CN105990274B - A kind of heat conducting film and preparation method thereof - Google Patents
A kind of heat conducting film and preparation method thereof Download PDFInfo
- Publication number
- CN105990274B CN105990274B CN201510069791.8A CN201510069791A CN105990274B CN 105990274 B CN105990274 B CN 105990274B CN 201510069791 A CN201510069791 A CN 201510069791A CN 105990274 B CN105990274 B CN 105990274B
- Authority
- CN
- China
- Prior art keywords
- heat conducting
- conducting film
- groove
- structure sheaf
- working medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of heat conducting films and preparation method thereof, the heat conducting film is followed successively by the surface layer of the bottom of flexible parent metal, structure sheaf and flexible parent metal from top to bottom, the structure sheaf is by there is the prominent geometry block for being distributed in bottom surface to form, the groove of perforation is formed between adjacent geometry block, the thickness of the structure sheaf is 30 50 microns, the width of the groove is 0.5 3 microns, the pressure working medium full of groove is filled in the groove, the ditch notch of the heat conducting film surrounding is blocked, and the pressure working medium is 0.5 2MPa in the pressure of groove.The series of advantages such as the heat conducting film of the present invention has thermal conductivity, insulating properties, suitable application area is wide, cost of manufacture is low.
Description
Technical field
The invention belongs to conductive new material technology fields, are related to a kind of preparation method of heat conducting film.
Background technology
Whether organization or electric device, excessively high temperature in use can usually cause function to be deteriorated or even fail, this
Also it can shorten service life outside, it is therefore desirable to which different radiators or mechanism are higher than critical value to avoid operating temperature.
As electronic device and product are to high integration, the development in high operation field, its calorific value increases therewith, separately
One side volume is less and less, and fever is more concentrated.The material of traditional heat sinks is generally aluminium or copper, and either chip seals at present
Dress or product systems heat dissipation are all that the directly heat dissipation of both materials or cooperation silica gel, fan form cooling system, nothing nothing more than
Method meets the radiating requirements of high-end electronic element, and has the electronic component of conducting wire because of metal class heat conducting film for some
It can not avoid electric conductivity accident and unusable, and easily have injured and impression.And some large power high efficiency heat dissipation technologys, than
Such as refrigerator, water cycle needs employ additional electric power competence exertion heat dissipation effect, and it is gradually exquisite energy saving not meet today
Theory is not suitable for for now increasingly focusing on economize on electricity and light mobile terminal yet.
At present in field of electronic devices, common heat pipe radiating mode and heat conducting film mode.
Heat pipe is substantially a closed cavity for including working fluid, is exchanged heat using phase transformation.In general the temperature difference
(temperature gradient in other words) is bigger, and the heat of exchange is more, and one of heat pipe is exactly to be that it has good perseverance the advantages of very big
Warm nature does not need to reach good heat transfer effect under conditions of the temperature difference is very big.Among these the reason of, which is that, utilizes heat
The solution-air phase transformation of working medium exchanges a large amount of heat in pipe, when substance is undergone phase transition, temperature be basically unchanged and work
Absorption (release) a large amount of latent heat is may require that when matter vaporization (liquefaction).Then it is exactly this that the course of work of heat pipe, which is briefly described,
Sample：Working medium inside heat pipe absorbs a large amount of heat from the external world at one end, and gaseous state is changing by liquid, under the driving of air pressure,
Other end is flow to, is condensed into liquid, releases a large amount of latent heat of vaporization, liquid is again (heavy under the driving of certain driving force
Power, the capillarity of porous material liquid-sucking core etc.) other end heat absorption is returned to, so recycle.In this process, thermal resistance
It is very small.
Theoretically the manufacturing engineering of heat pipe is included from being machined to 12 procedures of inspection, however actually manufacture
When tend to reach 20 even procedures up to a hundred, and high to technological requirement, corresponding cost is also extremely high.Based on heat
The radiator of conduit is made of pedestal, heat pipe, fin and fan, and volume is larger, and different heat source devices needs to determine
Different heat spreader structures are made, using above there is certain limitation.
