainly
It encloses, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and wants according to right of the present invention
Made equivalent variations is sought, is still belonged to the scope covered by the invention.
Claims (1)
1. a kind of wafer disk driving means, which is characterized in that including workbench (1), and be fixed on the workbench (1)
Upper delivery device, positioning component and feeding mechanism, wherein the delivery device includes at least one for being mounted with multiple wafer disks
Hand basket (22), is arranged jacking cylinder (23) below the hand basket (22), and for by wafer disk from the hand basket (22)
The push cylinder (24) of interior release, the push cylinder (24), the hand basket (22), the positioning component and the feeding mechanism
It is arranged successively along the wafer disk Y direction, the hand basket (22) is by bottom plate (222), two side plates (223) and top plate
(224) the rectangular hoop for the front and rear sides opening being enclosed, and handle (225), institute are fixedly installed on the top plate (224)
It states and is provided with multiple guide rails matched with the chip plate edge on the inner wall of side plate (223), the workbench (1) on pair
The position of hand basket described in Ying Yu (22) is provided with supporting plate (221), is further fixedly arranged on the supporting plate (221) described for positioning
The limited block (226) of bottom plate (222), the supporting plate (221) can be relative to institutes under the push rod effect of the jacking cylinder (23)
It states workbench (1) to move up and down, the positioning component includes the positioning installation frame being fixed on the workbench (1)
(31), and at least a pair of of locating piece (32) for being fixed on the positioning installation frame (31), each pair of locating piece (32) correspond to
One hand basket (22), and be provided with along the wafer disk Y direction for before and after the wafer disk on the locating piece (32)
Mobile guide rail, the positioning component further includes the push cylinder (33) being arranged between each pair of locating piece (32), and is located at
The second jacking cylinder below the push cylinder (33), the push cylinder (33) are fixed on the positioning installation frame (31)
On, for the wafer disk to be pushed go back to the hand basket (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610629437.0A CN106024687B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk driving means |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410549877.6A CN104332439B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk pusher |
| CN201610629437.0A CN106024687B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk driving means |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410549877.6A Division CN104332439B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk pusher |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106024687A CN106024687A (en) | 2016-10-12 |
| CN106024687B true CN106024687B (en) | 2019-01-18 |
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ID=52407144
Family Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610629423.9A Active CN106206389B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk pusher |
| CN201410549877.6A Expired - Fee Related CN104332439B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk pusher |
| CN201610629436.6A Active CN106024686B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk pusher |
| CN201610629425.8A Active CN106024685B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk driving means |
| CN201610629412.0A Expired - Fee Related CN106024684B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk pusher |
| CN201610629437.0A Expired - Fee Related CN106024687B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk driving means |
Family Applications Before (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610629423.9A Active CN106206389B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk pusher |
| CN201410549877.6A Expired - Fee Related CN104332439B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk pusher |
