CN103509987B - A kind of low-melting point metal alloy Heat Conduction Material and preparation method thereof - Google Patents
A kind of low-melting point metal alloy Heat Conduction Material and preparation method thereof Download PDFInfo
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- CN103509987B CN103509987B CN201310323754.6A CN201310323754A CN103509987B CN 103509987 B CN103509987 B CN 103509987B CN 201310323754 A CN201310323754 A CN 201310323754A CN 103509987 B CN103509987 B CN 103509987B
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Abstract
<b>the invention discloses a kind of low-melting point metal alloy Heat Conduction Material and preparation method thereof, it is prepared from by following components by mass percentage: In50-56.5%; Sn11.0-16.5%; Bi31-37%; Zn0-0.5%. This preparation method comprises the following steps that successively: 1) mixing: choose the powder of In, Sn, Bi, Zn, according to a formula ratio mix homogeneously; 2) powder is put in vacuum furnace, heating furnace is evacuated down to the air pressure of 0.1-1Torr; Then heating furnace is warmed up to 600 degrees Celsius; Keep 600 degrees Celsius afterwards 1 hour; 3) cooling: finally close heating power supply so that it is naturally cool to room temperature, obtain low-melting point metal alloy Heat Conduction Material. The Heat Conduction Material of the present invention has the advantages that fusing point is low, heat transfer efficiency good and cost is low.</b>
Description
Technical field
The present invention relates to a kind of alloy material and preparation method thereof, be specifically related to a kind of low-melting point metal alloy Heat Conduction Material and preparation method thereof.
Background technology
At present, microelectric technique develops rapidly so that electronic chip overall power density significantly increases, and heat flow density is consequently increased. Heat radiation quality can badly influence system stability and hardware longevity. Based on air-cooled, the traditional heat-dissipating technology of water-cooled and heat pipe cannot meet the booming needs of high performance chips. Comparatively novel heat dissipation technology, such as microchannel, thermoelectric cooling and phase transformation etc., improve radiating efficiency to a certain extent. But it is as high power density device large-scale application, these heat dissipation technologys also day by day convergence limit. High-performance heat dissipating method is proposed unprecedented urgent needs by chip technology so that excessive heat current density chip cooling is always up the research field of Showed Very Brisk in the world. Chip is all carried out heat distributed by heat conductive silica gel connection chip surface and radiator module under many circumstances. Make again the heaters such as superior radiator and chip contact and have space unavoidably, and the air between gap is hot non-conductor. The effect of heat conductive silica gel is in that to utilize its mobility to fill gap between thermal source and spreader surface, enables them to more be fully contacted the purpose reaching to accelerate heat transfer. But, place due to silica gel easily aging in atmosphere for a long time, and its extremely low thermal conductivity be the heat radiation bottleneck of whole system.
Summary of the invention
For the deficiencies in the prior art, first purpose of the present invention is to be in that to provide a kind of low-melting point metal alloy Heat Conduction Material, and this Heat Conduction Material has the advantages that fusing point is low, heat transfer efficiency good and cost is low.
Second of the present invention in order that the preparation method that provides a kind of low-melting point metal alloy Heat Conduction Material.
First purpose realizing the present invention can be passed through to adopt the following technical scheme that and reach:
A kind of low-melting point metal alloy Heat Conduction Material, it is characterised in that it is prepared from by following components by mass percentage:
Preferably, the fusing point of described low-melting point metal alloy Heat Conduction Material is 57-63 degree Celsius.
Preferably, described low-melting point metal alloy Heat Conduction Material is prepared from by following components by mass percentage:
Preferably, described low-melting point metal alloy Heat Conduction Material is prepared from by following components by mass percentage:
Preferably, described low-melting point metal alloy Heat Conduction Material is prepared from by following components by mass percentage:
Preferably, described low-melting point metal alloy Heat Conduction Material is prepared from by following components by mass percentage:
Preferably, described low-melting point metal alloy Heat Conduction Material is prepared from by following components by mass percentage:
Second purpose realizing the present invention can be passed through to adopt the following technical scheme that and reach:
A kind of preparation method of low-melting point metal alloy Heat Conduction Material, it comprises the following steps that successively:
1) mixing: choose the powder of In, Sn, Bi, Zn, by the formula proportion mix homogeneously of an object of the present disclosure;
2) vacuum furnace heating: the powder after mix homogeneously is contained in crucible, places in vacuum furnace, heating furnace is evacuated down to the air pressure of 0.1-1Torr; Then heating furnace is warmed up to 600 degrees Celsius; Keep 600 degrees Celsius afterwards 1 hour;
3) cooling: finally close heating power supply so that it is naturally cool to room temperature, obtain low-melting point metal alloy Heat Conduction Material.
