CN108617151A - Cooling and heat dissipation module - Google Patents
Cooling and heat dissipation module Download PDFInfo
- Publication number
- CN108617151A CN108617151A CN201810845930.5A CN201810845930A CN108617151A CN 108617151 A CN108617151 A CN 108617151A CN 201810845930 A CN201810845930 A CN 201810845930A CN 108617151 A CN108617151 A CN 108617151A
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- Prior art keywords
- plate
- cooling
- semiconductor chilling
- fan
- heat dissipation
- Prior art date
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- 238000001816 cooling Methods 0.000 title claims abstract description 49
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 42
- 239000004065 semiconductor Substances 0.000 claims abstract description 58
- 238000010438 heat treatment Methods 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 17
- 229920001296 polysiloxane Polymers 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000013461 design Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 206010037660 Pyrexia Diseases 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229920001342 Bakelite® Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of cooling and heat dissipation modules, including：Box body and the semiconductor chilling plate in the box body and fan；The box body includes the upper plate being oppositely arranged and lower plate and the side plate for being separately connected the upper plate and lower plate；At least described lower plate is prepared by Heat Conduction Material in the box body；The semiconductor chilling plate is set up in parallel with the fan in the plane for being parallel to the lower plate；The semiconductor chilling plate has the chill surface being oppositely arranged and heating surface；The upper plate is equipped with through-hole, and the chill surface of the semiconductor chilling plate is exposed to outside the through-hole；The lower plate is equipped with air inlet, and the fan corresponds to the air inlet setting, and the air inlet is used to provide air intake passage for the fan；The side plate is equipped with air outlet, and the air outlet is used to provide air exhaust passage for the fan.
Description
Technical field
The present invention relates to heat abstractor technical field more particularly to a kind of cooling and heat dissipation modules.
Background technology
With popularizing for mobile electronic device such as mobile phone, people’s lives are greatly facilitated, frequency of use is increasingly
Height, also high speed development, especially wireless charging technology also come into the application stage to the charging technique of mobile electronic device therewith.
Wireless charger is can be charged the battery in the case of not physical connection direct with the electrical contact of battery
Equipment, and generally include the terminal body that power transmission coil is wound about.
At present in mobile phone wireless charging process, due to the fever of the electromagnetic coil in wireless charging base, it is attached to mobile phone back
Power coil operation fever and mobile phone charging process in the fever of itself, the superposition of three kinds of heats causes current
Fever is serious when mobile phone wireless charges, and damages mobile phone.On the other hand, some mobile phones are detecting temperature to keep safe charging
When degree is increased to a certain threshold value, it can force to reduce charging current, cause the extension in charging time.With the in-built electrical of electronic equipment
Tankage is increasing, and radiating requirements when charging are also increasing.
Invention content
The purpose of the present invention is to provide a kind of cooling and heat dissipation modules, have smaller thickness, and can realize excellent
Heat dissipation effect.
For the above goal of the invention of realization, the present invention provides a kind of cooling and heat dissipation module, including：Box body and be set to the box
Internal semiconductor chilling plate and fan；
The box body includes the upper plate being oppositely arranged and lower plate and is separately connected the upper plate and lower plate
Side plate；At least described lower plate is prepared by Heat Conduction Material in the box body；
The semiconductor chilling plate is set up in parallel with the fan in the plane for being parallel to the lower plate；It is described partly to lead
Body cooling piece has the chill surface being oppositely arranged and heating surface；
The upper plate is equipped with through-hole, and the chill surface of the semiconductor chilling plate is exposed to outside the through-hole；Under described
Bottom plate is equipped with air inlet, and the fan corresponds to the air inlet setting, and the air inlet is used to provide air inlet for the fan
Channel；The side plate is equipped with air outlet, and the air outlet is used to provide air exhaust passage for the fan.
Optionally, the heating surface of the semiconductor chilling plate is directly in contact with the lower plate.
