CN106019828A - First liquid and second liquid of two-liquid mixing type and method for manufacturing printed wiring board - Google Patents
First liquid and second liquid of two-liquid mixing type and method for manufacturing printed wiring board Download PDFInfo
- Publication number
- CN106019828A CN106019828A CN201610169087.4A CN201610169087A CN106019828A CN 106019828 A CN106019828 A CN 106019828A CN 201610169087 A CN201610169087 A CN 201610169087A CN 106019828 A CN106019828 A CN 106019828A
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- Prior art keywords
- liquid
- mentioned
- organic solvent
- titanium oxide
- photosensitive composite
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- 239000007788 liquid Substances 0.000 title claims abstract description 208
- 238000002156 mixing Methods 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 41
- 238000000034 method Methods 0.000 title claims description 17
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 69
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000003960 organic solvent Substances 0.000 claims abstract description 53
- 239000000203 mixture Substances 0.000 claims abstract description 47
- 239000011256 inorganic filler Substances 0.000 claims abstract description 38
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 38
- 150000001875 compounds Chemical class 0.000 claims abstract description 32
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 31
- 229920000642 polymer Polymers 0.000 claims abstract description 30
- 150000004292 cyclic ethers Chemical class 0.000 claims abstract description 17
- 239000002131 composite material Substances 0.000 claims description 59
- 239000002253 acid Substances 0.000 claims description 20
- 239000000178 monomer Substances 0.000 claims description 20
- 150000002148 esters Chemical class 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 238000003860 storage Methods 0.000 abstract description 10
- 238000005260 corrosion Methods 0.000 abstract description 5
- 239000003505 polymerization initiator Substances 0.000 abstract description 2
- 238000002310 reflectometry Methods 0.000 abstract description 2
- -1 alkoxy silane Chemical compound 0.000 description 30
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 22
- 239000003822 epoxy resin Substances 0.000 description 21
- 229920000647 polyepoxide Polymers 0.000 description 21
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 238000004821 distillation Methods 0.000 description 18
- 239000003963 antioxidant agent Substances 0.000 description 16
- 239000003795 chemical substances by application Substances 0.000 description 13
- 230000003078 antioxidant effect Effects 0.000 description 12
- 230000003628 erosive effect Effects 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 11
- 239000000454 talc Substances 0.000 description 11
- 235000012222 talc Nutrition 0.000 description 11
- 229910052623 talc Inorganic materials 0.000 description 11
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 239000003208 petroleum Substances 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 8
- 238000009835 boiling Methods 0.000 description 8
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 229940106691 bisphenol a Drugs 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 150000005846 sugar alcohols Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 235000010724 Wisteria floribunda Nutrition 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000004575 stone Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- PPQREHKVAOVYBT-UHFFFAOYSA-H dialuminum;tricarbonate Chemical compound [Al+3].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O PPQREHKVAOVYBT-UHFFFAOYSA-H 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229940059574 pentaerithrityl Drugs 0.000 description 2
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- 208000007578 phototoxic dermatitis Diseases 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- 238000007711 solidification Methods 0.000 description 2
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- 239000000243 solution Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- IVIDDMGBRCPGLJ-UHFFFAOYSA-N 2,3-bis(oxiran-2-ylmethoxy)propan-1-ol Chemical compound C1OC1COC(CO)COCC1CO1 IVIDDMGBRCPGLJ-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
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- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
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- MSXXDBCLAKQJQT-UHFFFAOYSA-N 2-tert-butyl-6-methyl-4-[3-(2,4,8,10-tetratert-butylbenzo[d][1,3,2]benzodioxaphosphepin-6-yl)oxypropyl]phenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCCOP2OC3=C(C=C(C=C3C=3C=C(C=C(C=3O2)C(C)(C)C)C(C)(C)C)C(C)(C)C)C(C)(C)C)=C1 MSXXDBCLAKQJQT-UHFFFAOYSA-N 0.000 description 1
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 1
- ZVVFVKJZNVSANF-UHFFFAOYSA-N 6-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]hexyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCCCCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 ZVVFVKJZNVSANF-UHFFFAOYSA-N 0.000 description 1
- HUKPVYBUJRAUAG-UHFFFAOYSA-N 7-benzo[a]phenalenone Chemical compound C1=CC(C(=O)C=2C3=CC=CC=2)=C2C3=CC=CC2=C1 HUKPVYBUJRAUAG-UHFFFAOYSA-N 0.000 description 1
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- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
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- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002879 Lewis base Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GMISHZVPHINJPA-UHFFFAOYSA-N N1=CN=CN=C1.NNC(NN)=O Chemical compound N1=CN=CN=C1.NNC(NN)=O GMISHZVPHINJPA-UHFFFAOYSA-N 0.000 description 1
- 241001597008 Nomeidae Species 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- WTKZEGDFNFYCGP-UHFFFAOYSA-N Pyrazole Chemical compound C=1C=NNC=1 WTKZEGDFNFYCGP-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- STLLXWLDRUVCHL-UHFFFAOYSA-N [2-[1-[2-hydroxy-3,5-bis(2-methylbutan-2-yl)phenyl]ethyl]-4,6-bis(2-methylbutan-2-yl)phenyl] prop-2-enoate Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(C(C)C=2C(=C(C=C(C=2)C(C)(C)CC)C(C)(C)CC)OC(=O)C=C)=C1O STLLXWLDRUVCHL-UHFFFAOYSA-N 0.000 description 1
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 1
- IORUEKDKNHHQAL-UHFFFAOYSA-N [2-tert-butyl-6-[(3-tert-butyl-2-hydroxy-5-methylphenyl)methyl]-4-methylphenyl] prop-2-enoate Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)OC(=O)C=C)=C1O IORUEKDKNHHQAL-UHFFFAOYSA-N 0.000 description 1
- SSOONFBDIYMPEU-UHFFFAOYSA-N [3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COCC(CO)(CO)COC(=O)C=C SSOONFBDIYMPEU-UHFFFAOYSA-N 0.000 description 1
- BEIOEBMXPVYLRY-UHFFFAOYSA-N [4-[4-bis(2,4-ditert-butylphenoxy)phosphanylphenyl]phenyl]-bis(2,4-ditert-butylphenoxy)phosphane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(C=1C=CC(=CC=1)C=1C=CC(=CC=1)P(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C BEIOEBMXPVYLRY-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 239000003429 antifungal agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- VKJLWXGJGDEGSO-UHFFFAOYSA-N barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[Ti+4].[Ba+2] VKJLWXGJGDEGSO-UHFFFAOYSA-N 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000012241 calcium silicate Nutrition 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical group O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 1
- ZBCKWHYWPLHBOK-UHFFFAOYSA-N cyclohexylphosphane Chemical compound PC1CCCCC1 ZBCKWHYWPLHBOK-UHFFFAOYSA-N 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- SQNZJJAZBFDUTD-UHFFFAOYSA-N durene Chemical compound CC1=CC(C)=C(C)C=C1C SQNZJJAZBFDUTD-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical group O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000007527 lewis bases Chemical class 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical group CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- MBAUOPQYSQVYJV-UHFFFAOYSA-N octyl 3-[4-hydroxy-3,5-di(propan-2-yl)phenyl]propanoate Chemical compound OC1=C(C=C(C=C1C(C)C)CCC(=O)OCCCCCCCC)C(C)C MBAUOPQYSQVYJV-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 235000014786 phosphorus Nutrition 0.000 description 1
- 108091008695 photoreceptors Proteins 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011856 silicon-based particle Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Abstract
The invention provides a first liquid and a second liquid of a two-liquid mixing type, wherein the first liquid and the second liquid have excellent storage stability and can prevent deviation of the reflectivity of an anti-corrosion film. The first liquid and the second liquid are used for obtaining a mixture, that is, a first liquid and a second liquid of a two-liquid mixing type of a photo-sensitive composition. The first liquid contains a carboxyl-containing polymerizable polymer, a polymerization initiator, titanium oxide, inorganic filler and an organic solvent. The second liquid contains a cyclic-ether-containing compound, titanium oxide and inorganic filler, and is free of an organic solvent. No more than 10% by weight of the photo-sensitive composition contains the organic solvent based on that the photo-sensitive composition contains 100% by weight of the whole organic solvent.
