CN106016766A - Heat storage and release unit, chemical heat pump, and non-electrified cooling unit - Google Patents

Abstract

A heat storage and release unit includes a reactant formed body for reacting with a reaction medium to store and release heat; a reaction vessel for accommodating the reactant formed body and exchanging heat with the reactant formed body; a reaction medium flow path structure, connected to the reaction vessel, for supplying the reaction medium to the reaction vessel or discharging the reaction medium from the reaction vessel. The reactant formed body includes a plate-like heat transfer plate that contacts the reaction vessel, heat transfer elements extending from a surface of the heat transfer plate at substantially right angles, and a reactant formed unit that encloses the heat transfer elements in such a way that the heat transfer elements are partially exposed from the reactant formed unit, and the reaction vessel can change form by a pressure difference between the outside and the inside of the reaction vessel.

Description

Heat storage and releasing unit, chemical heat pump and non-electrical gasification cooling unit

Technical field

The present invention relates to heat storage and releasing unit, chemical heat pump and non-electrical gasification cooling unit.

Background technology

In recent years, for recovery and the heat recovery system of the thermal source utilizing such as used heat, such as chemical heat Pump and adsorption-type refrigerating plant, arouse attention at energy-conservation aspect.In heat recovery system, heat is deposited Storage and releasing unit include the reactant with reaction medium exchanged heat, evaporation reaction medium vaporizer, And the condenser of condensation reaction medium is attached via switching mechanism.

In this heat recovery system, if heat storage and the reaction medium in releasing unit and reactant Between contact area little, then can not carry out sufficient heat exchange between reaction medium and reactant. Therefore, traditionally, it is known that a kind of technology, it is for increasing the contact between reaction medium and reactant Area and promotion reaction medium motion, in the art, porous material is sandwiched by one group of reactant, And porous material is used as the flow path of reaction medium.

Further, in heat recovery system, if reaction vessels capacity is big, then in reaction vessels Sensible heat loss increases.Therefore, traditionally, it is known that a kind of technology, its for by means of utilize by Reaction vessels that flat member is formed and reduce the capacity of reaction vessels thus reduce sensible heat loss.

But, the heat at the porous material utilizing the flow path for reaction medium stores and release is single In unit, when flat member is used as reaction vessels, porous material can be by the inside of reaction vessels with outer Pressure reduction between portion is compressed, and the function accordingly, as the flow path of reaction medium can deteriorate. As a result, can there is a case in which, wherein by including that the heat with the reaction vessels of flat member stores Sufficient heat exchanger effectiveness can not be realized with releasing unit.

The purpose of an aspect of of the present present invention is to increase the heat exchanger effectiveness in heat storage and releasing unit, institute State heat storage and releasing unit include can by reaction vessels outwardly and inwardly between pressure reduction and change The reaction vessels of deformation states.

[quoting list of documents]

[patent documentation]

[patent documentation 1] Japanese Laid-Open Patent Application 2014-044000

[patent documentation 2] Japanese Laid-Open Patent Application 9-142801

Summary of the invention

Heat storage and releasing unit are provided.The storage of this heat and releasing unit include that reactant forms body, It is configured to react with reaction medium with storage and release heat；Reaction vessels, it is configured to receive reaction Thing forms body and forms body exchanged heat with reactant；Reaction medium flow path structure, it is connected to instead Answer vessel, and be configured to supply reaction medium to reaction vessels or from reaction vessels discharge reaction medium. Reactant forms body and includes: tabular heat transfer plate, its haptoreaction vessel；Heat transfer element, its from The surface of heat transfer plate extends substantially at right anglesly；Forming unit with reactant, it is around heat transfer unit Part is so that heat transfer element exposes from reactant with forming cell mesh, and reaction vessels can lead to Cross reaction vessels outwardly and inwardly between pressure reduction and change form.

One aspect of the present invention increases the heat exchanger effectiveness in heat storage and releasing unit, and this heat stores And releasing unit include can by reaction vessels outwardly and inwardly between pressure reduction and change form Reaction vessels.

Other objects, features and advantages of the present invention will be retouched from following in detail when reading in conjunction with the accompanying State and become obvious.

Accompanying drawing explanation

Figure 1A and 1B is the schematic diagram that the reactant according to an embodiment forms body；

Fig. 2 A and 2B is the schematic cross-sectional view that the reactant according to an embodiment forms body；

Fig. 3 is the perspective schematic view of the heat transfer plate according to an embodiment；

Fig. 4 is the schematic plan view of the heat transfer plate according to one (the first) embodiment；

Fig. 5 is the schematic plan view of the heat transfer plate according to one (the second) embodiment；

Fig. 6 is the schematic plan view of the heat transfer plate according to one (the 3rd) embodiment；

Fig. 7 is the schematic plan view of the heat transfer plate according to one (the 4th) embodiment；

Fig. 8 is the perspective schematic view that the reactant according to an embodiment forms body；

Fig. 9 A-9C is the figure of the example 1 illustrating heat storage and releasing unit according to an embodiment；

Figure 10 is the heat storage according to first embodiment and the schematic cross-sectional view of releasing unit；

Figure 11 is the heat storage according to the second embodiment and the schematic cross-sectional view of releasing unit；

Figure 12 is the heat storage according to the 3rd embodiment and the schematic cross-sectional view of releasing unit；

Figure 13 is heat storage and the schematic cross-sectional view of releasing unit of comparative example 1；

Figure 14 is the schematic diagram of the example of chemical heat pump；

Figure 15 is the schematic diagram of the example of non-electrified cooling unit；

Figure 16 A and 16B is the figure of the example 2 illustrating heat storage and releasing unit according to an embodiment；

Figure 17 A and 17B is the figure of the example 3 illustrating heat storage and releasing unit according to an embodiment；

Figure 18 A-18C be illustrate according to an embodiment heat storage and releasing unit example 3 in anti- Thing is answered to form the figure of body；

Figure 19 A and 19B is to illustrate repairing of the hot example 3 stored with releasing unit according to an embodiment Change the figure of example；

Figure 20 is in the modification of the example 3 illustrating heat storage and releasing unit according to an embodiment Reactant forms the figure of the structure of body.

Detailed description of the invention

Below, embodiments of the invention are described with reference to the accompanying drawings.It should be noted that, in description and In accompanying drawing, the element including roughly the same functional structure will be given identical labelling with in order to avoid weight Multiple description.

(reactant formation body)

The example of the reactant formation body being used for heat storage and releasing unit according to an embodiment will be described Son.Figure 1A and 1B is the schematic diagram that the reactant according to an embodiment forms body 10.Fig. 2 A and 2B is the schematic cross-sectional view that the reactant according to an embodiment forms body 10.In Figure 1A Line A-A represents cross section.

Reactant formation body 10 is by reacting and heat with reaction medium, or is discharged anti-by heating Answer medium.As shown in Figure 1A and 1B, reactant formation body 10 includes heat transfer plate 11, heat transfer Element 12 and reactant form unit 13.

Heat transfer plate 11 is tabular component.

Heat transfer element 12 is the element extended from the surface of heat transfer plate 11 substantially at right anglesly.Heat Transmitting element 12 can have such as pin-like shape or plate-like shape.Heat transfer element 12 includes exposing Region 12a and exposed area 12b.Exposed area 12a arranges the side at place in heat transfer plate 11 The surface exposed of unit 13 is formed from reactant in opposite sides.Exposed area 12b is from heat transfer plate 11 Arrange on the side at place from reactant formed unit 13 another is surface exposed.

