CN105957847B - A kind of chip cooling structure and set-top box - Google Patents
A kind of chip cooling structure and set-top box Download PDFInfo
- Publication number
- CN105957847B CN105957847B CN201610507030.0A CN201610507030A CN105957847B CN 105957847 B CN105957847 B CN 105957847B CN 201610507030 A CN201610507030 A CN 201610507030A CN 105957847 B CN105957847 B CN 105957847B
- Authority
- CN
- China
- Prior art keywords
- chip
- heat
- cooling structure
- silica gel
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
Abstract
The present invention relates to a kind of chip cooling structure and set-top boxes, including hollow silica gel piece, silicone grease, heat dissipation aluminium block and heat-dissipating aluminium plate；Using the hollow silica gel piece for having certain thickness and compression ratio, protection support can be not only carried out, but also cooperatively form a seal chamber with the silicone grease with high thermal conductivity, effectively play and protect exposed wafer and good heat-transfer effect.Back-shaped silica gel piece is pressed using heat dissipation aluminium block on one side, another side stamping riveting avoids gap on heat-dissipating aluminium plate, can effectively conduct to heat, improves heat dissipation effect, to effectively be radiated to chip and carry out effective protection to wafer, installs simple and convenient.
Description
Technical field
The present invention relates to radiator structure more particularly to a kind of chip cooling structures and set-top box.
Background technique
With the continuous upgrading of IC integrated level and technique, the integrated functionality of chip is also stronger and stronger on set-top box, chip
The heat of generation is also increasing.Based on experience, performance and the requirement in service life to set-top box, the Wafer bumping of heat dissipation and chip
Brought chip protection problem also extraordinarily attracts attention.
Existing set-top-box chip heat dissipation design, mainly by three kinds of cross-ventilation, conduction and heat radiation modes, mostly
Increase radiating surface by increasing set-top box heat dissipation hole number, internal configuration fan, increasing radiator or increase soaking plate mode
Product is to realize.But increase heat dissipation hole number and built-in fans, it can largely influence set-top box appearance, water proof and dust proof effect
Fruit difference and the size for increasing set-top box；And increase radiator and increase soaking plate by way of, will increase installation complexity,
Transportation problem and EMI problem (electromagnetic interference problem) are brought, it is unfavorable that these all bring to set-top box, and cannot carry out well scattered
Heat also can not protect well chip.
Summary of the invention
In view of this, it is necessary to for said chip heat dissipation design to set-top box bring it is unfavorable, cannot to chip carry out very
The problem of protecting well provides a kind of chip cooling structure and set-top box.
A kind of chip cooling structure provided by the invention, including hollow silica gel piece, silicone grease, heat dissipation aluminium block and radiation aluminium
Plate；The hollow silica gel piece is bonded on chip, and thickness, which is greater than Wafer bumping height, and centre is provided with can accommodate chip die
Square opening, the silicone grease is applied in the square opening of the hollow silica gel piece, forms seal chamber and is sealed protection to wafer, described
Heat dissipation aluminium block is used to press on one side the hollow silica gel piece, another side stamping riveting to the heat-dissipating aluminium plate bottom surface, the heat dissipation
Aluminium sheet is connect by screw with pcb board where chip, chip cooling structure is fixedly mounted on pcb board, and make the heat dissipation
Aluminium block compresses the hollow silica gel piece on one side.
In one of them embodiment, the silicone grease uses the heat-conducting silicone grease of 3.0 or more high thermal conductivity coefficient.
In one of them embodiment, the heat dissipation aluminium block is the smooth rectangular aluminium block of upper and lower surface.
In one of them embodiment, the heat-dissipating aluminium plate bottom surface is equipped with multiple screw columns；The screw column is logical
It crosses riveting method to be connected on the heat-dissipating aluminium plate, and height is greater than the height of the heat dissipation aluminium block.
In one of them embodiment, multiple grooves are offered on the heat-dissipating aluminium plate；The groove is strip,
And level is alternately distributed vertically.
In one of them embodiment, the heat-dissipating aluminium plate edge is bent to form bent sheet.
In one of them embodiment, the internal layer copper that pcb board where chip is 2 ounces is thick.
In one of them embodiment, the pcb board internal layer paving copper between chip and ambient chip, which is formed with, is isolated.
A kind of set-top box provided by the invention, includes chip cooling structure, and the chip cooling structure is above-mentioned core
Piece radiator structure.