Description
Technical field
The present invention relates to a kind of two liquid mixed types for obtaining the i.e. photosensitive composite of mixture first,
Second liquid.More particularly it relates to one be preferred on substrate formed soldering-resistance layer or
Be equipped with on the substrate of light-emitting diode chip for backlight unit formed reflection light etchant resist two liquid mixed types first,
Second liquid.Moreover, it relates to a kind of first, second liquid employing above-mentioned two liquid mixed types
The manufacture method of printed wiring board.
Background technology
As the protecting film for protecting printed wiring board to damage from high temperature scolding tin, welding resistance is widely used
Film.
It addition, in various electronics applications, the upper surface at printed wiring board is equipped with light-emitting diodes
Pipe (hreinafter referred to as LED) chip.In the light sent from LED, up to go up in order to use
State the light of printed wiring board upper surface side, on the upper surface of printed wiring board, be sometimes formed with white resistance
Weldering film.Now, the surface from LED chip can not only be utilized to shine directly into contrary with printed wiring board
The light of side, additionally it is possible to utilize arrive printed wiring board upper surface side and by white solder masks reflect anti-
Penetrate light.Therefore, it is possible to improve the utilization ratio of the light produced by LED.
As an example of the material for forming above-mentioned white solder masks, in following patent documentation 1,
Disclosing a kind of erosion resistant, it contains, and to carry out dealcoholysis by epoxy resin and water-disintegrable alkoxy silane anti-
The silane-modified epoxy resin containing alkoxyl answered and obtain, and comprise further containing unsaturated group
Polycarboxylic acid resin, diluent, Photoepolymerizationinitiater initiater and solidification adaptation imparting agent.Can also resist at this
Corrosion material coordinates the filleies such as titanium oxide.
In following patent documentation 2, disclose a kind of comprise do not have aromatic rings containing carboxy resin, light
The white solder resist material of polymerization initiator, epoxide, Titanium Dioxide Rutile Top grade and diluent.
In following patent documentation 3, disclose a kind of mixing and the first of the two liquid mixed types that use, the
Two liquid.Prepare first, second liquid, make the photonasty group of mixture as first, second liquid
Compound entirety contains and has the polymerizable polymer of carboxyl, Photoepolymerizationinitiater initiater, has the change of cyclic ether group
Compound, titanium oxide and organic solvent.Above-mentioned photosensitive composite contain selected from dipropylene glycol monomethyl ether, two
Initial boiling point in ethylene glycol monoethylether acetate and distillation character is more than 150 DEG C and distills the end in character
Evaporate at least two in the Petroleum being a little less than 290 DEG C as above-mentioned organic solvent.Above-mentioned first liquid contains
There is above-mentioned polymerizable polymer, and containing selected from dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether acetas
And the initial boiling point in distillation character is more than 150 DEG C and distills the stone that the end point of distillation is less than 290 DEG C in character
At least one in cerebrol is as a part for above-mentioned organic solvent.Above-mentioned second liquid contains and above-mentioned has
The compound of cyclic ether group, and containing selected from diethylene glycol monoethyl ether acetas, dipropylene glycol monomethyl ether and
Initial boiling point in distillation character is more than 150 DEG C and distills the stone brain that the end point of distillation is less than 220 DEG C in character
At least one in oil is as a part for above-mentioned organic solvent.Above-mentioned first liquid contains above-mentioned photopolymerization
Initiator or containing above-mentioned titanium oxide or containing above-mentioned Photoepolymerizationinitiater initiater and above-mentioned both titanium oxides.
In the case of above-mentioned first liquid is without above-mentioned Photoepolymerizationinitiater initiater, above-mentioned second liquid contains
State Photoepolymerizationinitiater initiater, in the case of above-mentioned first liquid is without above-mentioned titanium oxide, above-mentioned second liquid
Containing above-mentioned titanium oxide.
Prior art literature
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2007-249148 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2007-322546 publication
Patent documentation 3:WO2012/111356A1
Summary of the invention
Invent technical problem to be solved
In existing erosion resistant as described in patent documentation 1～2, the problem that there is storage stability difference.
Further, the existing erosion resistant described in patent documentation 1～2 is coated on substrate make against corrosion
In the case of film, the reflectance of etchant resist produces deviation sometimes.
It addition, with first, second liquid phase ratio of two liquid mixed types described in patent documentation 3, preserve
Stability is further excellent and is further not likely to produce the erosion resistant of reflectivity deviation of etchant resist
The performance such as printed wiring board making to possess etchant resist improves.
It is an object of the invention to, it is provided that a kind of excellent storage stability and the reflection of etchant resist can be suppressed
First, second liquid of two liquid mixed types of the deviation of rate.It addition, it is an object of the invention to, it is provided that
A kind of use has the manufacture method of the printed wiring board of first, second liquid of above-mentioned two liquid mixed types.
For solving the technical scheme of technical problem
Aspect widely according to the present invention, it is possible to provide first, second liquid of a kind of two liquid mixed types (with
Under, sometimes referred to as first, second liquid), it is for obtaining the photosensitive composite as mixture
First, second liquid of two liquid mixed types, first, second liquid of this two liquid mixed type should for mixing
Liquid before first, second liquid, the mixture of described first, second liquid mixing is the most photosensitive
Property compositions entirety contains and has the polymerizable polymer of carboxyl, Photoepolymerizationinitiater initiater, has cyclic ether group
Compound, the titanium oxide inorganic filler different from titanium oxide and organic solvent, described first liquid contains
There is described in having the polymerizable polymer of carboxyl, described Photoepolymerizationinitiater initiater, described titanium oxide, described nothing
Machine filler and described organic solvent, described second liquid contain described in there is the compound of cyclic ether group, institute
Stating titanium oxide and described inorganic filler, described second liquid does not contains described organic solvent, or with described sense
Containing below 10 weight % in overall 100 weight % of described organic solvent contained in photosensitiveness compositions
State organic solvent.
In certain particular aspects of first, second liquid of the present invention, described second liquid is without described organic
Solvent.
In certain particular aspects of first, second liquid of the present invention, contained in described photosensitive composite
Described organic solvent contains dibasic acid ester.
In certain particular aspects of first, second liquid of the present invention, the mean diameter of described inorganic filler is
More than 0.1 μm and below 10 μm.
In certain particular aspects of first, second liquid of the present invention, the described oxidation in described first liquid
The content of the described titanium oxide in the content of titanium and described second liquid with mass ratio range as 20:80～80:20,
Described inorganic filler in the content of the described inorganic filler in described first liquid and described second liquid
Content is with mass ratio range as 20:80～80:20.
