CN105950909B - A kind of metal alloy Heat Conduction Material and preparation method thereof - Google Patents
A kind of metal alloy Heat Conduction Material and preparation method thereof Download PDFInfo
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- CN105950909B CN105950909B CN201610298410.8A CN201610298410A CN105950909B CN 105950909 B CN105950909 B CN 105950909B CN 201610298410 A CN201610298410 A CN 201610298410A CN 105950909 B CN105950909 B CN 105950909B
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/06—Alloys containing less than 50% by weight of each constituent containing zinc
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Abstract
The invention discloses a kind of metal alloy Heat Conduction Materials and preparation method thereof, are prepared Pb:19-37 parts by following components according to the mass fraction；In15-42 parts；Sn15-28 parts；Bi38-54 parts；Zn0.6-1.2 parts；Al0.2-0.8 parts；Ga0.01-0.6 parts.The preparation method successively comprises the following steps that: 1) mixing: choosing the powder of Pb, In, Sn, Bi, Zn, Al and Ga, ratio is uniformly mixed according to a formula；2) powder is put into vacuum furnace, heating furnace is evacuated down to the air pressure of 0.5-1.5Torr；Then heating furnace is warming up to 650-700 degrees Celsius；650-700 degrees Celsius of 1 hour is kept later；3) cooling: finally to close heating power supply, it is made to naturally cool to room temperature to get metal alloy Heat Conduction Material.Heat Conduction Material of the invention has the characteristics that fusing point is low, heat transfer efficiency is good and at low cost.
Description
Technical field
The present invention relates to a kind of alloy materials and preparation method thereof, and in particular to a kind of metal alloy Heat Conduction Material and its system
Preparation Method.
Background technique
Currently, microelectric technique rapidly develops so that electronic chip overall power density substantially increases, heat flow density is also therewith
Increase.Heat dissipation quality can seriously affect system stability and hardware longevity.Based on air-cooled, the traditional heat-dissipating of water cooling and heat pipe
Technology can no longer meet the booming needs of high performance chips.More novel heat dissipation technology, such as microchannel, thermoelectricity system
Cold and phase transformation etc., improves radiating efficiency to a certain extent.But with high power density device large-scale application, these are dissipated
Thermal technology also increasingly approaches the limit.Chip technology proposes unprecedented urgent need to high-performance heat dissipating method, so that super
High heat flux density chip cooling is always the research field of Showed Very Brisk in the world.Chip is all by thermally conductive in many cases
Silica gel connection chip surface and radiator mould group carry out heat and distribute.The contact of the heaters such as superior radiator and chip is difficult again for production
Exempt from have gap, and the air between gap is the non-conductor of heat.The effect of heat conductive silica gel is to fill out using its mobility
Gap between heat source and spreader surface is filled, enables them to more come into full contact with to achieve the purpose that accelerate heat transfer.But due to silicon
Glue is placed for a long time be easy aging in air, and its extremely low thermal conductivity is the heat dissipation bottleneck of whole system.
CN 103509987A discloses a kind of low-melting point metal alloy Heat Conduction Material and preparation method thereof, by pressing quality
The following components of number meter is prepared；In50-56.5% parts；Sn11.0-16.5% parts；Bi31-37% parts；Zn0-0.5%
Part.The fusing point of the low-melting point metal alloy Heat Conduction Material is 57-63 degrees Celsius.But the heating conduction of the Heat Conduction Material is also
Need to be further increased.
Summary of the invention
In view of the deficiencies of the prior art, the first purpose of this invention is to be to provide a kind of metal alloy Heat Conduction Material,
The Heat Conduction Material has the characteristics that fusing point is low, heat transfer efficiency is good and at low cost.
Second object of the present invention is to provide for a kind of preparation method of metal alloy Heat Conduction Material.
Realize that the first purpose of this invention can reach by adopting the following technical scheme that:
A kind of metal alloy Heat Conduction Material, is prepared by following components according to the mass fraction:
Preferably, the fusing point of the metal alloy Heat Conduction Material be 54-62 degrees Celsius, such as 56 degrees Celsius, 57 degrees Celsius,
58 degrees Celsius, 59 degrees Celsius, 60 degrees Celsius or 61 degrees Celsius.
