CN105997334B - A kind of wearable heating and cooling device - Google Patents

A kind of wearable heating and cooling device Download PDF

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Publication number
CN105997334B
CN105997334B CN201610506622.0A CN201610506622A CN105997334B CN 105997334 B CN105997334 B CN 105997334B CN 201610506622 A CN201610506622 A CN 201610506622A CN 105997334 B CN105997334 B CN 105997334B
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China
Prior art keywords
thermally conductive
conductive sheet
lower floor
semiconductor chilling
cooling device
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CN201610506622.0A
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Chinese (zh)
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CN105997334A (en
Inventor
王凯
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Suzhou Love Intelligent Technology Co Ltd
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Suzhou Love Intelligent Technology Co Ltd
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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F7/00Heating or cooling appliances for medical or therapeutic treatment of the human body
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F7/00Heating or cooling appliances for medical or therapeutic treatment of the human body
    • A61F7/02Compresses or poultices for effecting heating or cooling
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F7/00Heating or cooling appliances for medical or therapeutic treatment of the human body
    • A61F7/02Compresses or poultices for effecting heating or cooling
    • A61F2007/0295Compresses or poultices for effecting heating or cooling for heating or cooling or use at more than one temperature
    • A61F2007/0298Compresses or poultices for effecting heating or cooling for heating or cooling or use at more than one temperature with a section for heating and a section for cooling

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  • Health & Medical Sciences (AREA)
  • Vascular Medicine (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention discloses a kind of wearable heating and cooling device, including fixation bottom plate, lower floor's thermally conductive sheet, at least two semiconductor chilling plates, upper strata thermally conductive sheet, mini-fan, the clamp button of the spring sequentially set from the bottom to top.At least two semiconductor chilling plates are connected by circuit in series or in parallel, and power supply circuit is polarity switching circuit, by changing the adjusting device cooling of circuit voltage direction and heating power and energy.Mini-fan occupy the centre of at least two semiconductor chilling plates, makes full use of space, fully reduces product thickness, reaches product miniaturization.Entirely through Spring Card and raised outward buckle hanging buckle on fixed bottom plate, the movement of two layers of thermally conductive sheet horizontal direction is limited, clamp button of the spring structure is relatively easy, and can ensure that two layers of thermally conductive sheet compresses semiconductor chilling plate, while realizing that heat effectively transfers, product weight is reduced.The present invention is compact-sized, small, light-weight, and heat transfer efficiency is high, realizes cooling and the difunctional conversion that heats up.