Optionally, heat conduction silicone is equipped between the heating surface of the semiconductor chilling plate and the lower plate, it is described to lead
Hot layer of silica gel is distributed in all areas of the heating surface of the semiconductor chilling plate.
Optionally, cooling and heat dissipation module of the invention further includes the support element being set on the lower plate, the semiconductor
Cooling piece is set on the support element and is fixedly connected with the support element by heat conductive silica gel, and the support element is by heat conduction material
Prepared by material, the area of the top surface of the support element is less than the area of the heating surface of the semiconductor chilling plate.
Optionally, the support element is fixedly connected with the lower plate.
Optionally, the support element is integrally formed with the lower plate, alternatively, the support element is welded with the lower plate
Together.
Optionally, cooling and heat dissipation module of the invention further includes the thermal-insulated frame set on semiconductor chilling plate periphery.
Optionally, the fan is fixedly connected with the upper plate.
Optionally, cooling and heat dissipation module of the invention further includes being set to above the upper plate and corresponding to the fan to set
The heat insulating mattress set.
Optionally, the heat insulating mattress is fixed on by adhesive glue on the upper plate.
Beneficial effects of the present invention：The cooling and heat dissipation module of the present invention by setting semiconductor chilling plate with fan side by side
It sets, i.e., the semiconductor chilling plate and the fan is arranged substantially in approximately the same plane rather than layer stack designs, it is this
Design can reduce the thickness of cooling and heat dissipation module to the greatest extent.The cooling and heat dissipation module of the present invention can be applied to all kinds of electricity
Cooling effect is played in sub- product (such as wireless charger), for the electronic product of the other radiators of application, is answered
Smaller thickness can be kept with the electronic product of cooling and heat dissipation module of the present invention, is conducive to the thinning of product.In addition, of the invention
Cooling and heat dissipation module fan and semiconductor chilling plate are incorporated into the same frame form integrated heat radiation module, for pin
It sells, transport and assembling is provided convenience.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of the scope of the invention.
Semiconductor chilling plate is set with fan in box body side by side in the cooling and heat dissipation module that Fig. 1 is 1-3 of the embodiment of the present invention
The schematic diagram set；
Fig. 2 is the schematic top plan view of the upper plate of the box body in the cooling and heat dissipation module of 1-3 of the embodiment of the present invention；
Fig. 3 is the schematic cross-sectional view of the cooling and heat dissipation module of the embodiment of the present invention 1；
Fig. 4 is the schematic cross-sectional view of the cooling and heat dissipation module of the embodiment of the present invention 2；
Fig. 5 is the schematic cross-sectional view of the cooling and heat dissipation module of the embodiment of the present invention 3.
Main element symbol description：
10- box bodys；
11- upper plates；
115- through-holes；
12- lower plates；
121- air inlets；
13- side plates；
131- air outlets；
20- semiconductor chilling plates；
21- chill surfaces；
22- heating surfaces；
30- fans；
40- thermal-insulated frames；
50- heat insulating mattress；
60- heat conduction silicones；
70- support elements.
Specific implementation mode
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
The component of embodiments of the present invention, which are generally described and illustrated herein in the accompanying drawings can be come with a variety of different configurations
Arrangement and design.Therefore, the detailed description of the embodiment of the present invention to providing in the accompanying drawings is not intended to limit requirement below
The scope of the present invention of protection, but it is merely representative of the selected embodiment of the present invention.Based on the embodiment of the present invention, this field skill
The every other embodiment that art personnel are obtained without making creative work belongs to the model that the present invention protects
It encloses.
Hereinafter, term " comprising ", " having " and its cognate that can be used in various embodiments of the present invention are only
It is intended to mean that special characteristic, number, step, operation, the combination of element, component or aforementioned item, and is understood not to first
Exclude one or more other features, number, step, operation, the presence of the combination of element, component or aforementioned item or increase by one
A or more feature, number, step, the possibility of operation, the combination of element, component or aforementioned item.
In various embodiments of the present invention, statement " A or/and B " includes any combinations or the institute of the word listed file names with
There is combination, it may include A, may include B or may include A and B both.
In the description of the present invention, it is to be understood that, term " longitudinal direction ", " transverse direction ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", " transverse direction ", "top", "bottom", "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown, is merely for convenience of description of the present invention and simplification of the description, and does not indicate or imply the indicated dress
It sets or element must have a particular orientation, with specific azimuth configuration and operation, therefore should not be understood as the limit to the present invention
System.In addition, term " first ", " second ", " third " etc. are only used for distinguishing description, it is not understood to indicate or imply relatively heavy
The property wanted.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
Centainly refer to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
One or more embodiments or example in can be combined in any suitable manner.
In the description of the present invention, unless otherwise specified and limited, it should be noted that term " installation ", " connected ",
" connection " shall be understood in a broad sense, for example, it may be mechanical connection, can also be the connection inside two elements, can be direct
It is connected, can also indirectly connected through an intermediary, for the ordinary skill in the art, it can be as the case may be
Understand the concrete meaning of above-mentioned term.Unless otherwise defined, otherwise all terms used herein (including technical term and section
Technics) there is meaning identical with the normally understood meaning of various embodiments of the present invention one skilled in the art.
The term (term such as limited in the dictionary generally used) be to be interpreted as with in the related technical field
The identical meaning of situational meaning and the meaning that Utopian meaning or too formal will be interpreted as having, unless in this hair
It is clearly defined in bright various embodiments.
Embodiment 1
Please refer to Fig.1, Fig. 2 and Fig. 3, the embodiment of the present invention 1 provide a kind of cooling and heat dissipation module, including：Box body 10 is set
In semiconductor chilling plate 20 and fan 30 in the box body 10；
The box body 10 include the upper plate 11 that is oppositely arranged with lower plate 12 and be separately connected the upper plate 11 with
The side plate 13 of lower plate 12；At least the lower plate 12 is prepared by Heat Conduction Material in the box body 10；
The semiconductor chilling plate 20 is set up in parallel with fan 30 in the plane for being parallel to the lower plate 12；Described half
Conductor cooling piece 20 has the chill surface 21 being oppositely arranged and heating surface 22；
The upper plate 11 is equipped with through-hole 115, and the chill surface 21 of the semiconductor chilling plate 20 is exposed to the through-hole
Outside 115；
The lower plate 12 is equipped with air inlet 121, and the fan 30 corresponds to the setting of the air inlet 121, the air inlet
Mouth 121 for the fan 30 for providing air intake passage；
The side plate 13 is equipped with air outlet 131, and the air outlet 131 is used to provide air exhaust passage for the fan 30.
Specifically, the heating surface 22 of the semiconductor chilling plate 20 is directly in contact with the lower plate 12.
Specifically, the upper plate 11, lower plate 12 and side plate 13 are prepared by Heat Conduction Material, the Heat Conduction Material can
Think metal, such as copper, aluminium etc..
Optionally, the upper plate 11, lower plate 12 and side plate 13 are integrally formed.
The operation principle of cooling and heat dissipation module of the present invention is：The chill surface 21 of the semiconductor chilling plate 20 is used for will be cold
Amount is transferred in the object for needing to cool down, and the heating surface 22 of the semiconductor chilling plate 20 transfers heat to the box body 10
On, it radiates later to the box body 10 by the outlet air of the fan 30, the heat on the box body 10 is taken away, pass through
The hot wind formed after heat exchange is discharged from the air outlet 131 on the box body 10.
The present invention can reduce cooling and heat dissipation to the greatest extent by the way that semiconductor chilling plate 20 and fan 30 to be set up in parallel
The thickness of module.
Specifically, the cooling and heat dissipation module of the embodiment of the present invention 1 further includes being set to 20 periphery of the semiconductor chilling plate
Thermal-insulated frame 40, the thermal-insulated frame 40 avoid the semiconductor for keeping apart the semiconductor chilling plate 20 and other objects
The cold of the chill surface 21 of cooling piece 20 is transferred on other objects.
Specifically, the material of the thermal-insulated frame 40 is bakelite, rubber (such as silicon rubber) or plastic cement.
Specifically, the cooling and heat dissipation module of the embodiment of the present invention 1 further includes being set to 11 top of the upper plate and corresponding to
The heat insulating mattress 50 that the fan 30 is arranged.
The purposes of the heat insulating mattress 50 is：When on the box body 10 and with the system of the semiconductor chilling plate 20
When the object that huyashi-chuuka (cold chinese-style noodles) 21 is in contact is cooled and cools down, the heat insulating mattress 50 can prevent the cold on cooled object from being transferred to
The cold in cooled object is caused to be lost on upper plate 11.
Specifically, the material of the heat insulating mattress 50 is bakelite, rubber (such as silicon rubber) or plastic cement.
Specifically, the heat insulating mattress 50 is fixed on by adhesive glue on the upper plate 11.
Specifically, the structure of the semiconductor chilling plate 20 is the common knowledge of this field, it is not described in detail herein.
Specifically, the fan 30 is fixedly connected with the upper plate 11.
Embodiment 2
Please refer to Fig.1, Fig. 2 and Fig. 4, the embodiment of the present invention 2 provide a kind of cooling and heat dissipation module, including：Box body 10 is set
In semiconductor chilling plate 20 and fan 30 in the box body 10；
The box body 10 include the upper plate 11 that is oppositely arranged with lower plate 12 and be separately connected the upper plate 11 with
The side plate 13 of lower plate 12；At least the lower plate 12 is prepared by Heat Conduction Material in the box body 10；
The semiconductor chilling plate 20 is set up in parallel with fan 30 in the plane for being parallel to the lower plate 12；Described half
Conductor cooling piece 20 has the chill surface 21 being oppositely arranged and heating surface 22；
The upper plate 11 is equipped with through-hole 115, and the chill surface 21 of the semiconductor chilling plate 20 is exposed to the through-hole
Outside 115；
The lower plate 12 is equipped with air inlet 121, and the fan 30 corresponds to the setting of the air inlet 121, the air inlet
Mouth 121 for the fan 30 for providing air intake passage；
The side plate 13 is equipped with air outlet 131, and the air outlet 131 is used to provide air exhaust passage for the fan 30.
Compared with above-described embodiment 1, difference place is：In the embodiment 2, the heating surface of the semiconductor chilling plate 20
Heat conduction silicone 60 is equipped between 22 and the lower plate 12, the heat conduction silicone 60 is distributed in the semiconductor chilling plate 20
Heating surface 22 all areas.
In the embodiment 2,60 one side of the heat conduction silicone is played the semiconductor chilling plate 20 and the bottom
The effect that plate 12 is fixedly connected, on the other hand plays the role of heat transfer, can quickly conduct the heat of the heating surface 22
On to the box body 10.
Compared with Example 1, the heating surface 22 of semiconductor chilling plate 20 described in the embodiment 2 and the lower plate 12 it
Between heat-transfer effect it is more preferable.
Embodiment 3
Please refer to Fig.1, Fig. 2 and Fig. 5, the embodiment of the present invention 3 provide a kind of cooling and heat dissipation module, including：Box body 10 is set
In semiconductor chilling plate 20 and fan 30 in the box body 10；
The box body 10 include the upper plate 11 that is oppositely arranged with lower plate 12 and be separately connected the upper plate 11 with
The side plate 13 of lower plate 12；At least the lower plate 12 is prepared by Heat Conduction Material in the box body 10；
The semiconductor chilling plate 20 is set up in parallel with fan 30 in the plane for being parallel to the lower plate 12；Described half
Conductor cooling piece 20 has the chill surface 21 being oppositely arranged and heating surface 22；
The upper plate 11 is equipped with through-hole 115, and the chill surface 21 of the semiconductor chilling plate 20 is exposed to the through-hole
Outside 115；
The lower plate 12 is equipped with air inlet 121, and the fan 30 corresponds to the setting of the air inlet 121, the air inlet
Mouth 121 for the fan 30 for providing air intake passage；
The side plate 13 is equipped with air outlet 131, and the air outlet 131 is used to provide air exhaust passage for the fan 30.
Compared with above-described embodiment 1 and embodiment 2, difference place is：In the embodiment 3, cooling and heat dissipation of the invention
Module further includes the support element 70 being set on the lower plate 12, and the semiconductor chilling plate 20 is set on the support element 70 simultaneously
And be fixedly connected with the support element 70 by heat conductive silica gel, the support element 70 is prepared by Heat Conduction Material, the support element 70
Top surface area be less than the semiconductor chilling plate 20 heating surface 22 area.
In the embodiment 3, there are two the heat dissipation paths of the heating surface 22 of the semiconductor chilling plate 20：
One of path is：The heat of the heating surface 22 of the semiconductor chilling plate 20 is transmitted via the support element 70
On to the lower plate 12, and then it is transferred to entire box body 10, the box body 10 is dissipated by the outlet air of the fan 30
Heat disperses this partial heat in turn.
Another path is：Due to the semiconductor chilling plate 20 heating surface 22 subregion not with the support element
70 are in contact, therefore the outlet air of the fan 30 can directly disperse the heat of this subregion.
Optionally, the material of the support element 70 is metal, such as copper, aluminium etc..
Optionally, the support element 70 is fixedly connected with the lower plate 12.
Optionally, the support element 70 is integrally formed with the lower plate 12, alternatively, the support element 70 and the bottom
Plate 12 welds together.
In conclusion the present invention cooling and heat dissipation module by the way that semiconductor chilling plate 20 and fan 30 are set up in parallel, i.e.,
The semiconductor chilling plate 20 and fan 30 are arranged substantially in approximately the same plane rather than layer stack designs, this design energy
The enough thickness for reducing cooling and heat dissipation module to the greatest extent.The cooling and heat dissipation module of the present invention can be applied to each electronic product
Cooling effect is played in (such as wireless charger), for the electronic product of the other radiators of application, using this hair
The electronic product of publicly price-reduction temperature heat radiation module can keep smaller thickness, be conducive to the thinning of product.In addition, the cooling of the present invention
Fan 30 and semiconductor chilling plate 20 are incorporated into the same frame and form integrated heat radiation module by heat radiation module, for pin
It sells, transport and assembling is provided convenience.
It will be appreciated by those skilled in the art that the accompanying drawings are only schematic diagrams of a preferred implementation scenario, module in attached drawing or
Flow is not necessarily implemented necessary to the present invention.
It will be appreciated by those skilled in the art that the module in device in implement scene can be described according to implement scene into
Row is distributed in the device of implement scene, can also be carried out respective change and is located at the one or more dresses for being different from this implement scene
In setting.The module of above-mentioned implement scene can be merged into a module, can also be further split into multiple submodule.
The foregoing is merely the preferable implementation examples of the present invention, are not intended to limit the invention, all the present invention's
Within spirit and principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of cooling and heat dissipation module, which is characterized in that including：Box body and semiconductor chilling plate in the box body with
Fan；
The box body includes the upper plate being oppositely arranged and lower plate and the side plate for being separately connected the upper plate and lower plate；
At least described lower plate is prepared by Heat Conduction Material in the box body；
The semiconductor chilling plate is set up in parallel with the fan in the plane for being parallel to the lower plate；The semiconductor system
Cold has the chill surface being oppositely arranged and heating surface；
The upper plate is equipped with through-hole, and the chill surface of the semiconductor chilling plate is exposed to outside the through-hole；The lower plate
It is equipped with air inlet, the fan corresponds to the air inlet setting, and the air inlet is used to provide air intake passage for the fan；
The side plate is equipped with air outlet, and the air outlet is used to provide air exhaust passage for the fan.
2. cooling and heat dissipation module as described in claim 1, which is characterized in that the heating surface of the semiconductor chilling plate directly with
The lower plate is in contact.
3. cooling and heat dissipation module as described in claim 1, which is characterized in that the heating surface of the semiconductor chilling plate with it is described
Heat conduction silicone is equipped between lower plate, the heat conduction silicone is distributed in all areas of the heating surface of the semiconductor chilling plate
Domain.
4. cooling and heat dissipation module as described in claim 1, which is characterized in that further include the support being set on the lower plate
Part, the semiconductor chilling plate is set on the support element and is fixedly connected with the support element by heat conductive silica gel, described
Support element is prepared by Heat Conduction Material, and the area of the top surface of the support element is less than the heating surface of the semiconductor chilling plate
Area.
5. cooling and heat dissipation module as claimed in claim 4, which is characterized in that the support element is fixed with the lower plate to be connected
It connects.
6. cooling and heat dissipation module as claimed in claim 5, which is characterized in that the support element and the lower plate one at
Type, alternatively, the support element welds together with the lower plate.
7. cooling and heat dissipation module as described in claim 1, which is characterized in that further include being set to semiconductor chilling plate periphery
Thermal-insulated frame.
8. cooling and heat dissipation module as described in claim 1, which is characterized in that the fan is fixedly connected with the upper plate.
9. cooling and heat dissipation module as described in claim 1, which is characterized in that further include above the upper plate and right
Answer the heat insulating mattress of the fan setting.
10. cooling and heat dissipation module as claimed in claim 9, which is characterized in that the heat insulating mattress is fixed on institute by adhesive glue
It states on upper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810845930.5A CN108617151A (en) | 2018-07-27 | 2018-07-27 | Cooling and heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810845930.5A CN108617151A (en) | 2018-07-27 | 2018-07-27 | Cooling and heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108617151A true CN108617151A (en) | 2018-10-02 |
Family
ID=63666767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810845930.5A Pending CN108617151A (en) | 2018-07-27 | 2018-07-27 | Cooling and heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108617151A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447812A (en) * | 2020-05-15 | 2020-07-24 | 维沃移动通信有限公司 | Heat sink device |
| CN111459251A (en) * | 2020-03-31 | 2020-07-28 | 杭州浩米科技有限公司 | High-efficiency radiator for CPU heat radiation |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2435279Y (en) * | 2000-07-13 | 2001-06-20 | 刘虎年 | Portable semiconductor hot and cold glass holder for use on vehicle |
| CN2530350Y (en) * | 2001-10-30 | 2003-01-08 | 戴胜熙 | Radiating modulus of CPU |
| CN202158597U (en) * | 2011-01-18 | 2012-03-07 | 浙江苏泊尔家电制造有限公司 | Radiating structure of induction cooker |
| CN203618989U (en) * | 2013-12-20 | 2014-06-04 | 杭州双量科技有限公司 | Cooling and heating pot |
| CN104902042A (en) * | 2015-06-19 | 2015-09-09 | 东南大学 | Heat radiation mobile phone shell |
| CN205038588U (en) * | 2015-10-20 | 2016-02-17 | 齐鑫 | Mobile terminal cooler |
| CN205481472U (en) * | 2015-12-30 | 2016-08-17 | 合肥华凌股份有限公司 | Air -conditioning fan |
| CN105997334A (en) * | 2016-07-01 | 2016-10-12 | 苏州爱科意智能科技有限公司 | Wearable heating and cooling device |
| WO2017036282A1 (en) * | 2015-09-02 | 2017-03-09 | 柳熠 | Air cooling semiconductor refrigerating device for circulation cooling system |
| CN206125860U (en) * | 2016-07-25 | 2017-04-26 | 陈海运 | Portable insulin refrigeration box |
| CN206370024U (en) * | 2017-01-11 | 2017-08-01 | 深圳市易贵科技有限公司 | A kind of notebook radiator with illumination functions |
| WO2017202251A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Computer chassis |
| CN206961062U (en) * | 2017-08-09 | 2018-02-02 | 三峡大学 | Semiconductor refrigerating notebook PC radiator |
| CN108055799A (en) * | 2017-12-21 | 2018-05-18 | 上海航天科工电器研究院有限公司 | A kind of cabinet for carrying dehumidifying and sensor monitoring |
| CN207408578U (en) * | 2017-10-26 | 2018-05-25 | 武汉武高电测电气有限公司 | A kind of frequency conversion mutual inductor comprehensive tester of reliable working performance |
| CN207543168U (en) * | 2017-10-17 | 2018-06-26 | 陈民欣 | A kind of Multifunctional mobile phone bracket |
| CN208638879U (en) * | 2018-07-27 | 2019-03-22 | 深圳市誉品智能光电科技有限公司 | Cooling and heat dissipation mould group |
-
2018
- 2018-07-27 CN CN201810845930.5A patent/CN108617151A/en active Pending
Patent Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2435279Y (en) * | 2000-07-13 | 2001-06-20 | 刘虎年 | Portable semiconductor hot and cold glass holder for use on vehicle |
| CN2530350Y (en) * | 2001-10-30 | 2003-01-08 | 戴胜熙 | Radiating modulus of CPU |
| CN202158597U (en) * | 2011-01-18 | 2012-03-07 | 浙江苏泊尔家电制造有限公司 | Radiating structure of induction cooker |
| CN203618989U (en) * | 2013-12-20 | 2014-06-04 | 杭州双量科技有限公司 | Cooling and heating pot |
| WO2017202251A1 (en) * | 2015-05-25 | 2017-11-30 | 周奋豪 | Computer chassis |
| CN104902042A (en) * | 2015-06-19 | 2015-09-09 | 东南大学 | Heat radiation mobile phone shell |
| WO2017036282A1 (en) * | 2015-09-02 | 2017-03-09 | 柳熠 | Air cooling semiconductor refrigerating device for circulation cooling system |
| CN205038588U (en) * | 2015-10-20 | 2016-02-17 | 齐鑫 | Mobile terminal cooler |
| CN205481472U (en) * | 2015-12-30 | 2016-08-17 | 合肥华凌股份有限公司 | Air -conditioning fan |
| CN105997334A (en) * | 2016-07-01 | 2016-10-12 | 苏州爱科意智能科技有限公司 | Wearable heating and cooling device |
| CN206125860U (en) * | 2016-07-25 | 2017-04-26 | 陈海运 | Portable insulin refrigeration box |
| CN206370024U (en) * | 2017-01-11 | 2017-08-01 | 深圳市易贵科技有限公司 | A kind of notebook radiator with illumination functions |
| CN206961062U (en) * | 2017-08-09 | 2018-02-02 | 三峡大学 | Semiconductor refrigerating notebook PC radiator |
| CN207543168U (en) * | 2017-10-17 | 2018-06-26 | 陈民欣 | A kind of Multifunctional mobile phone bracket |
| CN207408578U (en) * | 2017-10-26 | 2018-05-25 | 武汉武高电测电气有限公司 | A kind of frequency conversion mutual inductor comprehensive tester of reliable working performance |
| CN108055799A (en) * | 2017-12-21 | 2018-05-18 | 上海航天科工电器研究院有限公司 | A kind of cabinet for carrying dehumidifying and sensor monitoring |
| CN208638879U (en) * | 2018-07-27 | 2019-03-22 | 深圳市誉品智能光电科技有限公司 | Cooling and heat dissipation mould group |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111459251A (en) * | 2020-03-31 | 2020-07-28 | 杭州浩米科技有限公司 | High-efficiency radiator for CPU heat radiation |
| CN111459251B (en) * | 2020-03-31 | 2022-03-25 | 杭州浩米科技有限公司 | High-efficiency radiator for CPU heat radiation |
| CN111447812A (en) * | 2020-05-15 | 2020-07-24 | 维沃移动通信有限公司 | Heat sink device |
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