CN105965985B - Preparation method for the heat conduction graphite patch of adhesive tape - Google Patents

Preparation method for the heat conduction graphite patch of adhesive tape Download PDF

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Publication number
CN105965985B
CN105965985B CN201511014593.8A CN201511014593A CN105965985B CN 105965985 B CN105965985 B CN 105965985B CN 201511014593 A CN201511014593 A CN 201511014593A CN 105965985 B CN105965985 B CN 105965985B
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Prior art keywords
parts
graphite
heat conduction
coat
kapton
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CN201511014593.8A
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CN105965985A (en
Inventor
金闯
梁豪
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Jiangsu Stick New Materials Polytron Technologies Inc
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Jiangsu Stick New Materials Polytron Technologies Inc
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • C—CHEMISTRY; METALLURGY
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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Abstract

A kind of preparation method of heat conduction graphite patch for adhesive tape of the present invention, heat conduction graphite patch are made of Kapton, the first coat and the second coat, and the first coat, the second coat are located at the upper and lower surface of Kapton respectively；First coat, the second coat are by the graphite modified dosage form coated on Kapton upper and lower surface into the graphite modified dose of component by following parts by weight forms：22 parts of benzophenone tetracarboxylic dianhydride, 12.5 parts of pyromellitic acid anhydride, 26 parts of diaminodiphenylmethane, 22.5 parts of dimethylformamide, 9.5 parts of N methyl pyrrolidones, 2.2 parts of ethylene glycol, 2.8 parts of dimethyl silicone polymer, 0.9 part of dibutyl phthalate.The present invention avoids hot-spot, while realizing the uniformity of heat conductivility, improves the thermal diffusivity of product, stability, reliability, greatly reduces the cost of product.