Figure 1A illustrates that a reactant forms body 10A, and this reactant forms the heat transfer element of body 10A 12 include exposed area 12a, and this exposed area 12a arranges the phase of the side at place in heat transfer plate 11 Toss about and form the surface exposed of unit 13 from reactant on face.Fig. 2 A illustrates that reactant forms body 10B, This reactant forms the heat transfer element 12 of body 10B and includes exposed area 12b, this exposed area 12b Arrange in heat transfer plate 11 and form the surface exposed of unit 13 from reactant on the side at place.Fig. 2 B Illustrating that reactant forms body 10C, this reactant forms the heat transfer element 12 of body 10C and includes exposed area Territory 12a and exposed area 12b, this exposed area 12a arrange the side at place in heat transfer plate 11 Forming the surface exposed of unit 13 from reactant in opposite sides, described exposed area 12b is in heat transfer Plate 11 is arranged and is formed the surface exposed of unit 13 from reactant on the side at place.

It should be noted that, heat transfer plate 11 and heat transfer element 12 will be described by detail below.

Reactant forms unit 13 around heat transfer element 12 so that heat transfer element 12 is from reactant Form unit 13 partly to expose.Reactant forms unit 13 by such as molding curing reaction thing And formed.

Reactant is not limited to certain material, as long as it can reversibly perform the suction about reaction medium Attached-to be desorbed, and its form is solid or gel during adsorption-desorption.

As reaction medium, it is possible to use such as water, ammonia or methanol.It is used as reaction medium at water When, as reactant, such as, calcium sulfate, sodium sulfate, calcium chloride, magnesium chloride, chlorination Manganese, calcium oxide, magnesium oxide, sodium acetate, sodium carbonate or calcium bromide can be used.Further, Can also use by the adsorbent representated by silica gel or zeolite.

Ammonia be used as reaction medium situation in, as reactant, such as, manganese chloride, magnesium chloride, Nickel dichloride., barium chloride or calcium chloride can be used.In methanol is used as the situation of reaction medium, As reactant, such as, magnesium chloride can be used.It is possible to further be used alone a kind of anti- Answer thing, or two kinds or the mixture of more kinds of reactant can be used.

Further, reactant includes the material with deliquescence.The material even with deliquescence can be by Use, if it can by it mix with expanded graphite by applying impregnation technology heat storage and In solid-state during release.

It should be noted that, the forming method that reactant forms body 10 does not limit, but, such as, excellent Such method, wherein integrated with heat transfer element 12 heat transfer plate 11 is selected to be arranged on desired mould In tool, pulpous state reactant (hemihydrate being dissolved in water) is introduced into and solidifies.Further, It is, for example possible to use such method, wherein, it is known bonding by utilizing that reactant forms body 10 Agent and be formed as intended shape.By said method, reactant forms body 10 and can be readily formed, It increases productivity.

Reactant described above is formed in body 10, is accommodated in following when reactant forms body 10 Time in the reaction vessels 20 described, the heat transfer element 12 exposed from reactant formation unit 13 is used as Bridging structure and formed reaction medium flow path (hereinafter, be referred to as " reaction medium flow path 14”)。

(heat transfer plate)

It follows that will be described according to the heat transfer plate 11 of an embodiment.Fig. 3 is according to an embodiment The perspective schematic view of heat transfer plate 11.Fig. 4 is showing of the heat transfer plate 11 according to an embodiment It is intended to view.Specifically, the heat transfer plate 11, Fig. 4 after Fig. 3 is shown in heat transfer element 12 warpage It is shown in the heat transfer plate 11 before heat transfer element 12 warpage.It should be noted that, it is assumed that at Fig. 3 and 4 In X-direction be laterally, Y-direction be longitudinal direction.

As it is shown on figure 3, heat transfer plate 11 includes multiple heat transfer element 12, the plurality of heat transfer Element 12 is integrally formed with heat transfer plate 11 and at a generally normal angle relative to the surface of heat transfer plate 11 Ground warpage.Further, heat transfer plate 11 includes the upper and lower surface through heat transfer plate 11 Through hole 111, this through hole 111 by heat transfer element 12 relative to the upper table of heat transfer plate 11 Face at a generally normal anglely at least in part warpage and formed.

The material of heat transfer plate 11 is not limited to certain material, as long as it is the easy-to-handle tool of tabular There is the material of thermal conductive resin.Such as, the metal material including aluminum and copper is preferred, and this is from it Can realize having the configuration aspects forming the good transfer of heat between body at metal material and reactant For.

Preferably, heat transfer element 12 has pin-like shape.By above arrangement, heat can be in heat Effectively transmit between transmission plate 11, heat transfer element 12 and reaction vessels 20.

Further, it is preferable to so form heat transfer element 12, i.e. make in heat as shown in Figure 4 Transmission plate 11 is formed to cut out structure 112 substantially at right angles relative to the upper surface of heat transfer plate 11 Ground warpage, as shown in Figure 3.The method cutting out structure 112 as formation, from the viewpoint of batch production From the point of view of, method that simple method, such as wire cutting method or cutter cut out is preferably used.

Heat transfer element 12 does not limit relative to the angle of the upper surface of heat transfer plate 11, as long as it For approximate right angle, but preferably this angle more than or equal to 70 degree and is less than or equal to 110 degree, and this is From in the position away from heat transfer plate 11 for the visual angle that the heat transfer of reactant promotes.Further Ground, the most described angle is more than or equal to 80 degree and less than or equal to 100 degree, and this is from heat transfer plate 11 Surface in for the equidistributed visual angle of the heat transfer facilitation effect of reactant.

Further, it is preferable to ground, whole heat transfer elements 12 is relative to the upper table of heat transfer plate 11 Face is in the face of identical direction.At some heat transfer elements 12 relative to the upper surface face of heat transfer plate 11 To in the situation of different directions, adjacent heat transfer element can interfere with each other.

The size of heat transfer element 12 does not limit, but, such as, the width of heat transfer element 12 W can be 1 millimeter, can be highly 5 millimeters.Further, the arrangement of heat transfer element 12 does not has Restricted, but, such as, can be 3.2 millimeters in horizontal pitch P1, in longitudinal pitch P2 Can be 7.5 millimeters.

Through hole is the hole of the upper and lower surface through heat transfer plate 11.When in heat transfer plate 11 In cut out structure 112 when being flexed, through hole 111 is formed.

Further, such as, reactant formation body 10A as shown in Figure 8 can be achieved in that, i.e. Mould and solidify the pulpous state calcium sulfate poured in heat transfer plate 11 so that the reactant obtained forms body 10A is around heat transfer element 12.It should be noted that, preferably, prepare before superincumbent molding by The molding material that resin etc. are made.

It should be noted that, the arrangement of the heat transfer element 12 being formed in heat transfer plate 11 is not limited to Arrangement as shown in Figure 4 described above, as long as heat transfer element 12 is relative to heat transfer plate 11 Upper surface is substantially at right angles.It is, however, preferable that heat transfer element 12 is evenly distributed in heat biography Passing on the surface of plate 11, this is the decile of the heat transfer facilitation effect from the surface of heat transfer plate 11 For the visual angle of cloth.

Another example of heat transfer plate 11 will be described with reference to Fig. 5-7.Fig. 5-7 is according to an embodiment The schematic plan view of heat transfer plate 11.