Chip cooling structure and set-top box of the present invention both may be used using the hollow silica gel piece for having certain thickness and compression ratio
To carry out protection support, while a seal chamber is cooperatively formed with the silicone grease with high thermal conductivity again, it is exposed effectively to play protection
Wafer and good heat-transfer effect.Back-shaped silica gel piece is pressed using heat dissipation aluminium block on one side, another side stamping riveting is in radiation aluminium
Gap is avoided on plate, effectively heat can be conducted, and heat dissipation effect is improved, to effectively be radiated to chip and to crystalline substance
Circle carries out effective protection, installs simple and convenient.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the chip cooling structure in one embodiment；
Fig. 2 is the structural schematic diagram of the hollow silica gel piece in one embodiment；
Fig. 3 is aluminium block and aluminium sheet structural schematic diagram in one embodiment.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
Fig. 1 is the structural schematic diagram of the chip cooling structure in one embodiment；Fig. 2 is the hollow silicon in one embodiment
The structural schematic diagram of film；Fig. 3 is aluminium block and aluminium sheet structural schematic diagram in one embodiment.In conjunction with Fig. 1 to Fig. 3, the chip
Radiator structure includes hollow silica gel piece 100, silicone grease 200, heat dissipation aluminium block 300 and heat-dissipating aluminium plate 400.Hollow silica gel piece 100 is viscous
It connects on chip, thickness is greater than Wafer bumping height and centre is provided with the square opening 110 that can accommodate chip die.Silicone grease 200 applies
It is put in the square opening 110 of hollow silica gel piece 100, forms seal chamber and protection is sealed to wafer.Heat dissipation 300 one side of aluminium block is used for
Press hollow silica gel piece 100, another side stamping riveting to 400 bottom surface of heat-dissipating aluminium plate.Heat-dissipating aluminium plate 400 passes through screw and chip institute
It is connected in pcb board 500, chip cooling structure is fixedly mounted on pcb board 500, and heat dissipation aluminium block 300 is made to compress hollow on one side
Silica gel piece 100.The chip cooling structure can both be protected using the hollow silica gel piece 100 for having certain thickness and compression ratio
Shield support, while a seal chamber is cooperatively formed with the silicone grease 200 with high thermal conductivity again, it effectively plays and protects exposed wafer
With good heat-transfer effect.Back-shaped silica gel piece 100 is pressed using heat dissipation aluminium block 300 on one side, another side stamping riveting is in radiation aluminium
Avoid gap on plate 400, effectively heat can be conducted, improve heat dissipation effect, thus to chip carry out effectively heat dissipation and
Effective protection is carried out to wafer.
In this embodiment, 100 material of hollow silica gel piece has high-insulativity and high-breakdown-voltage, V-0 grade fire protecting performance.
Have the compression ratio of setting, wide temperature resistant range and long life.The initial all respective membrane in the top and bottom of hollow silica gel piece 100,
Remove membrane when in use.The thickness of hollow silica gel piece 100 can be according to 200 thickness of silicone grease, the wafer of Wafer bumping height, smearing
With the gap spacing of heat dissipation aluminium block 300 and adjusting to calculate for decrement, one is collectively formed with silicone grease 200, heat dissipation aluminium block 300
Have the seal chamber not only protected chip die but also play excellent heat-conducting function, effectively play the exposed wafer of protection and good dissipates
Thermal effect.
Silicone grease 200 has lower thermal resistance and volatility, wide temperature using the heat-conducting silicone grease of 3.0 or more high thermal conductivity coefficient
Spend range and incombustibility.Seal chamber is collectively formed with hollow silica gel piece 100, and material itself does not contain silicone component, very
Good meets equipment of the complete machine with HDD (hard disk), and HDD is avoided to break down after a certain period of use time.
The aluminium block 300 that radiates is the smooth rectangular aluminium block of upper and lower surface.(bottom surface) is pressed on hollow silica gel piece 100 on one side,
The length and width dimensions of heat dissipation aluminium block 300 it is (big by one can be greater than chip size with the contact area of chip depending on the size of chip
Point).Another side (top surface) punching press is riveted on again on heat-dissipating aluminium plate 400, allows the two is approximate to consider to be integrally formed,
For same device, gap is avoided to influence heat-transfer effect.