In certain particular aspects of first, second liquid of the present invention, described first, second liquid mixing and
The i.e. photosensitive composite entirety of mixture become contains polymerizable monomer.
In certain particular aspects of first, second liquid of the present invention, described first, second liquid is used for shape
Become soldering-resistance layer.
Aspect widely according to the present invention, it is possible to provide the manufacture method of a kind of printed wiring board, described print
Brush wiring plate possesses:
Have on surface the printed wiring board main body of circuit and be stacked on this printed wiring board main body be provided with electricity
Soldering-resistance layer on the surface on road,
The manufacture method of described printed wiring board includes following operation:
First, second liquid of above-mentioned two liquid mixed types is mixed, obtains described first, second liquid
The solder mask composition that body mixes i.e. photosensitive composite；With
Have on the surface being provided with circuit of printed wiring board main body of circuit from the teeth outwards, apply described
One, the solder mask composition that second liquid mixes i.e. photosensitive composite, is formed and is stacked on described print
Soldering-resistance layer on the surface being provided with described circuit of brush wiring board body.
The effect of invention
The mixture i.e. photosensitive composition of first, second liquid mixing of the two liquid mixed types of the present invention
Thing entirety contains and has the polymerizable polymer of carboxyl, Photoepolymerizationinitiater initiater, has the chemical combination of cyclic ether group
Inorganic filler that thing, titanium oxide are different from titanium oxide and organic solvent, described first liquid contains described
There is the polymerizable polymer of carboxyl, described Photoepolymerizationinitiater initiater, described titanium oxide, described inorganic filler
With described organic solvent, described second liquid contain described in there is the compound of cyclic ether group, described oxidation
Titanium and described inorganic filler, described second liquid does not contains described organic solvent, or with described photonasty group
Containing described organic below 10 weight % in overall 100 weight % of described organic solvent contained in compound
Solvent, therefore, the excellent storage stability of first, second liquid of two liquid mixed types, and can suppress to make
Deviation with the reflectance of the etchant resist of first, second liquid of two liquid mixed types.
Accompanying drawing explanation
Fig. 1 is to schematically show to have the two liquid mixed types employing an embodiment of the invention
Front cross-sectional view is blocked in the local of one example of the LED device of the etchant resist of first, second liquid.
[symbol description]
1 ... LED device
2 ... substrate
2a ... upper surface
3 ... etchant resist
3a ... upper surface
4a, 4b ... electrode
7 ... LED chip
7a ... lower surface
8a, 8b ... terminal
9a, 9b ... scolding tin
Detailed description of the invention
Hereinafter, the present invention is described in detail.
First, second liquid of the two liquid mixed types of the present invention is used for obtaining mixture i.e. photosensitive composite.
First, second liquid of the two liquid mixed types of the present invention is for obtaining the i.e. photosensitive composite of mixture
Combination (kit).First, second liquid of the two liquid mixed types of the present invention uses upon mixing.The two of the present invention
First, second liquid of liquid mixed type is the liquid before this first, second liquid mixing.Before mixing
First, second liquid be mixing before photosensitive composite.Being mixed with of the two liquid mixed types of the present invention
The mixture of first, second liquid i.e. photosensitive composite entirety contains the polymerizable polymer with carboxyl
(A), Photoepolymerizationinitiater initiater (B), there is the compound (C) of cyclic ether group, titanium oxide (D) and titanium oxide not
Same inorganic filler (E) and organic solvent (F).The mixture being mixed with above-mentioned first, second liquid is photosensitive
Property compositions, this photosensitive composite entirety being obtained by mixing contains above-mentioned (A)～(F) composition.
Above-mentioned first liquid contains above-mentioned polymerizable polymer (A), Photoepolymerizationinitiater initiater (B), titanium oxide
(D) (part for the titanium oxide (D) in photosensitive composite), inorganic filler (E) are (in photosensitive composite
A part for inorganic filler (E)) and organic solvent (F).
Above-mentioned second liquid contains and has the compound (C) of cyclic ether group, titanium oxide (D) (photosensitive composite
In the part of titanium oxide (D)) and inorganic filler (E) (of the inorganic filler (E) in photosensitive composite
Part).
Above-mentioned second liquid can contain organic solvent (F), it is also possible to without organic solvent (F).Above-mentioned second
Liquid does not contains organic solvent (F), or whole with described organic solvent (F) contained in described photosensitive composite
Containing organic solvent (F) below 10 weight % in body 100 weight %.Second liquid can be containing organic molten
Agent (F), but in the case of second liquid contains organic solvent (F), the content of organic solvent (F) is few.
It addition, first, second liquid in the two liquid mixed types of the present invention contains polymerizable monomer described later
Or containing in the case of antioxidant described later, polymerizable monomer and antioxidant may be embodied in the first liquid
In body, it is also possible to be included in second liquid, it is also possible to be included in first liquid and second liquid.
By the above-mentioned composition in first, second liquid of the two liquid mixed types of the employing present invention, Ke Yiti
The Combination of high above-mentioned first, second liquid.Further, by using above-mentioned composition, two liquid can be improved
The storage stability of first, second liquid of mixed type.Further, by using above-mentioned composition, can press down
System employs the deviation of the reflectance of the etchant resist of first, second liquid of two liquid mixed types.
As it has been described above, in the present invention that must use inorganic filler (E), make in first, second liquid
Composition is coordinated to play bigger effect in terms of being used for obtaining the effect of the present invention.
Hereinafter, first, second liquid and the mixed photonasty group to the two liquid mixed types of the present invention
Each composition contained in compound is described in detail.
(polymerizable polymer (A))
Above-mentioned polymerizable polymer (A) has carboxyl.The polymerizable polymer (A) with carboxyl has polymerization
Property, may be polymerized.By above-mentioned polymerizable polymer (A), there is carboxyl, the development of photosensitive composite
Property becomes good.As above-mentioned polymerizable polymer (A), such as, can enumerate: there is the acrylic acid of carboxyl
Resin, there is the epoxy resin of carboxyl and there is the olefin resin of carboxyl.It should be noted that " resin "
It is not limited to hard resin, also comprises fluid resin and oligomer.
Above-mentioned polymerizable polymer (A) is preferably following carboxylic resin (a)～(e).
A () carries out copolymerization by unsaturated carboxylic acid and the compound with polymerism unsaturated double-bond and obtains
Carboxylic resin
B () is by having oxirane in (methyl) acrylic copolymeric resin (b1) containing carboxyl and 1 molecule
The reaction of the compound (b2) of ring and olefinic polymerism unsaturated double-bond and the carboxylic resin that obtains
C () makes to be respectively provided with 1 epoxy radicals in unsaturated monocarboxylic and 1 molecule and polymerism is unsaturated double
After the copolymer reaction that the compound of key and the compound with polymerism unsaturated double-bond are formed, make generation
The secondary hydroxyl of reactant react with saturated or unsaturated multi-anhydride and the carboxylic resin that obtains
D () makes the polymer reaction of saturated or unsaturated multi-anhydride and hydroxyl after, make generation has carboxylic
The compound being respectively provided with 1 epoxy radicals and polymerism unsaturated double-bond in the polymer of base and 1 molecule is anti-
Should and obtain containing hydroxyl and the resin of carboxyl
E () makes the carboxylic compound at least with 1 unsaturated double-bond and the epoxidation with aromatic rings
Compound and saturated polybasic acid acid anhydride or unsaturated multi-anhydride reaction and the resin that obtains or there is aromatic rings
Epoxide react after, make saturated polybasic acid acid anhydride or the reaction of unsaturated multi-anhydride further and
The resin obtained
In above-mentioned photosensitive composite 100 weight %, above-mentioned polymerizable polymer (A) with carboxyl contains
Amount is preferably more than 3 weight %, more than more preferably 5 weight %, below preferably 50 weight %, more
It is preferably below 40 weight %.If the content of the above-mentioned polymerizable polymer (A) with carboxyl is above-mentioned lower limit
Above and below the above-mentioned upper limit, then the curable of photosensitive composite becomes good.
