CN101510533A - Novel microelectronic device radiator - Google Patents
Novel microelectronic device radiator Download PDFInfo
- Publication number
- CN101510533A CN101510533A CNA2009100801795A CN200910080179A CN101510533A CN 101510533 A CN101510533 A CN 101510533A CN A2009100801795 A CNA2009100801795 A CN A2009100801795A CN 200910080179 A CN200910080179 A CN 200910080179A CN 101510533 A CN101510533 A CN 101510533A
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- Prior art keywords
- heat pipe
- microelectronic device
- flat
- device radiator
- plate heat
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- 238000004377 microelectronic Methods 0.000 title claims abstract description 57
- 238000009833 condensation Methods 0.000 claims abstract description 27
- 230000005494 condensation Effects 0.000 claims abstract description 27
- 238000001704 evaporation Methods 0.000 claims abstract description 21
- 230000008020 evaporation Effects 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 238000001125 extrusion Methods 0.000 claims abstract description 4
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 230000000694 effects Effects 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000003416 augmentation Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000008030 elimination Effects 0.000 abstract 2
- 238000003379 elimination reaction Methods 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000004080 punching Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a novel microelectronic device radiator which comprises a planar heat pipe being two or more through hole array flat plate structures arranged side by side and formed by extrusion or punching of metal materials and the equivalent diameters of through holes range from 0.2mm to 6mm. The through holes are filled with liquid working substance and two ends of the planar heat pipe are encapsulated in a sealing manner; an evaporation section of the planar heat pipe is in surface contact with a heating surface of a microelectronic device and a condensation section of the planar heat pipe eliminates heat through a heat elimination component. The novel microelectronic device radiator overcomes the defects of small contact area between the current round heat pipe and the heating surface of the microelectronic device, large equivalent resistance of heat conduction and complex manufacture technology, and has the advantages of high heat elimination efficiency and simple technology.
Description
Technical field
The present invention relates to a kind of heat dissipation from microelectronic devices technology, the radiator that is used for heat dissipation from microelectronic devices that particularly a kind of flat-plate heat pipe forms.
Background technology
Along with developing rapidly of microelectric technique, the caloric value and the density of heat flow rate of microelectronic chip increase considerably, and the constraint that the layout of heat abstractor and design run into is more and more.Traditional radiating mode such as air-cooledly make it to form forced convertion, its cooling effectiveness is directly proportional with the speed of fan, and when density of heat flow rate reached certain numerical value, this type of cooling can't reach predetermined cooling effect.And the Water Cooling Technology cooling effect is outstanding, but the structure of water-cooling system is very complicated, and the bucket capacity is had requirement, and there is potential safety hazard in Water Cooling Technology itself, in case revealing appears in water-cooling system, will cause microelectronic component to damage.Utilize the mode of the product that the phase-change heat-exchange technology cools off microelectronic components such as CPU that certain application is also arranged, especially hot pipe technique, this mode heat transfer efficiency is very high, but the manufacture craft of heat pipe is very complicated, and the contact area of general heat pipe such as circular heat pipe and microelectronic component heating face is very little, cause equivalent thermal resistance big, make to use to be very limited.
Summary of the invention
The present invention is directed to the defective or the deficiency that exist in the prior art, a kind of novel microelectronic device radiator is provided, the radiator that forms with flat-plate heat pipe has radiating efficiency height, advantage of simple technology to heat dissipation from microelectronic devices.
Technical scheme of the present invention is as follows:
A kind of novel microelectronic device radiator, it is characterized in that: comprise flat-plate heat pipe, described flat-plate heat pipe is that metal material is through extruding or stamping forming two via-hole array slab constructions that are arranged side by side more than reaching, the equivalent diameter of described through hole is 0.2mm-6mm, is filled with the sealed at both ends encapsulation of liquid working substance and flat-plate heat pipe in the described through hole; The evaporation section of flat-plate heat pipe contacts with the heating face face of microelectronic component, and its condensation segment dispels the heat by thermal component.
The some little fin that has extrusion modling on the described through-hole wall with augmentation of heat transfer effect.
