CN105945435A - Laser machining device of annular micropore and laser machining method of annular micropore - Google Patents
Laser machining device of annular micropore and laser machining method of annular micropore Download PDFInfo
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- CN105945435A CN105945435A CN201610409601.7A CN201610409601A CN105945435A CN 105945435 A CN105945435 A CN 105945435A CN 201610409601 A CN201610409601 A CN 201610409601A CN 105945435 A CN105945435 A CN 105945435A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention provides a laser machining device of an annular micropore. The laser machining device of the annular micropore comprises a pulse laser, a polarization control system, a scanning mirror, an aperture, a focusing lens, a confinement layer, single-layer nano-particles, a three-dimensional moving platform and a computer control system. The pulse laser, the polarization control system and the scanning mirror are distributed along the same optical axis center in order. The aperture and the focusing lens are arranged right below the scanning mirror and the three-dimensional moving platform is arranged right below the focusing lens. The pulse laser, the focusing lens and the three-dimensional moving platform are connected with the computer control system. The creating of the annular micropore is realized in the way of depositing the single-layer nano-particles on the surface of a workpiece by the pretreatment of the surface of the workpiece, then determining the energy strengthening multiple, and machining the surface of the workpiece by the output energy of the pulse laser. According to the device, the laser machining of the annular micropore can be realized. The device has the characteristics of being high in accuracy, controllable in size, high in machining efficiency, simple in equipment and like.
Description
Technical field
The invention belongs to field of laser processing, the laser processing device of a kind of annular micropore and method.
Background technology
The progress of industrial technology so that laser processing technology is developed rapidly, wherein laser boring is to reach practical the earliest
Laser processing technology.Owing to laser boring has speed soon, the advantages such as efficiency is high, good in economic efficiency, have become as laser and add
One of main application fields of work.
Laser drilling is the laser beam irradiation target utilizing high power density, makes the temperature of target material surface be quickly ramped up to vaporization temperature
Degree, evaporation forms hole, and beam of laser single effect can be only formed a hole.And when laser drilling is applied at micro-nano
Time in manufacture field, just face a lot of problem.Mainly have: 1. can not large-area manufacturing micropore, carry out micro-at micro-nano technology yardstick
When hole makes, efficiency is substantially reduced；2. laser micropore size is limited by laser beam spot diameter, and swashs by adjusting processing
The spot diameter of light is processed the mode in various micro/nano-scale aperture and is realized difficulty very greatly, pore size the most controlled requirement；
3. micro-pore shape is single, is circle, it is impossible to process unusual hole, such as annular micropore.
For in overcoming laser micropore to make can not the technological deficiency of large-area manufacturing micropore, the patent No.: CN201310007951 is open
A kind of device that by optics, laser beam is split shaping, it is achieved that the technique effect that beam of laser is porous, shaped,
The microwell array of multiple combination can be processed.But this device has multiple optical system to constitute, building cost high, operation easier is big.
And pore size is uncontrollable and shape is single etc., and problem is the most effectively solved.When research sight is focused on micro-nano technology by people
During field, the requirement to laser boring technique is more and more higher, and especially at laser micro/nano manufacture field, urgent needs one swashs
Light cheesing techniques, it is possible to solve the problems referred to above.
Summary of the invention
There is the deficiencies such as working (machining) efficiency is low, pore size is uncontrollable, shape is single for laser micropore technology in prior art, this
Invention provides a kind of laser processing device and the method for annular micropore, utilizes noble metal nano particles to make laser energy processed
Surface of the work forms circular power and strengthens region, it is achieved that the Laser Processing of annular micropore, has high accuracy, size is controlled, add
The features such as work efficiency rate is high, equipment is simple.
The present invention realizes above-mentioned technical purpose by techniques below means.
The laser processing device of a kind of annular micropore, including pulse laser, polarization control system, scanning galvanometer, aperture, gathers
Focus lens, restraint layer, monolayer nano-particle, three-dimensional mobile platform and computerized control system；Described pulse laser, polarization control
System processed and scanning galvanometer are arranged successively along same optical axis center；Described scanning galvanometer is arranged right below aperture；Described aperture just under
Side is provided with condenser lens；Described condenser lens is arranged right below three-dimensional mobile platform；Described three-dimensional mobile platform upper surface places work
Part；Described workpiece surface covers monolayer nano-particle；Described monolayer nano-particle upper surface covers restraint layer；Described pulse swashs
Light device, condenser lens and three-dimensional mobile platform all electrically connect with computerized control system.Preferably, described monolayer nano-particle is expensive
Metal nanoparticle.