Another example of heat transfer plate 11 can have a structure in which, wherein, adjacent cuts out structure The direction (for forming the warpage direction of heat transfer element 12) of 112 is identical, as shown in Figure 5. Further, heat transfer plate 11 can have a structure in which, wherein, cutting out structure 112 is at horizontal stroke It is formed continuously to direction, as shown in Figure 6.

Further, heat transfer element 12 can have plate-like shape, as shown in Figure 7.Including tabular The heat transfer plate 11 of heat transfer element 12 can have a structure in which, wherein, has 20 mm wides The heat transfer element 12 of degree and 5 height is arranged as laterally having 25 millimeters of pitches P1, vertical To having 7.5 millimeters of pitches.

The embodiment of heat transfer plate 11 has been described above, but, the present invention is not limited to above-mentioned Embodiment.Such as, the heat transfer element extended substantially at right anglesly relative to the surface of heat transfer plate 11 12 elements can with shapes such as pin-like shape, plate-like shape, pin holder shape shapes Formed to heat transfer plate 11.

(heat storage and the example 1 of releasing unit)

It follows that heat storage and releasing unit according to an embodiment will be described.Fig. 9 A-9C is to show Go out the figure of the example 1 of the heat storage according to an embodiment and releasing unit 100.Specifically, Fig. 9 A is The heat storage before body 10 is accommodated in reaction vessels 20 and releasing unit 100 is formed at reactant Schematic side elevation.Further, Fig. 9 B is that reactant formation body 10 is accommodated in reaction vessels After heat storage in 20 and the schematic plan view of releasing unit 100.Further, Fig. 9 C be Reactant forms showing of the after heat storage that is accommodated in reaction vessels 20 of body 10 and releasing unit 100 Meaning property side view.

Heat storage and releasing unit 100 according to an embodiment include that reactant forms body 10 and reactor Ware 20, as shown in Figure 9 A.Heat storage and releasing unit 100 by such as forming body 10 by reactant It is contained in reaction vessels 20 and engages reaction vessels 20 and formed, as shown in figures 9 b and 9 c.

Reaction vessels 20 is for accommodating reactant formation body 10 and performing heat with reactant formation body 10 The container of exchange.Further, reaction vessels 20 is can be by the outside of reaction vessels 20 and interior Pressure reduction between portion and change the flexible container of form.

Reaction vessels 20 includes that sealing unit 21, reactant accommodate unit 22 and reaction medium flow road Gauge structure 23.

Sealing unit 21 is the peripheral edge portion (outside at the dotted line of Fig. 9 B along reaction vessels 20 Part) part that formed.

It is the part forming body 10 for accommodating reactant that reactant accommodates unit 22.

In a part for the peripheral edge portion that reaction medium flow path structure 23 is formed at reaction vessels 20, And the reaction forming body 10 absorption for supplying the reactant within reaction vessels 20 to be accommodated in is situated between Matter, or discharge the reaction medium desorbed from reactant formation body 10.

The peripheral edge portion of reaction vessels 20 passes through sealing unit 21 or reaction medium flow path structure 23 are formed.Therefore, the reaction medium in reactant accommodates unit 22 is only by reaction medium flow road Gauge structure 23 is supplied or is discharged.

As reaction vessels 20, there is such as rectangular shape or round-shaped flat member, permissible Used.As flat member, such as, utilize have good transfer of heat performance metal such as aluminum, The sheeting (foil) of copper etc. can be used.The thickness of foil does not limit, but, Such as, in the situation using aluminum, thickness can be 30-200 micron, in the situation using copper, Thickness can be 10-100 micron.Further, plastic sheet is also used as flat member.

Joint method for the sealing unit 21 of reaction vessels 20 does not limit, but, in reaction In the situation that vessel 20 are made of metal, described method can be utilize diffusion bonding etc. joint method, Utilize the joint method of brazing etc. or utilize the joint method of known binding agent.

(heat storage and the example 2 of releasing unit)

It follows that will be described according to the heat storage of an embodiment and another example of releasing unit.Figure 16A and 16B is the figure of the example 2 illustrating heat storage and releasing unit 110 according to an embodiment. Specifically, Figure 16 A is heat storage and the decomposition view of releasing unit 110, and Figure 16 B is at reactant Form the heat storage after body 10 is accommodated in reaction vessels 20 and schematically the showing of releasing unit 110 It is intended to.

Heat storage and releasing unit 110 according to an embodiment include that reactant forms body 10, reactor Ware 20, reaction medium flow path structure 23 and lid 24, as shown in Figure 16 A.Heat storage and release Unit 110 is contained in reaction vessels 20 and at sealing unit 21 by reactant is formed body 10 Engage reaction vessels 20 and lid 24, as shown in the arrow of Figure 16 A, and formed.

Reaction vessels 20 has bottom 20b, and is formed as the box shaped on the top surface with opening. Reaction vessels 20 is for accommodating reactant formation body 10 and forming the appearance of body 10 heat exchange with reactant Device.Further, reaction vessels 20 be can by reaction vessels 20 outwardly and inwardly between Pressure reduction and change the flexible container of form.

Sealing unit 21 be the inner wall surface along reaction vessels 20 top-side formed part ( The upper portion of the dotted line in Figure 16 A).

It is the part forming body 10 for accommodating reactant that reactant accommodates unit 22.

Reaction medium flow path structure 23 is formed to penetrate lid 24, and is used for supplying reaction medium Form body 10 to the reactant being accommodated in reaction vessels 20, or body 10 will be formed from reactant The reaction medium desorbed is discharged.Reaction medium flow path structure 23 is formed as such as having out at two ends The cylindrical shape of mouth.

Lid 24 is the component of the opening in the top surface of closed reaction vessel 20, and is formed For such as plate-like shape.Lid 24 by being joined to the sealing list of reaction vessels 20 by its side surface 24s Unit 21 and be engaged to reaction vessels 20.As it has been described above, opening in the top surface of reaction vessels 20 Mouth is by lid 24 Guan Bi.Therefore, the reaction medium during reactant accommodates unit 22 is only situated between by reaction Matter flow path configurations 23 is supplied or is discharged.

It should be noted that, reaction medium flow path structure 23 and lid 24 may be integrally formed, or can Then it is bonded together to independently form.

Reaction vessels 20 can be by such as producing the drawing flatiron mechanography of the tank for beverage (drawing and ironing molding method) and formed.Further, reaction vessels 20 is permissible By utilizing flat member, include laser welding, seam welds, adhesive bond etc. by utilization Various methods are formed.As the material of reaction vessels 20, aluminum, copper etc. can be used.Using aluminum Situation in, the thickness of reaction vessels 20 can be 30-200 micron, use copper situation in, The thickness of reaction vessels 20 can be 30-200 micron, and in the situation using copper, it can be 10-100 Micron.Further, plastic sheet can serve as flat member.

In the situation that reaction vessels 20 is made of metal, for engaging reaction at sealing unit 21 Vessel 20 can be to utilize the joint method of diffusion bonding etc., utilize brazing etc. to the method for lid 24 Joint method or the joint method of the known binding agent of utilization.

Further, in the above example, reaction vessels 20 has square shape, but permissible There is the shape of bending.It is essential that reaction vessels 20 has flexible structure and can pass through reaction Vessel 20 outwardly and inwardly between pressure reduction and change form.Reaction vessels 20 is not limited to retouch above The example stated, but, can be any container, as long as it has flexibility function described above.