Preferably, the metal alloy Heat Conduction Material is prepared by following components according to the mass fraction:
Preferably, the metal alloy Heat Conduction Material is prepared by following components according to the mass fraction:
Preferably, the metal alloy Heat Conduction Material is prepared by following components according to the mass fraction:
Preferably, the metal alloy Heat Conduction Material is prepared by following components according to the mass fraction:
Preferably, the metal alloy Heat Conduction Material is prepared by following components according to the mass fraction:
Realize that second object of the present invention can reach by adopting the following technical scheme that:
A kind of preparation method of metal alloy Heat Conduction Material, successively comprises the following steps that:
1) it mixes: choosing the powder of Pb, In, Sn, Bi, Zn, Al and Ga of formula ratio, be uniformly mixed；
2) heating in vacuum stove heating: powder after mixing being contained in crucible, is placed into vacuum furnace, will be added
Hot stove is evacuated down to the air pressure of 0.5-1.5Torr；Then heating furnace is warming up to 650-700 degrees Celsius；650-700 is kept later
Degree Celsius 1 hour；
3) cooling: finally to close heating power supply, it is made to naturally cool to room temperature to get metal alloy Heat Conduction Material.
Air pressure in step 2) can for 0.5Torr, 0.6Torr, 0.8Torr, 1.0Torr, 1.2Torr, 1.4Torr or
1.5Torr etc., the temperature of heating furnace heating can for 650 degrees Celsius, 660 degrees Celsius, 670 degrees Celsius, 690 degrees Celsius or
700 degrees Celsius etc..
Preferably, in step 2), heating furnace is warming up to 650-700 degrees Celsius of time-consuming 0.5-1 hour, as 0.5 hour,
0.6 hour, 0.8 hour, 0.9 hour or 1.0 hours etc..
The beneficial effects of the present invention are:
1, the fusing point of alloy of the present invention is 54-62 degrees Celsius.Therefore, this alloy is solid-state at normal temperature.For side
Just it uses, slabbing can be rolled.Such as by between this alloys adhesion and computer processor and radiator fan, in usual work temperature
Alloy will melt as liquid under degree (> 70 degrees Celsius), therefore we are called liquid alloy.
2, alloy of the present invention thermal conductivity with higher in liquid.By measurement, taken the photograph in temperature for 80
When family name spends, thermal conductivity 100-125W/mK.Compared with the thermal conductivity 1-5W/mK of common heat conductive silica gel, performance has tens of
Raising again.
3, formula of the invention is that applicant gropes just to finally obtain by what is for a long time analyzed Phase Diagram of Materials and prepare, is adopted
It is thermally conductive very excellent with thermal stability with the correlation of the alloy material of the formula, liquid can be prepared by controlling cooling temperature
State, paste and sheet, operating temperature can be reduced to 55 DEG C or so.This product can be not only used for high-performance server, desk-top
The chip heat pipe of machine, notebook, industrial personal computer and communication base station is managed, and (industrial exhaust heat utilizes, solar energy in advanced energy field
Power generation focuses photocell cooling, fuel cell etc.), aviation thermal control field, battery is cooling, field of photoelectric devices (such as projector,
Power electronics devices etc.), field of LED illumination, micro-nano electronic mechanical system, many crucial necks such as biochip and electric car
Domain plays indispensable role.Demand in view of cloud computing technology in the ascendant to high-end heat dissipation, this product may be used also
To expand out more wide application fields.
Specific embodiment
In the following, being described further in conjunction with specific embodiment to the present invention:
Following components are according to the mass fraction.
Embodiment 1:
A kind of metal alloy Heat Conduction Material, it is characterised in that it is prepared by following components according to the mass fraction: Pb
19 parts of (lead)；42 parts of In (indium)；15 parts of Sn (tin)；54 parts of Bi (bismuth)；0.6 part of Zn (zinc)；0.8 part of Al (aluminium)；Ga (gallium) 0.01
Part.The fusing point of the alloy material is 62 degrees Celsius.
By measurement, when temperature is 80 degrees Celsius, thermal conductivity 100W/mK.
A kind of preparation method of metal alloy Heat Conduction Material, successively comprises the following steps that:
1) it mixes: choosing the powder of Pb, In, Sn, Bi, Zn, Al and Ga of formula ratio, be uniformly mixed；
2) heating in vacuum stove heating: powder after mixing being contained in crucible, is placed into vacuum furnace, will be added
Hot stove is evacuated down to the air pressure of 0.5-1.5Torr；Then heating furnace is warming up to 650-700 degrees Celsius, it is time-consuming 0.5-1 small
When；650-700 degrees Celsius of 1 hour is kept later；
3) cooling: finally to close heating power supply, it is made to naturally cool to room temperature, cooling time is 2.5 hours to get metal
Alloy Heat Conduction Material.