Preferably, the one during described noble metal nano particles is gold nano grain or silver nano-grain.
Preferably, a diameter of a of described monolayer nano-particle, the wavelength of described pulse laser is λ, then it meets relational expression:
λ/10<a<λ。
Preferably, described restraint layer is transparent material；Described polarization control system is made up of linear polarizer and 1/4 slide；Described
Aperture is low pass circular hole wave filter.
The laser processing of a kind of annular micropore, comprises the steps:
S1: put up the laser processing device of annular micropore: adjust pulse laser, polarization control system and scanning galvanometer and be in
Same optical axis center；Adjust aperture, condenser lens, the focal point of three-dimensional mobile platform to scanning galvanometer；By pulse laser,
Condenser lens, three-dimensional mobile platform and computerized control system electrical connection；
S2: pre-treated workpiece surface: monolayer nano-particle is configured to nano granule suspension, and suspension is deposited on workpiece
Surface, obtains surface and has deposited the workpiece of monolayer nano-particle；
S3: determine energy intensification factor A: according to workpiece, pulse laser and the characteristic parameter of monolayer nano-particle, solve work
The normalization Laser beam energy distribution on part surface, draws out energy Enhanced feature curve；According to the annular processing internal diameter d of micropore or add
Work outer diameter D determines energy intensification factor A；
S4: determine laser export energy parameter: energy intensification factor A determined according to step S3, open computerized control system,
Output energy density J of pulse laser, J=J are set0/ A, wherein J0For workpiece damage energy density threshold；
S5: adjust light polarization and the location of workpiece: adjust polarization control system so that the laser beam of outgoing is circularly polarized light；
The workpiece that surface described in step S2 has deposited monolayer nano-particle is positioned in three-dimensional mobile platform；At monolayer nano-particle
Upper surface covers one layer of restraint layer；
S6: processing workpiece: computerized control system Output of laser, is processed surface of the work, it is achieved the making of annular micropore.
Preferably, pre-treated workpiece surface process described in step S2 is as follows: to surface of the work sanding and polishing, ultrasonic waves for cleaning,
And the solvent comprising hydrophilic group is smeared at surface of the work；The described surface that obtains has deposited the processing workpiece mistake of monolayer nano-particle
Journey is as follows: monolayer nano-particle is configured to the nano granule suspension of 5% solid content, nano granule suspension is placed in ultrasound wave
Ultrasonic 10-15min in cleaning machine；Use micropipettor, take out 500 μ L every time, carefully drop in the work having carried out pretreatment
Part surface；There is the titanium alloy of nanoparticles solution to be placed on inclination 9 ° standing 12h in the dustless kitchen of ventilation by dripping, steam completely to solvent
Send out, obtain surface and deposited the processing workpiece of monolayer nano-particle.
Preferably, determine described in step S3 that energy intensification factor A process is as follows: normalization incident pulse laser energy density
Being 1, set the contact point zero o as abscissa of nano-particle and processing surface of the work, transverse axis is the position of surface of the work
Point, vertical coordinate is energy intensification factor, and then builds coordinate system；The peak A of energy intensification factormaxCorresponding transverse axis location point
Being respectively+h and-h, coordinate corresponding in a coordinate system is (± h, Amax)；Peak is risen to by contact point o in energy intensification factor
Value AmaxSegment, if laser energy density is the location point at 1 is respectively+p and-p, coordinate corresponding in a coordinate system be (± p,
1)；In energy intensification factor A by peak AmaxDrop to 0 segment, be respectively if laser energy density is the location point at 1
+ q and-q, coordinate corresponding in a coordinate system is (± q, 1).Wherein the value of p, h, q meets: 0 < p < h < q；
When requiring that the internal diameter processing workpiece is d, it is desirable to op < d/2 < oh, determine that+d or-d location point is corresponding according to d size
Energy intensification factor Ad；When require process workpiece external diameter be D time, it is desirable to oh≤D/2 < oq, according to D size determine+D or
Energy intensification factor A that-D location point is correspondingD。
Preferably, the material of workpiece described in step S4 is metal material or semi-conducting material.
Preferably, any one during the material of described workpiece is steel, copper, titanium alloy, monocrystal silicon, polysilicon.