(heat storage and the example 3 of releasing unit)

It follows that will be described according to the heat storage of an embodiment and another example again of releasing unit. Figure 17 A and 17B is the figure of the example 3 illustrating heat storage and releasing unit 120 according to an embodiment. Specifically, Figure 17 A is heat storage and the decomposition view of releasing unit 120, and Figure 17 B is at reactant Form the heat storage after body is accommodated in reaction vessels and the schematic illustration of releasing unit 120. Figure 18 A-18C is to be shown in the example 3 of the heat storage and releasing unit 120 according to an embodiment Reactant forms the figure of body 10E.

Heat storage and releasing unit 120 according to an embodiment include that reactant forms body 10E, reaction Vessel 20, reaction medium flow path structure 23 and lid 24, as shown in Figure 17 A.Heat stores and releases Put unit 120 to be contained in reaction vessels 20 and at sealing unit by reactant is formed body 10E Engage reaction vessels 20 and lid 24 at 21, as shown in the arrow of Figure 17 A, and formed.

As shown in figure 18 c, reactant formation body 10E (10) includes heat transfer plate 11, heat transfer element 12 and reactant formed unit 13.

Heat transfer plate 11 is bending tabular component.

Heat transfer element 12 is the element extended with the surface of heat transfer plate 11 substantially at right anglesly.Heat Transmitting element 12 can have such as pin-like shape or plate-like shape.Heat transfer element 12 includes exposing Region 12a, described exposed area 12a are surface exposed from the one of reactant formation unit 13, described table Face is the opposite sides that heat transfer plate 11 arranges the side at place.It should be noted that, heat transfer element 12 Unit 13 can be formed by reactant to surround completely, it is possible to there is no exposed area 12a.

Reactant forms unit 13 and has hollow cylindrical so that its cover heating transmission plate 11 interior Wall surface whole at least in part cover heating transmitting element 12.

Reaction vessels 20 is such container, i.e. this container has bottom as shown in Figure 17 A 20b, and have the cylindrical shape at top surface band opening, accommodates reactant and forms body 10, and with instead Thing is answered to form body 10 heat exchange.Further, reaction vessels 20 is flexible structure and can pass through Reaction vessels 20 outwardly and inwardly between pressure reduction and change form.

Sealing unit 21 be the inner wall surface along reaction vessels 20 top-side formed part ( The upper portion of the dotted line in Figure 17 A).

It is the part forming body 10 for accommodating reactant that reactant accommodates unit 22.

Reaction medium flow path structure 23 is formed to penetrate lid 24, and is used for supplying reaction medium Form body 10 to the reactant that is contained in reaction vessels 20, or body 10 will be formed from reactant and solve Attached reaction medium is discharged.Reaction medium flow path structure 23 is formed as such as having opening at two ends Cylindrical shape.

Lid 24 is the component of the opening in the top surface of closed reaction vessel 20, and is formed For such as plate-like shape.Lid 24 by being joined to the sealing list of reaction vessels 20 by its side surface 24s Unit 21 and be engaged to reaction vessels 20.As it has been described above, opening in the top surface of reaction vessels 20 Mouth is by lid 24 Guan Bi.Therefore, the reaction medium during reactant accommodates unit 22 is only situated between by reaction Matter flow path configurations 23 is supplied or is discharged.

It should be noted that, reaction medium flow path structure 23 and lid 24 may be integrally formed, or can Then it is bonded together to independently form.

Reaction vessels 20 can be by such as producing the drawing flatiron mechanography of the tank for beverage Formed.Further, reaction vessels 20 can include laser by utilizing flat member by utilization The various methods of welding, seam welds, adhesive bond etc. and formed.Reaction vessels 20 can pass through It is such as that then cylindrical shape welds and formed by rectangular patch member bends, or by utilizing thin-walled Aluminum pipe attached base plate are formed to close one of opening of aluminum pipe.

Material as reaction vessels 20, it is possible to use aluminum, copper etc..In the situation using aluminum, instead The thickness answering vessel 20 can be 30-200 micron, and in the situation using copper, it can be 10-100 Micron.Further, plastic sheet can serve as the material of reaction vessels 20.Reaction vessels 20 does not limits In special container, as long as it has flexible structure and can according to reaction vessels 20 outwardly and inwardly Between pressure reduction and change form.

In the situation that reaction vessels 20 is made of metal, for engaging reaction at sealing unit 21 Vessel 20 can be to utilize the joint method of diffusion bonding etc., utilize brazing etc. to the method for lid 24 Joint method or the joint method of the known binding agent of utilization.

(modification of the example 3 of heat storage and releasing unit)

It follows that as the heat storage according to an embodiment and another example again of releasing unit, heat is deposited The modification of the example 3 of storage and releasing unit will be described.

Figure 19 A and 19B is to illustrate the heat storage according to an embodiment and the example 3 of releasing unit 130 The figure of modification.Specifically, Figure 19 A is heat storage and the decomposition view of releasing unit 130, figure 19B is to form, at reactant, after heat storage and the releasing unit that body 10 is accommodated in reaction vessels 20 The schematic illustration of 130.Figure 20 is to be shown in the heat storage according to an embodiment and releasing unit 130 Example 3 modification in reactant form the figure of body 10, it illustrates that reactant forms body 130 Cross section.

Heat storage and releasing unit 130 are different from example 3 in terms of reactant forms the form of body 10 Heat storage and releasing unit 120.It should be noted that, because heat storage and releasing unit 130 are except instead Answering the other side outside the form of thing formation body 10 is identical with heat storage and releasing unit 120, It is different from heat storage and the side of releasing unit 120 with releasing unit 130 below by mainly describing heat storage Face.

Heat storage and releasing unit 130 according to an embodiment include that reactant forms body 10, reactor Ware 20, reaction medium flow path structure 23 and lid 24, as shown in Figure 19 A.Heat storage and release Unit 130 is contained in reaction vessels 20 and at sealing unit 21 by reactant is formed body 10 Engage reaction vessels 20 and lid 24, as shown in the arrow of Figure 19 A, and formed.

As shown in figure 20, reactant formation body 10 (10F) includes heat transfer plate 11, heat transfer element 12 Unit 13 is formed with reactant.

Heat transfer plate 11 is bending tabular component.

Heat transfer element 12 is the component of the inner wall surface being joined to heat transfer plate 11, the one of this component Part extends substantially at right anglesly relative to the surface of heat transfer plate 11, and whole described members in alignment are with face To substantially common direction.

It is such component that reactant forms unit 13, and this component has hollow cylindrical and is formed as So that the whole inner wall surface of its cover heating transmission plate 11 and heat transfer element 12 is whole.

Reactant forms body 10 (10G) and includes that heat transfer plate 11, heat transfer element 12 and reactant are formed Unit 13.

Heat transfer plate 11 is bending tabular component.

Heat transfer element 12 is such component, and this component is joined to the inner wall surface of heat transfer plate 11, A part for described component extends substantially at right anglesly relative to the surface of heat transfer plate 11, all described Members in alignment is with substantially in the face of identical direction.Heat transfer element 12 includes exposed area 12a, described Exposed area 12a arranges in heat transfer plate 11 and forms list from reactant in the opposite sides of the side at place The surface of unit 13 extends.

It is such component that reactant forms unit 13, and this component has hollow cylindrical and is formed as So that a part for the inner wall surface of its cover heating transmission plate 11 and one of heat transfer element 12 Point.

