CN105977183B - Mounting device and attaching method - Google Patents
Mounting device and attaching method Download PDFInfo
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- CN105977183B CN105977183B CN201510929210.3A CN201510929210A CN105977183B CN 105977183 B CN105977183 B CN 105977183B CN 201510929210 A CN201510929210 A CN 201510929210A CN 105977183 B CN105977183 B CN 105977183B
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- chip
- collet
- shooting
- microscope carrier
- mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Present invention offer can not be influenced and the accurately chip attachment machine and attaching method of the high reliablity of pasting chip by the ongoing change for mounting required component parts.In the present invention, collet has from wafer chip, installation site of the mechanism from surface shooting chip is imaged using 1 installation, so as to identify to adsorb the construction of the posture of the position of the chip kept and rotation angle restriction, the mounting head of the collet is disposed separately by chip attachment in installation site using with the side for going up and down the collet, attachment is to image mechanism always while the installation site in shooting chip and installation microscope carrier using installation on one side, on one side based on the shooting result of the shooting, to control the position of chip, it is carried out at least position in rotation angle.
Description
Technical field
The present invention relates to mounting device and attaching method, more particularly, to for the component parts needed for mounting through time-varying
Change does not need modified mounting device and attaching method.
Background technique
The work of assembled package on the substrate that chip (semiconductor chip) is mounted in circuit board or lead frame etc.
In a part of sequence, have from wafer adsorption chip and to substrate mount attachment process.
In attachment process, need accurately to be mounted on the attachment face of substrate.But real estate is (chip is attached using DAF
Film) mounted in the case where be heated to 80~160 DEG C or so of high temperature.In addition, there are also the drivings for carrying out the movement of XYZ axis
The fever or variation of ambient temperature in portion.Because of heating, driving portion fever or variation of ambient temperature, the dislocation etc. of component parts will lead to
Ongoing change generate.But because of mounting head structurally the problem of, in 1 camera, from surface cannot observe core simultaneously
Piece and collet both sides or substrate and collet both sides.It is thus impossible to which chip is accurately mounted on installation site.
As solving the problems, such as that the prior art of above-mentioned ongoing change has patent document 1.Patent Document 1 discloses as follows
Technology, i.e., as shown in figure 11, in order to simultaneously shooting chip and substrate, seen using multiple camera 21a, 21b from inclined angle
It examines, is constructed according to the optical system with transparent panel 12 and reflectance coating 12p, 12q for being arranged on transparent panel using reflecting mirror
Body, so that chip is installed on substrate.In addition, appended drawing reference used in the explanation of Figure 11 and Figure 11 is that patent document 1 is remembered
There is the case where repeating with appended drawing reference used in presently filed embodiment and attached drawing, but be not in the appended drawing reference of load
Identical structure.
In addition, though without the record of the dislocation of above-mentioned component parts etc., but as using observing core in 1 camera simultaneously
The technology of piece and substrate, there are also patent documents 2 disclosed in the background technique as patent document 1.Disclose in patent document 2 as
Under technology: the reflection as optical system being for example made of semi-transparent semi-reflecting lens and perpendicular mirrors is inserted between chip and substrate
Body, from positive side while shooting chip and substrate.
Patent document 1: Japanese Unexamined Patent Publication 2007-103667 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2000-244195 bulletin
On the other hand, because of the stacked die caused by the recent small-sized slimming based on encapsulation, the slimming of chip
The development of the lamination techniques of (chip on chip), so that the attachment of chip needs the positioning of the tightened up μm order of magnitude.
It, can be because using the transparent panel for constituting optical system or instead in tilt in the technology disclosed in patent document 1
It penetrates the refraction of film and generates error.In addition, can simultaneously shooting chip and the case where substrate be only state when Figure 11 is shown,
The project of precision cannot be reached in installation site by existing as a result,.In addition, it is also necessary to multiple cameras.
In patent document 2, because of the above-mentioned height for the driving mechanism for making the reflector as optical system move back and forth
Ongoing change caused by heat etc., so that the posture of reflector changes, existing cannot accurately detection chip and substrate
Dislocation and the project that cannot precisely be installed.
Summary of the invention
The present invention is researched and developed in view of the above subject, and the purpose is to provide the chip attachment machine and patch of a kind of high reliablity
Dress method, can not be influenced by the ongoing change for mounting required component parts and accurately pasting chip.
The present invention is to achieve the above object, for example, has following characteristics.
A kind of mounting device of the invention, comprising:
It can make the tool that chip is mobile and loads；With
1 photographic unit of the mounting position of mounting chip is shot from surface,
In the mounting device, tool has the collet that can adsorb holding chip, and being configured to photographic unit can
The chip and mounting position both sides that identification collet is kept.
In addition, a kind of attaching method of the invention, includes decline step, absorption is made to remain the collet of chip from big
Top is caused to drop to the mounting position of mounting chip；With shooting step, in the midway of decline step, using surface is arranged in
Photographic unit is from surface shooting chip and loads position both sides.
Moreover, a kind of attaching method of the invention, includes decline step, absorption is made to remain the collet of chip from big
Cause position decline of the top towards mounting chip；Step is shot, after collet declines to mounting position, using setting on just
The photographic unit of side is from surface shooting chip and loads position both sides.
In addition, the present invention can also in the following way, what collet was configured to be kept in photographic unit and tool
Space between chip does not interfere to shoot.Include following mode as one mode: adsorbing the other side of the collet of chip
The position different from the straight line for being able to carry out the tool of mounting is set, and thus, it is possible to be inhaled using identification camera looks into fee collet
Attached chip.
Moreover, tool of the invention also has the elevating mechanism for going up and down collet, collet is arranged in center of gravity and elevating mechanism
The different position of center of gravity on.
Here, the case where center of gravity position different from the center of gravity of elevating mechanism is arranged in comprising by elevating mechanism in collet
It is upper that there is collet, and make collet that the situation on the different this position of position of centre of gravity of elevating mechanism is set.As one
Mode can enumerate the mode of crank.That is, in the case where there is elevating mechanism along the straight line of crank, along the song
The case of the another straight line setting collet of handle.Here, the length in the path in the center of crank can be very short.As long as that is, crank
In the straight line of entrance be in parallel disjoint relationship with the straight line of outlet.
In addition, the collet on the position that the side that tool of the invention is also possible to be arranged in go up and down collet separates.
Moreover, tool of the invention is also possible to the mounting head by chip pre-crimping in installation site, wherein installation position
It is set to mounting position, is also had to the formal crimp head formally crimped by the chip of pre-crimping.
In addition, collet of the invention is configured to, and when the chip adsorbed by collet is positioned in mounting position, shooting
The a line of shooting chip is capable of in mechanism.
Moreover, collet of the invention is also configured to, when the chip adsorbed by collet is positioned in mounting position, clap
Opposite two side including two corners comprising chip can be shot by taking the photograph mechanism.
In addition, tool of the invention also can have makes the collet rotation in the face parallel with the mounting position
Collet rotating mechanism.
Moreover, the present invention also can have mounting step, based on the image obtained in shooting step, for that should load core
The position of piece is modified, at the defined position that should be loaded using position of the control device to the collet of absorption holding chip
Load chip.
In addition, the step of movement of the invention is also possible to by having the tool for the elevating mechanism for going up and down collet mobile
The step of, chip is adsorbed using the collet being arranged on the center of gravity position different from the center of gravity of elevating mechanism.
Moreover, decline step of the invention is also possible to the decline based on the mounting head by chip pre-crimping in installation site
The step of, wherein installation site is mounting position, also has attachment step, is formally pressed using to by the chip of pre-crimping
The formal crimp head connect is mounted.
In addition, shooting the step of step is also possible to a line of shooting chip in decline step of the invention.
Moreover, in decline step of the invention, including shooting step is also possible to shooting comprising two corners of chip
The step of opposite two sides.
In addition, tool of the invention also can have the collet rotation for rotating collet in the face parallel with the position of mounting
Rotation mechanism.
The effect of invention
In accordance with the invention it is possible to which providing is not influenced by the ongoing change for mounting required component parts and is accurately mounted
The chip attachment machine and attaching method of the high reliablity of chip.
Detailed description of the invention
Fig. 1 is the schematic side perspective view of the major part of an embodiment of preferred chip attachment machine of the invention.
Fig. 2 is the synoptic diagram for indicating the embodiment from the pick-up head of wafer chip.
Fig. 3 is the synoptic diagram for indicating an embodiment of the formal crimp head being formally crimped on chip on substrate.
Fig. 4 is to indicate to pick up chip from intermediate microscope carrier and by new chip pre-crimping on substrate or mounted chip
The structural map of one embodiment of precompressed connector of the invention.
Fig. 5 is the figure for indicating the other embodiments of collet of precompressed connector of the invention.
Fig. 6 is the figure for indicating the motion flow of precompressed connector of the invention.
(a) of Fig. 7 is the rotary shifted figure for showing schematically the chip on microscope carrier, and (b) of Fig. 7 is to be schematically illustrated at
The rotary shifted figure of 32 upper substrate of microscope carrier is installed.
Fig. 8 is the figure for the first half for illustrating a series of processing of chip attachment machine entirety of the invention.
Fig. 9 is the figure for the latter half for illustrating a series of processing of chip attachment machine entirety of the invention.
Figure 10 is the figure for indicating an example of collet rotating mechanism of the invention.
Figure 11 is the figure for indicating the prior art.
Description of symbols
11: chip identifies camera
12: supply microscope carrier
13: pick-up head
13c: collet
13m: lifting unit
21: intermediate microscope carrier camera
22: intermediate microscope carrier
23: precompressed connector
23a: flexible executing agency
23b: rotation mandrel rod
23c: collet
23d: separation unit
23p: drive rod
23s: collet maintaining part
23w: the body side of precompressed connector
23k: attract cable
23E: lift drive shaft
23H: the main body of precompressed connector
23T: collet rotating mechanism
25: rotation drive device
31: crimping camera
32: installation microscope carrier
33: formal crimp head
33c: collet
34: heating device
41: downside vision camera
100: chip attachment machine
D: chip (semiconductor chip)
L: separating distance
P: substrate
Pm: base plate mark
W: wafer
θ d: the gradient of chip
θ p: the gradient of substrate
Specific embodiment
Hereinafter, illustrating one embodiment of the present invention using attached drawing etc..In addition, the following description is of the invention for illustrating
One embodiment, does not limit the scope of the invention.Therefore, to those skilled in the art, it can use and respectively want these
Element or whole elements are replaced as the embodiment for the structure being equal with it, these embodiments are also contained in the scope of the present invention
It is interior.
In addition, in the present specification, in the explanation of each figure, having the function of that common constituent element marks same attached drawing
Label, and repeat description is avoided as far as possible.
Fig. 1 is the schematic side perspective view for indicating the major part of first embodiment of preferred chip attachment machine of the invention.This
Chip attachment machine 100 picks up chip D from supply microscope carrier 12, is placed in intermediate microscope carrier 22, then pick up from intermediate microscope carrier 22, is positioned in
For carrying out the installation microscope carrier 32 of attachment operation and carrying out pre-crimping (attachment), then formally crimped, and be mounted on substrate P
On.
Chip attachment machine 100 also has following 3 kinds of structures and control device 50 other than with aftermentioned structure.First
Structure is that intermediate microscope carrier 22 is arranged in and installs the downside vision camera 41 between microscope carrier 32, aftermentioned pre- from underface
The state for the chip D that crimp head 23 is adsorbed in moving process.Second structure is the heating device being arranged on installation microscope carrier 32
34, it is easy to carry out pre-crimping or formal crimping by heating.Third structure is to make intermediate microscope carrier 22 parallel with mounting surface
Face on the rotation drive device 25 that rotates, be used to correct the posture of installed chip D.Control device 50 has not shown
CPU (Central processor unit: central processing unit), storage control program ROM (Read only memory:
Read-only memory), the RAM (Random access memory: random access memory) of storing data, control bus etc., control structure
At each element of chip attachment machine 100, and carry out installation control described below.In addition, the posture in the present invention is indicated by position
Set and rotation angle as defined in posture.
Firstly, the processing of construction and its progress to pick-up head 13 shown in Fig. 2 is illustrated.(a) of Fig. 2 is pick-up head
13 side view, (b) of Fig. 2 are the figures for removing lifting unit 13m etc. and pick-up head viewed from above 13 (collet 13c), due to from
Top cannot see that chip D, so being represented by dashed line.Pick-up head 13 picks up chip D from the wafer W of supply microscope carrier 12, and in Fig. 1
Shown in move on path shown in chain-dotted line, chip D is positioned on intermediate microscope carrier 22.Pick-up head 13 is because having along main body
The lifting unit 13m etc. of the guide rail 13g lifting of 13H, and collet 13c cannot be observed from surface.Therefore, chip knowledge is advanced with
Other camera 11 shoots picked up chip D (semiconductor chip), and the posture of detection chip D from surface, is based on the detection knot
Fruit, corrects the posture of pick-up head 13, and picks up chip D, and chip D is positioned on intermediate microscope carrier 22 with the posture.Collet 13c
In order to be removed by adsorption hole absorption chip D, and adsorbs and keep chip D whole.Especially, for example thick in order to steadily pick up
Degree is 20 μm of the wavy chip that is easily made into, and the absorption of preferably progress chip entirety is kept.
Then, illustrate have feature of the invention precompressed connector 23 shown in Fig. 4 before, illustrate it is shown in Fig. 3 just
The construction of formula crimp head 33 and its formal crimping processing carried out.(a) of Fig. 3 is the side view of formal crimp head 33, Fig. 3's
It (b) is the figure for removing the formal crimp head 33 (collet 33c) viewed from above such as lifting unit 33m, due to cannot see that core from top
Piece D, so being represented by dashed line.23 pre-crimping of precompressed connector installation microscope carrier 32 on or installed chip on, and towards in
Between microscope carrier 22 it is mobile.Then, to by the chip D of pre-crimping on formal crimp head 33 path being represented by dashed line shown in Fig. 1
Position it is mobile, decline and simultaneously formally crimped using collet 33c.As shown in (b) of Fig. 3, due to by the electrolysis of collet 33c
Product is arranged to be crimped area compared to sufficiently large with chip D, can also be with so the positioning accuracy of formal crimp head 33 is not stringent,
Or amendment posture is not needed.In addition, comprising collet 33c without adsorbing mechanism is arranged in formal crimp head 33.In addition, attached
Icon note 33H indicates the main body of formal crimp head, and appended drawing reference 33g indicates that the guide rail being arranged on main body 33H, 33m indicate
The lifting unit moved on the guide rail 33g being fixed on main body 33H.
After formal crimp head 33 is moved away from the position of the chip D formally crimped, clapped using crimping camera 31
The state of the chip D formally crimped is taken the photograph, and is checked.In the case where the exception of chip D crackle etc. has occurred, later
The processing for next substrate P is carried out without lamination process.In addition, the camera of inspection can also divide with camera 31 is crimped
It opens up and sets.In addition, installed with being laminated while making chip D be staggered in a substrate P 3 positions in Fig. 1, therefore,
The mobile right end until installing microscope carrier 32 of aftermentioned precompressed connector 23, is successively installed 3 positions.In addition, formal crimping
The shift position of first 33 right end is the evacuation position in the substrate P of 23 pre-crimping right end of precompressed connector.
Then, mounting head shown in Fig. 4, that is, precompressed connector 23 with feature of the invention is constructed and its is carried out
Processing is illustrated.(a) of Fig. 4 is the figure for indicating the construction for the lift drive shaft 23E for going up and down collet 23c.(b) of Fig. 4 be
The figure of collet 23c and collet maintaining part 23s from the arrow A in (a) of Fig. 4.(c) of Fig. 4 is using identification camera from just
The figure of chip D and collet 23c when top shooting picks up chip D from intermediate microscope carrier 22.In (c) of Fig. 4, core can be identified
The side of left and right two of piece D.
Precompressed connector 23 includes main body 23H, and having keeps head whole along the conveying direction (side X of substrate P shown in FIG. 1
To) mobile X drive shaft (not shown) and keep head whole along it is orthogonal with conveying direction (X-direction) and link intermediate microscope carrier 22 and
The Y drive shaft (not shown) of Y-direction movement between microscope carrier 32 is installed；With lift drive shaft 23E, go up and down collet 23c.In advance
Crimp head 23 does not have the rotary shaft being modified to rotation angle, that is, gradient on the X/Y plane of chip D.The gradient is repaired
The rotation of intermediate microscope carrier 22 is passed through to implement.In the present embodiment, precompressed connector 23 does not have rotary shaft, and thereby, it is possible to realities
The simplification of control when now to substrate P pre-crimping.
Lift drive shaft 23E is gone up and down along the guide rail 23g on the side 23w for the main body 23H that precompressed connector 23 is arranged in.It rises
Drop drive shaft 23E includes collet 23c, the front end of lift drive shaft 23E is arranged in, and have the adsorption hole of absorption chip D；
Collet maintaining part 23s keeps collet 23c；Lifting unit 23m keeps the guide rail 23g being fixed on main body 23H mobile；With L word
The separation unit 23d of shape only deviates separating distance L from the side 23w for going up and down the lifting unit 23m of collet 23c.For absorbent core
Piece D has on collet 23c and collet maintaining part 23s via the suction for attracting cable 23k to be connected to suction device (not shown)
Attached hole.In addition, in the present embodiment, the shape formed by separation unit 23d and collet maintaining part 23s is pre- with transmitting is such as facilitated
Shape as the crank path of crimp force, but also it is not necessarily limited to above-mentioned shape.Importantly, making collet 23c only extractor gauge
Fixed separating distance L.
Separating distance L is following distance: for example when picking up chip D from intermediate microscope carrier 22 using precompressed connector 23, energy
The structure for enough avoiding the precompressed connector 23 as barrier, utilizes the intermediate microscope carrier phase for the surface for being fixed on intermediate microscope carrier 22
Machine 21 while shooting chip D and collet 23c both sides.In addition, separating distance L is also possible to following distance: utilizing precompressed
New chip D pre-crimping when installing on substrate P or mounted chip D on microscope carrier 32, can be avoided becoming by connector 23
The structure of the precompressed connector 23 of barrier using the crimping camera 31 for being moved to pre-crimping (installation) position while shooting substrate
P or mounted chip D and new chip D (collet 23c).In addition, the substrate P being transported on installation microscope carrier 32 every time is one
When a, crimping camera 31 is fixed.For example, barrier specifically has lifting unit and guide rail.Precompressed connector 23 has and Fig. 2
Shown in pick-up head 11 similarly construct, if but collet 23c be in close contact as illustrated in fig. 2 with side 23w, intermediate microscope carrier phase
Machine 21 and the visual field for crimping camera 31 can be blocked by lifting unit 23m or guide rail 23g.
In addition, collet 23c has the following construction that can be identified: when having adsorbed chip D, intermediate microscope carrier camera 21 or
Crimp camera 31 (identification camera, photographic unit) from surface downwards from when can identification chip D relative to collet 23c's
The posture of position.The construction that can be identified refers to, when camera adsorbs the collet 23 that remain chip D from surface,
At least one side of chip D is able to enter to the construction in the visual field.The above-mentioned construction that can be identified is identifying camera from chip
Chip D is preferably adsorbed from surface using in identification camera from the part that collet 23c exposes when surface is observed downwards
When remain the collet 23 of chip D, more than two sides of chip D it is able to enter to the construction in the visual field.For example, at (c) of Fig. 4
In, become the size for being able to observe that opposite the two sides of short side of chip D.In addition to this, such as (a) of Fig. 5, Fig. 5
(b) shown in, the construction at 2 to 4 angles of chip D is also able to observe that, alternatively, being able to observe that core as shown in (c) of Fig. 5
The construction etc. on 4 sides of piece D.In addition, in the identical situation of cross sectional shape of collet maintaining part 23s and collet 23c, in order to bright
The really relationship between chip D can also set two opposite sides plate bigger and shorter than the long side of chip D than collet 23c
It sets on the top of collet 23c, to replace collet 23c to play above-mentioned effect.
Collet maintaining part 23s and separation unit 23d has following size: when having adsorbed chip D, when from surface
Do not become obstruction of the chip D relative to the gesture recognition of collet 23c.For example, collet maintaining part 23s and separation unit 23d with folder
The size in length and breadth of parallel sectional area is smaller than the size in length and breadth in collet 23c viewed from above.
Then, using Fig. 6, to chip D is picked up from intermediate microscope carrier 22 using precompressed connector 23, simultaneously pre-crimping is installing microscope carrier
Motion flow needed on 32 is illustrated.
Firstly, in Fig. 1, when substrate P is transported on installation microscope carrier 32, as being schematically illustrated (a) of Fig. 7,
Using 1 crimping camera 31 from the installation site of the chip D in the substrate P that reference mark for shooting indicates simultaneously of surface and
Collet 23c in installation site or installation site detects rotation angle, that is, gradient θ p (step S1) of the substrate P relative to collet.
In addition, the label of corner shown in (b) of Fig. 7 is an example of base plate mark Pm, but as long as the mounting of the chip D on display base plate P
Position.As being schematically illustrated (b) of Fig. 7, make precompressed connector 23 to the chip D being positioned on intermediate microscope carrier 22 just
Top is mobile (step S2).The core being positioned on intermediate microscope carrier 22 is shot simultaneously from surface using 1 intermediate microscope carrier camera 21
The piece D and collet 23c, rotation angle, that is, gradient θ of the detection chip D relative to collet 23c for dropping to the tight preceding surface chip D
D (step S3).So that the gradient of the chip D on intermediate microscope carrier 22 becomes the gradient θ p's of the substrate P on installation microscope carrier 32
Mode makes intermediate microscope carrier 22 rotate angle (θ p- θ d) (step S4).In addition, gradient θ p, θ d in step S1, S2 and S4 and
Angle (θ p- θ d) is when from identification camera looks into fee by clockwise direction as positive.It, can also be together in step S1, S3
Detect the mistake between rotation angle i.e. gradient and substrate P and the respective center chip D and the center of collet 23c
Position.
Then, decline precompressed connector 23, and adsorb and keep chip D (step S5).As a result, precompressed connector 23 is with base
The gradient θ p of plate P keeps chip D to adsorb.Then, the top for the substrate P for being moved to precompressed connector 23 on installation microscope carrier 32
(step S6).In step S1, S3, rotation angle i.e. gradient and substrate P and the respective center chip D can also be detected together
Dislocation between position and the center of collet 23c, and dislocation is corrected in the moving process.
Then, it is shot simultaneously from surface always using 1 crimping camera 31 by precompressed connector 23c absorption holding on one side
Base plate mark Pm both sides on chip D and substrate, on one side so that corner one possessed by the corner of chip D and base plate mark Pm
The mode of cause moves precompressed connector 23 along the direction XY, carries out pre-crimping (step S7).For example, if being shot simultaneously from rectangle always
Base plate mark Pm both sides on chip D and substrate P, then can generate error because of inclination, can not realize the accurate of several μm of units
Contraposition.After pre-crimping, precompressed connector 23 is mobile (step S8) to the surface of intermediate microscope carrier 22 once again.
Then, the lamination process that new chip D is laminated on chip D is entered to, but since the stacking of chip D is inclined
Gradient becomes the gradient θ p of substrate P, so until defined stacking the piece number, substrate P is replaced as to chip D is simultaneously
The processing (step S9) of implementation steps S2 to step S8 is repeated.
In general, when implementing processing shown in fig. 6 repeatedly, intermediate microscope carrier camera 21, crimping camera 31, precompressed connector
23 etc. can generate the ongoing change of dislocation, rotation angle etc..
, can be using the constituent element that ongoing change occurs but according to above-described embodiment, detection chip D is relative to hair
The posture of the installation site of raw ongoing change can be fed back always from surface on one side using 1 identification camera (photographic unit)
The chip D and installation site installed is installed on one side.
Therefore, the present embodiment from the description above also can even if ongoing change occurs for the constituent element for constituting Fig. 1
Chip is accurately fitted within installation site unaffectedly.
In addition, the present embodiment from the description above, between 1 intermediate microscope carrier camera 21 and intermediate microscope carrier 22 and 1
Platform crimps between camera 31 and installation microscope carrier 32, is not provided with the optical system for shooting, therefore, will not generate because of the optical system
Dislocation caused by system, and can accurately be installed.
Then, the whole a series of processing of chip attachment machine 100 is illustrated using Fig. 8, Fig. 9.In Fig. 8, Fig. 9, it is
It is easy to understand explanation, it is different from Fig. 1, it is illustrated using the example for only having the case where installation site at 1 in substrate P.?
Below explanation in, as illustrated the step of, the processing on each microscope carrier is illustrated.In Fig. 8, Fig. 9, in the lower section of each camera
There are in the case where arrow, indicate that the camera carrying out shooting processing.
(a) of Fig. 8:
On installation microscope carrier 32, collet 23c is made to be moved to the surface for being conveyed the substrate P come, utilizes crimping camera 31
Shooting carries out the processing of the step S1 of Fig. 6 to check the state of substrate P, detects the rotation angle i.e. gradient θ p of substrate.
On supply microscope carrier 12, chip D is picked up from wafer W using pick-up head 13, and be placed in intermediate microscope carrier 22.
(b) of Fig. 8:
On intermediate microscope carrier 22, so that collet 23c is moved to the surface of placed chip D, utilize intermediate microscope carrier camera
21 carry out the processing of the step S3 of Fig. 6, rotation angle, that is, gradient θ d of detection chip D.
On supply microscope carrier 12, the picking action of next chip D is carried out using the pick-up head 13 for being back to supply microscope carrier 12.
In addition, on installation microscope carrier 32, chip D if it exists shown in dotted line, then just using the progress of formal crimp head 33
Formula crimping.
(c) of Fig. 8:
On intermediate microscope carrier 22, the processing of the step S4 based on Fig. 6 revolves intermediate microscope carrier 22 by rotation drive device 25
Gyration (θ p- θ d), and carry out θ amendment.
In addition, when having carried out formal crimping in (b) of Fig. 8, in after treatment, utilizing pressure in installation microscope carrier 32
The state of the shooting crimping of camera 31 is connect, and mobile to evacuation position.When an exception is detected, then stop lamination process.
(d) of Fig. 9:
On intermediate microscope carrier 22, the processing of the step S5 of Fig. 6 is carried out, using precompressed connector 23 with the gradient θ p of substrate P
Absorption keeps chip D.
(e) of Fig. 9:
On intermediate microscope carrier 22, the processing of the step S6 of Fig. 6 is carried out, picks up chip D using precompressed connector 23, and towards peace
Loading stage 32.In midway, using downside vision camera 41 from underface shooting chip D, to confirm the gradient θ p of chip, and
Absorption hold mode can also be grasped or whether there is or not rubbish.
On supply microscope carrier 12, microscope carrier 22 conveys the next chip D picked up towards the middle.
(f) of Fig. 9:
On intermediate microscope carrier 22, next chip D is loaded by pick-up head 13.
It, will be by pre-crimping along with the processing of the step S7 of the Fig. 6 carried out using crimping camera 31 on installation microscope carrier 32
The chip that first 23 conveying comes is positioned in the top of substrate P or the mounted chip D being represented by dashed line.
After the processing of (f) of Fig. 9, into lamination process, (b) of the Fig. 8 formally crimped is returned to.In this case, exist
It installs on microscope carrier 32, the chip D being represented by dashed line in (e) of (a) to Fig. 9 of Fig. 8 becomes solid line.Defined stacking is reached
After number, the processing substrate of the new substrate come or the processing substrate of adjacent production line in Fig. 1 are conveyed in order to enter, and
It is back to (a) of Fig. 8.
In addition, for example, the load (Light Place Load: underload) for carrying out the precompressed connector of pre-crimping is 0.5~2
[N] (load load time (Short Place Time): 0.1~0.5 [s]), the load of the formal crimp head formally crimped
Lotus (Heavy Place Load) be 1~70 [N] (load load time (Heavy Place Time: heavy load): 0.5 [s] with
On).
The present embodiment from the description above does not need that the posture of chip is fitly positioned in centre as previous
Microscope carrier or posture by downside vision camera detection chip are just able to carry out merely with the contraposition of installation microscope carrier for precompressed
The contraposition connect, so as to cut down the installation work-hour of chip attachment machine entirety.
Then, the second embodiment of currently preferred chip attachment machine is illustrated.It is real with the first of the present embodiment
Two differences for applying example are: precompressed connector 23；Movement with the precompressed connector 23 of the change with first and the control that generates
The change of method processed and the change of intermediate microscope carrier 22.
In the first embodiment, precompressed connector 23 does not have the function of rotating collet 23c.In the present embodiment, in order to
X, Y-direction corrections to dislocation effect while also carry out rotation angle amendment, and on precompressed connector 23 be arranged collet rotating mechanism
23T.Collet rotating mechanism 23T is in pre-crimping or before pre-crimping, crimping camera 31 can shoot simultaneously always substrate P or
In the state of the adsorbed chip D of chip D and collet 23c, it is able to carry out the rotation of collet 23c.It is adsorbed in collet 23c
In stage of the chip D of holding when the top of from substrate P or chip D is close or before horse back contacts, crimp camera
31 can shoot the adsorbed chip D of these collets 23c and substrate P or chip D both sides always.
Figure 10 is the figure for indicating to meet the collet rotating mechanism 23T of an example of such condition.Collet rotating mechanism 23T exists
The region B of Fig. 4 being represented by dashed line is set in (a) of Fig. 4, separation unit 23d is supported on by mechanism (not shown).
Collet rotating mechanism 23T includes rotation mandrel rod 23b, extends from the axis center of collet maintaining part 23s；2 drivings
Bar 23p, from the both ends of rotation mandrel rod 23b in the face parallel with the adsorption plane of collet 23c, respectively from the both ends and rotary shaft
Stick 23b is normally located otherwise；With two flexible executing agency 23a, make 2 drive rod 23p flexible respectively.
In the mechanism, by making two flexible executing agency 23a stretch round about each other, collet can be made to keep
The center of axis center, that is, collet adsorption area of portion 23s rotates, and can easily be done rotation angle adjustment.
In the present embodiment, there is collet rotating mechanism 23T, as a result, in installation site, 1 crimping can be utilized on one side
Camera 31 shoots substrate P or the adsorbed chip D of chip D and collet 23c from surface always, controls collet on one side
The position of 23c and rotation angle, to be installed.Therefore, in the present embodiment, the gradient θ p for detecting substrate P in advance is not needed
And it is positioned in the gradient θ d of the chip D on intermediate microscope carrier 22, and carry out the rotation angle amendment based on intermediate microscope carrier 22.As a result,
In the present embodiment, the rotation drive device 25 of intermediate microscope carrier 22 is not needed yet.
The present embodiment from the description above carries out pre-crimping using the precompressed connector 23 of the present embodiment, and thereby, it is possible to begin
Eventually simultaneously shoot substrate P or chip D and new chip D (collet 23c), with X, Y-direction corrections to dislocation effect while also
Carry out rotation angle amendment.Therewith, the rotation angle i.e. gradient θ p of substrate P can not also be detected in advance and is positioned in intermediate microscope carrier 22
On chip D rotation angle, that is, gradient θ, in addition, do not need to carry out yet based on intermediate microscope carrier 22 rotation angle amendment, Neng Goushi
Existing working hour is reduced.
In addition, even if ongoing change occurs for the constituent element for constituting Fig. 1, being installed in the present embodiment described above
Position also can shoot substrate P or chip D and new chip D (collet 23c) simultaneously always, so that new chip D is arrived
Mode up to installation site controls collet 23c, so as to not installed with being influenced by ongoing change.
In addition, in the present embodiment described above, when carrying out pre-crimping, with only shown in Figure 11 in the state of can
The patent document 2 of contraposition is different, the chip that also can be shot substrate P or mounted chip D from surface always and newly install
D, and can be realized the contraposition of the two, so as to be accurately proceed installation.
That is, collet absorption keep chip until with mounting chip location contacts until, comprising crimping camera including
Camera can from surface shoot said chip and load chip position both sides, therefore, will not generate because gradient generate
Location error, and shot while image focal point can be directed at.Moreover, as described above, remain the folder of chip in absorption
Head with mounting chip location contacts after, also can based on by comprising crimping camera including camera shoot image, in core
The positional relationship at the position of piece and setting chip needs in modified situation (for example, control device is for having taken chip and setting
Set the image at the position of chip and have taken in advance correct chip and be arranged chip position it is correct as defined in image into
Go and compare, the relationship at the position of chip and setting chip produces the case where defined value or more misplaces etc.), to correct above-mentioned core
The position of piece.This has the effect that after making to be contacted by the chip that collet adsorbs with the position at the position of setting chip
Also it can correct, thereby, it is possible to the dislocation not generated by the distance at the position of the chip and setting chip that are adsorbed by collet
It is modified.
In the first, second embodiment described above, instantiates with intermediate microscope carrier and carry out pre-crimping, formal crimping
Chip attachment machine example.For example, of the invention can discretely have in a manner of identification chip absorption holding posture
In the mounting head of collet, on one side using 1 identification camera from surface simultaneously from chip and installation site while installed
It also can be suitable for the handover of installation or chip trigger circuit placement equipment shown in patent document 2.
Claims (16)
1. a kind of mounting device comprising:
The pick-up head of chip is picked up from supply microscope carrier；
Intermediate microscope carrier is loaded for the chip picked up using the pick-up head；
Intermediate microscope carrier photographic unit, shooting are placed in the chip of the intermediate microscope carrier；
Precompressed connector, is picked up and movement is placed in the chip of the intermediate microscope carrier, and can be placed in the multiple of substrate
Position；With
1 photographic unit shoots the chip on the mounting position for being already installed on the substrate from surface,
In, the chip is placed in the mounting position of the substrate using the precompressed connector,
The precompressed connector have can adsorb the collet for keeping the chip and make the collet relative to the collet
The collet rotating mechanism rotated in the parallel face of adsorption plane, and be configured to the photographic unit and can identify that the collet is kept
Chip and the mounting position both sides,
The compression joint area of formal crimp head than the chip to be crimped area big,
The collet is configured to, when the chip adsorbed by the collet is placed in the mounting position, the shooting
Mechanism can be shot including opposite two side entirety or opposite two corner comprising the chip of the chip
Two opposite sides.
2. mounting device as described in claim 1, which is characterized in that
There is no harms for the space between the chip that the photographic unit and the precompressed connector are kept for the collet
Hinder the state of the article of shooting.
3. mounting device as described in claim 1, which is characterized in that
The precompressed connector also has the elevating mechanism for making the precompressed connector lifting,
The collet is arranged on the center of gravity position different from the center of gravity of the elevating mechanism.
4. mounting device as described in claim 1, which is characterized in that
The collet is arranged on the position separated with the side for going up and down the collet.
5. mounting device as described in any one of claims 1 to 4, which is characterized in that
The precompressed connector also has the collet maintaining part for keeping the collet,
The collet maintaining part be configured to when viewing from the side its collect in the width range of the collet.
6. mounting device as described in any one of claims 1 to 4, which is characterized in that
The collet is configured to, when the chip adsorbed by the collet is positioned in the mounting position, the shooting
Mechanism can shoot two sides of the chip or more.
7. mounting device as described in any one of claims 1 to 4, which is characterized in that
The collet is configured to, when the chip adsorbed by the collet is positioned in the mounting position, the shooting
Mechanism can shoot the four edges of the chip.
8. mounting device as described in any one of claims 1 to 4, which is characterized in that
The collet rotating mechanism includes rotation mandrel rod, extends from the axis center of collet maintaining part；Two drive rods,
In the parallel face of adsorption plane relative to the collet, orthogonally set from the both ends of the rotation mandrel rod with the rotation mandrel rod respectively
It sets；With two flexible executing agencies, make two drive rods flexible respectively.
9. a kind of attaching method comprising:
(a) decline step, the collet for making absorption remain chip is lowered from above at the mounting position for loading the chip
On substrate or installed chip；
(b) step is shot, in the midway of the decline step, shoots institute from surface using the photographic unit that surface is arranged in
State chip and the mounting position both sides；With
(c) step is loaded, the image obtained in the shooting step is based on, using rotating mechanism relative to the collet
The collet is rotated in the parallel face of adsorption plane and the position of the collet is modified, and is carried at the defined position that should be loaded
The chip is set,
In the shooting step, shoot opposite including a line of the chip or two corners comprising the chip
Two sides,
It repeats described (a) step~(c) step for different multiple mounting positions of the substrate and mounts.
10. attaching method as claimed in claim 9, which is characterized in that
Also there is moving step, pick up the chip from intermediate microscope carrier and moved to the top of the mounting position.
11. attaching method as claimed in claim 9, which is characterized in that
The decline step is the step moved by having the tool for the elevating mechanism for making the collet lifting,
The chip is adsorbed using the collet being arranged on the center of gravity position different from the center of gravity of the elevating mechanism.
12. the attaching method as described in any one of claim 9~11, which is characterized in that
The decline step be based on by the chip pre-crimping the decline that the mounting head in installation site is realized the step of,
The installation site is the mounting position,
Also there is attachment step, mounted using to the formal crimp head formally crimped by the chip of pre-crimping,
The compression joint area of the formal crimp head than the chip to be crimped area big.
13. the attaching method as described in any one of claim 9~11, which is characterized in that
In the decline step, shooting step is to shoot the step on two sides of the chip or more.
14. the attaching method as described in any one of claim 9~11, which is characterized in that
In the decline step, shooting step is the step of shooting the four edges of the chip.
15. the attaching method as described in any one of claim 9~11, which is characterized in that
The rotating mechanism includes rotation mandrel rod, extends from the axis center of collet maintaining part；Two drive rods, opposite
In in the parallel face of the adsorption plane of the collet, it is normally located otherwise respectively from the both ends of the rotation mandrel rod with the rotation mandrel rod；
With two flexible executing agencies, make two drive rods flexible respectively.
16. a kind of attaching method, which is characterized in that
It includes
(a) moving step picks up chip and towards the substrate or installed chip at the mounting position for loading the chip
Top it is mobile；
(b) decline step, the collet for making absorption remain the chip declines from above towards the position for chip mounting；
(c) shoot step, after the collet declines to the mounting position, using be arranged in the photographic unit of surface from
Surface shoots the chip and the mounting position both sides；
(d) pre-crimping step is based on the image obtained in the shooting step, using rotating mechanism relative to the collet
The parallel face of adsorption plane in the rotation collet and the position of the collet is modified, at the defined position that should be loaded
Chip described in pre-crimping；With
(e) step is mounted, is mounted using the formal crimp head that the chip to pre-crimping is formally crimped,
In the shooting step, shoot opposite including a line of the chip or two corners comprising the chip
Two sides,
It repeats described (a) step~(e) step for different multiple mounting positions of the substrate and mounts.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-048168 | 2015-03-11 | ||
| JP2015048168A JP6510837B2 (en) | 2015-03-11 | 2015-03-11 | Bonding apparatus and bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105977183A CN105977183A (en) | 2016-09-28 |
| CN105977183B true CN105977183B (en) | 2019-10-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510929210.3A Active CN105977183B (en) | 2015-03-11 | 2015-12-14 | Mounting device and attaching method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6510837B2 (en) |
| KR (2) | KR101807369B1 (en) |
| CN (1) | CN105977183B (en) |
| TW (1) | TWI593046B (en) |
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| JP6643197B2 (en) * | 2016-07-13 | 2020-02-12 | ファスフォードテクノロジ株式会社 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
| CN108511364B (en) | 2017-02-28 | 2020-01-24 | 上海微电子装备（集团）股份有限公司 | Chip bonding device |
| JP7164314B2 (en) | 2017-04-28 | 2022-11-01 | ベシ スウィッツァーランド エージー | APPARATUS AND METHOD FOR MOUNTING COMPONENTS ON SUBSTRATE |
| CN107093651B (en) * | 2017-05-18 | 2023-08-04 | 江西比太科技有限公司 | Automatic unloading equipment of going up of two unification of solar wafer |
| JP7018341B2 (en) * | 2018-03-26 | 2022-02-10 | ファスフォードテクノロジ株式会社 | Manufacturing method of die bonding equipment and semiconductor equipment |
| US10861819B1 (en) * | 2019-07-05 | 2020-12-08 | Asm Technology Singapore Pte Ltd | High-precision bond head positioning method and apparatus |
| JP7352159B2 (en) * | 2019-09-30 | 2023-09-28 | 日本電気硝子株式会社 | Device manufacturing method |
| CN112802793A (en) * | 2021-02-09 | 2021-05-14 | 深圳市卓兴半导体科技有限公司 | Running mechanism and wafer adsorption device |
| CN117080127B (en) * | 2023-10-11 | 2024-01-05 | 江苏快克芯装备科技有限公司 | Chip suction abnormality detection device and detection method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024008A (en) * | 1999-07-09 | 2001-01-26 | Fuji Photo Film Co Ltd | Method and apparatus for bonding light emitting component |
| JP2006032987A (en) * | 2005-09-27 | 2006-02-02 | Renesas Technology Corp | Manufacturing method for bonding equipment and semiconductor ic device |
| JP2010029707A (en) * | 2009-11-09 | 2010-02-12 | Takeya Co Ltd | Mounting structure of electronic part |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6140040A (en) * | 1984-07-31 | 1986-02-26 | Oki Electric Ind Co Ltd | Die bonding position determining method for light emitting element |
| JP2696617B2 (en) * | 1991-06-04 | 1998-01-14 | ローム株式会社 | Die bonding equipment |
| JPH05337865A (en) * | 1992-06-10 | 1993-12-21 | Sony Corp | Semiconductor mounting device and mounting method using this device |
| KR100214586B1 (en) * | 1995-12-29 | 1999-08-02 | 구자홍 | A hologram module fabrication device |
| JPH11274180A (en) * | 1998-03-24 | 1999-10-08 | Sony Corp | Die bonder and manufacture of semiconductor device using the same |
| JP2000244195A (en) | 1999-02-17 | 2000-09-08 | Rohm Co Ltd | Chip position recognition device of flip-chip placement apparatus |
| JP2000269240A (en) * | 1999-03-16 | 2000-09-29 | Hitachi Cable Ltd | Manufacture of optical module and optical element mounting device |
| JP4425609B2 (en) * | 2003-02-19 | 2010-03-03 | キヤノンマシナリー株式会社 | Chip mounting method and apparatus |
| JP4156460B2 (en) * | 2003-07-09 | 2008-09-24 | Ｔｄｋ株式会社 | Work pickup method and apparatus, and mounting machine |
| JP3808465B2 (en) * | 2003-12-24 | 2006-08-09 | エルピーダメモリ株式会社 | Mounting method and apparatus |
| JP2006261209A (en) * | 2005-03-15 | 2006-09-28 | Seiko Epson Corp | Collet for sucking component |
| JP4593429B2 (en) | 2005-10-04 | 2010-12-08 | キヤノンマシナリー株式会社 | Die bonder |
| JP2009212456A (en) * | 2008-03-06 | 2009-09-17 | Sharp Corp | Bonding apparatus |
| JP5989313B2 (en) * | 2011-09-15 | 2016-09-07 | ファスフォードテクノロジ株式会社 | Die bonder and bonding method |
| US8967452B2 (en) * | 2012-04-17 | 2015-03-03 | Asm Technology Singapore Pte Ltd | Thermal compression bonding of semiconductor chips |
-
2015
- 2015-03-11 JP JP2015048168A patent/JP6510837B2/en active Active
- 2015-12-04 TW TW104140754A patent/TWI593046B/en active
- 2015-12-11 KR KR1020150176798A patent/KR101807369B1/en active IP Right Grant
- 2015-12-14 CN CN201510929210.3A patent/CN105977183B/en active Active
-
2017
- 2017-10-25 KR KR1020170139319A patent/KR101874756B1/en active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024008A (en) * | 1999-07-09 | 2001-01-26 | Fuji Photo Film Co Ltd | Method and apparatus for bonding light emitting component |
| JP2006032987A (en) * | 2005-09-27 | 2006-02-02 | Renesas Technology Corp | Manufacturing method for bonding equipment and semiconductor ic device |
| JP2010029707A (en) * | 2009-11-09 | 2010-02-12 | Takeya Co Ltd | Mounting structure of electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170121133A (en) | 2017-11-01 |
| KR101874756B1 (en) | 2018-07-04 |
| TWI593046B (en) | 2017-07-21 |
| KR101807369B1 (en) | 2017-12-08 |
| TW201633441A (en) | 2016-09-16 |
| JP2016171106A (en) | 2016-09-23 |
| KR20160110058A (en) | 2016-09-21 |
| JP6510837B2 (en) | 2019-05-08 |
| CN105977183A (en) | 2016-09-28 |
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