Beneficial effects of the present invention:
(1) a kind of annular laser processing device of micropore of the present invention and method, utilize and be coated in by noble metal nano particles
The surface of the work of pretreatment, forms monolayer nano-particle, to strengthen laser emission energy, and laser energy is constrained in nanometer
Bottom Li, form circular power on workpiece to be machined surface and strengthen region, by rationally selecting machined parameters, produce annular micro-
Hole array.
(2) precision is high.Annular capillary processing yardstick is micro-nano magnitude, uses noble metal nano particles near field optic field,
Form Localized field enhancement effect, it is possible to break through the diffraction limit of laser beam；Pore size is controlled.Owing to pore size depends on receiving
Choosing of rice grain and laser energy, strengthens curve according to energy and can predict the characteristic size of annular micropore, it is achieved controlled skill
Art effect.
(3) heat effect is low, and capacity usage ratio is high.Can greatly strengthen the energy of incident laser so that the course of processing can make
Obtain the micropore of micro/nano level with relatively low energy, there is the highest precision；Working (machining) efficiency is high.After surface of the work hydrophilic treated,
Nano-particle can be with extensive deposition at surface of the work, thus the method can the micropore of large-area manufacturing micro/nano level.
(4) device is simple, easily operates.The laser drilling device that the present invention proposes does not has the optical system device of complexity, processing
During there is no unnecessary regulation and control step, simple to operation.
Accompanying drawing explanation
Fig. 1 is the structural representation of the laser processing device of described annular micropore.
Fig. 2 is embodiment 1 laser energy cross-sectional distribution figure, and white dashed line part is the gold nano grain of diameter 200nm.
Fig. 3 is the energy profile that embodiment 1 processes surface of the work.
Fig. 4 is the energy enhancing curve that Fig. 3 processes surface of the work white dashed line part.
Fig. 5 is that the energy of embodiment 1 and 2 titanium alloy surface strengthens curve chart and the data point of correspondence.
Reference is as follows: 1-pulse laser, 2-polarization control system, 3-pulse laser, 4-scanning galvanometer, 5-aperture, 6-
Condenser lens, 7-restraint layer, 8-monolayer nano-particle, 9-workpiece, 10-three-dimensional mobile platform, 11-computerized control system.
Detailed description of the invention
Below in conjunction with the accompanying drawings and specific embodiment the present invention is further illustrated, but protection scope of the present invention is not limited to
This.
As it is shown in figure 1, the laser processing device of a kind of annular micropore, including pulse laser 1, polarization control system 2, scanning
Galvanometer 4, aperture 5, condenser lens 6, restraint layer 7, monolayer nano-particle 8, three-dimensional mobile platform 10 and computerized control system
11；Described pulse laser 1, polarization control system 2 and scanning galvanometer 4 are arranged successively along same optical axis center；Described polarization
Control system 2 is made up of linear polarizer and 1/4 slide, and adjustment pulse laser is circularly polarized light, acts on workpiece 9 surface；Institute
State scanning galvanometer 4 and be arranged right below aperture 5；Described aperture 5 is low pass circular hole wave filter, act as filtering restraint layer 7 and reflects
Light, prevent reflect photodoping processing laser in；Described aperture 5 is arranged right below condenser lens 6；Described condenser lens 6
Pulse laser is converged and vertical incidence is on workpiece 9 surface.The energy density that described pulse laser 1 is chosen in the course of processing
Should be less than the damage energy density threshold of workpiece 9.
Described condenser lens 6 is arranged right below three-dimensional mobile platform 10, and described three-dimensional mobile platform 10 upper surface places workpiece 9,
The focal position of laser beam it is positioned at for adjusting workpiece 9.Described workpiece 9 upper surface covers monolayer nano-particle 8, monolayer nanometer
Granule 8 is noble metal nano particles, such as the one in gold nano grain or silver nano-grain；Table on described monolayer nano-particle 8
Face covers restraint layer 7, and restraint layer 7 is transparent material, such as glass；A diameter of a of described monolayer nano-particle 8, described pulse
The wavelength of laser instrument 1 is λ, then it meets relational expression: λ/10 < a < λ.Described pulse laser 1, condenser lens 6 and three-dimensional shifting
Moving platform 10 all electrically connects with computerized control system 11.