(Photoepolymerizationinitiater initiater (B))
Above-mentioned photosensitive composite contains Photoepolymerizationinitiater initiater (B), therefore, can make photosensitive by the irradiation of light
Property compositions solidification.Photoepolymerizationinitiater initiater (B) is not particularly limited.Photoepolymerizationinitiater initiater (B) can individually make
By one, it is also possible to be applied in combination two or more.
As above-mentioned Photoepolymerizationinitiater initiater (B), such as, can enumerate: acylphosphine oxide, halomethylation triazine,
Halomethylation diazole, imidazoles, benzoin, benzoin alkylether, anthraquinone, benzanthrone, hexichol first
Ketone, 1-Phenylethanone., thiaxanthone, benzoate, acridine, azophenlyene, titanocenes, alpha-aminoalkyl benzophenone,
Oxime and their derivant.Above-mentioned Photoepolymerizationinitiater initiater (B) can be used alone one, it is also possible to combination makes
With two or more.
From further improving the thermostability of etchant resist and light resistance, further suppression etchant resist surface
From the viewpoint of adhesion, preferably acylphosphine oxide class Photoepolymerizationinitiater initiater.
In above-mentioned photosensitive composite, relative to above-mentioned polymerizable polymer (A) 100 weight with carboxyl
Part, the content of above-mentioned Photoepolymerizationinitiater initiater (B) is preferably more than 0.1 weight portion, more preferably 1 weight portion
Above, below preferably 30 weight portions, below more preferably 15 weight portions.If above-mentioned photopolymerization causes
The content of agent (B) is below more than above-mentioned lower limit and the above-mentioned upper limit, then can further improve photosensitive composition
The photonasty of thing.
(there is the compound (C) of cyclic ether group)
For improving the purpose cutting out processability etc. of etchant resist, above-mentioned photosensitive composite contains and has ring
The compound (C) of shape ether.It addition, by using the above-mentioned compound (C) with cyclic ether group, photonasty
The curable of compositions becomes good.
As the above-mentioned compound (C) with cyclic ether group, such as, can enumerate: bisphenol-s epoxy resin,
The hetero ring type epoxy resin such as o-phthalic acid diglycidyl ester resin, triglycidyl isocyanurate,
Bis-xylene phenol-type epoxy resin, bisphenol-type epoxy resin, four glycidyl group xylenols ethane resin,
Bisphenol A type epoxy resin, bisphenol-A epoxy resin, bisphenol F type resin, bmminated bisphenol-A type
Epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, ester ring type ring
Epoxy resins, the phenolic resin varnish type epoxy resin of bisphenol-A, chelating type epoxy resin, Biformyl type asphalt mixtures modified by epoxy resin
Fat, epoxy resin containing amino, rubber modified epoxy resin, dicyclopentadiene phenolic type epoxy resin,
Polysiloxane modified epoxy resin and 6-caprolactone modified epoxy.The above-mentioned chemical combination with cyclic ether group
Thing (C) can be used alone one, it is also possible to is applied in combination two or more.
The above-mentioned compound (C) with cyclic ether group is had with the above-mentioned polymerizable polymer (A) with carboxyl
Some carboxyl reactions, and play a role and make photosensitive composite solidify.The above-mentioned chemical combination with cyclic ether group
Thing (C) is preferably epoxide.
In above-mentioned photosensitive composite, relative to above-mentioned polymerizable polymer (A) 100 weight with carboxyl
Part, the content of the above-mentioned compound (C) with cyclic ether group is preferably more than 0.1 weight portion, more preferably
More than 1 weight portion, below preferably 50 weight portions, below more preferably 30 weight portions.Have if above-mentioned
The content of the compound (C) of cyclic ether group is below more than above-mentioned lower limit and the above-mentioned upper limit, then can be further
Improve the electrical insulating property of etchant resist.
(titanium oxide (D))
Above-mentioned photosensitive composite contains titanium oxide (D), therefore, can form the high soldering-resistance layer of reflectance etc. and resist
Erosion film.Titanium oxide (D) contained in above-mentioned photosensitive composite is not particularly limited.Titanium oxide (D) can be single
Solely use one, it is also possible to be applied in combination two or more.
Compared with the situation of other inorganic filler used beyond titanium oxide (D), by using above-mentioned titanium oxide
(D), the etchant resist that reflectance is high can be formed.
Above-mentioned titanium oxide (D) is preferably Titanium Dioxide Rutile Top grade or anatase-type titanium oxide.By using golden red
Stone-type titanium oxide, can form the etchant resist that heat-resisting xanthochromia is further excellent.Above-mentioned Detitanium-ore-type aoxidizes
Titanium is lower than the hardness of Titanium Dioxide Rutile Top grade.Therefore, by using anatase-type titanium oxide, can improve
The processability of etchant resist.
It addition, from the storage stability of first, second liquid that can further improve two liquid mixed types,
And from the viewpoint of further suppressing the deviation of reflectance of etchant resist, above-mentioned titanium oxide (D) preferably comprises
Titanium Dioxide Rutile Top grade.
Above-mentioned titanium oxide (D) preferably comprises and has carried out surface by Si oxide or polysiloxane compound
The Titanium Dioxide Rutile Top grade of reason.In above-mentioned titanium oxide (D) 100 weight %, by above-mentioned Si oxide or poly-
Silicone compounds carried out the content of Titanium Dioxide Rutile Top grade that surface processes be preferably 10 weight % with
On, more than more preferably 30 weight % and below 100 weight %.The total amount of above-mentioned titanium oxide (D) can be
The Titanium Dioxide Rutile Top grade that surface processes has been carried out by above-mentioned Si oxide or polysiloxane compound.Logical
Cross to use and carried out, by above-mentioned Si oxide or polysiloxane compound, the rutile-type oxidation that surface processes
Titanium, can further improve the heat-resisting xanthochromia of etchant resist.
The rutile-type oxidation that surface processes has been carried out as by Si oxide or polysiloxane compound
Titanium, such as, can enumerate: the marque that rutile chlorine method titanium oxide Ji Shiyuan industry companies manufactures:
The marque that CR-90 or rutile sulfuric acid process titanium oxide Ji Shiyuan industry companies manufacture: R-550 etc..
The mean diameter of above-mentioned titanium oxide (D) is preferably more than 0.1 μm, and more than more preferably 0.15 μm,
It is preferably below 1.0 μm, below more preferably 0.5 μm.
Mean diameter in above-mentioned titanium oxide (D) is that in volume reference size distribution curve, accumulated value is 50%
Time particle size values.This mean diameter such as can use laser type particle size distribution meter to measure.As this laser type
The commercially available prod of particle size distribution meter, can enumerate: " LS 13 320 " that Beckman Coulter company manufactures
Deng.