Preferably, in step 2) in, from room temperature to the temperature-rise period of 600 degrees Celsius for being slowly heated process, 1 hour consuming time.
The beneficial effects of the present invention is:
1, the fusing point of alloy of the present invention is 57-63 degree Celsius. Therefore, this alloy is solid-state at normal temperatures. For convenience of using, it is possible to be rolled into lamellar. As by between this alloys adhesion and computer processor and radiator fan, usual operating temperature (> 70 degrees Celsius) under alloy be liquid by thawing, therefore we are called liquid alloy.
2, alloy of the present invention has higher thermal conductivity in liquid situation. Measured, when temperature is 80 degrees Celsius, its thermal conductivity is 60-85W/mK. Compared with the thermal conductivity 1-5W/mK of common heat conductive silica gel, performance has had the raising of decades of times.
3, the formula of the present invention be applicant pass through long-term to Phase Diagram of Materials analysis and preparation grope just finally give, the relevant heat conduction and the thermal stability that adopt the alloy material of this formula are very excellent, liquid is can be prepared as by controlling chilling temperature, paste and lamellar, operating temperature can be reduced to about 60 DEG C. This product can be not only used for high-performance server, desktop computer, notebook, the chip heat pipe reason of industrial computer and communication base station, and at advanced energy field, (industrial exhaust heat utilizes, solar electrical energy generation, focusing light cell cools down, fuel cell etc.), aviation thermal control field, battery cools down, field of photoelectric devices (such as projector, power electronics devices etc.), field of LED illumination, micro-nano electronic mechanical system, many key areas such as biochip and electric automobile play indispensable role. Considering the cloud computing technology in the ascendant demand to high-end heat radiation, this product can also expand out more wide application. )
Detailed description of the invention
Below, in conjunction with detailed description of the invention, the present invention is described further:
Percentage rate % in following component is weight accounting rate.
Embodiment 1:
A kind of low-melting point metal alloy Heat Conduction Material, it is characterised in that it is prepared from by following components by mass percentage: In (indium) 50%; Sn (stannum) 16.0%; Bi (bismuth) 34%; Zn (zinc) 0%.The fusing point of this alloy material is 57 degrees Celsius.
A kind of preparation method of low-melting point metal alloy Heat Conduction Material, it comprises the following steps that successively:
1) mixing: choose the powder of In, Sn, Bi, Zn, by above-mentioned formula proportion mix homogeneously;
2) vacuum furnace heating: the powder after mix homogeneously is contained in crucible, places in vacuum furnace, heating furnace is evacuated down to the air pressure of 0.1-1Torr; Then heating furnace is warmed up to 600 degrees Celsius, from room temperature to the temperature-rise period of 600 degrees Celsius for being slowly heated process, 1 hour consuming time; Keep 600 degrees Celsius afterwards 1 hour;
3) cooling: finally closing heating power supply so that it is naturally cool to room temperature, cool time is 2 hours, obtains low-melting point metal alloy Heat Conduction Material.
Embodiment 2:
The feature of the present embodiment is: a kind of low-melting point metal alloy Heat Conduction Material, it is characterised in that it is prepared from by following components by mass percentage: In (indium) 553%; Sn (stannum) 13.5%; Bi (bismuth) 33.3%; Zn (zinc) 0.2%. The fusing point of this alloy material is 60.5 degrees Celsius. Other are identical with specific embodiment 1.
Embodiment 3:
The feature of the present embodiment is: a kind of low-melting point metal alloy Heat Conduction Material, it is characterised in that it is prepared from by following components by mass percentage: In (indium) 56.5%; Sn (stannum) 12%; Bi (bismuth) 31%; Zn (zinc) 0.5%. The fusing point of this alloy material is 63 degrees Celsius. Other are identical with specific embodiment 1.
Temperature test: 1, the test system described in employing table 1 carries out temperature test.
Table 1 test system configurations table
2, at the surface-coated of the CPU of desktop computer silica gel of the prior art, temperature test is carried out. Low-melting point metal alloy Heat Conduction Material in the surface configuration embodiment 1-3 of the present invention of the CPU of desktop computer, carries out temperature test, and test result is in Table 2.
Table 2CPU tests temperature comparisons's table
From table 2 it can be seen that adopt the alloy Heat Conduction Material of the embodiment of the present invention, run the peak temperature of CPU during IntelBurnTest and reduce more than 15 DEG C.
3, at the surface-coated of the video card of desktop computer silica gel of the prior art, temperature test is carried out. Low-melting point metal alloy Heat Conduction Material in the surface configuration embodiment of the present invention of the video card of desktop computer, carries out temperature test, and test result is in Table 3.