The course of processing of whole device is as follows:
The pulse laser that described pulse laser 1 is launched, obtains circularly polarized light through described polarization control system 2, scanning shakes
Mirror 4 controls scanning pattern, is filled into veiling glare by aperture 5, is focused lens 6 and converges and be radiated workpiece 9 surface.Monolayer
Nano-particle 8 forms Localized field enhancement effect under laser emission effect on workpiece 9 surface, and then realizes the micro-of workpiece 9 surface
Hole machined.In the range of near field optic, laser can continue to propagate by cut-through thing in communication process, arrives workpiece 9 surface,
Multiple reflections bottom granule.Noble metal nano particles has abundant electron outside nucleus, is easily formed under the excitation of laser energy
Surface plasmons, and then form Localized field enhancement effect.In conjunction with Finite-Difference Time-Domain Method and Mie theory, can be in the hope of
Solve the laser energy field distribution on workpiece 9 surface, and then the energy obtaining workpiece 9 surface strengthens curve, it was predicted that the work after processing
Part surface annular cell morphology feature.
Embodiment 1
S1: put up the laser processing device of annular micropore: adjust pulse laser 1, polarization control system 2 and scanning galvanometer 4
It is in same optical axis center；Adjust aperture 5, condenser lens 6, the focal point of three-dimensional mobile platform 10 to scanning galvanometer 4；Will
Pulse laser 1, condenser lens 6, three-dimensional mobile platform 10 and computerized control system 11 electrically connect.Wherein, noble metal is selected
Nano-particle material is gold；The laser instrument used is IPG series of pulses optical fiber laser, centre wavelength 1064nm, repeats frequency
Rate 10KHz-100KHz is adjustable, spot diameter 50 μm, maximum impulse energy 1mJ；
S2: choose workpiece 9, material is titanium alloy, a size of 20mm*20mm*5mm, and its damage threshold is J0=30.5
mJ/cm2；Pre-treated workpiece 9 surface: roughness is followed successively by the sand paper of 120,600,1200,3000 mesh and enters titanium alloy surface
Row polishing, removes the obvious cut in surface；Polished titanium alloy is utilized dehydrated alcohol as solvent, at ultrasonic washing unit
Middle cleaning 5 minutes.Not there is due to titanium alloy surface hydrophilic, cleaning the dried use suds rich in hydrophilic group
Smear its surface so that it is there is hydrophilic；
Select the gold nano grain suspension of the diameter a=200nm of 5% solid content, meet λ/10 < a < λ, i.e. 106.4
nm<a<1064nm.Suspension is placed in ultrasonic 15min in ultrasonic washing unit so that nano-particle is fully dispersed to be opened；Use
Micropipettor, takes out 500 μ L every time, carefully drops in the titanium alloy surface having carried out hydrophilic treated so that nano-particle is molten
Liquid is fully dispersed to titanium alloy surface；The titanium alloy of nanoparticles solution is had to be placed on inclination 9 ° standing 12 in the dustless kitchen of ventilation by dripping
H, evaporates completely to solvent, obtains surface and has deposited the processing workpiece of monolayer nano-particle.Need the processing workpiece prepared to protect
Exist in culture dish, in order to avoid the contaminated surfaces such as dust foreign material.Fig. 2 is that the gold grain of single diameter a=200nm is at 1064nm ripple
Long pulsed laser energy distribution sectional view, the polarization state of laser beam is circular.Laser energy is constrained at the bottom of granule by nano-particle
Portion, forms Localized field enhancement effect.As shown in Figure 2, strengthen energy and concentrate on workpiece 9 surface and nano-particle contact area.
In order to more clearly observe the Energy distribution of processing surface of the work, Fig. 3 is the energy profile on workpiece 9 surface corresponding for Fig. 2.
The laser energy that nano-particle bottom formed can be clearly seen by Fig. 3 and strengthen region, the enhancing region, field that workpiece 9 surface is formed is
Annular.
S3: determine energy intensification factor A: according to workpiece 9, pulse laser 1 and the characteristic parameter of monolayer nano-particle 8,
Solve the normalization Laser beam energy distribution on workpiece 9 surface, draw out energy Enhanced feature curve；In processing according to annular micropore
Footpath d or processing outer diameter D determine energy intensification factor A；As shown in Figure 4, penetrate pulsed laser energy density when normalizing dissolves be
1, set the contact point zero o as abscissa of nano-particle and processing surface of the work, transverse axis is the location point of surface of the work,
Vertical coordinate is energy intensification factor A.According to Fig. 5, the peak A of energy intensification factormaxThe location point of=154.33 correspondences
Being respectively+h and-h, h=15nm herein, the coordinate in respective coordinates system is (± 15,154.33).Require that processing annular is micro-
Outer diameter D=the 100nm in hole, now q=50, meet oh≤D/2 < oq, according to energy Enhanced feature curve, corresponding in coordinate system
In coordinate be (50,9.01323), it is determined that go out energy intensification factor AD=9.01323.