In above-mentioned photosensitive composite 100 weight %, the content of titanium oxide (D) and Titanium Dioxide Rutile Top grade divides
You Xuanwei be more than 3 weight %, more than more preferably 10 weight %, more preferably 15 weight % with
On, below preferably 80 weight %, below more preferably 75 weight %, more preferably 70 weight
Below %.If the content of titanium oxide (D) and Titanium Dioxide Rutile Top grade be more than above-mentioned lower limit and the above-mentioned upper limit with
Under, then when etchant resist is exposed to high temperature, it is not susceptible to xanthochromia.Further, can easily prepare have suitable
Photosensitive composite in the viscosity of coating.
It addition, the titanium oxide (D) in the content of titanium oxide (D) in above-mentioned first liquid and above-mentioned second liquid
Content with the weight ratio (content of the titanium oxide (D) in first liquid: the titanium oxide (D) in second liquid
Content) meter preferably 20:80～80:20, more preferably 50:50～75:25.
(inorganic filler (E))
Above-mentioned inorganic filler (E) is the inorganic filler different from titanium oxide.Above-mentioned inorganic filler (E) can be independent
Use one, it is also possible to be applied in combination two or more.
As the concrete example of above-mentioned inorganic filler (E), can enumerate: silicon dioxide, aluminium oxide, Muscovitum,
Beryllium oxide, potassium titanate, Barium metatitanate., strontium titanates, calcium titanate, zirconium oxide, stibium oxide, Alborex M 12, hydrogen
Aluminium oxide, magnesium oxide, calcium carbonate, magnesium carbonate, aluminium carbonate, calcium silicates, aluminium silicate, magnesium silicate, phosphorus
Clay, Talcum, the carborundums such as acid calcium, calcium sulfate, barium sulfate, silicon nitride, boron nitride, calcined clay
And silicon particle etc..Above-mentioned inorganic filler (E) can be used alone one, it is also possible to is applied in combination two or more.
From further improving the thermostability of etchant resist and light resistance, further suppressing the surface of etchant resist
From the viewpoint of adhesion, above-mentioned photosensitive composite preferably comprises Talcum or silicon dioxide, more preferably contains
Silicon dioxide.Above-mentioned photosensitive composite can contain Talcum.
The mean diameter of above-mentioned inorganic filler (E) is preferably more than 0.1 μm, and more than more preferably 0.2 μm,
It is preferably below 10 μm, below more preferably 5 μm.
Mean diameter in above-mentioned inorganic filler (E) is that in volume reference size distribution curve, accumulated value is 50%
Time particle size values.This mean diameter such as can use laser type particle size distribution meter to measure.As this laser type
The commercially available prod of particle size distribution meter, can enumerate: " LS 13 320 " that Beckman Coulter company manufactures
Deng.
In above-mentioned photosensitive composite 100 weight %, the content of above-mentioned inorganic filler (E) and Talcum and dioxy
The total content of SiClx is respectively preferably more than 0.1 weight %, more than more preferably 1 weight %, the most excellent
Elect more than 3 weight % as, below preferably 50 weight %, below more preferably 30 weight %, further
It is preferably below 10 weight %.If the content of above-mentioned inorganic filler (E) and Talcum and the total content of silicon dioxide
For more than above-mentioned lower limit and below the above-mentioned upper limit, then thermostability and the light resistance of etchant resist further uprises,
Can further suppress surface adhering.
In above-mentioned photosensitive composite 100 weight %, above-mentioned titanium oxide (D) and above-mentioned inorganic filler (E) total
Content is preferably more than 5 weight %, and more than more preferably 10 weight %, more preferably 20 weight %
Above, below preferably 80 weight %, below more preferably 60 weight %, more preferably 40 weight
Amount below %.If the total content of above-mentioned titanium oxide (D) and above-mentioned inorganic filler (E) be more than above-mentioned lower limit and on
State below the upper limit, then thermostability and the light resistance of etchant resist further uprises, and can further suppress table
Adhere in face.
In above-mentioned photosensitive composite, the weight ratio of the content of above-mentioned titanium oxide (D) and above-mentioned inorganic filler (E)
(content of titanium oxide (D): the content of inorganic filler (E)) is preferably 0.1:99.9～99.9:0.1, more preferably
1:99～99:1, more preferably 10:90～90:10.
It addition, inorganic in the content of inorganic filler (E) in above-mentioned first liquid and above-mentioned second liquid is filled out
The content of material (E) is with the weight ratio (content of the inorganic filler (E) in first liquid: inorganic in second liquid is filled out
The content of material (E)) meter preferably 20:80～80:20, more preferably 30:70～50:50.
(organic solvent (F))
Above-mentioned photosensitive composite contains organic solvent (F).The sense of above-mentioned first, second liquid mixing
Photosensitiveness compositions contains organic solvent (F).Above-mentioned photosensitive composite contains at least 2 kinds of organic solvents.Have
Machine solvent (F) can be used alone one, it is also possible to combines two or more.
As commonly known organic solvent, can enumerate: the ketone such as methyl ethyl ketone, Ketohexamethylene；First
Benzene, dimethylbenzene, durol etc. are aromatic hydrocarbon；Cellosolve, methyl cellosolve, butyl cellosolve,
Carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropyl
The glycol ethers such as glycol diethyl ether, Tripropylene glycol monomethyl Ether；Ethyl acetate, butyl acetate, butyl lactate,
Cellosolve acetate, butyl cellosolve acetate, carbitol acetate, acetate of butyl carbitol, third
Glycol monomethylether acetate, diethylene glycol monoethyl ether acetas, dipropylene glycol monomethyl ether acetas, carbonic acid
The esters such as sub-propyl ester；The aliphatic hydrocarbon such as octane, decane；The petroleum solvents such as petroleum ether, Petroleum with
And dibasic acid ester etc..Above-mentioned dibasic acid ester is the solvent being referred to as DBE.
Above-mentioned photosensitive composite preferably comprises dibasic acid ester, dipropylene glycol monomethyl ether, diethylene glycol list second
Initial boiling point in ether acetic acid ester or distillation character is more than 150 DEG C and the end point of distillation that distills in character is 290 DEG C
Following Petroleum is as above-mentioned organic solvent (F).Now, the of two liquid mixed types can further be improved
One, the storage stability of second liquid, and, can further suppress to employ the of two liquid mixed types
One, the deviation of the reflectance of the etchant resist of second liquid.Contained in above-mentioned photosensitive composite above-mentioned have
Machine solvent (F) preferably comprises dibasic acid ester.
Above-mentioned first liquid preferably comprises dibasic acid ester, dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether second
Initial boiling point in acid esters or distillation character is more than 150 DEG C and the end point of distillation that distills in character is less than 290 DEG C
Petroleum as above-mentioned organic solvent (F).Above-mentioned organic solvent (F) contained in above-mentioned first liquid is preferred
Containing dibasic acid ester.
Above-mentioned second liquid can contain above-mentioned organic solvent (F), it is also possible to without above-mentioned organic solvent (F).
The content of the above-mentioned organic solvent (F) in above-mentioned second liquid is the most less.Contain at above-mentioned second liquid
In the case of stating organic solvent (F), above-mentioned second liquid preferably comprise dibasic acid ester, dipropylene glycol monomethyl ether,
Initial boiling point in diethylene glycol monoethyl ether acetas or distillation character is more than 150 DEG C and distills in character
The end point of distillation is that the Petroleum of less than 290 DEG C is as above-mentioned organic solvent (F).Contained by above-mentioned second liquid
Above-mentioned organic solvent (F) can contain dibasic acid ester.