Reactant forms body 10F and reactant forms body 10G and combines to form cylindrical shape, and is held It is contained in reactant housing unit 22.

It should be noted that, in the above example, reactant forms body 10G and includes heat transfer element 12, Described heat transfer element 12 includes exposed area 12a, and described exposed area 12a is at heat transfer plate 11 cloth Put the surface extension forming unit 13 in the opposite sides of side, place from reactant, but, embodiment party Formula is not limited to this example, if at least one reactant formed body 10 (reactant formed body 10F and 10G) having and include the heat transfer element 12 of exposed area 12a, described exposed area 12a is in heat transfer Plate 11 is arranged and is formed the surface exposed of unit 13 from reactant in the opposite sides of the side at place.

Below, will be described in heat storage and the example 1 of releasing unit.

(first embodiment)

Figure 10 is that the schematic cross-section of the heat storage according to first embodiment and releasing unit 100A regards Figure.Figure 10 illustrates the cross section of the line B-B in corresponding diagram 9B.

In heat storage and releasing unit 100A, as shown in Figure 10, reaction vessels 20 receiving has The reactant of structure as shown in Figure 1B forms body 10A and reactant forms body 10D, described instead Answering thing to form body 10D to have a structure in which, wherein reactant forms the heat transfer element 12 of body 10A Exposed area 12a be removed.Specifically, reactant forms body 10a and reactant forms body 10d Facing with each other, there is each heat transfer plate 11 outwardly, and be accommodated in reaction vessels 20.

In the first embodiment, the exposed area of the heat transfer element 12 of body 10A is formed by reactant Territory 12a, is formed at reactant and forms a space S 1 between body 10A and reactant formation body 10D, should Space S 1 is used as reaction medium flow path 14, and this is the feature of first embodiment.

During formation heat storage and releasing unit 100A, form body 10A with anti-at reactant After answering thing formation body 10D to be accommodated in reaction vessels 20, the inside of reaction vessels 20 is taken out very Empty (evacuation).Now, the volume of reaction vessels 20 reduces, and reaction vessels 20 is in close contact reaction Thing forms heat transfer plate 11 and the heat transfer plate 11 of reactant formation body 10D of body 10A.Further Ground, the space of the peripheral edge portion of reaction vessels 20 is compressed equally, and so-called " vacuum packet " state Formed.

The most in this condition, in the heat storage according to first embodiment and releasing unit 100A, Reaction medium flow path 14, it leads to reactant from reaction medium flow path structure 23 and forms unit The surface of 13, is kept by the bridging structure of heat transfer element 12.Therefore, at reaction medium and reactant Between sufficient contact area can be guaranteed, and promote that reaction medium is in reaction vessels 20 Motion.As a result, the heat exchanger effectiveness of heat storage and releasing unit 100A is improved.

It should be noted that, as shown in Figure 10, heat storage and releasing unit 100A include that having band exposes The reactant of the heat transfer element 12 of region 12a forms body 10A and has without exposed area 12a's The reactant of heat transfer element 12 forms body 10D, but the present invention is not limited to this example.Such as, Reactant forms body 10 and all has the heat of the exposed area 12a that band exposes from reactant formation unit 13 Transmitting element 12, reactant formed body 10 can facing with each other so that heat transfer element 12 the most each other Interfere.

In this embodiment, heat transfer plate 11 can bend and be contained in cylindrical reaction vessel 20, As shown in the example 3 of heat storage and releasing unit 120.Further, the side of heat transfer element 12 To being arranged as cooperation cylindrical reaction vessel 20, as at heat storage and the example 3 of releasing unit 130 Modification shown in.

(the second embodiment)

Figure 11 is that the schematic cross-section of the heat storage according to the second embodiment and releasing unit 100B regards Figure.Figure 11 illustrates the cross section of the line B-B in corresponding diagram 9B.

In heat storage and releasing unit 100B, the reactant with structure as shown in Figure 2 A is formed Body 10B is accommodated in reaction vessels 20 as shown in figure 11.

In a second embodiment, the exposed area of the heat transfer element 12 of body 10B is formed by reactant 12b is formed in heat transfer plate 11 and reactant and forms space S 2 between unit 13, and described space S 2 is used Making reaction medium flow path 14, this is the feature of the second embodiment.

During forming heat storage and releasing unit 100B, form body 10B at reactant and held After being contained in reaction vessels 20, the inside of reaction vessels 20 is evacuated (evacuation).Now, reactor The volume of ware 20 reduces, and reaction vessels 20 is closely contacted reactant and forms the heat transfer plate of body 10B 11 and reactant formed unit 13 surface.The space of the peripheral edge portion of reaction vessels 20 is also pressed Contracting, so-called " vacuum packet " state is formed.

The most in this condition, in the heat storage according to the second embodiment and releasing unit 100B, the most instead Answering media flow paths 14, it leads to reactant from reaction medium flow path structure 23 and forms unit The surface of 13, is kept by the bridging structure of heat transfer element 12.Therefore, at reaction medium and reactant Between sufficient contact area can be guaranteed, and promote that reaction medium is in reaction vessels 20 Motion.As a result, the heat exchanger effectiveness of heat storage and releasing unit 100B is improved.

(the 3rd embodiment)

Figure 12 is that the schematic cross-section of the heat storage according to the 3rd embodiment and releasing unit 100C regards Figure.Figure 12 illustrates the cross section of the line B-B of corresponding diagram 9B.

In heat storage and releasing unit 100C, the reactant with structure as shown in Figure 2 A is formed Body 10B is accommodated in such as Figure 12 institute with the reactant formation body 10C of the structure having as shown in Figure 2 B In the reaction vessels 20 shown.Specifically, reactant formed body 10B and reactant formed body 10C that Faced by this, its each heat transfer plate 11 is the most right, and reactant forms body 10B and reactant shape Adult 10C is accommodated in reaction vessels 20.

In the third embodiment, the exposed area of the heat transfer element 12 of body 10C is formed by reactant 12a is formed at reactant and forms space S 1 between body 10B and reactant formation body 10C.Further, The exposed area of the heat transfer element 12 of body 10B and reactant formation body 10C is formed by reactant 12b is formed in heat transfer plate 11 and reactant and forms space S 2 between unit 13, and space S 1 He S2 is used as reaction medium flow path 14, and it is the feature of the 3rd embodiment.

During formation heat storage and releasing unit 100C, form body 10B with anti-at reactant After answering thing formation body 10C to be accommodated in reaction vessels 20, the inside of reaction vessels 20 is evacuated (takes out Empty).Now, the volume of reaction vessels 20 reduces, and reaction vessels 20 is closely contacted reactant and is formed The heat transfer plate 11 of body 10B and reactant form the heat transfer plate 11 of body 10C.Reaction vessels 20 The space of peripheral edge portion also compressed, so-called " vacuum packet " state is formed.

The most in this condition, in the heat storage according to the 3rd embodiment and releasing unit 100B, three Individual reaction medium flow path 14, it leads to reactant from reaction medium flow path structure 23 and forms list The surface of unit 13, is kept by the bridging structure of heat transfer element 12.Therefore, at reaction medium with anti- Answer the sufficient contact area between thing to be guaranteed, and promote that reaction medium is at reaction vessels 20 In motion.As a result, the heat exchanger effectiveness of heat storage and releasing unit 100C is improved.