Heat-dissipating aluminium plate 400 is connect by screw with pcb board 500 where chip.400 bottom surface of heat-dissipating aluminium plate is equipped with multiple spiral shells
Silk column 410.Screw column 410 is connected on heat-dissipating aluminium plate 400 by riveting method, forms one.410 height of screw column, which is greater than, to be dissipated
The height of hot aluminium block 300 is the placement reserved space of Wafer bumping, silicone grease 200 and hollow silica gel piece 100.Screw column 410 is right
Screw via hole where quasi core piece on pcb board 500, is fixed by screws on pcb board 500, firm to install radiator structure
On pcb board 500, all very convenient, the reduction impaired probability of chip is mounted and dismounted, and fall examination conducive to transport and vibration
It tests, preferably plays the role of protecting chip.The quantity of screw column 410 can be 3.
To avoid potential EMI problem, multiple grooves 420 are offered on heat-dissipating aluminium plate 400.Groove 420 is strip
Shape, and level is alternately distributed vertically, prevents monolith heat-dissipating aluminium plate 400 from causing EMI problem as antenna.
For the heat dissipation area for further increasing heat-dissipating aluminium plate 400,400 edge of heat-dissipating aluminium plate is bent to form bent sheet 430, increases
The heat dissipation area of big heat-dissipating aluminium plate 400.
In addition, the radiator structure can also include pcb board 500 preferably to radiate to chip, pcb board 500 is 2
The internal layer copper of ounce is thick.Using the pcb board 500 of 2 ounces of internal layer copper thickness, the heat transfer of each euthermic chip has greatly been spread.
It is influenced caused by other chip coolings around chip to reduce, 500 internal layer of pcb board paving copper between chip and ambient chip (the
The paving copper on two layers of stratum) it is formed with isolation, it is effectively isolated the conduction of ambient chip heat.
Hollow silica gel piece 100 is placed on chip by the chip cooling structure, and wafer is located in square opening 110, smears silicone grease
200, heat dissipation aluminium block 300 is pressed on hollow silica gel piece 100, heat-dissipating aluminium plate 400 is fixed on pcb board 500 by screw,
Complete assembling.Using the hollow silica gel piece 100 for having certain thickness and compression ratio, protection support can be not only carried out, but also
A seal chamber is cooperatively formed with the silicone grease 200 with high thermal conductivity, effectively plays and protects exposed wafer and good heat transfer
Effect.Back-shaped silica gel piece 100 is pressed using heat dissipation aluminium block 300 on one side, another side stamping riveting avoids stitching on heat-dissipating aluminium plate 400
Gap can effectively conduct heat, improve heat dissipation effect, to effectively be radiated and be carried out to wafer effective to chip
Protection is installed simple and convenient.
Simultaneously the present invention also provides a kind of set-top box, set-top box includes chip cooling structure, and chip cooling structure is upper
The chip cooling structure stated.
Chip cooling structure and set-top box of the present invention both may be used using the hollow silica gel piece for having certain thickness and compression ratio
To carry out protection support, while a seal chamber is cooperatively formed with the silicone grease with high thermal conductivity again, it is exposed effectively to play protection
Wafer and good heat-transfer effect.Back-shaped silica gel piece is pressed using heat dissipation aluminium block on one side, another side stamping riveting is in radiation aluminium
Gap is avoided on plate, effectively heat can be conducted, and heat dissipation effect is improved, to effectively be radiated to chip and to crystalline substance
Circle carries out effective protection, installs simple and convenient.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all in spirit of the invention and
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within principle.
Claims (9)
1. a kind of chip cooling structure, which is characterized in that including hollow silica gel piece, silicone grease, heat dissipation aluminium block and heat-dissipating aluminium plate；Institute
It states hollow silica gel piece to be bonded on chip, thickness is greater than Wafer bumping height and centre is provided with the side that can accommodate chip die
Mouthful, the silicone grease is applied in the square opening of the hollow silica gel piece, is formed seal chamber and is sealed protection, the heat dissipation to wafer
Aluminium block is used to press on one side the hollow silica gel piece, another side stamping riveting to the heat-dissipating aluminium plate bottom surface, the heat-dissipating aluminium plate
It is connect, chip cooling structure is fixedly mounted on pcb board, and make the heat dissipation aluminium block with pcb board where chip by screw
The hollow silica gel piece is compressed on one side；
Hollow silica gel sheet material has high-insulativity and high-breakdown-voltage.
2. chip cooling structure according to claim 1, which is characterized in that the silicone grease using high thermal conductivity coefficient 3.0 and
Above heat-conducting silicone grease.