As above-mentioned organic solvent (F), it is possible to use dibasic acid ester, it is possible to use dipropylene glycol monomethyl ether,
Diethylene glycol monoethyl ether acetas can be used, it is possible to use distillation character in initial boiling point be 150 DEG C with
The Petroleum that the end point of distillation is less than 290 DEG C above and in distillation character.
Above-mentioned " initial boiling point in distillation character " and above-mentioned " end point of distillation in distillation character " refers to pass through JIS
The value that K2254 " petroleum product-distillation test method " records.
The organic solvent that the content of the organic solvent (F) in above-mentioned second liquid is contained in photosensitive composite
(F) entirety 100 weight % is preferably below 5 weight %, below more preferably 1 weight %.
In first, second overall 100 weight % of liquid of two liquid mixed types and mixed photonasty group
In compound 100 weight %, the content of organic solvent (F) is preferably more than 5 weight %, more preferably 10 weights
Amount more than %, below preferably 50 weight %, below more preferably 30 weight %.
(other composition)
In order to further improve curable, above-mentioned photosensitive composite preferably comprises polymerizable monomer conduct
The composition different from the polymerizable polymer (A) with carboxyl.Above-mentioned photosensitive composite preferably comprises to be had
Both the polymerizable polymer (A) of carboxyl and polymerizable monomer.Above-mentioned polymerizable monomer has polymerism,
May be polymerized.Above-mentioned polymerizable monomer is not particularly limited.Above-mentioned polymerizable monomer can be used alone
A kind of, it is also possible to be applied in combination two or more.
Above-mentioned polymerizable monomer is preferably the monomer containing polymerism unsaturated group.As above-mentioned polymerism
Polymerism unsaturated group in monomer, such as, can enumerate: (methyl) acryloyl group and vinyl ether group etc.
There is the functional group of polymerism unsaturated double-bond.Due to (methyl) acryloyl group, can to improve the crosslinking of etchant resist close
Degree, therefore preferably.
The above-mentioned monomer containing polymerism unsaturated group preferably has the compound of (methyl) acryloyl group.
As the above-mentioned compound with (methyl) acryloyl group, can enumerate: ethylene glycol, methoxyl group TEG,
Two (methyl) the acrylate modified thing of the alcohol such as Polyethylene Glycol or propylene glycol or polyhydric alcohol, the ring of polyhydric alcohol
Polynary (methyl) the acrylate modified thing of the propylene oxide adduct of oxidative ethane addition product or polyhydric alcohol or
(methyl) of the propylene oxide adduct of phenol, the ethylene oxide adduct of phenol or phenol is acrylate modified
Thing or the (first of the glycidyl ether such as glycerin diglycidyl ether or trihydroxymethylpropanyltri diglycidyl ether
Base) acrylate modified thing or tripolycyanamide (methyl) acrylate.
As above-mentioned polyhydric alcohol, such as, can enumerate: hexanediol, trimethylolpropane, tetramethylolmethane,
Dipentaerythritol and tris(2-hydroxy ethyl)isocyanurate.As (methyl) acrylate of above-mentioned phenol, such as may be used
To enumerate: two (methyl) acrylate modified thing of (methyl) acrylic acid phenoxy group ester and bisphenol-A.
" (methyl) acryloyl group " refers to acryloyl group and methylacryloyl." (methyl) acrylic acid " refers to third
Olefin(e) acid and methacrylic acid." (methyl) acrylate " refers to acrylate and methacrylate.
In the case of containing above-mentioned polymerizable monomer, at this polymerizable monomer with above-mentioned there is the poly-of carboxyl
Close property polymer (A) amount in 100 weight %, the content of above-mentioned polymerizable monomer be preferably 5 weight % with
On, below preferably 50 weight %.If the content of above-mentioned polymerizable monomer is more than above-mentioned lower limit and above-mentioned
Below the upper limit, then photosensitive composite can be made fully to solidify.Further, the crosslink density of etchant resist becomes suitable
When, sufficient exploring degree can be obtained, and etchant resist is not susceptible to xanthochromia.
Above-mentioned polymerizable monomer can be contained in first liquid, it is also possible to is contained in second liquid, also
Can be contained in both first liquid and second liquid.
The risk of soldering-resistance layer generation xanthochromia when being exposed to high temperature to reduce, above-mentioned photosensitive composite is preferred
Containing antioxidant.Above-mentioned antioxidant preferably has lewis base property position.From further suppressing anti-
From the viewpoint of erosion film xanthochromia, above-mentioned antioxidant is preferably selected from phenol antioxidant, Phosphorus antioxidation
At least one in agent and amine antioxidants.Examine from the viewpoint further suppressing etchant resist generation xanthochromia
Considering, above-mentioned antioxidant is preferably phenol antioxidant.That is, above-mentioned photosensitive composite preferably comprises phenol
Class antioxidant.
As the commercially available prod of above-mentioned phenol antioxidant, can enumerate: IRGANOX 1010,
IRGANOX 1035、IRGANOX 1076、IRGANOX 1135、IRGANOX 245、
IRGANOX 259 and IRGANOX 295 (be above Ciba Japan company manufacture),
ADEKASTAB AO-30、ADEKASTAB AO-40、ADEKASTAB AO-50、
ADEKASTAB AO-60、ADEKASTAB AO-70、ADEKASTAB AO-80、
ADEKASTAB AO-90 and ADEKASTAB AO-330 (being ADEKA company above to manufacture),
Sumilizer GA-80、Sumilizer MDP-S、Sumilizer BBM-S、Sumilizer GM、Sumilizer
GS (F) and Sumilizer GP (be above Sumitomo Chemical Co. Ltd. manufacture), HOSTANOX O10,
HOSTANOX O16, HOSTANOX O14 and HOSTANOX O3 (are Clariant public above
Department manufacture), Antage BHT, Antage W-300, Antage W-400 and Antage W500 (the most equal
For chemical industrial company of Kawaguchi manufacture) and SEENOX 224M and SEENOX 326M (be above
Shipro is melted into company and manufactures) etc..
As above-mentioned phosphorus antioxidants, can enumerate: cyclohexyl phosphine and triphenylphosphine etc..As above-mentioned
The commercially available prod of phosphorus antioxidants, can enumerate: ADEKASTAB PEP-4C, ADEKASTAB
PEP-8、ADEKASTAB PEP-24G、ADEKASTAB PEP-36、ADEKASTAB HP-10、
ADEKASTAB 2112、ADEKASTAB 260、ADEKASTAB 522A、ADEKASTAB
1178、ADEKASTAB 1500、ADEKASTAB C、ADEKASTAB 135A、
ADEKASTAB 3010 and ADEKASTAB TPP (being ADEKA company above to manufacture),
Sandostab P-EPQ and Hostanox PAR24 (be above Clariant company manufacture) and
JP-312L, JP-318-0, JPM-308, JPM-313, JPP-613M, JPP-31, JPP-2000PT and
JPH-3800 (being north of the city chemical industrial company above to manufacture) etc..
As above-mentioned amine antioxidants, can enumerate: triethylamine, double cyanogen diamidogen, tripolycyanamide, second
Base diaminourea s-triazine, 2,4-diaminourea s-triazine, 2,4-diaminourea-6-tolyl s-triazine, 2,4-diamino
Base-6-xylyl s-triazine and quaternary ammonium salt derivative etc..