It should be noted that, as shown in figure 12, heat storage and releasing unit 100A include that having band exposes The reactant of the heat transfer element 12 of region 12a forms body 10C and has without exposed area 12a's The reactant of heat transfer element 12 forms body 10B, but the present invention is not limited to this example.Such as, Reactant forms body 10 and can be provided with the exposed area 12a that band exposes from reactant formation unit 13 Heat transfer element 12, reactant formed body 10 can facing with each other so that heat transfer element 12 not Interfere with each other.

<example>

Below, will describe embodiments of the invention by example and comparative example, this should not be used as right The restriction of the present invention.

(example 1)

In example 1, there are two reactants as shown in Figure 1 and form the heat storage of body 10A and release Put unit to be formed.

Specifically, two reactants formation body 10A are so formed, i.e. utilize as shown in Figure 4 Heat transfer plate 11, cuts out structure 112 relative to the upper surface ground substantially at right angles warpage of heat transfer plate 11, And form reactant formation unit 13, so that heat transfer element 12 is enclosed in reactant and forms unit In 13.

The aluminium sheet of 500 millimeters × 800 millimeters × 0.5 millimeter is used as heat transfer plate 11.Cut out structure 112 Size be adjusted so that the height of heat transfer element 12 is 10 millimeters, width is 2 millimeters, The density of the heat transfer element 12 on surface is every 100 square centimeters of 78 elements (13 × 6 elements).

Calcium sulfate is used as reactant.Pulpous state calcium sulfate is poured in heat transfer plate 11, and reactant is formed Unit 13 is formed, thus surrounds heat transfer element 12.Additionally, by the amount regulating reactant, heat The transmitting element 12 reactant after the hardening of molding forms unit 13 and exposes 1 millimeter.Now, instead The volume answering thing to form unit 13 is of about each formation body about 3600 cubic centimetres.

Reactant forms body 10A and is so combined, i.e. by making reactant form body 10A's Facing with each other on the surface of that side that heat transfer element 12 exposes place, by regulating them in surface side To position so that reactant formed body 10A heat transfer element 12 do not interfere with each other；Reaction vessels 20 are formed by the aluminum flat member of 100 microns；Reaction medium flow path structure 23 is attached.Pass through Above-mentioned technique, heat storage and releasing unit 100A are formed.

Pass through above process, it is possible to the surface area of the reactant formation unit 13 that reaction medium reacts For every heat storage and releasing unit 100A8500 plane centimetre.The value of surface area is the biggest, reaction rate The fastest, so, the hot input/output speed during heat storage and release can be improved.

Further, in example 1, heat transfer element 12 can be about in longitudinal pyroconductivity 2W/ (m*K), its 0.2W/ (m*K) with the only situation that calcium sulfate is cured as reactant be in a ratio of its 10 Times.Noticing, pyroconductivity can be adjusted by the quantity of heat transfer element 12.Much less, In the situation needed, higher pyroconductivity can obtain by increasing the quantity of heat transfer element 12 ?.

(example 2)

In example 2, have a reactant as shown in Figure 2 A formed body 10B heat storage and Releasing unit is formed.

Specifically, reactant formation body 10B is so formed, i.e. by utilizing as shown in Figure 4 Heat transfer plate 11, cuts out structure by the upper surface ground substantially at right angles warpage relative to heat transfer plate 11 112, and form reactant formation unit 13 so that heat transfer element 12 is enclosed in reactant and is formed In unit 13.

The aluminium sheet of 500 millimeters × 800 millimeters × 0.5 millimeter is used as heat transfer plate 11.Cut out structure 112 Size be adjusted so that the height of heat transfer element 12 is 20 millimeters, width is 2 millimeters, The density of the heat transfer element 12 on surface is every 100 square centimeters of 52 elements (13 × 4 elements).

Calcium sulfate is used as reactant.Pulpous state calcium sulfate is poured in heat transfer plate 11, and reactant is formed Unit 13 is formed, thus surrounds heat transfer element 12.Additionally, by regulate reactant amount, Heat transfer plate 11 and reactant form the exposed area 12b's of the heat transfer element 12 between unit 13 Length is 2 millimeters.Now, the volume of reactant formation unit 13 is of about each formation body about 7200 Cubic centimetre.

The reactant formation body 10B formed is accommodated in and is formed by the aluminum metal flat member of 100 microns Reaction vessels 20 in, reaction medium flow path structure 23 is attached, heat storage and releasing unit It is formed.

Pass through above process, it is possible to the surface area of the reactant formation unit 13 that reaction medium reacts For every heat storage and releasing unit about 4500 plane centimetre.The value of surface area is the biggest, and reaction rate is the fastest, So, the hot input/output speed during heat storage and release can be improved.

Further, in example 2, heat transfer element 12 can be about in longitudinal pyroconductivity 1.4W/ (m*K), its 0.2W/ (m*K) with the only situation that calcium sulfate is cured as reactant be in a ratio of its 7 Times.It should be noted that, pyroconductivity can be adjusted by the quantity of heat transfer element 12.Need not Saying, in the situation needed, higher pyroconductivity can be by increasing the quantity of heat transfer element 12 And obtain.

(example 3)

In example 3, have two reactants as shown in Figure 2 B formed body 10C heat storage and Releasing unit is formed.

Specifically, reactant formation body 10C is so formed, i.e. by utilizing as shown in Figure 4 Heat transfer plate 11, cuts out structure by the upper surface ground substantially at right angles warpage relative to heat transfer plate 11 112, and form reactant formation unit 13 so that heat transfer element 12 is enclosed in reactant and is formed In unit 13.

The aluminium sheet of 500 millimeters × 800 millimeters × 0.5 millimeter is used as heat transfer plate 11.Cut out structure 112 Size be adjusted so that the height of heat transfer element 12 is 10 millimeters, width is 2 millimeters, The density of the heat transfer element 12 on surface is every 100 square centimeters of 78 elements (13 × 6 elements).

Calcium sulfate is used as reactant.Pulpous state calcium sulfate is poured in heat transfer plate 11, and reactant is formed Unit 13 is formed, thus surrounds heat transfer element 12.Now, by regulating the amount of reactant, heat The transmitting element 12 reactant after the hardening of molding forms unit 13 and exposes 1 millimeter, heat transfer plate A length of the 1 of the exposed area 12b of the heat transfer element 12 between 11 and reactant formation unit 13 Millimeter.

Above structure can the most such as realize: by heat transfer element 12 is arranged on the 50 of preparation In the silicon mould of cm x 80 cm x 1 centimetre, heat transfer element 12 leaching is as in silicon mould 1 millimeter； The amount of the reactant that regulation is poured into, so that being formed between unit 13 in heat transfer plate 11 and reactant Form gap.

Now, the volume of reactant formation unit 13 is of about often formation body 3200 cubic centimetres.

Reactant formed body 10C be so combined, i.e. by make reactant formed body 10C The surface of that side that heat transfer element 12 exposes place is facing with each other, by regulating them in surface direction Position so that reactant formed body 10C heat transfer element 12 do not interfere with each other；Reaction vessels 20 are formed by the aluminum flat member of 100 microns；Reaction medium flow path structure 23 is attached.Pass through Above-mentioned technique, heat storage and releasing unit 100C are formed.

Pass through above process, it is possible to the surface area of the reactant formation unit 13 that reaction medium reacts For every heat storage and releasing unit about 16500 plane centimetre.The value of surface area is the biggest, and reaction rate is more Hurry up, so, the hot input/output speed during heat storage and release can be improved.