The distance of adjacent two little fins is 0.01mm-0.6mm, and the height of little fin is 0.02mm-2mm.
The size of described little fin and structure are suitable for forming along the based on capillary slot of through hole length direction trend with through-hole wall.
The groove width of described based on capillary slot is 0.01mm-0.4mm, and groove depth is 0.02mm-0.7mm.
Described thermal component is the outside heat dissipation metal parts of installing of flat-plate heat pipe condensation segment.
Described heat dissipation metal parts are outer fin, and described outer fin is equipped with by aluminium or copper.
The sealed at both ends encapsulation of described through hole forms the micro heat pipe that works alone.
Described flat-plate heat pipe bends to " L " type or similar " L " type; The bottom of described " L " type is an evaporation section, and the side is a condensation segment.
Described flat-plate heat pipe bends to " U " type or similar " U " type; The bottom of described " U " type is an evaporation section, and both sides are condensation segment.
Technique effect of the present invention is as follows:
Novel microelectronic device radiator of the present invention, form via-hole array with the through hole of equivalent diameter and constitute flat-plate heat pipe to form specific radiator with the particular range that adapts with factors such as the condition of work of microelectronic component and heat generation characteristics, the evaporation section of flat-plate heat pipe is contacted with the heating face face of microelectronic component, and its condensation segment dispels the heat by thermal component.Filling liquid working medium forms micro heat pipe in the through hole, forms the heat pipe effect naturally.Owing to have the high advantage of hot pipe technique heat transfer efficiency, simultaneously again because be flat-plate heat pipe, its evaporation section contacts with the heating face face of microelectronic component, make that the contact area of heating face of flat-plate heat pipe and microelectronic component can be very big, so make that the heat conduction equivalent thermal resistance is very little, improved heat transfer efficiency, also improved simultaneously the radiating efficiency of microelectronic component, the contact area of heating face that has overcome existing circular heat pipe and microelectronic component is little, the shortcoming that the heat conduction equivalent resistance is big, and owing to be extrusion modling, technology is simple, when having saved existing heat pipe and making such as technology such as capillary wick material preparation.Consider the heat dissipation characteristics and the architectural characteristics such as microelectronic component installation environment, condition and environment for use of the heating face of microelectronic component, the equivalent diameter that through hole is set is 0.2mm-6mm, in through hole, be filled with liquid working substance and form micro heat pipe, both strengthen the exchange capability of heat of liquid working substance, and can effectively reduce contact heat resistance again.
Have the exchange capability of heat that some little fins can further strengthen liquid working substance on the through-hole wall, and has capillary force between little fin that is provided with in the through hole and the through-hole wall, also can produce capillary force if distance is suitable between little fin and the little fin, the formation of capillary force has promoted flowing of working medium, also helps the enhance heat transfer ability.
The distance that adjacent two little fins are set is 0.01mm-0.6mm, and the height of little fin is 0.02mm-2mm, not only very high heat-transfer capability can be arranged, and significantly strengthens mechanical properties such as the bending resistance of flat-plate heat pipe own, heat resistanceheat resistant.
The size of little fin and structure are suitable for forming along the based on capillary slot of through hole length direction trend with through-hole wall, can produce high-intensity phase-change heat transfer.
The groove width that based on capillary slot is set is 0.01mm-0.4mm, groove depth is 0.02mm-0.7mm, the kind of liquid working substance cooperates the size and the structure of suitable based on capillary slot, the density of heat flow rate that forms in the time of can strengthening heat dissipation from microelectronic devices, increasing substantially heat transfer efficiency, thereby make that microelectronic component is cooled off rapidly.
The sealed at both ends encapsulation of through hole forms the micro heat pipe that works alone, like this, flat-plate heat pipe contain two and more than join side by side and micro heat pipe that work alone, can not influence other micro heat pipe work even certain micro heat pipe is damaged as take place revealing yet, and help security maintenance.
Thermal component is that the outside heat dissipation metal parts of installing of flat-plate heat pipe condensation segment carry out air cooling, the heat dissipation metal parts are outer fin etc., can augmentation of heat transfer, accelerate flat-plate heat pipe in the condensation segment heat release, make the quick heat release condensation of liquid working substance flow back to the evaporation section of flat-plate heat pipe.