Description

A kind of wearable heating and cooling device
Technical field
The present invention relates to semiconductor refrigerating and medical instruments field, especially a kind of wearable heating and cooling device.
Background technology
Human body skin part lesion or fever, mostly using the method for ice block cooling, are passed when needing body cool Ice bank of uniting is not extremely square every time in use, must place refrigerator precooling in advance can use in itself without refrigeration and temperature control performance Just.Solve the problems, such as the inconvenient to use of traditional ice bag using a kind of water-bag type micro semiconductor temperature-decreasing ice belt in the prior art, But the equipment can be only applied to body temperature lowering, it is impossible to meet human body requirements heating demand, and volume is larger, and it is not portable.
The content of the invention
The object of the invention:Be in order to overcome the problems, such as present in the prior art it is above-mentioned can only cool down, it is bulky.Invention one The new both cold and hot applications dual-purpose apparatus of kind, the device are suitble to different human body to use, and increase fomentation effect, and its small volume, wear It wears comfortable.By the present invention, dual-purpose, the expansion human body cold compress products application scope that heats up and cool down, and compact-sized, body are realized Product is small, light-weight, and heat transfer efficiency is high.
The technical solution adopted by the present invention:A kind of wearable heating and cooling device, including the fixation sequentially set from the bottom to top Bottom plate, lower floor's thermally conductive sheet, at least two semiconductor chilling plates, upper strata thermally conductive sheet, mini-fan, clamp button of the spring, the semiconductor Cooling piece is connected by series circuit, and the mini-fan is located at the center of the upper strata thermally conductive sheet, the wearable heating and cooling Device is fixed by the clamp button of the spring.
The fixed bottom plate center is equipped with the first hole slot, and the first hole slot is surrounded by raised outward buckle, the fixed bottom plate Shape is depending on shape of product.
The shape size of lower floor's thermally conductive sheet is consistent with the shape size of first hole slot on the fixed bottom plate, It matches so that lower floor's thermally conductive sheet can be embedded in the first hole slot on fixed bottom plate.
Further, groove, the position of the groove and size and the fixed bottom are equipped on the outside of lower floor's thermally conductive sheet The raised outward buckle of plate, which corresponds, to be set, and by groove and the mutually embedding effect of raised outward buckle, can fix lower floor's bottom plate in water Square to movement.
Further again, lower floor's thermally conductive sheet is surrounded by protrusive board item, and the protrusive board item is parallel to lower floor's heat-conducting plate Plane so that lower floor's thermally conductive sheet is affiliated on the fixed bottom plate, for fixing lower floor's thermally conductive sheet vertical direction.Pass through institute State the mutually embedding effect between the groove on lower floor's thermally conductive sheet and the raised outward buckle on the fixed bottom plate and the protrusive board Lower floor's thermally conductive sheet can be firmly secured on the fixed bottom plate by be affiliated to effect of the item on the fixed bottom plate.
Groove, the groove location and size are equipped on the outside of the upper strata thermally conductive sheet surrounding and the raised outward buckle one is a pair of Should, by groove and the mutually embedding effect of raised outward buckle, the movement in the horizontal direction of upper strata bottom plate can be fixed.
Further, the upper strata thermally conductive sheet center is equipped with the second hole slot, and second hole slot is applied to dispose described micro- Type fan.
Including at least two semiconductor chilling plates, at least two semiconductor chilling plate is evenly distributed on the lower floor and passes The both ends of backing upper surface are clipped in the centre of upper strata thermally conductive sheet and lower floor's thermally conductive sheet, are connected by circuit in series or in parallel.
Further, at least two semiconductor chilling plate being connected in series has externally fed circuit, the power supply Circuit is polarity switching circuit, and the voltage direction of the polarity switching circuit is adjustable.By changing voltage direction, so as to change half Conductor heat transfer direction so that device heating cooling function is mutually converted, while improves heat transfer contact area, and then improves heat transfer effect Rate.
The mini-fan is arranged on the second hole slot of the upper strata thermally conductive sheet, is fixed on by screw or Dingmao described The radiating rate of two semiconductors and the upper strata thermally conductive sheet is accelerated, together in the center of at least two semiconductor chilling plates When make full use of space, fully reduce product thickness, achieve the purpose that product minimize.
The clamp button of the spring and the snap effect of the raised outward buckle, ensure the upper strata thermally conductive sheet and lower floor's heat conduction Piece tightly pushes down the semiconductor chilling plate, while realizing that heat effectively transfers, reduces product weight, compact-sized.
Circuit of the present invention is polarity switching circuit, and by changing voltage direction, heating and the cooling function of regulating device turn Become, wherein in temperature-fall period, lower floor's thermally conductive sheet is heat sink, and upper strata thermally conductive sheet is radiator;In temperature-rise period, lower floor leads Backing is radiator, gives human heat, and upper strata thermally conductive sheet is heat sink.