S4: energy intensification factor A determined according to step S3, opens computerized control system 11, arranges the defeated of pulse laser
Go out energy density J, J=J0/ A, wherein J0Energy density threshold is damaged for workpiece 9；The spot diameter of known laser bundle is 50 μm,
Being calculated laser energy and be chosen as 0.015mJ, arranging repetition rate is 20KHz, and scanning speed is 10m/s.
S5: adjust polarization control system 2 so that the laser beam of outgoing is circularly polarized light；Surface described in step S2 is deposited
The processing workpiece of complete monolayer nano-particle is positioned in three-dimensional mobile platform 10；One layer is covered about at monolayer nano-particle 8 upper surface
Bundle layer 7；
S6: computerized control system 11 Output of laser, is processed processing surface of the work, it is achieved the making of annular micropore.
The annular micropore using scanning electron microscope to process this embodiment is observed, and the outer diameter D of the annular micropore that discovery is processed is equal
Value is 95.6nm, meets very well with processing request.
Embodiment 2
Require internal diameter d=20nm, the now p=10 of processing annular micropore, meet op < d/2 < oh.Such as Fig. 5, obtain according to solving
Energy Enhanced feature curve, determine energy intensification factor Ad=24.5.Open computerized control system, it is known that the hot spot of laser beam
A diameter of 50 μm, are calculated laser energy and are chosen as 0.019mJ, and arranging repetition rate is 50KHz, and scanning speed is 25
m/s.The step of other processing, parameter are identical with embodiment 1.
Use scanning electron microscope that the annular micropore of processing is observed, find that the internal diameter d average of the annular micropore processed is 18.78
Nm, meets very well with processing request.
Described embodiment be the present invention preferred embodiment, but the present invention is not limited to above-mentioned embodiment, without departing substantially from this
In the case of the flesh and blood of invention, any conspicuously improved, replacement or modification that those skilled in the art can make are equal
Belong to protection scope of the present invention.
Claims (10)
1. the laser processing device of an annular micropore, it is characterised in that include pulse laser (1), polarization control system (2),
Scanning galvanometer (4), aperture (5), condenser lens (6), restraint layer (7), monolayer nano-particle (8), three-dimensional mobile platform
And computerized control system (11) (10)；Described pulse laser (1), polarization control system (2) and scanning galvanometer (4) edge
Same optical axis center is arranged successively；Described scanning galvanometer (4) is arranged right below aperture (5)；Set immediately below described aperture (5)
There is condenser lens (6)；Described condenser lens (6) is arranged right below three-dimensional mobile platform (10)；Described three-dimensional mobile platform (10)
Upper surface places workpiece (9)；Described workpiece (9) upper surface covers monolayer nano-particle (8)；Described monolayer nano-particle (8)
Upper surface covers restraint layer (7)；Described pulse laser (1), condenser lens (6) and three-dimensional mobile platform (10) are equal and electric
Brain control system (11) electrically connects.
The laser processing device of a kind of annular micropore the most according to claim 1, it is characterised in that described monolayer nanometer
Grain (8) is noble metal nano particles.
The laser processing device of a kind of annular micropore the most according to claim 2, it is characterised in that described noble metal nano
Granule is the one in gold nano grain or silver nano-grain.
The laser processing device of a kind of annular micropore the most according to claim 1 and 2, it is characterised in that described monolayer is received
A diameter of a of rice grain (8), the wavelength of described pulse laser (1) is λ, then it meets relational expression: λ/10 < a < λ.
The laser processing device of a kind of annular micropore the most according to claim 1 and 2, it is characterised in that described restraint layer
(7) it is transparent material, such as glass；Described polarization control system (2) is made up of linear polarizer and 1/4 slide；Described aperture
(5) it is low pass circular hole wave filter.