Relative to above-mentioned polymerizable polymer (A) 100 weight portion with carboxyl, containing of above-mentioned antioxidant
Amount is preferably more than 0.1 weight portion, more than more preferably 5 weight portions, below preferably 30 weight portions,
Below more preferably 15 weight portions.If the content of above-mentioned antioxidant is below more than above-mentioned lower limit and the upper limit,
Then can form the etchant resist that heat-resisting xanthochromia is further excellent.
It addition, above-mentioned photosensitive composite can also contain coloring agent, filler, defoamer, firming agent,
Curing accelerator, releasing agent, surface conditioning agent, fire retardant, viscosity modifier, dispersant, dispersion help
Agent, surface modifier, plasticizer, antibacterial, antifungus agent, levelling agent, stabilizer, coupling agent, anti-
Sagging agent or fluorophor etc..
Above-mentioned photosensitive composite such as can be by after stirring mixes each gradation composition, by using three
Roller machine carries out mixing to prepare equably.
As for making the light source that above-mentioned photosensitive composite solidifies, can enumerate: send ultraviolet or can
See the irradiation unit of light isoreactivity energy line.As above-mentioned light source, such as, can enumerate: high-pressure water
Silver lamp, DeepUV lamp, high-pressure mercury-vapor lamp, low pressure mercury lamp, metal halide lamp and excimer laser.
These light sources suitably can select according to the wavelength photoreceptor of the constituent of photosensitive composite.The irradiation of light
Energy suitably can select according to the constituent of desired thickness or photosensitive composite.The irradiation energy of light
Amount is general 10～3000mJ/cm2In the range of.
(LED device)
First, second liquid of the two liquid mixed types of the present invention is preferably used to form the etchant resist of LED device,
It is more preferably used for forming soldering-resistance layer.First, second liquid of the two liquid mixed types of the present invention is the most against corrosion
Agent compositions, preferably solder mask composition.
The manufacture method of the printed wiring board of the present invention is the manufacture method manufacturing following printed wiring board, institute
State printed wiring board to possess: there is on surface the printed wiring board main body of circuit and be stacked on this printed wiring
Etchant resist on the surface being provided with foregoing circuit of plate main body.This etchant resist is by the two liquid mixed types of the present invention
First, second liquid formed.
In FIG, block front cross-sectional view with local to schematically show to have and use one of the present invention
One example of the LED device of the etchant resist that first, second liquid of two liquid mixed types of embodiment is formed
Son.
In the LED device 1 shown in Fig. 1, the upper surface 2a superimposed layer at substrate 2 has and is mixed by two liquid
The etchant resist 3 that first, second liquid of mould assembly is formed.Etchant resist 3 is pattern film.Therefore, at substrate 2
Upper surface 2a a part of region in, be formed without etchant resist 3.Etchant resist is not formed at substrate 2
The upper surface 2a of 3 parts is provided with electrode 4a and electrode 4b.Substrate 2 is preferably printed wiring board main body.
Upper surface 3a superimposed layer at etchant resist 3 has LED chip 7.On a substrate 2 across etchant resist 3
Lamination has LED chip 7.It is provided with terminal 8a and terminal in the outer peripheral edge of the lower surface 7a of LED chip 7
8b.Terminal 8a and terminal 8b is electrically connected by scolding tin 9a and scolding tin 9b and electrode 4a and electrode 4b.
By this electrical connection, LED chip 7 can be supplied electric power.
Hereinafter, specific embodiment and comparative example by enumerating the present invention carry out the clear and definite present invention.
In embodiment and comparative example, use following material 1)～11).
1) acrylate copolymer 1 (has third obtained in the polymerizable polymer of carboxyl, following synthesis example 1
Olefin(e) acid polymer 1)
(synthesis example 1)
The flask possessing thermometer, blender, Dropping funnel and reflux condenser is put into as solvent
Ethylcarbitol acetate and as the azodiisobutyronitrile of catalyst, be heated to 80 DEG C under nitrogen atmosphere,
The mixed in molar ratio methacryloxyethyl acid with 30:70 and the list of methyl methacrylate is dripped with 2 hours
Body.After dropping, stir 1 hour, temperature is risen to 120 DEG C.Then, cool down.Add propylene
Acid glycidyl ester, its mole is 10 with the ratio of the integral molar quantity of the total monomer units of the resin obtained,
Use Tetrabutylammonium bromide as catalyst, heat 30 hours at 100 DEG C, make glycidyl
Ester and carboxyl carry out additive reaction.After cooling, take out from flask, obtain containing 50 weight % (non-volatile
Composition) solid constituent acid number 60mgKOH/g, weight average molecular weight 15000, the containing of double bond equivalent 1000
The solution of carboxy resin.Hereinafter, this solution is referred to as acrylate copolymer 1.
2) DPHA (acrylic monomers, dipentaerythritol acrylate)
3) 828 (bisphenol A type epoxy resin, Mitsubishi Chemical Ind manufacture)
4) TPO (optical free radical producing agent i.e. Photoepolymerizationinitiater initiater, BASF Japan company manufacture)
5) CR-50 (Titanium Dioxide Rutile Top grade that titanium oxide, Shi Yuan industry companies manufacture, utilize chlorine method to manufacture)
6) FH105 (Talcum, talc company of Fuji manufacture)
7) 5X (silicon dioxide, Long Sen company manufacture)
8) KS-7710 (complex silicone oil, polydimethylsiloxane, chemical industrial company of SHIN-ETSU HANTOTAI manufacture)
9) ethylcarbitol acetate (diethylene glycol monoethyl ether acetas, Diacel company manufacture)
10) dipropylene glycol monomethyl ether (emulsifying agent company of Japan manufactures)
11) DBE (dibasic acid ester, three chemical companies of association manufacture)
(embodiment 1)
Coordinate acrylate copolymer 1, TPO (the optical free radical producing agent of 2g obtained in 15g synthesis example 1
I.e. Photoepolymerizationinitiater initiater, BASF Japan company manufactures), (it is public that titanium oxide, stone originate in industry to the CR-50 of 30g
Department manufactures), the ethylcarbitol acetate of 30g (diethylene glycol monoethyl ether acetas, Diacel company manufacture),
The KS-7710 of the FH105 of 5g (Talcum, talc company of Fuji manufacture) and 1g (complex silicone oil, poly-two
Methylsiloxane, chemical industrial company of SHIN-ETSU HANTOTAI manufacture), (practice Taro ARE-310, Thinky with mixer
Company manufactures) after mixing 3 minutes, mix with three rollers, thus obtain mixture.Then, ARE-310 is used
To the mixture deaeration obtained 3 minutes, thus obtain first liquid.
Coordinate 828 (bisphenol A type epoxy resin, Mitsubishi Chemical Ind manufacture) of 8g, the DPHA (two of 5g
Tetramethylolmethane six acrylate), 5gFH105 (Talcum, talc company of Fuji manufacture) and 10gCR-50 (aoxidizes
Titanium, Shi Yuan industry companies manufacture), with mixer (practice Taro ARE-310, Thinky company manufacture) mixing
After 3 minutes, with 3 roller mixing, obtain mixture.Then, the ARE-310 mixing to obtaining is used
Thing deaeration 3 minutes, thus obtains second liquid.
First, second liquid of the two liquid mixed types with first, second liquid prepared above is (before mixing
Photosensitive composite).