Description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is present invention construction exploded perspective view (omitting power supply, circuit part), and Fig. 2 is the front view of the present invention.
1. fix bottom plate, 11. raised outward buckles, 12. first hole slots, 2. lower floor's thermally conductive sheets, 21. grooves, 22. outer protrusive boards in figure Item, 3. semiconductor chilling plates, 4. upper strata thermally conductive sheets, 41. grooves, 42. second hole slots, 5. mini-fans, 6. clamp button of the spring
Specific embodiment
As shown in Figure 1, a kind of wearable heating and cooling device, by fixed bottom plate 1, lower floor's thermally conductive sheet 2, semiconductor chilling plate 3, Upper strata thermally conductive sheet 4, mini-fan 5 and clamp button of the spring 6 are formed, and are followed successively by fixed bottom plate 1, lower floor's thermally conductive sheet 2, multiple from lower to upper Semiconductor chilling plate 3, upper strata thermally conductive sheet 4, clamp button of the spring 6, mini-fan 5, the wearable heat riser are consolidated by clamp button of the spring It is fixed.
Fixed 1 center of bottom plate is equipped with the first hole slot 12, and first hole slot 12 is surrounded by raised outward buckle 11, the fixation The shape of bottom plate 1 is depending on shape of product.
2 shape size of lower floor's thermally conductive sheet is consistent with the shape size of first hole slot 12, matches so that lower floor's heat conduction Piece can be embedded in the groove on fixed bottom plate.The outside of lower floor's thermally conductive sheet 2 is equipped with groove 21, the position of the groove 21 and big It is small to be corresponded with the raised outward buckle 11, by groove and the mutually embedding effect of raised outward buckle, lower floor's bottom plate can be fixed in level The movement in direction.Lower floor's thermally conductive sheet 2 is surrounded by protrusive board item 22, and the protrusive board item 22 is parallel to lower floor's heat-conducting plate plane so that Lower floor's thermally conductive sheet 2 is affiliated on the fixed bottom plate 1, for fixing lower floor's thermally conductive sheet vertical direction.
Groove 41,41 position of groove and size and the raised outward buckle 11 1 are equipped on the outside of 4 surrounding of upper strata thermally conductive sheet One corresponds to, and by groove and the mutually embedding effect of raised outward buckle, can fix the movement in the horizontal direction of upper strata bottom plate.Upper strata thermally conductive sheet 4 centers are equipped with the second hole slot 42, and second hole slot 42 is applied to dispose the mini-fan.
In the implementation case, semiconductor chilling plate 3 includes two, and two semiconductor chilling plates are led respectively positioned at the lower floor The both ends of backing upper surface.Two semiconductor chilling plates 3 are connected using series circuit, and power supply circuit is polarity switching electricity Road by changing voltage direction, and changes semiconductor heat transfer direction so that device heating cooling function is mutually converted, and is carried simultaneously High heat transfer contact area, and then improve heat transfer efficiency.Preferably, parallel circuit company can be used in two semiconductor chilling plates 3 It connects, the power of the parallel circuit is four times of the power of series circuit, and realizes the refrigeration of two semiconductor chilling plates 3 Being adjusted for general power size, makes it use more hommization.
Mini-fan 5 passes through upper strata thermally conductive sheet 4, is fixed on by screw or Dingmao in two semiconductor chilling plates Centre, 4 positive and negative ingress of air of upper strata thermally conductive sheet on the premise of not improving air quantity and increasing heat exchange material weight, accelerate two The radiating rate of semiconductor 3 and upper strata thermally conductive sheet 4, while space is made full use of, product thickness is fully reduced, it is small to reach product The purpose of type.
Clamp button of the spring 6 realizes that wearable heat riser is integrally fixed together with the raised collar extension 11 tightly hanging buckle.Bullet Spring 6 structures of buckle are relatively easy, and can ensure that upper strata thermally conductive sheet and lower floor's thermally conductive sheet compress semiconductor chilling plate, realize heat While amount is effectively transferred, product weight is reduced.
When the wearable heating and cooling device is as heat sink, lower floor's thermally conductive sheet 2 be heat sink, upper strata thermally conductive sheet 4 For radiator, control polarity switching circuit, heat will be transferred to upper strata by semiconductor chilling plate 3 from lower floor's thermally conductive sheet 2 and lead By the quickening heat sinking function of mini-fan 5, heat Quick diffusing is gone out for backing 4;When the wearable heating and cooling device conduct During heat riser, lower floor's thermally conductive sheet 2 be radiator, upper strata thermally conductive sheet 4 be heat sink, control polarity switching circuit, heat Upper strata thermally conductive sheet 2 will be transferred to from upper strata thermally conductive sheet 4 by semiconductor chilling plate 3, then by upper strata thermally conductive sheet 2 by heat transmission To human body.
So far, although those skilled in the art will appreciate that detailed herein have shown and described the exemplary of the present invention Embodiment still, without departing from the spirit and scope of the present invention, still can be determined directly according to the present disclosure Or derive many other variations or modifications consistent with the principles of the invention.Therefore, the scope of the invention should be understood and defined as Cover other all these variations or modifications.