6. the laser processing of an annular micropore, it is characterised in that comprise the steps:
S1: put up the laser processing device of annular micropore: adjust pulse laser (1), polarization control system (2) and scanning
Galvanometer (4) is in same optical axis center；Adjust the extremely scanning of aperture (5), condenser lens (6), three-dimensional mobile platform (10) to shake
The focal point of mirror (4)；By pulse laser (1), condenser lens (6), three-dimensional mobile platform (10) and computerized control system
(11) electrical connection；
S2: pre-treated workpiece (9) surface: monolayer nano-particle (8) is configured to nano granule suspension, and by suspension
It is deposited on workpiece (9) surface, obtains surface and deposited the workpiece of monolayer nano-particle；
S3: determine energy intensification factor A: according to workpiece (9), pulse laser (1) and the spy of monolayer nano-particle (8)
Levy parameter, solve the normalization Laser beam energy distribution on workpiece (9) surface, draw out energy Enhanced feature curve；Micro-according to annular
Processing internal diameter d or the processing outer diameter D in hole determine energy intensification factor A；
S4: determine laser export energy parameter: energy intensification factor A determined according to step S3, open computerized control system
(11), output energy density J of pulse laser, J=J are set0/ A, wherein J0Energy density threshold is damaged for workpiece (9)；
S5: adjust light polarization and the location of workpiece: adjust polarization control system (2) so that the laser beam of outgoing is circular polarization
Light；The workpiece that surface described in step S2 has deposited monolayer nano-particle is positioned in three-dimensional mobile platform (10)；At list
Layer nano-particle (8) upper surface covers one layer of restraint layer (7)；
S6: processing workpiece: computerized control system (11) Output of laser, is processed surface of the work, it is achieved annular micropore
Make.
The laser processing of a kind of annular micropore the most according to claim 6, it is characterised in that described in step S2
Pre-treated workpiece (9) surface process is as follows: to workpiece (9) surface sanding and polishing, ultrasonic waves for cleaning, and at workpiece (9) table
Topcoating smears the solvent comprising hydrophilic group；
Described obtain surface to have deposited the processing workpiece fabrication of monolayer nano-particle as follows: monolayer nano-particle (8) is configured to
The nano granule suspension of 5% solid content, is placed in ultrasonic 10-15min in ultrasonic washing unit by nano granule suspension；Use
Micropipettor, takes out 500 μ L every time, carefully drops in workpiece (9) surface having carried out pretreatment；To drip and have nanometer
The titanium alloy of grain solution is placed in the dustless kitchen of ventilation and tilts 9 ° of standing 12h, evaporates completely to solvent, obtains surface and deposit
The processing workpiece of complete monolayer nano-particle.
The laser processing of a kind of annular micropore the most according to claim 6, it is characterised in that described in step S3
Determine that energy intensification factor A process is as follows:
Normalization incident pulse laser energy density is 1, sets the contact point of nano-particle and processing surface of the work as abscissa
Zero o, transverse axis is the location point of surface of the work, and vertical coordinate is energy intensification factor, and then builds coordinate system；Energy increases
The peak A of strong multiplemaxCorresponding transverse axis location point is respectively+h and-h, and coordinate corresponding in a coordinate system is (± h, Amax)；
Peak A is risen to by contact point o in energy intensification factormaxSegment, is respectively if laser energy density is the location point at 1
+ p and-p, coordinate corresponding in a coordinate system is (± p, 1)；0th district is dropped to by peak A max in energy intensification factor A
Between section, if laser energy density is the location point at 1 is respectively+q and-q, coordinate corresponding in a coordinate system is (± q, 1)；
Wherein the value of p, h, q meets: 0 < p < h < q；
When requiring that the internal diameter processing workpiece is d, it is desirable to op < d/2 < oh, determine that+d or-d location point is corresponding according to d size
Energy intensification factor Ad；When require process workpiece external diameter be D time, it is desirable to oh≤D/2 < oq, according to D size determine+D or
Energy intensification factor A that-D location point is correspondingD。
The laser processing of a kind of annular micropore the most according to claim 6, it is characterised in that described in step S4
The material of workpiece (9) is metal material or semi-conducting material.