Embodiment 2:
The characteristics of the present embodiment, is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared: 37 parts of Pb (lead)；15 parts of In (indium)；28 parts of Sn (tin)；38 parts of Bi (bismuth)；1.2 parts of Zn (zinc)；Al (aluminium)
0.2 part；0.6 part of Ga (gallium).The fusing point of the alloy material is 60 degrees Celsius.Other are identical as specific embodiment 1.
By measurement, when temperature is 80 degrees Celsius, thermal conductivity 102W/mK.
Embodiment 3:
The characteristics of the present embodiment, is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared: 35 parts of Pb (lead)；18 parts of In (indium)；27 parts of Sn (tin)；40 parts of Bi (bismuth)；1.1 parts of Zn (zinc)；Al (aluminium)
0.3 part；0.5 part of Ga (gallium).The fusing point of the alloy material is 61 degrees Celsius.Other are identical as specific embodiment 1.
By measurement, when temperature is 80 degrees Celsius, thermal conductivity 105W/mK.
Embodiment 4:
The characteristics of the present embodiment, is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared: 22 parts of Pb (lead)；40 parts of In (indium)；17 parts of Sn (tin)；52 parts of Bi (bismuth)；0.7 part of Zn (zinc)；Al (aluminium)
0.7 part；0.02 part of Ga (gallium).The fusing point of the alloy material is 58 degrees Celsius.Other are identical as specific embodiment 1.
By measurement, when temperature is 80 degrees Celsius, thermal conductivity 108W/mK.
Embodiment 5:
The characteristics of the present embodiment, is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared: 24 parts of Pb (lead)；35 parts of In (indium)；18 parts of Sn (tin)；48 parts of Bi (bismuth)；0.7 part of Zn (zinc)；Al (aluminium)
0.7 part；0.05 part of Ga (gallium).The fusing point of the alloy material is 56 degrees Celsius.Other are identical as specific embodiment 1.
By measurement, when temperature is 80 degrees Celsius, thermal conductivity 110W/mK.
Embodiment 6
The characteristics of the present embodiment, is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared: 33 parts of Pb (lead)；20 parts of In (indium)；24 parts of Sn (tin)；43 parts of Bi (bismuth)；1.0 parts of Zn (zinc)；Al (aluminium)
0.4 part；0.4 part of Ga (gallium).The fusing point of the alloy material is 59 degrees Celsius.Other are identical as specific embodiment 1.
By measurement, when temperature is 80 degrees Celsius, thermal conductivity 107W/mK.
Embodiment 7
The characteristics of the present embodiment, is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared: 27 parts of Pb (lead)；30 parts of In (indium)；20 parts of Sn (tin)；45 parts of Bi (bismuth)；0.8 part of Zn (zinc)；Al (aluminium)
0.5 part；0.1 part of Ga (gallium).The fusing point of the alloy material is 54 degrees Celsius.Other are identical as specific embodiment 1.
By measurement, when temperature is 80 degrees Celsius, thermal conductivity 125W/mK.
Embodiment 8
The characteristics of the present embodiment, is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared: 29 parts of Pb (lead)；28 parts of In (indium)；21 parts of Sn (tin)；46 parts of Bi (bismuth)；0.9 part of Zn (zinc)；Al (aluminium)
0.6 part；0.15 part of Ga (gallium).The fusing point of the alloy material is 55 degrees Celsius.Other are identical as specific embodiment 1.
By measurement, when temperature is 80 degrees Celsius, thermal conductivity 120W/mK.
Embodiment 9
The characteristics of the present embodiment, is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared: 26 parts of Pb (lead)；32 parts of In (indium)；19 parts of Sn (tin)；47 parts of Bi (bismuth)；0.8 part of Zn (zinc)；Al (aluminium)
0.6 part；0.1 part of Ga (gallium).The fusing point of the alloy material is 60 degrees Celsius.Other are identical as specific embodiment 1.
By measurement, when temperature is 80 degrees Celsius, thermal conductivity 112W/mK.
Embodiment 10
The characteristics of the present embodiment, is: a kind of metal alloy Heat Conduction Material, it is characterised in that its by according to the mass fraction with
Lower component is prepared: 30 parts of Pb (lead)；25 parts of In (indium)；22 parts of Sn (tin)；47 parts of Bi (bismuth)；1.0 parts of Zn (zinc)；Al (aluminium)
0.4 part；0.2 part of Ga (gallium).The fusing point of the alloy material is 59 degrees Celsius.Other are identical as specific embodiment 1.
By measurement, when temperature is 80 degrees Celsius, thermal conductivity 117W/mK.