Heat conduction membrane material on the market has native graphite heat conducting film, electrographite heat conducting film, nano-sized carbon heat conducting film, height at present
The material carbon nanotube and graphene of heat conduction may be alternatively configured heat conducting film, but the prices of raw materials are high, and technology is immature.
Above-described various cooling fins and heat conducting film, all conductive energy, this has some the electricity of conducting wire
Can be conductive in sub- component use, easily cause short circuit phenomenon, and price thousands of one square metre of members easily, it is few then hundreds of yuan one is flat
Rice, can not benefit general mass product, and the product of only a small number of high unit prices affords to use such heat conducting film.
Invention content
The technical problems to be solved by the invention are to provide a kind of heat conducting film, to overcome the shortcomings of the prior art.
In order to solve the above technical problems, the present invention adopts the following technical scheme that：
A kind of heat conducting film is followed successively by the surface layer of the bottom of flexible parent metal, structure sheaf and flexible parent metal, feature from top to bottom
It is：The structure sheaf forms the ditch of perforation by there is the prominent geometry block for being distributed in bottom surface to form between adjacent geometry block
Slot, the thickness of the structure sheaf is 30-50 microns, and the width of the groove is 0.5-3 microns, is filled with and is full of in the groove
The pressure working medium of groove, the ditch notch of the heat conducting film surrounding are blocked, and the pressure working medium is 0.5- in the pressure of groove
2MPa。
It is connected between the structure sheaf and surface layer by adhesive layer.
The preferred regular hexagon shape of geometry block is so as to form cellular groove.
The flexible parent metal is PI or PET.The thickness of the bottom is 50-200 microns, and the thickness on surface layer is 100 μm,
The pressure working medium is water or carbon dioxide.
In an embodiment of invention, the structure sheaf is the flexible parent metal in integral structure with bottom.
In the also embodiment of the present invention, the structure sheaf is structure glue.
In the also embodiment of the present invention, the structure sheaf is PET or metallic film.
In addition, invention also provides a kind of production method of heat conducting film, which is characterized in that comprises the following steps：
A, the structure sheaf of the geometry block of prominent bottom surface distribution, adjacent geometry block phase are produced on the bottom of flexible membrane
Mutually interval forms the groove of perforation, and the thickness of structure sheaf is 30-50 microns, and the width of slot is 0.5-3 microns；
B, by flexible membrane and structure layer surface phase adhesion, closing groove forms pipeline；
C, the filling pressure working medium into groove, pressure working medium are full of groove, and the pressure after pressure working medium is full of is 0.5-
2MPa；
D, the ditch notch of heat conducting film surrounding is blocked.
The surface layer is attached by adhesive layer and structure sheaf.
In one embodiment of this invention, the step A is to utilize the masterplate with continuously distributed bulge-structure soft
Property thin-film material surface coining, form bottom, structure sheaf and groove.
In another embodiment of the invention, the step A is in the structure glue in bottom surface printing geometry block diagram case.
It is first that structure sheaf and bottom progress is compound in the step A in one more embodiment of the present invention, and in structure
Photoresist is smeared on layer, the mask with geometry reticular structure is recycled to be etched structure sheaf, until etching into bottom table
Face stops.
Using above-mentioned technical proposal, the subtle pipeline of reticular structure is just formed in heat conducting film of the invention, each is formed
Pipeline have the adjacent channel of at least two or more, side film can be fast by the heat that heat exchange pattern is absorbed from heat source
In the pressure working medium that speed spreads and then is evenly distributed in each pipeline of film, pressure working medium is again by heat by way of heat transfer
In conduction to the opposite side flexible material film being bonded therewith.Flexible material film can be by being bonded metal shell or convection current
The modes such as heat dissipation radiate.A dynamic equilibrium is thusly-formed, within the scope of the temperature of heat source is maintained at certain, and institute
The flexible material film used has electric insulating quality, suitable for having the electronic component of conducting wire.
Therefore, heat conducting film of the invention has that thermal conductivity, that insulating properties, suitable application area is wide, cost of manufacture is low etc. is a series of excellent
Point.