| CN201610629436.6A Active CN106024686B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk pusher |
| CN201610629425.8A Active CN106024685B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk driving means |
| CN201610629412.0A Expired - Fee Related CN106024684B (en) | 2014-10-17 | 2014-10-17 | A kind of wafer disk pusher |
Country Status (1)
| Country | Link |
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| CN (6) | CN106206389B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106206389B (en) * | 2014-10-17 | 2018-10-09 | 兴化市联富食品有限公司 | A kind of wafer disk pusher |
| CN105173690B (en) * | 2015-08-18 | 2018-02-06 | 先进光电器材（深圳）有限公司 | Automatic feeding and discharging device |
| CN105197583B (en) * | 2015-10-30 | 2017-06-23 | 江苏比微曼智能科技有限公司 | Trigger under pcb board |
| CN105314393B (en) * | 2015-11-20 | 2017-07-28 | 江苏艾科瑞思封装自动化设备有限公司 | Do not shut down feeding device |
| CN106629037A (en) * | 2016-11-25 | 2017-05-10 | 深圳市诚亿自动化科技有限公司 | Non-shutdown various-IC picking device |
| CN106783677B (en) * | 2016-12-08 | 2023-12-05 | 江门格兰达物联装备有限公司 | Automatic feeding equipment for trough type feed box |
| CN109560030B (en) * | 2017-09-26 | 2024-02-09 | Tcl环鑫半导体(天津)有限公司 | Automatic circular silicon wafer rewinding machine |
| CN109037129B (en) * | 2018-07-19 | 2024-02-09 | 广州明森科技股份有限公司 | Rotatory handling device of chip |
| CN109772726B (en) * | 2019-01-03 | 2021-02-02 | 大族激光科技产业集团股份有限公司 | LED processing equipment and LED processing technology applying same |
| CN111618885B (en) * | 2020-07-29 | 2020-10-16 | 山东元旭光电股份有限公司 | Automatic wafer feeding device |
| CN112319897A (en) * | 2020-12-04 | 2021-02-05 | 重庆机电职业技术大学 | Automatic high-speed chip intelligent packaging machine |
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|---|---|---|---|---|
| JP2000269245A (en) * | 1999-03-15 | 2000-09-29 | Iwate Toshiba Electronics Kk | Manufacturing apparatus of semiconductor devices |
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| KR100941447B1 (en) * | 2007-12-18 | 2010-02-11 | 주식회사제4기한국 | Auto plasma continuous treatment apparatus of pcb |
| CN201663151U (en) * | 2009-03-06 | 2010-12-01 | 东莞市启天自动化设备有限公司 | Full automatic silicon chip loading and unloading machine |
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| CN203481200U (en) * | 2013-08-28 | 2014-03-12 | 东莞市启天自动化设备有限公司 | Solar energy silicon wafer 5-channel 100-layer basket automatic feeder |
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| CN106206389B (en) * | 2014-10-17 | 2018-10-09 | 兴化市联富食品有限公司 | A kind of wafer disk pusher |
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- 2014-10-17 CN CN201410549877.6A patent/CN104332439B/en not_active Expired - Fee Related
- 2014-10-17 CN CN201610629436.6A patent/CN106024686B/en active Active
- 2014-10-17 CN CN201610629425.8A patent/CN106024685B/en active Active
- 2014-10-17 CN CN201610629412.0A patent/CN106024684B/en not_active Expired - Fee Related
- 2014-10-17 CN CN201610629437.0A patent/CN106024687B/en not_active Expired - Fee Related
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| JP2000269245A (en) * | 1999-03-15 | 2000-09-29 | Iwate Toshiba Electronics Kk | Manufacturing apparatus of semiconductor devices |
| CN201117644Y (en) * | 2007-09-20 | 2008-09-17 | 中国电子科技集团公司第二研究所 | Full-automatic silicon chip charging-discharging machine |
| CN201655771U (en) * | 2009-12-24 | 2010-11-24 | 徐竹林 | Fully-automatic silicon slice loading and unloading machine |
| CN102358449A (en) * | 2011-06-21 | 2012-02-22 | 中国电子科技集团公司第二研究所 | Full-automatic silicon wafer loader |
| CN102623377A (en) * | 2012-04-06 | 2012-08-01 | 常州亿晶光电科技有限公司 | Gripper device of automatic silicon wafer loading and unloading machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106024685A (en) | 2016-10-12 |
| CN106024684B (en) | 2018-06-15 |
| CN106024684A (en) | 2016-10-12 |
| CN106024685B (en) | 2019-01-01 |
| CN106206389A (en) | 2016-12-07 |
| CN106024686A (en) | 2016-10-12 |
| CN104332439A (en) | 2015-02-04 |
| CN106024686B (en) | 2018-06-08 |
| CN106024687A (en) | 2016-10-12 |
| CN106206389B (en) | 2018-10-09 |
| CN104332439B (en) | 2017-03-01 |
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