Temperature test: 1, temperature test is carried out using table 1 described in test macro.
1 test system configurations table of table
Silica gel in the prior art is coated on the surface of the CPU of desktop computer, carries out temperature test.In the CPU of desktop computer
The metal alloy Heat Conduction Material in embodiment 1-10 of the present invention is arranged in surface, carries out temperature test, and test result is shown in Table 2.
Table 2CPU test temperature contrast table
As it can be seen from table 1 using the alloy Heat Conduction Material of the embodiment of the present invention, CPU when running IntelBurn Test
Peak temperature reduce 17 DEG C or more.
3, silica gel in the prior art is coated on the surface of the video card of desktop computer, carries out temperature test.In the aobvious of desktop computer
The metal alloy Heat Conduction Material in embodiment of the present invention is arranged in the surface of card, carries out temperature test, and test result is shown in Table 3.
3 display card test temperature comparisons' table of table
From table 3 it can be seen that using the alloy Heat Conduction Material of the embodiment of the present invention, the temperature of video card when running FurMark
Reduce 16 DEG C or more.
For those skilled in the art, it can make other each according to the above description of the technical scheme and ideas
Kind is corresponding to be changed and deforms, and all these change and deform the protection model that all should belong to the claims in the present invention
Within enclosing.
The Applicant declares that the foregoing is merely a specific embodiment of the invention, but protection scope of the present invention not office
It is limited to this, it should be clear to those skilled in the art, any to belong to those skilled in the art and take off in the present invention
In the technical scope of dew, any changes or substitutions that can be easily thought of, and all of which fall within the scope of protection and disclosure of the present invention.
Claims (6)
- The metal alloy Heat Conduction Material that thermal conductivity is 100-125W/mK when 1. a kind of fusing point is 54-62 degrees Celsius, 80 degrees Celsius Preparation method, which is characterized in that successively comprise the following steps that:1) it mixes: choosing the powder of Pb, In, Sn, Bi, Zn, Al and Ga of formula ratio, be uniformly mixed；2) heating in vacuum stove heating: powder after mixing being contained in crucible, is placed into vacuum furnace, by heating furnace It is evacuated down to the air pressure of 0.5-1.5Torr；Then heating furnace is warming up to 650-700 degrees Celsius；Keep 650-700 Celsius later Spend 1 hour；3) cooling: finally to close heating power supply, it is made to naturally cool to room temperature to get metal alloy Heat Conduction Material；The material is prepared from the following components by mass fraction:
- 2. the preparation method of metal alloy Heat Conduction Material according to claim 1, it is characterised in that: by according to the mass fraction Following components be prepared:
- 3. the preparation method of metal alloy Heat Conduction Material according to claim 2, it is characterised in that: by according to the mass fraction Following components be prepared:
- 4. the preparation method of metal alloy Heat Conduction Material according to claim 3, it is characterised in that: by according to the mass fraction Following components be prepared:
- 5. the preparation method of metal alloy Heat Conduction Material according to claim 3, it is characterised in that: by according to the mass fraction Following components be prepared:
- 6. the preparation method of metal alloy Heat Conduction Material according to claim 1, it is characterised in that: in step 2), add Hot stove is warming up to 650-700 degrees Celsius of time-consuming 0.5-1 hour.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5346418A (en) * | 1976-10-08 | 1978-04-26 | Seiko Epson Corp | Low melting point alloy |
| US6367683B1 (en) * | 1997-07-10 | 2002-04-09 | Materials Resources International | Solder braze alloy |
| CN104032199A (en) * | 2014-06-17 | 2014-09-10 | 北京依米康科技发展有限公司 | Low-melting-point liquid metal and preparation method and application thereof |
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN105349866A (en) * | 2015-11-26 | 2016-02-24 | 苏州天脉导热科技有限公司 | Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy |
-
2016
- 2016-05-04 CN CN201610298410.8A patent/CN105950909B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5346418A (en) * | 1976-10-08 | 1978-04-26 | Seiko Epson Corp | Low melting point alloy |
| US6367683B1 (en) * | 1997-07-10 | 2002-04-09 | Materials Resources International | Solder braze alloy |
| CN104032199A (en) * | 2014-06-17 | 2014-09-10 | 北京依米康科技发展有限公司 | Low-melting-point liquid metal and preparation method and application thereof |
| CN104148822A (en) * | 2014-07-28 | 2014-11-19 | 北京卫星制造厂 | Low-temperature brazing material |
| CN105349866A (en) * | 2015-11-26 | 2016-02-24 | 苏州天脉导热科技有限公司 | Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy |
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