Description of the drawings
The present invention is described in detail with reference to the accompanying drawings and detailed description：
Fig. 1 is the cross-sectional view of the structure of the present invention；
Fig. 2 is the floor map of structure sheaf.
Specific embodiment
As shown in Figure 1, the heat conducting film of the present invention, is followed successively by the bottom 100, structure sheaf 200, glue of flexible parent metal from top to bottom
The surface layer 400 of adhesion coating 300 and flexible parent metal.
With reference to shown in Fig. 2, wherein, structure sheaf 200 is adjacent by there is the prominent geometry block 201 for being distributed in bottom surface to form
The groove 202 of perforation is formed between geometry block 201.Pressure working medium is filled in groove 202, the ditch notch of heat conducting film surrounding is sealed
It is stifled.
The thickness of bottom 100 is 100 microns, and the thickness of structure sheaf is 30-50 microns, and the thickness of adhesive layer is 20 microns,
The thickness on surface layer 400 is 100 microns, and the width of groove is 0.5-3 microns.Pressure working medium is full of entire groove.
Bottom 100 and the flexible parent metal on surface layer 400 select PET or PI, and adhesive layer 300 uses epoxy glue.
In a most preferred embodiment, the geometry block of preferably regular hexagon forms structure sheaf, is just formed in such structure sheaf
The subtle pipeline of honeycomb structure, the pipeline of each can with adjacent four pipeline connections, since pressure working medium exists
When the filling of inside, there is very big pressure, reach 0.5-2MPa, which enables the heat at heat source to pass through pressure wave
The rapid terminad of form transmits, and radiating efficiency is high.
The heat conducting film of above structure forms the structure sheaf 200 with passing-through groove 202 on bottom 100 and can pass through respectively
Three kinds of techniques make below：
1st, using the masterplate with continuously distributed geometric form through-hole in flexible thin-film material's surface imprint, formed bottom,
Structure sheaf and groove.In the process, bottom and structure sheaf are structure as a whole.
2nd, in the structure glue of bottom surface printing geometry block diagram case.The groove of perforation is formed between the geometry block diagram case.It should
Structure glue uses macromolecule material, such as epoxy resin, polyacrylate or polyurethane.
3rd, it is first that structure sheaf and bottom progress is compound, and photoresist is smeared on structure sheaf, netted using geometry is carried
The mask of structure is etched structure sheaf, until etching into bottom surface stopping.Structure sheaf can be pet layer or metal
Layer, metal layer can be the materials that copper, aluminium etc. has high thermal conductivity.
Heat conduction is tested：
The heat conduction film bottom and the flexible parent metal on surface layer that this heat conduction experiment uses are using PET, using above-mentioned 2nd kind of work
Skill is made, and structure glue is epoxy resin, and adhesive layer uses epoxy glue.
The thickness of the bottom 100 of heat conducting film is 100 microns, and the geometry block of structure sheaf is regular hexagon, and thickness is 40 microns,
The thickness of adhesive layer is 20 microns, and the thickness on surface layer 400 is 100 microns, and the width of groove is 2 microns.The pressure filled in groove
Power working medium be water, pressure 1MPa.
When carrying out heat conduction experiment, heat source is measured with A points, B points far from heat source 3.5cm respectively.Its measurement result
As shown in table 1：
Table 1：The heat conducting film of this patent carries out heat conduction experiment (unit：℃)
| Heat source | A points | B points | |
| Initial temperature | 80 | 25 | 25 |
| Equilibrium temperature | 80 | 78 | 78 |
Comparison heat conduction experiment is carried out with normal aluminium foil
Also heat source is measured with A points, B points far from heat source 3.5cm respectively.Its measurement result is as shown in table 2：
Table 2：Normal aluminium foil carries out heat conduction experiment (unit：℃)
| Heat source | A points | B points | |
| Initial temperature | 80 | 25 | 25 |
| Equilibrium temperature | 80 | 55 | 55 |
Compared by above-mentioned two table it can be found that using normal aluminium foil, can not be by the temperature fast distribution of heat source, and stablize
Temperature is difficult the equilibrium temperature close to heat source.And heat conducting film using the present invention, the equilibrium temperature of A points and B points is very on heat conducting film
Close to the equilibrium temperature of heat source, illustrate that the heat conducting film heat conduction of this patent is fast, heat conductivity is high.