Flat-plate heat pipe bends to " L " type or similar " L " type, and flat-plate heat pipe bends to " U " type or similar " U " type, because being nature, this flat-plate heat pipe forms the heat pipe effect, with the flat-plate heat pipe brake forming, as microelectronic device radiator, liquid working substance heat absorption back carburation by evaporation in its evaporation section, naturally travel up to condensation segment, condensation segment heat release liquefaction, and rely on action of gravity to flow back to evaporation section downwards, automatically finish circulation, this structure is more conducive to heat exchange, reaches the quick cooling purpose of microelectronic component.
Description of drawings
Fig. 1 is the structural representation of first kind of preferred embodiment of novel microelectronic device radiator of the present invention;
Fig. 2 is the structural representation of second kind of preferred embodiment of novel microelectronic device radiator of the present invention;
Fig. 3 is the structural representation of the third preferred embodiment of novel microelectronic device radiator of the present invention.
Embodiment
The present invention will be described below in conjunction with accompanying drawing.
Fig. 1 is the structural representation of first kind of preferred embodiment of novel microelectronic device radiator of the present invention, this novel microelectronic device radiator, comprise flat-plate heat pipe 1, this flat-plate heat pipe is that metal material is through extruding or stamping forming two via-hole array slab constructions that are arranged side by side more than reaching, consider factor such as the heat dissipation characteristics of heating face of microelectronic component and architectural characteristic that microelectronic component is installed and the influence of operational environment factor and the through hole equivalent diameter of specific size is set, for example the inner installing space of notebook computer is narrow and small, and require this computer fuselage thinner, the installing space of desktop computer is then big relatively, in 70 ℃, the density of heat flow rate of work is usually at 10-100W/cm usually for the working temperature of cpu chip
2So the equivalent diameter that through hole is set is 0.2mm-6mm, preferred 1mm-2mm is filled with liquid working substance and forms micro heat pipe in through hole, strengthened the exchange capability of heat of liquid working substance greatly, can effectively reduce contact heat resistance again simultaneously.The single face of through-hole wall or all around in have little fin that several are made by Heat Conduction Material, the distance of adjacent two little fins is 0.01mm-0.6mm, the height of little fin is 0.02mm-2mm, can significantly strengthen mechanical properties such as the bending resistance of flat-plate heat pipe own, heat resistanceheat resistant like this.In through hole, be filled with liquid working substance, the sealed at both ends encapsulation of flat-plate heat pipe, the also sealed encapsulation in through hole two ends forms the micro heat pipe that works alone, and can guarantee that like this certain micro heat pipe is damaged as not influencing other micro heat pipe work after revealing.Size and structure that present embodiment can be provided with little fin make it to be suitable for to form along the based on capillary slot of through hole length direction trend with through-hole wall, the groove width that based on capillary slot is set is 0.01mm-0.4mm, groove depth is 0.02mm-0.7mm, the kind of liquid working substance cooperates the size and the structure of suitable based on capillary slot, the density of heat flow rate that forms in the time of can strengthening heat dissipation from microelectronic devices, increasing substantially heat transfer efficiency, thereby make that microelectronic component is cooled off rapidly.Make the optimum working temperature of the liquid working substance of encapsulation in the flat-plate heat pipe in 75 ℃, the maximum critical heat flux of flat-plate heat pipe approximately can reach 160W/cm
2Do not show the internal structure schematic diagram of flat-plate heat pipe among the embodiment 1, but it is done as a whole.The left-hand component of flat-plate heat pipe 1 is evaporation section, this evaporation section contacts with the heating face face of microelectronic component 2, the right-hand component of flat-plate heat pipe 1 is a condensation segment, outer fin 3 heat radiations of this condensation segment by installing, should outer fin 3 be the heat dissipation metal parts, can be by aluminium or copper or the preparation of other metal material, this outer fin can increase area of dissipation with augmentation of heat transfer, accelerate flat-plate heat pipe in the condensation segment heat release, make the quick heat release condensation of liquid working substance flow back to the evaporation section of flat-plate heat pipe.Outside fin 3 directly over fan 4 is installed, in the mode of forced convertion heat is dispersed in the atmosphere.Wherein, microelectronic component 2 can be CPU or other microelectronic chip.
Fig. 2 is the structural representation of second kind of preferred embodiment of novel microelectronic device radiator of the present invention, and this embodiment middle plateform heat pipe 1 bends to " L " type.The bottom of " L " type is an evaporation section, contacts with the heating face face of microelectronic component 2; The side is a condensation segment, and the left and right sides of condensation segment all is equipped with outer fin 3.Liquid working substance heat absorption back carburation by evaporation travels up to condensation segment, condensation segment heat release liquefaction naturally in the evaporation section of flat-plate heat pipe, and rely on gravity or capillary force effect to flow back to evaporation section downwards, automatically finish circulation, this structure is more conducive to heat exchange, reaches the microelectronic component cooling purpose.Condensation segment also can be by this heat dissipation metal parts heat radiation of outer fin, and for example, condensation segment can be by connecting the water cooling equipment heat radiation.
Fig. 3 is the structural representation of the third preferred embodiment of novel microelectronic device radiator of the present invention, and this embodiment middle plateform heat pipe 1 bends to " U " type.The bottom of " U " type is an evaporation section, contacts with the heating face face of microelectronic component 2; Both sides are condensation segment, and the left and right sides of condensation segment all is equipped with outer fin 3.
Should be pointed out that the above embodiment can make those skilled in the art more fully understand the invention, but do not limit the present invention in any way creation.Therefore; although this specification has been described in detail the invention with reference to drawings and Examples; but; those skilled in the art are to be understood that; still can make amendment or be equal to replacement the invention; in a word, all do not break away from the technical scheme and the improvement thereof of the spirit and scope of the invention, and it all should be encompassed in the middle of the protection range of the invention patent.
Claims (10)
1, a kind of novel microelectronic device radiator, it is characterized in that: comprise flat-plate heat pipe, described flat-plate heat pipe is that metal material is through extruding or stamping forming two via-hole array slab constructions that are arranged side by side more than reaching, the equivalent diameter of described through hole is 0.2mm-6mm, is filled with the sealed at both ends encapsulation of liquid working substance and flat-plate heat pipe in the described through hole; The evaporation section of flat-plate heat pipe contacts with the heating face face of microelectronic component, and its condensation segment dispels the heat by thermal component.
2, novel microelectronic device radiator according to claim 1 is characterized in that, has the some little fin with augmentation of heat transfer effect of extrusion modling on the described through-hole wall.
3, novel microelectronic device radiator according to claim 2 is characterized in that, the distance of adjacent two little fins is 0.01mm-0.6mm, and the height of little fin is 0.02mm-2mm.
According to claim 2 or 3 described novel microelectronic device radiators, it is characterized in that 4, the size of described little fin and structure are suitable for forming along the based on capillary slot of through hole length direction trend with through-hole wall.
5, novel microelectronic device radiator according to claim 4 is characterized in that, the groove width of described based on capillary slot is 0.01mm-0.4mm, and groove depth is 0.02mm-0.7mm.
6, novel microelectronic device radiator according to claim 1 is characterized in that, described thermal component is the outside heat dissipation metal parts of installing of flat-plate heat pipe condensation segment.
7, novel microelectronic device radiator according to claim 6 is characterized in that, described heat dissipation metal parts are outer fin, and described outer fin is equipped with by aluminium or copper.
8, novel microelectronic device radiator according to claim 1 is characterized in that, the sealed at both ends encapsulation of described through hole forms the micro heat pipe that works alone.
9, novel microelectronic device radiator according to claim 1 is characterized in that, described flat-plate heat pipe bends to " L " type or similar " L " type; The bottom of described " L " type is an evaporation section, and the side is a condensation segment.
10, novel microelectronic device radiator according to claim 1 is characterized in that, described flat-plate heat pipe bends to " U " type or similar " U " type; The bottom of described " U " type is an evaporation section, and both sides are condensation segment.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100801795A CN101510533B (en) | 2009-03-24 | 2009-03-24 | Novel microelectronic device radiator |
| PCT/CN2009/072362 WO2010060302A1 (en) | 2008-11-03 | 2009-06-19 | A heat pipe with arranged micro-pore tubes, its fabricating method and a heat exchanging system |
| US13/127,444 US11022380B2 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro-pore tube array and heat exchange system employing the heat pipe |
| HUE09828602A HUE029949T2 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro tubes array and making method thereof and heat exchanging system |
| ES09828602.4T ES2578291T3 (en) | 2008-11-03 | 2009-11-03 | Heat duct with microtube matrix and procedure for manufacturing it and heat exchange system |
| PCT/CN2009/074775 WO2010060342A1 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro-pore tubes array and making method thereof and heat exchanging system |
| JP2011533524A JP2012507680A (en) | 2008-11-03 | 2009-11-03 | MICRO HEAT PIPE ARRAY HAVING FINE TUBE ARRAY, ITS MANUFACTURING METHOD, AND HEAT EXCHANGE SYSTEM |
| EP09828602.4A EP2357440B1 (en) | 2008-11-03 | 2009-11-03 | Heat pipe with micro tubes array and making method thereof and heat exchanging system |
| US17/246,597 US11852421B2 (en) | 2008-11-03 | 2021-05-01 | Heat pipe with micro-pore tubes array and making method thereof and heat exchanging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100801795A CN101510533B (en) | 2009-03-24 | 2009-03-24 | Novel microelectronic device radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101510533A true CN101510533A (en) | 2009-08-19 |
| CN101510533B CN101510533B (en) | 2011-06-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009100801795A Active CN101510533B (en) | 2008-11-03 | 2009-03-24 | Novel microelectronic device radiator |
Country Status (1)
| Country | Link |
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| CN (1) | CN101510533B (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102270768A (en) * | 2010-06-07 | 2011-12-07 | 广东德豪润达电气股份有限公司 | Cell device |
| CN102270769A (en) * | 2010-06-07 | 2011-12-07 | 广东德豪润达电气股份有限公司 | Battery apparatus |
| CN102843897A (en) * | 2012-09-17 | 2012-12-26 | 夏侯南希 | Array cold-end plane heat pipe |
| CN103038596A (en) * | 2010-09-01 | 2013-04-10 | 三菱重工业株式会社 | Heat exchanger and vehicle air conditioner with same |
| CN103336565A (en) * | 2013-07-12 | 2013-10-02 | 凝辉(天津)科技有限责任公司 | Notebook computer battery bin heat dissipating expanding device |
| CN103399623A (en) * | 2013-07-12 | 2013-11-20 | 凝辉(天津)科技有限责任公司 | Laptop drive bay radiation extended device |
| CN104567499A (en) * | 2015-01-20 | 2015-04-29 | 北京建筑大学 | Pulse heat pipe heat radiation device used for electronic device and heat radiation device thereof |
| CN105135921A (en) * | 2015-08-17 | 2015-12-09 | 吴德坚 | Superconductive temperature-even type structural-heat-resistance-free cooler |
| CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
| CN106558563A (en) * | 2015-09-29 | 2017-04-05 | 比亚迪股份有限公司 | Power model and the vehicle with which |
| CN106659090A (en) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | Heat pipe conduction heat sink |
| CN107677155A (en) * | 2017-11-03 | 2018-02-09 | 中国科学院理化技术研究所 | A kind of flat heat pipe radiator |
| WO2019015283A1 (en) * | 2017-07-20 | 2019-01-24 | 京东方科技集团股份有限公司 | Chip-on-film heat dissipation structure, manufacturing method thereof, and display device |