Description

Preparation method for the heat conduction graphite patch of adhesive tape
Technical field
The present invention relates to a kind of preparation method of the heat conduction graphite patch for adhesive tape, belong to graphite flake technical field.
Background technology
As modern microelectronic technology high-speed develops, electronic equipment（Such as laptop, mobile phone, tablet computer）Increasingly Become ultra-thin, light, this structure causes electronic equipment internal power density to significantly improve, and caused heat is not easy in operation Discharge, be easy to accumulation rapidly and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and using the longevity Life.Therefore, Current electronic industry proposes increasingly higher demands for the heat sink material as heat control system core component, urgently Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure electronic equipment normal operation.
Kapton is mostly used for flexible PCB in the prior art, is obtained although having using polyimide film sintered Graphite heat radiation fin is obtained, so as to be covered on heat source, but is constrained to the good and the bad of the product quality and performances of Kapton not Together, the performance of the two-sided pad pasting heat dissipation performance of heat dissipation has been influenced, there are following technical problem：Radiate uneven, adhesive tape easily occur Hot-spot, the heat dissipation performance that improves product is unstable, reliability performance is poor, is unfavorable for product quality management control, influences product Competitiveness.
The content of the invention
It is an object of the present invention to provide a kind of preparation method of the heat conduction graphite patch for adhesive tape, what which obtained Heat conduction graphite patch for adhesive tape is both vertically and horizontally improving heat conductivility, avoids hot-spot, realizes While the uniformity of heat conductivility, improve heat dissipation performance stability, the reliability of product, greatly reduce product into This.
To achieve the above object of the invention, the technical solution adopted by the present invention is：A kind of heat conduction graphite patch for adhesive tape Preparation method, the heat conduction graphite patch surface is coated with heat conduction adhesive layer, this heat conduction adhesive layer and heat conduction graphite patch phase The surface of the back of the body is fitted with separated type material layer；The heat conduction graphite patch is by Kapton, the first coat and the second coating Layer composition, the first coat, the second coat are located at the upper and lower surface of Kapton respectively；
First coat, the second coat are by the graphite modified dosage form coated on Kapton upper and lower surface Into the graphite modified dose of component by following parts by weight forms：22 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 12.5 Part, 26 parts of diaminodiphenylmethane, 22.5 parts of dimethylformamide, 9.5 parts of 1-methyl-2-pyrrolidinone, 2.2 parts of ethylene glycol, gather 2.8 parts of dimethyl siloxane, 0.9 part of dibutyl phthalate；
The heat conduction graphite patch is obtained by following steps：
Step 1: Kapton upper and lower surface be respectively coated graphite modified dose handled after polyimides Film, graphite modified dose of viscosity is 30000 ~ 48000cP；
Step 2: by the Kapton after processing under inert gas shielding, 240 DEG C ~ 260 DEG C are risen to from room temperature, 480 DEG C ~ 500 DEG C are risen to after insulation, is warming up to 780 DEG C ~ 820 DEG C after insulation again, 1200 DEG C of postcoolings are risen to after insulation, so as to obtain Obtain the carbonized film of pre-burned；
Step 3: roll the carbonized film of the pre-burned using calender；
Step 4: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then be warming up to 2850 DEG C ~ 2950 DEG C postcoolings, So as to obtain the graphite film of main firing；
Step 5: the graphite film of the main firing of gained is then subjected to calendering so as to obtain the heat conduction graphite patch.
Since above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
1st, the present invention is used for the preparation method of the heat conduction graphite patch of adhesive tape, and graphite linings are equal by upper and lower surface in its structure The Kapton of one layer graphite modified dose of coating is prepared, and improves in thermal conductivity both vertically and horizontally Can, adhesive tape hot-spot is avoided, realizes the uniformity of adhesive tape heat conductivility；Secondly, it is located at Kapton surface Graphite modified dose by 20 ~ 25 parts of benzophenone tetracarboxylic dianhydride, 12 ~ 18 parts of pyromellitic acid anhydride, diaminodiphenylmethane 20 ~ 28 2 ~ 3 parts of part, 30 ~ 35 parts of dimethylformamide, 1.5 ~ 2.5 parts of ethylene glycol, dimethyl silicone polymer compositions, coated on polyimides On film, the pin hole that is filled with heating process improves crystallinity at the same time, also overcome thermal contraction it is excessive caused by it is uneven It is even, improve graphite linings biaxial tension performance.
2nd, the present invention is used for the preparation method of the heat conduction graphite patch of adhesive tape, it is located at the graphite on Kapton surface Modifying agent by 20 ~ 25 parts of benzophenone tetracarboxylic dianhydride, 12 ~ 18 parts of pyromellitic acid anhydride, 20 ~ 28 parts of diaminodiphenylmethane, 20 ~ 25 parts of dimethylformamide, 8 ~ 10 parts of 1-methyl-2-pyrrolidinone, 1.5 ~ 2.5 parts of ethylene glycol, 2 ~ 3 parts of dimethyl silicone polymer Composition, azeotropic point and smooth boiling point are reduced using 20 ~ 25 parts of dimethylformamide, 8 ~ 10 parts of 1-methyl-2-pyrrolidinone Area, improves the flatness and pliability of final products film forming；Secondly, 20 ~ 25 parts of dimethylformamide, 1-methyl-2-pyrrolidinone 8 ~ 10 parts and 0.8 ~ 1.5 part of Kapton surface of dibutyl phthalate, prevent bubble from producing, and it is poly- to be more advantageous to filling The small pin hole of imide membrane, improves the uniformity of heat dissipation patch heat conductivility.
3rd, the present invention is used for the preparation method of the heat conduction graphite patch of adhesive tape, between the carbonized film and graphitization of pre-burned Increase calendaring processes, and roll again after re-forming heat conduction graphite patch, avoid in fold and graphitization sintering process Volume contraction, improves compactness and crystallinity, further increases in heat conductivility both vertically and horizontally.
Embodiment
With reference to embodiment, the invention will be further described：
Embodiment：A kind of preparation method of heat conduction graphite patch for adhesive tape, the heat conduction graphite patch surface coating The surface for having heat conduction adhesive layer, this heat conduction adhesive layer opposite with heat conduction graphite patch is fitted with separated type material layer；The heat conduction stone Black patch is made of Kapton, the first coat and the second coat, first coat, the second coat difference Positioned at the upper and lower surface of Kapton；
First coat, the second coat are by the graphite modified dosage form coated on Kapton upper and lower surface Into the graphite modified dose of component by following parts by weight forms：22 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 12.5 Part, 26 parts of diaminodiphenylmethane, 22.5 parts of dimethylformamide, 9.5 parts of 1-methyl-2-pyrrolidinone, 2.2 parts of ethylene glycol, gather 2.8 parts of dimethyl siloxane, 0.9 part of dibutyl phthalate；
The heat conduction graphite patch is obtained by following steps：
Step 1: Kapton upper and lower surface be respectively coated graphite modified dose handled after polyimides Film, graphite modified dose of viscosity is 30000 ~ 48000cP；
Step 2: by the Kapton after processing under inert gas shielding, 240 DEG C ~ 260 DEG C are risen to from room temperature, 480 DEG C ~ 500 DEG C are risen to after insulation, is warming up to 780 DEG C ~ 820 DEG C after insulation again, 1200 DEG C of postcoolings are risen to after insulation, so as to obtain Obtain the carbonized film of pre-burned；
Step 3: roll the carbonized film of the pre-burned using calender；
Step 4: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then be warming up to 2850 DEG C ~ 2950 DEG C postcoolings, So as to obtain the graphite film of main firing；
Step 5: the graphite film of the main firing of gained is then subjected to calendering so as to obtain the heat conduction graphite patch.
Using the above-mentioned heat conduction graphite patch for adhesive tape preparation method when, graphite linings are equal by upper and lower surface in its structure The Kapton of one layer graphite modified dose of coating is prepared, and improves in thermal conductivity both vertically and horizontally Can, adhesive tape hot-spot is avoided, realizes the uniformity of adhesive tape heat conductivility；Secondly, it is located at Kapton surface Graphite modified dose by 20 ~ 25 parts of benzophenone tetracarboxylic dianhydride, 12 ~ 18 parts of pyromellitic acid anhydride, diaminodiphenylmethane 20 ~ 28 2 ~ 3 parts of part, 30 ~ 35 parts of dimethylformamide, 1.5 ~ 2.5 parts of ethylene glycol, dimethyl silicone polymer compositions, coated on polyimides On film, the pin hole that is filled with heating process improves crystallinity at the same time, also overcome thermal contraction it is excessive caused by it is uneven It is even, graphite linings biaxial tension performance is improved, also reduces azeotropic point and smooth boiling point area, improves final products film forming Flatness and pliability；Again, Kapton surface has graphite modified dose, improve in two-sided pad pasting graphite linings with Heat conduction adhesive layer heat conductivility, and using the carbonized film of the calender calendering pre-burned, avoid fold and graphitization sintering During volume contraction, improve compactness and crystallinity, further increase in heat conduction both vertically and horizontally Performance；Again, 0.8 ~ 1.5 part of 20 ~ 25 parts of dimethylformamide, 8 ~ 10 parts of 1-methyl-2-pyrrolidinone and dibutyl phthalate Kapton surface, prevents bubble from producing, and is more advantageous to the small pin hole of filled polyimide film, improves heat dissipation patch The uniformity of piece heat conductivility.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention The equivalent change or modification that Spirit Essence is made, should be covered by the protection scope of the present invention.