The above is only presently preferred embodiments of the present invention, not makees limitation in any form, Ren Hesuo to the present invention
Belong in technical field and have usually intellectual, if not departing from scope of the claims proposed by the invention, utilize
Part made by disclosed technology contents is changed or the equivalent embodiment of modification, and without departing from the skill of the present invention
Art feature, in the range of still belonging to the technology of the present invention feature.
Claims (11)
1. a kind of heat conducting film, it is followed successively by the surface layer of the bottom of flexible parent metal, structure sheaf and flexible parent metal from top to bottom, feature exists
In：The structure sheaf is made of the geometry block for having protrusion to be distributed in bottom surface, and the groove of perforation is formed between adjacent geometry block,
The thickness of the structure sheaf is 30-50 microns, and the width of the groove is 0.5-3 microns, is filled in the groove full of ditch
The pressure working medium of slot, the ditch notch of the heat conducting film surrounding are blocked, and the pressure working medium is 0.5-2MPa in the pressure of groove.
2. heat conducting film according to claim 1, it is characterised in that：Connected between the structure sheaf and surface layer by adhesive layer
It connects.
3. heat conducting film according to claim 1, it is characterised in that：The geometry block is regular hexagon shape so as to form bee
The groove of nest shape.
4. heat conducting film according to claim 1, it is characterised in that：The flexible parent metal is PI or PET；The bottom
Thickness is 50-200 microns, and the thickness on surface layer is 100 μm, and the pressure working medium is water or carbon dioxide.
5. heat conducting film according to claim 1, it is characterised in that：The structure sheaf is the flexibility in integral structure with bottom
Base material；Or the structure sheaf is structure glue；Or the structure sheaf is PET or metallic film.
6. a kind of production method of heat conducting film as described in claim 1, which is characterized in that comprise the following steps：
A, the structure sheaf of the geometry block of prominent bottom surface distribution is produced on the bottom of flexible membrane, adjacent geometry block is mutual
Every the groove for forming perforation, the thickness of structure sheaf is 30-50 microns, and the width of groove is 0.5-3 microns；
B, by flexible membrane and structure layer surface phase adhesion, closing groove forms pipeline；
C, the filling pressure working medium into groove, pressure working medium are full of groove, and the pressure after pressure working medium is full of is 0.5-2MPa；
D, the ditch notch of heat conducting film surrounding is blocked.
7. the production method of heat conducting film according to claim 6, it is characterised in that：The surface layer passes through adhesive layer and structure
Layer is attached.
8. the production method of heat conducting film according to claim 6, it is characterised in that：The step A is to utilize to have continuously
The masterplate of the bulge-structure of distribution is in flexible film material surface imprint, formation bottom, structure sheaf and groove.
9. the production method of heat conducting film according to claim 6, it is characterised in that：The structure sheaf of the step A is the bottom of at
Layer surface prints the structure glue of geometry block diagram case.
10. the production method of heat conducting film according to claim 6, it is characterised in that：In the step A, first by structure sheaf
Carried out with bottom compound, and photoresist smeared on structure sheaf, recycle the mask with geometry reticular structure to structure sheaf into
Row etching, until etching into bottom surface stopping.