Claims (5)

1. a kind of wearable heating and cooling device, which is characterized in that including sequentially set from the bottom to top fixation bottom plate (1), lower floor Thermally conductive sheet (2), at least two semiconductor chilling plates (3), upper strata thermally conductive sheet (4), mini-fan (5), clamp button of the spring (6), it is described At least two semiconductor chilling plates (3) are connected by circuit in series or in parallel, and the mini-fan is located at the upper strata heat conduction The center of piece (4), the wearable heating and cooling device is fixed by the clamp button of the spring (6), and fixed bottom plate (1) center is set There is the first hole slot (12), first hole slot (12) is surrounded by raised outward buckle (11), and the shape of lower floor's thermally conductive sheet (2) is big It is small consistent with the shape size of first hole slot (12), fluted (21) are set on the outside of lower floor's thermally conductive sheet (2), and with Raised outward buckle (11) on the fixed bottom plate (1), which corresponds, to be set, and lower floor's thermally conductive sheet (2) upper surface is equipped with outer protrusive board Item (22), the evagination lath (22) are provided with recessed parallel to lower floor's thermally conductive sheet (2) plane, upper strata thermally conductive sheet (4) outside Slot (41), and correspond and set with the raised outward buckle (11) on the fixed bottom plate (1), the clamp button of the spring (6) and institute It states raised outward buckle (11) hanging buckle on fixed bottom plate (1) together, realizes that the entirety of the wearable heating and cooling device is fixed.
2. wearable heating and cooling device according to claim 1, which is characterized in that upper strata thermally conductive sheet (4) center is set There is the second hole slot (42), second hole slot (42) is used to place the mini-fan (5).
3. wearable heating and cooling device according to claim 1, which is characterized in that at least two semiconductor chilling plate (3) lower floor's thermally conductive sheet (2) surface is uniformly placed in, and is connected by circuit in series or in parallel.
4. wearable heating and cooling device according to claim 3, which is characterized in that be connected in series or in parallel it is described extremely Few two semiconductor chilling plates (3) have an externally fed circuit, and the power supply circuit is polarity switching circuit, the polarity switching The voltage direction of circuit is adjustable.
5. wearable heating and cooling device according to claim 2, which is characterized in that the mini-fan (5) is arranged on institute It states in the second hole slot (42), is fixed at least two semiconductor chilling plate (3) center.
CN201610506622.0A 2016-07-01 2016-07-01 A kind of wearable heating and cooling device Active CN105997334B (en)

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Application Number Priority Date Filing Date Title
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CN105997334B true CN105997334B (en) 2018-05-25

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CN108617151A (en) * 2018-07-27 2018-10-02 深圳市誉品智能光电科技有限公司 Cooling and heat dissipation module

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Publication number Priority date Publication date Assignee Title
US5800490A (en) * 1996-11-07 1998-09-01 Patz; Herbert Samuel Lightweight portable cooling or heating device with multiple applications
CN1575676A (en) * 2003-07-02 2005-02-09 Lg电子株式会社 Wearable cooler using thermoelectric module
CN101907368A (en) * 2010-07-07 2010-12-08 桂林市同步工业自动控制有限责任公司 Refrigerated constant temperature pot
CN104507426A (en) * 2012-07-31 2015-04-08 雅芒股份有限公司 Hot-cold beauty treatment device
CN103256751A (en) * 2013-05-10 2013-08-21 广东工业大学 Energy-saving semiconductor cold-hot switching device and controlling method thereof
WO2015079237A1 (en) * 2013-11-27 2015-06-04 Nayan Patel Orthopaedic device
CN204027070U (en) * 2014-08-22 2014-12-17 深圳市普康电子有限公司 Biochemical refrigerating plant
CN204084941U (en) * 2014-08-29 2015-01-07 美的集团武汉制冷设备有限公司 Refrigerating chip assembly and refrigeration plant
CN204364209U (en) * 2014-12-22 2015-06-03 广西蓝星大华化工有限责任公司 A kind of wear-type electronic temperature-decreasing device
CN104605982A (en) * 2015-01-15 2015-05-13 黄海廷 Cold and hot compress eye patch
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CN206026525U (en) * 2016-07-01 2017-03-22 苏州爱科意智能科技有限公司 Wearable heat sink that rises

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