CN105965163A - Laser processing equipment - Google Patents
Laser processing equipment Download PDFInfo
- Publication number
- CN105965163A CN105965163A CN201610351032.5A CN201610351032A CN105965163A CN 105965163 A CN105965163 A CN 105965163A CN 201610351032 A CN201610351032 A CN 201610351032A CN 105965163 A CN105965163 A CN 105965163A
- Authority
- CN
- China
- Prior art keywords
- laser
- computer
- base
- process equipment
- intensity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
- B23K26/705—Beam measuring device
Abstract
The invention discloses laser processing equipment. The laser processing equipment comprises a base, a working platform and a computer. The working platform is fixed to one side of the top surface of the base through a bracket. The base is provided with a processed piece placing base body. The working platform is provided with a laser assembly which comprises a laser device, a spectroscope, a photoelectric detector and a laser processing head. The laser device transmits laser which is divided into two beams through the spectroscope, one beam of laser penetrates into the photoelectric detector, and the other beam of the laser penetrates into the laser processing head. The laser processing head right faces the processed piece placing base body. The photoelectric detector is connected with the computer. The computer is connected with the laser device. According to the laser processing equipment, the photoelectric detector collects the intensity of one beam of the laser and sends the intensity of the laser into the computer, the computer works out the intensity of laser used for processing according to the intensity of the laser and the transmittance-reflectance ratio of the spectroscope, and the transmitting power of the laser device is controlled through the computer, so that the intensity of the laser used for processing is controlled in real time.
Description
Technical field
The present invention relates to a kind of laser process equipment, belong to optical field.
Background technology
Laser process equipment is to make the laser beam irradiation launched from light source on processing object, is processed on the surface of processing object, and the effect of Laser Processing and the power of laser have direct relation, and existing laser process equipment can not adjust the intensity of laser in real time.
Summary of the invention
In order to solve above-mentioned technical problem, the invention provides a kind of laser process equipment.
In order to achieve the above object, the technical solution adopted in the present invention is:
A kind of laser process equipment, including base, work platforms and computer, described work platforms is fixed on base top surface side by support, workpiece placement rack it is provided with on described base, it is provided with laser module on described work platforms, described laser module includes laser instrument, light splitting border, photodetector and laser Machining head, described laser instrument sends laser, it is divided into two bundles by light splitting border, a branch of penetrate photodetector, another bundle penetrates laser Machining head, described laser Machining head is just to workpiece placement rack, described photodetector is connected with computer, described computer is connected with laser instrument.
Described workpiece placement rack is fixed on slide block, and described slide block and base are rail structure.
The bottom surface of described base is provided with some cushions.
Being provided with aspiration channel, the external air draft equipment of described aspiration channel on described base, described aspiration channel is export-oriented tubular construction.
Described support is liftable support.
The button controlling lifting support is arranged on base side.
The beneficial effect that the present invention is reached: the present invention gathers the intensity of light beam by electric explorer, and the intensity of this Shu Guang is sent to computer, computer calculates, with reflectance ratio, the intensity that processing is used up according to intensity, the light splitting border absorbance of this Shu Guang, by the transmitting power of computer controlled laser, thus control the intensity that processing is used up in real time.
Accompanying drawing explanation
Fig. 1 is the top view of the present invention.
Fig. 2 is the side view of the present invention.
Detailed description of the invention
The invention will be further described below in conjunction with the accompanying drawings.Following example are only used for clearly illustrating technical scheme, and can not limit the scope of the invention with this.
nullAs illustrated in fig. 1 and 2，A kind of laser process equipment，Including base 1、Work platforms 2 and computer 3，Work platforms 2 is fixed on base 1 end face side by support 10，Support 10 is liftable support，The button controlling lifting support is arranged on base 1 side，The bottom surface of base 1 is provided with some cushions 12，Workpiece placement rack 7 and aspiration channel 11 it is provided with on base 1，Workpiece placement rack 7 is fixed on slide block 9，Slide block 9 and base 1 are rail structure，The external air draft equipment of aspiration channel 11，Aspiration channel 11 is export-oriented tubular construction，Direction can be regulated according to demand，It is provided with laser module on work platforms 2，Laser module includes laser instrument 4、Light splitting border 5、Photodetector 6 and laser Machining head 8，Laser instrument 4 sends laser，It is divided into two bundles by light splitting border 5，A branch of penetrate photodetector 6，Another bundle penetrates laser Machining head 8，Laser Machining head 8 is just to workpiece placement rack 7，Photodetector 6 is connected with computer 3，Computer is connected with laser instrument 4.