Claims (1)

1. a kind of preparation method of heat conduction graphite patch for adhesive tape, the heat conduction graphite patch surface is gluing coated with heat conduction Layer, heat conduction the adhesive layer surface opposite with heat conduction graphite patch are fitted with separated type material layer, it is characterised in that：The conductive graphite Patch is made of Kapton, the first coat and the second coat, and the first coat, the second coat are respectively positioned at poly- The upper and lower surface of imide membrane；
First coat, the second coat by the graphite modified dosage form coated on Kapton upper and lower surface into, should The graphite modified dose of component by following parts by weight forms：22 parts of benzophenone tetracarboxylic dianhydride, 12.5 parts of pyromellitic acid anhydride, 26 parts of diaminodiphenylmethane, 22.5 parts of dimethylformamide, 9.5 parts of 1-methyl-2-pyrrolidinone, 2.2 parts of ethylene glycol, poly- diformazan 2.8 parts of radical siloxane, 0.9 part of dibutyl phthalate；
The heat conduction graphite patch is obtained by following steps：
Step 1: Kapton upper and lower surface be respectively coated graphite modified dose handled after polyimides it is thin Film, graphite modified dose of viscosity is 30000 ~ 48000cP；
Step 2: by the Kapton after processing under inert gas shielding, 240 DEG C ~ 260 DEG C are risen to from room temperature, insulation After rise to 480 DEG C ~ 500 DEG C, 780 DEG C ~ 820 DEG C are warming up to after insulation again, 1200 DEG C of postcoolings are risen to after insulation, so as to obtain pre- The carbonized film of firing；
Step 3: roll the carbonized film of the pre-burned using calender；
Step 4: carbonized film is warming up to 2350 DEG C ~ 2450 DEG C, keep the temperature, then be warming up to 2850 DEG C ~ 2950 DEG C postcoolings, so that Obtain the graphite film of main firing；
Step 5: the graphite film of the main firing of gained is then subjected to calendering so as to obtain the heat conduction graphite patch.
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CN201511029000.5A Active CN105979751B (en) 2014-01-26 2014-01-26 Adhesive tape graphite heat conducting and heat radiating fin
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CN201511028635.3A Active CN105979750B (en) 2014-01-26 2014-01-26 Flexibility heat conduction graphite patch
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CN107441619A (en) * 2017-08-17 2017-12-08 成都三乙医疗科技有限公司 A kind of thermal conducting piece for electrotherapy
CN107551392A (en) * 2017-08-29 2018-01-09 成都三乙医疗科技有限公司 A kind of thermal conducting piece for thermotherapy

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JP4622429B2 (en) * 2004-09-30 2011-02-02 株式会社カネカ Manufacturing method of high thermal conductive casing
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