(embodiment 2～9 and comparative example 1,2)
By the kind of material used in first liquid and second liquid and use level as described in Table 1
Change like that, in addition, obtain that there is the two of first, second liquid similarly to Example 1
First, second liquid (photosensitive composite before mixing) of liquid mixed type.
(evaluation)
(1) storage stability
As above first, second liquid obtained is put into plastic containers (nearly Ji Vessel Inc manufacture,
BHS-1200), at room temperature stand 6 months, then, take 2g from first, second liquid respectively
The liquid of clear liquid and container bottom part, in crucible, carries out 2 hours burning till at 550 DEG C, following formula calculates
Ash.
Liquid weight × 100 before liquid weight after ash (%)=burn till/burn till
The difference that ash according to the supernatant obtained by above-mentioned formula and the liquid of container bottom part divides, by following
Standard determination storage stability.
[determinating reference of storage stability]
Zero: the difference of ash point is less than 0.1%
△: the difference of ash point is 0.1% less than 0.5%
×: the difference of ash point is more than 0.5%
(2) deviation of the reflectance of etchant resist
Measure the making of sample
First liquid and second liquid are put into 1L round plastic containers (nearly Ji Vessel Inc manufacture,
BHS-1200), the automatic ink mixer utilizing Mesh company to manufacture stirs 10 seconds with 50rpm, system
Make erosion resistant (mixed photosensitive composite).
Prepare 510mm × 610mm, the FR-4 substrate of thickness 0.8mm.By being screen printed onto this base
Use the version that 100 mesh polyester biass manufacture on plate, and print erosion resistant with full version pattern.After printing,
It is dried 20 minutes in the baking oven of 80 DEG C, substrate is formed erosion resistant layer.Then, across having finger
Determine the photomask of pattern, use ultraviolet lamp with 100mW/cm2Ultraviolet illumination to material against corrosion
The bed of material irradiates the ultraviolet of 4 seconds wavelength 365nm so that irradiation energy is 400mJ/cm2.Then, for
The erosion resistant layer in removing unexposed portion and form pattern, erosion resistant layer is impregnated into the 1 of sodium carbonate
Weight % aqueous solution develops, substrate is formed etchant resist.Then, add in the baking oven of 150 DEG C
Heat solidifies after within 1 hour, making etchant resist carry out, and thus obtains as the etchant resist measuring sample.Obtain is anti-
The thickness of erosion film is 20 μm.
Use color/colour difference meter (Konica Minoluta company manufacture, CR-400) to 510mm × 610mm
Measure 4 angle parts of sample and middle body amounts to the value measuring reflectance at 5.
[determinating reference of the deviation of the reflectance of etchant resist]
Zero: standard deviation is less than 0.5
△: standard deviation is 0.5 less than 1.0
×: standard deviation is more than 1.0
Composition and result are shown in table 1 below.
Claims (8)
1. first, second liquid of two liquid mixed types, it is used for obtaining mixture i.e. photosensitive composite,
First, second liquid of this two liquid mixed type is the liquid before this first, second liquid mixing,
The i.e. photosensitive composite entirety of mixture of described first, second liquid mixing contains:
There is the polymerizable polymer of carboxyl, Photoepolymerizationinitiater initiater, there is the compound of cyclic ether group, oxygen
Change the titanium inorganic filler different from titanium oxide and organic solvent,
Described first liquid contains:
Described have the polymerizable polymer of carboxyl, described Photoepolymerizationinitiater initiater, described titanium oxide, described
Inorganic filler and described organic solvent,
Described second liquid contains:
Described have the compound of cyclic ether group, described titanium oxide and described inorganic filler,
Described second liquid does not contains described organic solvent, or with institute contained in described photosensitive composite
State below 10 weight % in overall 100 weight % of organic solvent containing described organic solvent.
First, second liquid of two liquid mixed types the most according to claim 1, wherein, described
Second liquid does not contains described organic solvent.
First, second liquid of two liquid mixed types the most according to claim 1, wherein, described
Described organic solvent contained in photosensitive composite contains dibasic acid ester.
4. according to first, second liquid of two liquid mixed types according to any one of claims 1 to 3,
Wherein, the mean diameter of described inorganic filler is below more than 0.1 μm and 10 μm.
5. according to first, second liquid of two liquid mixed types according to any one of claims 1 to 3,
Wherein,
Described titanium oxide in the content of the described titanium oxide in described first liquid and described second liquid
Content with mass ratio range as 20:80～80:20,
Described inorganic in the content of the described inorganic filler in described first liquid and described second liquid
The content of filler is with mass ratio range as 20:80～80:20.
6. according to first, second liquid of two liquid mixed types according to any one of claims 1 to 3,
Wherein, the i.e. photosensitive composite entirety of mixture of described first, second liquid mixing contains polymerization
Property monomer.
7. according to first, second liquid of two liquid mixed types according to any one of claims 1 to 3,
Wherein, first, second liquid of described two liquid mixed types is used for forming soldering-resistance layer.
8. a manufacture method for printed wiring board, wherein,
Described printed wiring board possesses:
There is on surface the printed wiring board main body of circuit and be stacked on being provided with of this printed wiring board main body
Soldering-resistance layer on the surface of circuit,
The manufacture method of described printed wiring board includes following operation:
First, second liquid of two liquid mixed types according to any one of claim 1～7 is mixed
Close, obtain the solder mask composition i.e. photosensitive composite of described first, second liquid mixing；With
Have on the surface being provided with circuit of printed wiring board main body of circuit from the teeth outwards, apply described
One, the solder mask composition that second liquid mixes i.e. photosensitive composite, is formed and is stacked on described print
Soldering-resistance layer on the surface being provided with described circuit of brush wiring board body.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015062400 | 2015-03-25 | ||
| JP2015-062400 | 2015-03-25 | ||
| JP2016033857A JP6618829B2 (en) | 2015-03-25 | 2016-02-25 | Two-liquid mixed type first and second liquid and method for producing printed wiring board |
| JP2016-033857 | 2016-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106019828A true CN106019828A (en) | 2016-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610169087.4A Pending CN106019828A (en) | 2015-03-25 | 2016-03-23 | First liquid and second liquid of two-liquid mixing type and method for manufacturing printed wiring board |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20160115718A (en) |
| CN (1) | CN106019828A (en) |
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| JP4711208B2 (en) | 2006-03-17 | 2011-06-29 | 山栄化学株式会社 | Photosensitive thermosetting resin composition, resist film-coated smoothed printed wiring board, and method for producing the same. |
| JP4340272B2 (en) | 2006-05-30 | 2009-10-07 | 太陽インキ製造株式会社 | Photocurable / thermosetting solder resist composition and printed wiring board using the same |
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| US20060063113A1 (en) * | 2003-01-22 | 2006-03-23 | Fuji Photo Film Co., Ltd. | Antireflection film, polarizing plate and display device |
| WO2011018907A1 (en) * | 2009-08-10 | 2011-02-17 | 積水化学工業株式会社 | Photosensitive composition and solder resist composition |
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| KR20160115718A (en) | 2016-10-06 |
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Effective date of registration: 20231113 Address after: Saitama Prefecture, Japan Applicant after: TAIYO HOLDINGS Co.,Ltd. Address before: Osaka, Japan Applicant before: SEKISUI CHEMICAL Co.,Ltd. |
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Application publication date: 20161012 |