11. the production method of heat conducting film according to claim 6, it is characterised in that：The material of the structure sheaf for copper or
Aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510069791.8A CN105990274B (en) | 2015-02-10 | 2015-02-10 | A kind of heat conducting film and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510069791.8A CN105990274B (en) | 2015-02-10 | 2015-02-10 | A kind of heat conducting film and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105990274A CN105990274A (en) | 2016-10-05 |
| CN105990274B true CN105990274B (en) | 2018-06-15 |
Family
ID=57041064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510069791.8A Active CN105990274B (en) | 2015-02-10 | 2015-02-10 | A kind of heat conducting film and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105990274B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571307A (en) * | 2016-10-08 | 2017-04-19 | 中国电子科技集团公司第五十五研究所 | Preparation method of microchannel heat sink for high-heat flux heat dissipation |
| CN107833869B (en) * | 2017-10-23 | 2019-11-08 | 南京旭羽睿材料科技有限公司 | A kind of graphene heat conducting film and preparation method thereof |
| CN109246997A (en) * | 2018-10-30 | 2019-01-18 | 歌尔科技有限公司 | A kind of flexible heat structure and electronic product |
| WO2021082287A1 (en) * | 2019-10-30 | 2021-05-06 | 南昌欧菲生物识别技术有限公司 | Support structure and flexible printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203336548U (en) * | 2013-06-28 | 2013-12-11 | 华南理工大学 | Integrated radiator based on foamy copper and micro groove channels |
| CN103488266A (en) * | 2013-10-14 | 2014-01-01 | 浙江嘉熙光电设备制造有限公司 | Thin sheet type CPU heat dissipation device and machining method thereof |
| CN204577416U (en) * | 2015-02-10 | 2015-08-19 | 上海蓝沛新材料科技股份有限公司 | A kind of heat conducting film |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030159806A1 (en) * | 2002-02-28 | 2003-08-28 | Sehmbey Maninder Singh | Flat-plate heat-pipe with lanced-offset fin wick |
-
2015
- 2015-02-10 CN CN201510069791.8A patent/CN105990274B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203336548U (en) * | 2013-06-28 | 2013-12-11 | 华南理工大学 | Integrated radiator based on foamy copper and micro groove channels |
| CN103488266A (en) * | 2013-10-14 | 2014-01-01 | 浙江嘉熙光电设备制造有限公司 | Thin sheet type CPU heat dissipation device and machining method thereof |
| CN204577416U (en) * | 2015-02-10 | 2015-08-19 | 上海蓝沛新材料科技股份有限公司 | A kind of heat conducting film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105990274A (en) | 2016-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107359146B (en) | Heat superconducting plate fin type radiator with fins on surface | |
| CN105990274B (en) | A kind of heat conducting film and preparation method thereof | |
| CN203523220U (en) | Hollow heat pipe radiator | |
| CN104167399B (en) | The complicated microchannel micro heat exchanger of dislocation | |
| CN103429061A (en) | Empty-belly heat pipe radiator | |
| CN101510533A (en) | Novel microelectronic device radiator | |
| CN109974137B (en) | Air conditioner outdoor unit and air conditioner | |
| CN105845648A (en) | Microelectronic device tree-shaped radiator | |
| CN209822624U (en) | Microchannel-nano porous composite structure evaporator | |
| CN104676545A (en) | Heat absorbing device, heat radiating device and LED (light-emitting diode) mining lamp radiating system | |
| CN105491843A (en) | Sealing machine cabinet with heat superconducting heat exchanger | |
| CN112969349A (en) | Multi-heat-source heat dissipation cooling device and cooling method | |
| WO2005071747A1 (en) | Heat pipe radiator of heat-generating electronic component | |
| CN211012603U (en) | Ultrathin flexible flat heat pipe | |
| Pan et al. | Experiment and simulation analysis of oriented cut copper fiber heat sink for LED water cooling | |
| CN205717104U (en) | A kind of high-power LED heat radiating device and LED | |
| Chung et al. | Heat dissipation and electrical conduction of an LED by using a microfluidic channel with a graphene solution | |
| CN204513305U (en) | Heat sink, heat abstractor and LED bay light cooling system | |
| CN204577416U (en) | A kind of heat conducting film | |
| CN203983257U (en) | Complicated microchannel micro heat exchanger misplaces | |
| CN206471365U (en) | A kind of battery module structure | |
| CN206919718U (en) | A kind of flow passage structure of close-coupled heat-exchanger rig | |
| CN110043975A (en) | A kind of radiator, air-conditioner outdoor unit and air conditioner | |
| CN201780997U (en) | Heat radiating structure used in LED chip | |
| CN110043974A (en) | A kind of radiator, air-conditioner outdoor unit and air conditioner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |