CN105969280B - A kind of hollow fiber film assembly casting epoxy glue and preparation method thereof - Google Patents
A kind of hollow fiber film assembly casting epoxy glue and preparation method thereof Download PDFInfo
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- CN105969280B CN105969280B CN201610472635.0A CN201610472635A CN105969280B CN 105969280 B CN105969280 B CN 105969280B CN 201610472635 A CN201610472635 A CN 201610472635A CN 105969280 B CN105969280 B CN 105969280B
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- epoxy
- glue
- hollow fiber
- epoxy glue
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses dedicated epoxy glues of a kind of hollow fiber film assembly casting and preparation method thereof.It is characteristic of the invention that the epoxy glue includes 60~75 parts of epoxy resin, 10~15 parts of toughener, 15~20 parts of diluent, 25~40 parts of curing agent, 5~10 parts of coupling agent.It is an advantage of the invention that epoxy glue obtained is when carrying out end seal to hollow-fibre membrane, with good fluidity, operable time is long, thermal discharge is low, climb the advantages that silk is highly controllable, have excellent mechanical strength and flexibility after epoxy adhesive curing of the invention, not only can guarantee the flexibility of film wire root, but also external load can be born and avoid the phenomenon that cracking and shelling.
Description
Technical field
The present invention relates to dedicated epoxy glue of a kind of hollow fiber film assembly casting and preparation method thereof more particularly to large scales
The casting of pressure type hollow fiber film assembly blocks.
Background technique
Hollow-fibre membrane is a kind of porous filter membrane material, is widely used in seawater desalinization pretreatment, drinking water, industry
Fields, the principles such as black water processing are sieved by aperture, and big particulate matter is retained, and hydrone penetrates.Due to
The features such as filling area of hollow-fibre membrane unit volume is big, backwashes convenient for positive, and filter effect is good, has become water process row
The essential membrane material of industry.Hollow-fibre membranes material needs to be bonded using adhesive, and is encapsulated in specific shape and ruler
In very little putamina, become the membrane module for application.
Epoxy and polyurethane two major classes adhesive are broadly divided into adhesive system at present.Epoxy glue is that current dosage is maximum
Adhesive, generally use the amine or non-amine curing agent of two-component.The characteristics of epoxy glue is that solidification rate is fast, cure cycle
Short, cohesive force is strong, and self-strength is high.Polyurethane is another large class adhesive, it generallys use two-component at room temperature
It casts.Polyurethane adhesive has the features such as solidification rate is fast, hardness is low, and flexibility is good.
Heat release is more violent when epoxy glue is poured, and causes curing exothermic peak relatively high.Therefore in casting hollow-fibre membrane
When, film wire is easy discoloration and becomes fragile.Further, since capillary effect, in membrane module casting process, glue can be infiltrated along film wire,
Commonly referred to as " climb silk ", brittleness is big after epoxy adhesive curing, causes glue to become fragile with film wire connecting portion, film wire is held in use
Easily it is broken.
In order to solve the problems, such as epoxy glue burning silk and climb silk ribbon, common practice is at present, and with flexible glue, (epoxy is poly-
Urethane) second casting is carried out to the membrane module for having used epoxy glue to cast, hardness is lower after being solidified using flexible glue, toughness
It is good, it not will cause glue and film wire connecting portion become fragile.Epoxy ebonite plays the work for bonding film wire and bear external force load in this way
With flexible glue plays the role of protecting film wire root.Second casting is the main casting side of industrial hollow fiber film assembly at present
Method.The method of second casting not only increases the cost of raw material of adhesive, also adds operational sequence, reduces production effect
Rate.It has been proposed that cast using the extremely low epoxy glue of thermal discharge, but its cure cycle is long, is unfavorable for mentioning for production efficiency
It is high.Furthermore, it is thus proposed that using the method for primary casting flexible glue, such as polyurethane, can effectively avoid burn silk and film wire root in this way
The phenomenon that portion's embrittlement, but since polyurethane adhesive self-strength and hardness are inadequate, can be applied in small size membrane module, but
It cannot achieve the target that long-play does not crack and falls off on large scale membrane module.
A kind of self-strength height is urgently developed at present, and hardness is moderate, and flexibility is good, burns silk when can effectively avoid film wire casting
With the problems such as climbing thread, and do not occur the adhesive for cracking and falling off after membrane module longtime running.It will be in hollow fiber film assembly
Casting and production in have broad application prospects.
Summary of the invention
The present invention in view of the above technical problems, provides a kind of when carrying out end seal casting to hollow fiber film assembly, tool
There is good fluidity, operable time is long, and thermal discharge is low, climbs the epoxy glue for the advantages that silk is highly controllable.Epoxy glue of the invention is solid
Have excellent mechanical strength and flexibility after change, not only can guarantee the flexibility of film wire root, but also external load can be born and avoided
The phenomenon that cracking and shelling.
The present invention is addressed using following technical scheme: 60~75 parts of epoxy resin, 10~15 parts of toughener, and diluent
15~20 parts, 25~40 parts of curing agent, 5~10 parts of coupling agent.
Preferably, the epoxy resin is bisphenol A type epoxy resin, epoxide number is 0.46~0.52, viscosity (room
Under the conditions of temperature) it is 5000~8000mPaS.
Preferably, the toughener is liquid SBS elastomer, in liquid styrene butadiene rubber and liquid isoprene rubber
It is one or more.
Preferably, the diluent is reactive diluent butyl glycidyl ether, phenyl glycidyl ether, ethylene glycol
One of diglycidyl ether and trihydroxy methyl glycidol ether are a variety of.
Preferably, it is fatty amines-hexamethylene diamine, aromatic amine-diphenylamines that the curing agent, which is the curing agent,
Diphenyl sulphone (DPS) and polyamide it is one or more.
Preferably, the polyamide molecular weight is 300-500g/mol.
Preferably, the coupling agent is one of KH540, KH550, KH560, KH602, KH792 or a variety of.On
Coupling agent is stated to be commercially available on open market.
The present invention also provides a kind of preparation methods of hollow-fibre membrane cast epoxy glue, which is characterized in that including
Following steps:
(1) epoxy resin, toughener and diluent are mixed to uniformly；
(2) curing agent and coupling agent are mixed to uniformly；
(3) liquid of step 1 and 2 be mixed 3 to 5 minutes, obtain glue；By the glue standing and defoaming 5
To 10 minutes, epoxy glue needed for obtaining hollow-fibre membrane cast.
Preferably, the viscosity of the last mixed glue solution is 800~1500mPaS at room temperature.
Preferably, the epoxy glue of the casting need to be placed 3~5 days at room temperature, the hardness after being fully cured is
60~75D of shore.
Epoxy glue of the invention is suitable for the casting of micro-filtration or ultra filtration hollow fiber membrane component.
The utility model has the advantages that
Epoxy glue of the invention can be widely applied to polysulfones, polyether sulfone, the materials hollow fiber film assembly such as Kynoar
Casting, especially 8 inches or more large scales, casting of the single glue in 2kg or more membrane module.To hollow fiber film assembly
When carrying out end seal casting, there is good fluidity, operable time is long, and thermal discharge is low, climbs the epoxy glue for the advantages that silk is highly controllable.
Specific embodiment
Below by specific embodiment, technology of the invention is placed on and is further illustrated.
Implementation column 1:
First by 75g epoxy resin (epoxide number 0.46, viscosity 5000mPaS), 10g liquid SBS elastomer and
15g butyl glycidyl ether is stirred uniform.Then by 10g hexamethylene diamine, 10g diphenylamines diphenyl sulphone (DPS) and 5g polyamide (molecule
Amount is uniform for 300g/mol) curing agent and 5g KH540 mixing.Asphalt mixtures modified by epoxy resin is added in uniformly mixed curing agent and coupling agent again
It stirs uniform in aliphatic radical body, obtains the epoxy glue that viscosity is 800mPaS, by its standing and defoaming 10min, during then casting enters
In empty fiber membrane component.After room temperature condition is placed 3~5 days, epoxy glue is fully cured, and hardness is shore 75D.
Implementation column 2:
First by 60g epoxy resin (epoxide number 0.52, viscosity 8000mPaS), 10g liquid styrene butadiene rubber, 5g liquid
Body isoprene rubber, 10g phenyl glycidyl ether and 10g ethylene glycol diglycidylether be stirred it is uniform, then by 20g
Hexamethylene diamine, 5g diphenylamines diphenyl sulphone (DPS) and 15g polyamide (molecular weight 500g/mol) curing agent and 5g KH560 and 5g KH
602 mixing are uniform.Curing agent and coupling agent that again will be uniformly mixed, which be added in epoxy resin-base, to be stirred uniform, and obtaining viscosity is
The epoxy glue of 1500mPaS, by its standing and defoaming 10min, then casting enters in hollow fiber film assembly.In room temperature condition
After placing 3~5 days, epoxy glue is fully cured, and hardness is shore 60D.
Implementation column 3:
First by 65g epoxy resin (epoxide number 0.50, viscosity 6000mPaS), 10g liquid isoprene rubber,
5g phenyl glycidyl ether and 10g trihydroxy methyl glycidol ether are stirred uniform.Then by 15g hexamethylene diamine, 10g diphenylamines
Diphenyl sulphone (DPS) and 10g polyamide (molecular weight 500) curing agent and 3g KH560 and 5g KH 602 mix uniform.It again will mixing
Uniform curing agent and coupling agent, which are added in epoxy resin-base, to be stirred uniform, obtains the epoxy glue that viscosity is 1000mPaS,
By its standing and defoaming 10min, then casting enters in hollow fiber film assembly.After room temperature condition is placed 3~5 days, epoxy glue
It is fully cured, hardness is shore 65D.
Implementation column 4:
First by 70g epoxy resin (epoxide number 0.48, viscosity 7000mPaS), 10g liquid isoprene rubber,
10g phenyl glycidyl ether and 10g trihydroxy methyl glycidol ether are stirred uniform.Then by 10g hexamethylene diamine, 10g hexichol
Amine diphenyl sulphone (DPS) and the mixing of 10g polyamide (molecular weight 400g/mol) curing agent and 5gKH602 and 3gKH792 are uniform.Again will
Uniformly mixed curing agent and coupling agent, which are added in epoxy resin-base, to be stirred uniform, obtains the epoxy that viscosity is 1200mPaS
Glue, by its standing and defoaming 10min, then casting enters in hollow fiber film assembly.After room temperature condition is placed 3~5 days, epoxy
Glue is fully cured, and hardness is shore 70D.
Claims (5)
- A kind of epoxy glue 1. hollow fiber film assembly is cast, it is characterised in that: its mass component are as follows: 60~75 parts of epoxy resin, 10~15 parts of toughener, 15~20 parts of diluent, 25~40 parts of curing agent, 5~10 parts of coupling agent；The epoxy resin is bisphenol A type epoxy resin, and epoxide number is 0.46~0.52, and viscosity is 5000 under room temperature ~8000mPaS；The toughener is one or more of liquid SBS elastomer, liquid styrene butadiene rubber or liquid isoprene rubber Combination；The diluent be reactive diluent butyl glycidyl ether, phenyl glycidyl ether, ethylene glycol diglycidylether, Or one of trihydroxy methyl glycidol ether or a variety of；The curing agent is three kinds of groups of the polyamide that hexamethylene diamine, diphenylamines diphenyl sulphone (DPS) and molecular weight are 300-500g/mol It closes.
- The epoxy glue 2. a kind of hollow fiber film assembly according to claim 1 is cast, it is characterised in that: the coupling agent For one of KH540, KH550, KH560, KH602 or KH792 or a variety of.
- 3. a kind of preparation method of hollow fiber film assembly casting epoxy glue according to claim 1, which is characterized in that packet Include following steps:(1) epoxy resin, toughener and diluent are mixed to uniformly；(2) curing agent and coupling agent are mixed to uniformly；(3) liquid of step (1) and (2) be mixed 3 to 5 minutes, obtain glue；By the glue standing and defoaming 5 To 10 minutes, epoxy glue needed for obtaining hollow-fibre membrane cast.
- 4. a kind of preparation method of hollow fiber film assembly casting epoxy glue according to claim 3, it is characterised in that step Suddenly the viscosity of the mixed glue solution obtained in (3) is 800~1500mPaS at room temperature.
- 5. a kind of preparation method of hollow fiber film assembly casting epoxy glue according to claim 3, it is characterised in that institute The epoxy glue of acquisition is placed 3~5 days at room temperature, and the hardness after being fully cured is 60~75D of shore.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610472635.0A CN105969280B (en) | 2016-06-22 | 2016-06-22 | A kind of hollow fiber film assembly casting epoxy glue and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610472635.0A CN105969280B (en) | 2016-06-22 | 2016-06-22 | A kind of hollow fiber film assembly casting epoxy glue and preparation method thereof |
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| Publication Number | Publication Date |
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| CN105969280A CN105969280A (en) | 2016-09-28 |
| CN105969280B true CN105969280B (en) | 2019-05-21 |
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| CN106497474A (en) * | 2016-10-29 | 2017-03-15 | 张静 | A kind of preparation method of epoxy resin adhesive |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102850725A (en) * | 2012-07-23 | 2013-01-02 | 北京赛诺膜技术有限公司 | Epoxy potting material for microfiltration or ultrafiltration membrane filling and preparation method thereof |
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2016
- 2016-06-22 CN CN201610472635.0A patent/CN105969280B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102850725A (en) * | 2012-07-23 | 2013-01-02 | 北京赛诺膜技术有限公司 | Epoxy potting material for microfiltration or ultrafiltration membrane filling and preparation method thereof |
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