| CN110726318A (en) * | 2019-10-18 | 2020-01-24 | 大连大学 | Miniature MIMO antenna heat pipe radiator |
| CN112492437A (en) * | 2020-11-16 | 2021-03-12 | 中航华东光电（上海）有限公司 | Liquid cooling heat abstractor and high heat dissipation headphone of headphone |
| CN113138521A (en) * | 2021-04-29 | 2021-07-20 | 深圳市火乐科技发展有限公司 | Heat dissipation assembly and projector |
| CN115483172A (en) * | 2022-09-15 | 2022-12-16 | 湖南大学 | Device for high-power-density heat dissipation of wind power converter |
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Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102270769A (en) * | 2010-06-07 | 2011-12-07 | 广东德豪润达电气股份有限公司 | Battery apparatus |
| CN102270768A (en) * | 2010-06-07 | 2011-12-07 | 广东德豪润达电气股份有限公司 | Cell device |
| CN103038596B (en) * | 2010-09-01 | 2015-03-25 | 三菱重工业株式会社 | Heat exchanger and vehicle air conditioner with same |
| CN103038596A (en) * | 2010-09-01 | 2013-04-10 | 三菱重工业株式会社 | Heat exchanger and vehicle air conditioner with same |
| CN102843897A (en) * | 2012-09-17 | 2012-12-26 | 夏侯南希 | Array cold-end plane heat pipe |
| CN103336565A (en) * | 2013-07-12 | 2013-10-02 | 凝辉(天津)科技有限责任公司 | Notebook computer battery bin heat dissipating expanding device |
| CN103399623A (en) * | 2013-07-12 | 2013-11-20 | 凝辉(天津)科技有限责任公司 | Laptop drive bay radiation extended device |
| CN104567499A (en) * | 2015-01-20 | 2015-04-29 | 北京建筑大学 | Pulse heat pipe heat radiation device used for electronic device and heat radiation device thereof |
| CN105135921A (en) * | 2015-08-17 | 2015-12-09 | 吴德坚 | Superconductive temperature-even type structural-heat-resistance-free cooler |
| CN106558563A (en) * | 2015-09-29 | 2017-04-05 | 比亚迪股份有限公司 | Power model and the vehicle with which |
| CN106558563B (en) * | 2015-09-29 | 2020-03-31 | 比亚迪股份有限公司 | Power module and vehicle with same |
| CN105633037A (en) * | 2016-01-08 | 2016-06-01 | 西安交通大学 | Pulsation heat pipe radiating apparatus for cooling chips |
| CN106659090A (en) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | Heat pipe conduction heat sink |
| EP3657540A4 (en) * | 2017-07-20 | 2021-04-28 | BOE Technology Group Co., Ltd. | Chip-on-film heat dissipation structure, manufacturing method thereof, and display device |
| WO2019015283A1 (en) * | 2017-07-20 | 2019-01-24 | 京东方科技集团股份有限公司 | Chip-on-film heat dissipation structure, manufacturing method thereof, and display device |
| CN109285820A (en) * | 2017-07-20 | 2019-01-29 | 京东方科技集团股份有限公司 | Radiator structure and preparation method thereof, display device |
| US11362015B2 (en) | 2017-07-20 | 2022-06-14 | Beijing Boe Display Technology Co., Ltd. | Heat dissipation structure for chip-on-film, manufacturing method thereof, and display device |
| CN109285820B (en) * | 2017-07-20 | 2021-01-22 | 京东方科技集团股份有限公司 | Heat dissipation structure, manufacturing method thereof and display device |
| CN107677155A (en) * | 2017-11-03 | 2018-02-09 | 中国科学院理化技术研究所 | A kind of flat heat pipe radiator |
| CN110726318A (en) * | 2019-10-18 | 2020-01-24 | 大连大学 | Miniature MIMO antenna heat pipe radiator |
| CN112492437A (en) * | 2020-11-16 | 2021-03-12 | 中航华东光电（上海）有限公司 | Liquid cooling heat abstractor and high heat dissipation headphone of headphone |
| CN112492437B (en) * | 2020-11-16 | 2022-11-11 | 中航华东光电（上海）有限公司 | Liquid cooling heat abstractor and high heat dissipation headphone of headphone |
| CN113138521A (en) * | 2021-04-29 | 2021-07-20 | 深圳市火乐科技发展有限公司 | Heat dissipation assembly and projector |
| CN115483172A (en) * | 2022-09-15 | 2022-12-16 | 湖南大学 | Device for high-power-density heat dissipation of wind power converter |
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| CN101510533B (en) | 2011-06-15 |
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