Further, in example 3, being similar to example 1, heat transfer element 12 is in longitudinal heat biography Conductance can be about 2W/ (m*K), and itself and only calcium sulfate are cured as the situation of reactant 0.2W/ (m*K) is in a ratio of its 10 times.It should be noted that, pyroconductivity can pass through heat transfer element The quantity of 12 is adjusted.Much less, in the situation needed, higher pyroconductivity can be passed through Increase the quantity of heat transfer element 12 and obtain.

(comparative example 1)

Comparative example 1 will be described.Figure 13 is heat storage and the viewgraph of cross-section of releasing unit of comparative example 1.

In comparative example 1, the reactant that has of heat transfer element 12 is not had to form the heat storage of body 10Z It is formed with releasing unit 100Z, as shown in figure 13.

Specifically, reactant formation body 10Z is so formed: by preparing 50 cm x 80 cm x 1 Centimetre silicon mould, utilize calcium sulfate as reactant, and the reactant of pulp be poured into silicon mould In tool.The reactant formation body 10Z formed is accommodated in and is formed by 100 microns of aluminum metal flat members Reaction vessels 20 in, reaction medium flow path structure 23 is attached, and heat storage and release Unit 100Z is formed.

Pass through above process, it is possible to the surface area of the reactant formation unit 13 that reaction medium reacts It is of about every heat storage and releasing unit 500 square centimeters.

As described above, in example 1-3, compared with comparative example 1, it is possible to anti-with reaction medium The reactant answered forms the surface area of unit 13 and greatly increases, it is possible to height promotes the heat of reaction rate Storage and releasing unit 100 are achieved.More specifically, in example 1-3, with comparative example 1 phase Ratio, the surface area of 9-32 times is obtained.

Further, the pyroconductivity during reactant forms unit 13 is by wrapping heat transfer element 12 It is trapped among and reactant formation body 10 is greatly enhanced.More specifically, in example 1-3, with comparative example 1 compares, it is thus achieved that the pyroconductivity of 7-10 times.

In example 1-3, it may be particularly advantageous to, the reactant motion in reaction vessels 20 can be promoted Entering, reaction table area can have the reaction vessels 20 of flexible structure by utilization and increase, and can With design a kind of heat storage and releasing unit 100, wherein the sensible heat loss of reaction vessels 20 subtracts in particular Few.

It should be noted that, in example 1-3, calcium sulfate is used as reactant, but, the present invention is also It is not limited to these examples.As reactant, calcium oxide, magnesium oxide, calcium bromide, calcium chloride, use The reactant of other chemical reaction can use, and can store and discharge the various materials of heat, Including the adsorbent represented by silica gel and zeolite, can use.

(example 4)

In example 4, with reference to Figure 14, an example will be described, wherein according to the heat storage of an embodiment It is applied to chemical heat pump with releasing unit 100.

Figure 14 is the schematic diagram of the example of chemical heat pump 200.It should be noted that, wherein heat storage and Releasing unit 100 is used as in the situation of chemical heat pump, it should preparation more than one heat storage and release Unit 100.First heat storage and releasing unit 100 are connected to condenser, and carry out hot storing process. Further, the second heat storage and releasing unit 100 are connected to vaporizer, and carry out hot release process. It should be noted that, chemical heat pump 200 has the feature that, the hottest storing process and heat discharged Journey can be switched over by switching mechanism such as valve, but described mechanism is in fig. 14 with simplification Method illustrates.

Chemical heat pump 200 include heat storage and releasing unit 100, reaction medium flow path conduits 210, Heat transmission medium flow path 220, condenser 230 and vaporizer 240.

Reaction medium flow path conduits 210 is a pipeline, the end of this pipeline be connected to heat storage and The reaction medium flow path structure 23 of releasing unit 100.Further, reaction medium flow path tube Another end in road 210 is connected to condenser 230 via valve 250, and is connected to evaporation via valve 260 Device 240.

Heat transmission medium flow path 220 is flow path, inside this flow path, and heat transfer Media flow is passed through.Multiple heat storages and releasing unit 100 are placed in heat transmission medium flow path 220 In.In this case, heat storage and releasing unit 100 reaction medium flow path structure 23 via Reaction medium flow path conduits 210 is connected thermally to one another.

Condenser 230 is connected to heat transmission medium flow path 220, and has and be condensate in heat and stored Journey is formed the function of the gaseous reaction medium that unit 13 is released from reactant.

Vaporizer 240 has the function of the reaction medium of evaporative condenser with in order to incite somebody to action during discharging in heat It is fed to reactant and is formed in unit 13.

It follows that by utilizing the example of the recuperation of heat of chemical heat pump 200 to be described.It should be noted that Arrive, in this example embodiment, reason for convenience, such situation, wherein calcium sulfate will be described Being used for reactant and form unit 13, steam is used as reaction medium, but the present invention is not limited to Such situation.

In hot storing process, valve 260 closes and valve 250 is opened.In this state, such as, The discarded heat transfer being used as entering in heat transmission medium flow path 220 produced in the factory is situated between Matter H；Steam is released from hydrated calcium sulfate；And hot release process is carried out.Release from calcium sulfate Steam passes through reaction medium flow path conduits 210, and condenses in condenser 230.

On the other hand, during heat discharges, valve 250 closes, and valve 260 is opened.In evaporation In device 240, the steam of evaporation is introduced into heat storage by reaction medium flow path conduits 210 and releases Put in unit 100.By making the steam being introduced into react with calcium sulfate, hot release process is carried out.

Assuming that during hot storing process and heat release, inside heat transmission medium flow path 220 And in the region outside heat storage and releasing unit 100 (it is, heat transmission medium H place Region) in pressure be such as one atmospheric pressure.On the other hand, because heat stores and releasing unit 100 Inside be in wherein steam and calcium sulfate and be present in the state in vacuum space, therefore it Pressure is the water vapour pressure in heat storage and releasing unit 100.

Water vapour pressure above will be similar in hot storing process at a temperature of condenser 230 Water vapour pressure, and it is similar to depend on the water vapour pressure of the temperature of calcium sulfate, and aforementioned water Steam pressure both of which is less than normal ambient pressure.In other words, at heat storage and releasing unit 100 Inside and outside generation pressure differential, wherein the pressure of the outside of heat storage and releasing unit 100 is higher than interior The pressure in portion.

In this example, because heat transfer surface, it is the part of outer wall for reaction vessels 20, By lamellar lens forming, therefore heat transfer surface is pressed against calcium sulfate due to pressure differential.In other words, Heat transfer surface may be coupled to reactant and forms unit 13, and formed in heat transfer surface and reactant There is between unit 13 low thermal resistivity.By above-mentioned arrangement, during heat discharges, by reactant The reaction heat forming the reaction generation between unit 13 and reaction medium can be efficiently transferred to heat transfer Surface, and exchange with heat transmission medium H.On the other hand, in hot storing process, it is situated between from heat transfer Matter H is delivered to the heat of heat transfer surface and can be effectively stored in reactant formation unit 13.Change sentence Talk about, it is possible to obtain the chemical heat pump that heat storage is good with the hot input-output characteristic of releasing unit 100 200。

In superincumbent operation, due in the effects of compressive reaction vessels 20 that atmospheric pressure produces Portion, but due to the bridging structure as described in example 1-3, reaction medium flow path 14 is tieed up Hold without narrowing.Therefore, the big contact of reactant formation unit 13 describes and can be maintained also And heat stores and during release, the motion of reaction medium is promoted.