3. chip cooling structure according to claim 2, which is characterized in that the heat dissipation aluminium block is that upper and lower surface is smooth
Rectangular aluminium block.
4. chip cooling structure according to claim 3, which is characterized in that the heat-dissipating aluminium plate bottom surface is equipped with multiple spiral shells
Silk column；The screw column is connected on the heat-dissipating aluminium plate by riveting method, and height is greater than the height of the heat dissipation aluminium block.
5. chip cooling structure according to claim 4, which is characterized in that offer multiple ditches on the heat-dissipating aluminium plate
Slot；The groove is strip, and level is alternately distributed vertically.
6. chip cooling structure according to claim 5, which is characterized in that the heat-dissipating aluminium plate edge is bent to form bending
Piece.
7. chip cooling structure according to claim 1, which is characterized in that the internal layer copper that pcb board where chip is 2 ounces
It is thick.
8. chip cooling structure according to claim 7, which is characterized in that in the pcb board between chip and ambient chip
Layer paving copper is formed with isolation.
9. a kind of set-top box includes chip cooling structure, which is characterized in that the chip cooling structure is the claims
1 to 8 any chip cooling structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610507030.0A CN105957847B (en) | 2016-06-29 | 2016-06-29 | A kind of chip cooling structure and set-top box |
| PCT/CN2017/080426 WO2018000906A1 (en) | 2016-06-29 | 2017-04-13 | Chip heat-dissipation structure and set-top box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610507030.0A CN105957847B (en) | 2016-06-29 | 2016-06-29 | A kind of chip cooling structure and set-top box |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105957847A CN105957847A (en) | 2016-09-21 |
| CN105957847B true CN105957847B (en) | 2019-02-15 |
Family
ID=56902848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610507030.0A Expired - Fee Related CN105957847B (en) | 2016-06-29 | 2016-06-29 | A kind of chip cooling structure and set-top box |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105957847B (en) |
| WO (1) | WO2018000906A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105957847B (en) * | 2016-06-29 | 2019-02-15 | 深圳市九洲电器有限公司 | A kind of chip cooling structure and set-top box |
| CN111948882A (en) * | 2020-07-22 | 2020-11-17 | 惠州市德赛西威智能交通技术研究院有限公司 | Camera heat radiation structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6259154B1 (en) * | 1998-04-21 | 2001-07-10 | Nec Corporation | Semiconductor device and method of manufacturing the same |
| US7459782B1 (en) * | 2005-10-05 | 2008-12-02 | Altera Corporation | Stiffener for flip chip BGA package |
| CN203840687U (en) * | 2014-03-26 | 2014-09-17 | 深圳市九洲电器有限公司 | Heat radiator, circuit board heat radiation structure, and electronic device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121757A1 (en) * | 2003-12-04 | 2005-06-09 | Gealer Charles A. | Integrated circuit package overlay |
| JP4411123B2 (en) * | 2004-03-31 | 2010-02-10 | 新光電気工業株式会社 | Manufacturing method of heat sink |
| CN201629316U (en) * | 2010-01-30 | 2010-11-10 | 江苏长电科技股份有限公司 | Packaging structure with printed circuit board, positively arranged chip, heat dissipating block with locking hole and heat dissipating plate with external boss |
| JP6476567B2 (en) * | 2013-03-29 | 2019-03-06 | 日亜化学工業株式会社 | Light emitting device |
| CN105957847B (en) * | 2016-06-29 | 2019-02-15 | 深圳市九洲电器有限公司 | A kind of chip cooling structure and set-top box |
-
2016
- 2016-06-29 CN CN201610507030.0A patent/CN105957847B/en not_active Expired - Fee Related
-
2017
- 2017-04-13 WO PCT/CN2017/080426 patent/WO2018000906A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6259154B1 (en) * | 1998-04-21 | 2001-07-10 | Nec Corporation | Semiconductor device and method of manufacturing the same |
| US7459782B1 (en) * | 2005-10-05 | 2008-12-02 | Altera Corporation | Stiffener for flip chip BGA package |
| CN203840687U (en) * | 2014-03-26 | 2014-09-17 | 深圳市九洲电器有限公司 | Heat radiator, circuit board heat radiation structure, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018000906A1 (en) | 2018-01-04 |
| CN105957847A (en) | 2016-09-21 |
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| C10 | Entry into substantive examination | ||
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190215 Termination date: 20200629 |