The said equipment gathers the intensity of light beam by electric explorer, and the intensity of this Shu Guang is sent to computer 3, computer 3 calculates, with reflectance ratio, the intensity that processing is used up according to intensity, light splitting border 5 absorbance of this Shu Guang, controlled the transmitting power of laser instrument 4 by computer 3, thus control the intensity that processing is used up in real time.
The above is only the preferred embodiment of the present invention; it should be pointed out that, for those skilled in the art, on the premise of without departing from the technology of the present invention principle; can also make some improvement and deformation, these improve and deformation also should be regarded as protection scope of the present invention.
Claims (6)
1. a laser process equipment, it is characterized in that: include base, work platforms and computer, described work platforms is fixed on base top surface side by support, workpiece placement rack it is provided with on described base, it is provided with laser module on described work platforms, described laser module includes laser instrument, light splitting border, photodetector and laser Machining head, described laser instrument sends laser, it is divided into two bundles by light splitting border, a branch of penetrate photodetector, another bundle penetrates laser Machining head, described laser Machining head is just to workpiece placement rack, described photodetector is connected with computer, described computer is connected with laser instrument.
A kind of laser process equipment the most according to claim 1, it is characterised in that: described workpiece placement rack is fixed on slide block, and described slide block and base are rail structure.
A kind of laser process equipment the most according to claim 1, it is characterised in that: the bottom surface of described base is provided with some cushions.
A kind of laser process equipment the most according to claim 1, it is characterised in that: being provided with aspiration channel, the external air draft equipment of described aspiration channel on described base, described aspiration channel is export-oriented tubular construction.
A kind of laser process equipment the most according to claim 1, it is characterised in that: described support is liftable support.
A kind of laser process equipment the most according to claim 5, it is characterised in that: the button controlling lifting support is arranged on base side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610351032.5A CN105965163A (en) | 2016-05-25 | 2016-05-25 | Laser processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610351032.5A CN105965163A (en) | 2016-05-25 | 2016-05-25 | Laser processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105965163A true CN105965163A (en) | 2016-09-28 |
Family
ID=56955883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610351032.5A Pending CN105965163A (en) | 2016-05-25 | 2016-05-25 | Laser processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105965163A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110587159A (en) * | 2019-09-23 | 2019-12-20 | 广东工业大学 | System and method for monitoring laser processing performance in real time |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050018738A1 (en) * | 2003-07-02 | 2005-01-27 | Jun Duan | Method and apparatus for laser marking on finished glass disk media |
| CN202199932U (en) * | 2011-06-27 | 2012-04-25 | 武汉晶石光电技术有限公司 | Laser system |
| US20140202997A1 (en) * | 2013-01-24 | 2014-07-24 | Wisconsin Alumni Research Foundation | Reducing surface asperities |
| CN104416284A (en) * | 2013-08-30 | 2015-03-18 | 大族激光科技产业集团股份有限公司 | Optical isolator and laser processing system |
-
2016
- 2016-05-25 CN CN201610351032.5A patent/CN105965163A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050018738A1 (en) * | 2003-07-02 | 2005-01-27 | Jun Duan | Method and apparatus for laser marking on finished glass disk media |
| CN202199932U (en) * | 2011-06-27 | 2012-04-25 | 武汉晶石光电技术有限公司 | Laser system |
| US20140202997A1 (en) * | 2013-01-24 | 2014-07-24 | Wisconsin Alumni Research Foundation | Reducing surface asperities |
| CN104416284A (en) * | 2013-08-30 | 2015-03-18 | 大族激光科技产业集团股份有限公司 | Optical isolator and laser processing system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110587159A (en) * | 2019-09-23 | 2019-12-20 | 广东工业大学 | System and method for monitoring laser processing performance in real time |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160928 |
|
| RJ01 | Rejection of invention patent application after publication |