Embodiment as particularly example will be described, wherein, at heat transmission medium flow path 220 Inside and heat storage and releasing unit outside region pressure substantially atmospheric pressure (such as, 101kPa), calcium sulfate is used as reactant and forms unit 13, and steam is used as reaction medium.

The chemical heat pump 200 with good hot input-output characteristic obtains in such a situa-tion, i.e. Wherein the temperature of calcium sulfate is less than 190 DEG C, and water vapor pressure during the heat release of this embodiment Power is less than 90kPa.But, the present invention is not limited to above-described embodiment, but the reactant of higher temperature The reaction medium forming unit 13 and higher pressure can be designed by utilizing such method, I.e., in the method, heat storage is positioned in heat transmission medium bathroom with releasing unit and outside Pressure is applied in, etc..In other words, there is the chemical heat pump 200 of good hot input-output characteristic Can obtain under all conditions, wherein the pressure of heat storage and releasing unit is situated between less than being positioned at heat transfer Matter flow path 220 is internal and heat stores and the pressure in the region outside releasing unit.

(example 5)

In example 5, with reference to Figure 15, wherein according to heat storage and the releasing unit 100 of an embodiment The aspect being applied to non-electrical gasification cooling unit will be described.

Figure 15 is the schematic diagram of the example of non-electrified cooling unit 300.It should be noted that, be only used for The basic structure realizing refrigerating function illustrates the most in a simplified manner.In cooling down operation, false The heat storage that fixed heat stores with the reactant in releasing unit is complete, and what therefore heat stored retouches in detail State and will be omitted.Such as, during calcium sulfate is used as the situation of reactant wherein, when at 150 DEG C When performing the roasting of 5 hours, water of crystallization is pulled away；Anhydrous hydrate is obtained；And heat is stored. Such operation should first carry out in advance.

Non-electrical gasification cooling unit 300 includes above-mentioned heat storage and releasing unit 100, is connected to heat and deposits The reaction medium flow path conduits of the reaction medium flow path structure 23 of storage and releasing unit 100 310 and cooling panel 320 (corresponding to the vaporizer 240 of chemical heat pump 200).Reaction medium flow Path conduits 310 is connected to cool down panel 320 via valve 330.Cooling panel 320 is positioned in such as In cooling chamber 340 and cool down the inside of cooling chamber 340.

It follows that the cooling down operation that wherein non-electrical gasification cooling unit 300 is used will be described.? In this example, for convenience, wherein calcium sulfate is used for reactant and forms unit 13 and water Steam is used as the situation of reaction medium and will be described, but the present invention is not limited to this situation.

Heat storage and releasing unit 100 are in wherein heat storage and are complete and cool down panel 320 quilt It is filled with the state of water.At heat storage and releasing unit 100, reaction medium flow path conduits 310 It is evacuated with cooling panel 320 inside, and valve 330 closes.

In superincumbent state, when valve 330 is opened, the water in cooling panel 320 is evaporated and is led to Cross reaction medium flow path conduits 310 to be introduced in heat storage and releasing unit 100.By making The steam that must be introduced into reacts with calcium sulfate, and the evaporation of water in cooling panel 320 is promoted, As a result, cooling panel 320 is cooled down by heat of vaporization.

Calcium sulfate is by reacting generation heat with steam, but the heat produced is from the surface of reaction vessels 20 It is effectively released in air, and owing to the heat of this example stores and the heat of releasing unit 100 Transmission and the facilitation effect of reaction, the reaction between calcium sulfate and steam continuously performs.Above cold But effect continue, until heat storage and releasing unit 100 in calcium sulfate become hemihydrate and Reaction stops, or the water in cooling panel 320 is evaporated.

In other words, the non-electrical gasification cooling unit 300 with good cooling capacity can be provided. As it has been described above, because operation need not power supply cold going, functional unit the most in this example It is known as non-electrical gasification cooling unit 300.

As it has been described above, describe chemical heat pump and non-electrical gasification cooling unit by example, but The present invention is not limited to above example, but within the scope of the invention, can carry out various amendment And change.

The present invention is not limited to specifically disclosed embodiment, but can carry out various modifications and variations, And without departing from the scope of the present invention.

The application is based on the Japanese priority application number submitted on March 30th, 2015 2015-068476 and the Japanese priority application number submitted on October 7th, 2015 2015-199692, and require the rights and interests of these priority applications, the totality of these priority applications It is incorporated in this by reference.

Claims (11)

1. heat storage and a releasing unit, including:

Reactant forms body, and it is configured to react with reaction medium with storage and release heat；

Reaction vessels, it is configured to receive described reactant and forms body and form body exchange with this reactant Heat；

Reaction medium flow path structure, it is connected to described reaction vessels, be configured to supply described instead Medium is answered to arrive described reaction vessels or discharge described reaction medium from described reaction vessels,

Wherein, described reactant formed tabular heat transfer plate that body includes contacting with described reaction vessels, The heat transfer element extended from the surface of described heat transfer plate and reactant are formed substantially at right anglesly Unit, this reactant forms unit around described heat transfer element so that described heat transfer element part Ground exposes, and,

Wherein, described reaction vessels can by described reaction vessels outwardly and inwardly between pressure reduction And change form.

2. heat storage as claimed in claim 1 and releasing unit, wherein,

Described reaction vessels is formed by flat member.

3. heat storage as claimed in claim 2 and releasing unit, wherein,

Described flat member is foil or plastic sheet.

4. the heat storage as described in one of claim 1-3 and releasing unit, wherein,

Described heat transfer element has pin-like shape or plate-like shape.

5. the heat storage as described in one of claim 1-4 and releasing unit, wherein,

Described reactant is formed unit and is formed by molding curing reaction thing.

6. the heat storage as described in one of claim 1-5 and releasing unit, wherein,

Described heat transfer element includes forming, from described reactant, the exposed area that the first surface of unit exposes Territory, described first surface is positioned at described heat transfer plate and arranges on the opposite flank of side at place.

7. the heat storage as described in one of claim 1-6 and releasing unit, wherein,

Described heat transfer element includes forming, from described reactant, the exposed area that the second surface of unit exposes Territory, described second surface is positioned at described heat transfer plate and arranges on the side at place.

8. the heat storage as described in one of claim 1-7 and releasing unit, wherein,

Described heat transfer element is integrally formed with described heat transfer plate, and by making described heat transfer The part of plate is formed relative to the surface warpage approximate right angle of described heat transfer plate.

9. the heat storage as described in one of claim 1-8 and releasing unit, wherein,

Described heat transfer plate and described heat transfer element include aluminum or copper.

10. a chemical heat pump, including:

Heat storage as described in one of claim 1-9 and releasing unit；

It is configured to be thermally connected to the heat transmission medium of described reaction vessels；

The reaction of the described reaction medium flow path structure being configured to connect in described reaction vessels is situated between Matter flow path conduits；

It is configured to be connected to the condenser of described reaction medium flow path conduits via switching mechanism；With And

It is configured to be connected to the evaporation of described reaction medium flow path conduits via described switching mechanism Device.

11. 1 kinds of non-electrical gasification cooling units, including:

Heat storage as described in one of claim 1-9 and releasing unit；

It is configured to connect to the reaction of the reaction medium flow path structure of described heat storage and releasing unit Media flow paths pipeline；With

It is configured to be connected to the cooling panel of described reaction medium flow path conduits via switching mechanism.