Table 3 display card test temperature comparisons's table
From table 3 it can be seen that adopt the alloy Heat Conduction Material of the embodiment of the present invention, run the temperature reduction of video card more than 7 DEG C during FurMark.
For a person skilled in the art, can technical scheme as described above and design, make other various corresponding changes and deformation, and all these change and deformation all should belong within the protection domain of the claims in the present invention.
Claims (7)
1. a low-melting point metal alloy Heat Conduction Material, it is characterised in that be prepared from by following components by mass percentage:
The fusing point of described low-melting point metal alloy Heat Conduction Material is 57-63 degree Celsius;
The preparation method of described low-melting point metal alloy Heat Conduction Material, comprises the following steps that successively:
1) mixing: choose the powder of In, Sn, Bi, Zn, according to a formula ratio mix homogeneously;
2) vacuum furnace heating: the powder after mix homogeneously is contained in crucible, places in vacuum furnace, heating furnace is evacuated down to the air pressure of 0.1-1Torr; Then heating furnace is warmed up to 600 degrees Celsius; Keep 600 degrees Celsius afterwards 1 hour;
3) cooling: finally close heating power supply so that it is naturally cool to room temperature, obtain low-melting point metal alloy Heat Conduction Material.
2. low-melting point metal alloy Heat Conduction Material according to claim 1, it is characterised in that: it is prepared from by following components by mass percentage:
3. low-melting point metal alloy Heat Conduction Material according to claim 2, it is characterised in that: it is prepared from by following components by mass percentage:
4. low-melting point metal alloy Heat Conduction Material according to claim 2, it is characterised in that: it is prepared from by following components by mass percentage:
5. low-melting point metal alloy Heat Conduction Material according to claim 2, it is characterised in that: it is prepared from by following components by mass percentage:
6. the preparation method of a low-melting point metal alloy Heat Conduction Material, it is characterised in that comprise the following steps that successively:
1) mixing: choose the powder of In, Sn, Bi, Zn, by the formula proportion mix homogeneously described in any one in claim 1-5;
2) vacuum furnace heating: the powder after mix homogeneously is contained in crucible, places in vacuum furnace, heating furnace is evacuated down to the air pressure of 0.1-1Torr; Then heating furnace is warmed up to 600 degrees Celsius; Keep 600 degrees Celsius afterwards 1 hour;
3) cooling: finally close heating power supply so that it is naturally cool to room temperature, obtain low-melting point metal alloy Heat Conduction Material.
7. the preparation method of low-melting point metal alloy Heat Conduction Material according to claim 6, it is characterised in that: in step 2) in, from room temperature to the temperature-rise period of 600 degrees Celsius for being slowly heated process, 1 hour consuming time.
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| CN104213011A (en) * | 2014-09-04 | 2014-12-17 | 楚盛 | Long-service life and low-melting point metal alloy heat conducting material and preparation method thereof |
| CN104263994A (en) * | 2014-10-20 | 2015-01-07 | 湘潭大学 | Graphene alloy composite thermal conductive material and preparation method thereof |
| CN105925870A (en) * | 2016-05-04 | 2016-09-07 | 无锡市嘉邦电力管道厂 | Metal alloy heat conduction material and preparation method thereof |
| CN109055844A (en) * | 2018-08-20 | 2018-12-21 | 黄河科技学院 | A kind of long-life low-melting point metal alloy Heat Conduction Material and preparation method thereof |
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| CN1861824A (en) * | 2006-06-14 | 2006-11-15 | 四川省有色冶金研究院 | Non-pollution lower melting point alloy |
| CN101348875A (en) * | 2008-06-04 | 2009-01-21 | 厦门市及时雨焊料有限公司 | Tin, bismuth and copper type low temperature lead-free solder alloy |
| CN101420835A (en) * | 2007-10-26 | 2009-04-29 | 财团法人工业技术研究院 | Low melting point alloy thermal interface material |
| CN102620534A (en) * | 2012-04-16 | 2012-08-01 | 武汉理工大学 | Low melting point alloy phase change heat storage device applied to solar dryer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1861824A (en) * | 2006-06-14 | 2006-11-15 | 四川省有色冶金研究院 | Non-pollution lower melting point alloy |
| CN101420835A (en) * | 2007-10-26 | 2009-04-29 | 财团法人工业技术研究院 | Low melting point alloy thermal interface material |
| CN101348875A (en) * | 2008-06-04 | 2009-01-21 | 厦门市及时雨焊料有限公司 | Tin, bismuth and copper type low temperature lead-free solder alloy |
| CN102620534A (en) * | 2012-04-16 | 2012-08-01 | 武汉理工大学 | Low melting point alloy phase change heat storage device applied to solar dryer |
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