The laser processing of a kind of annular micropore the most according to claim 9, it is characterised in that described workpiece (9)
Material be any one in steel, copper, titanium alloy, monocrystal silicon, polysilicon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610409601.7A CN105945435B (en) | 2016-06-12 | 2016-06-12 | A kind of laser processing device and method of annular micropore |
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| CN201610409601.7A CN105945435B (en) | 2016-06-12 | 2016-06-12 | A kind of laser processing device and method of annular micropore |
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| CN105945435A true CN105945435A (en) | 2016-09-21 |
| CN105945435B CN105945435B (en) | 2018-02-27 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106181025A (en) * | 2016-08-29 | 2016-12-07 | 桂林电子科技大学 | The up-down vibration auxiliary device of a kind of laser ablation and using method |
| CN106501946A (en) * | 2017-01-10 | 2017-03-15 | 青岛镭创光电技术有限公司 | Optical lens module |
| CN108145312A (en) * | 2018-01-30 | 2018-06-12 | 江苏微纳激光应用技术研究院有限公司 | A kind of laser welding system and its welding method |
| CN109676245A (en) * | 2018-09-30 | 2019-04-26 | 湖北工业大学 | A method of super hydrophilic glass surface is prepared using pulse laser |
| CN114654116A (en) * | 2022-04-22 | 2022-06-24 | 武汉大学 | Fixed-point machining device and method for nanometer holes of optical drive nanoparticles |
| CN116727900A (en) * | 2023-08-11 | 2023-09-12 | 中国人民解放军空军工程大学 | Laser hole making and opening method and device for aviation composite material |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09223456A (en) * | 1996-02-16 | 1997-08-26 | Canon Inc | Manufacture of surface conductive type electron emission element using laser beam |
| CN101239418A (en) * | 2008-02-19 | 2008-08-13 | 江苏大学 | Flying plate driving type laser micro-welding method and device |
| CN101249590A (en) * | 2008-02-29 | 2008-08-27 | 深圳市大族激光科技股份有限公司 | Ultraviolet laser cutting machine tool |
| CN101519184A (en) * | 2008-02-29 | 2009-09-02 | 财团法人工业技术研究院 | Method for manufacturing application substrate through photo-thermal effect |
| CN102601529A (en) * | 2012-03-27 | 2012-07-25 | 北京理工大学 | Method for improving machining efficiency of micro-channel preparation through femtosecond laser |
-
2016
- 2016-06-12 CN CN201610409601.7A patent/CN105945435B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09223456A (en) * | 1996-02-16 | 1997-08-26 | Canon Inc | Manufacture of surface conductive type electron emission element using laser beam |
| CN101239418A (en) * | 2008-02-19 | 2008-08-13 | 江苏大学 | Flying plate driving type laser micro-welding method and device |
| CN101249590A (en) * | 2008-02-29 | 2008-08-27 | 深圳市大族激光科技股份有限公司 | Ultraviolet laser cutting machine tool |
| CN101519184A (en) * | 2008-02-29 | 2009-09-02 | 财团法人工业技术研究院 | Method for manufacturing application substrate through photo-thermal effect |
| CN102601529A (en) * | 2012-03-27 | 2012-07-25 | 北京理工大学 | Method for improving machining efficiency of micro-channel preparation through femtosecond laser |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106181025A (en) * | 2016-08-29 | 2016-12-07 | 桂林电子科技大学 | The up-down vibration auxiliary device of a kind of laser ablation and using method |
| CN106181025B (en) * | 2016-08-29 | 2018-01-23 | 桂林电子科技大学 | The up-down vibration servicing unit and application method of a kind of laser ablation |
| CN106501946A (en) * | 2017-01-10 | 2017-03-15 | 青岛镭创光电技术有限公司 | Optical lens module |
| CN106501946B (en) * | 2017-01-10 | 2023-02-14 | 青岛镭创光电技术有限公司 | Optical lens assembly |
| CN108145312A (en) * | 2018-01-30 | 2018-06-12 | 江苏微纳激光应用技术研究院有限公司 | A kind of laser welding system and its welding method |
| CN109676245A (en) * | 2018-09-30 | 2019-04-26 | 湖北工业大学 | A method of super hydrophilic glass surface is prepared using pulse laser |
| CN114654116A (en) * | 2022-04-22 | 2022-06-24 | 武汉大学 | Fixed-point machining device and method for nanometer holes of optical drive nanoparticles |
| CN114654116B (en) * | 2022-04-22 | 2023-02-03 | 武汉大学 | Fixed-point machining device and method for nanometer holes of optical drive nanoparticles |
| CN116727900A (en) * | 2023-08-11 | 2023-09-12 | 中国人民解放军空军工程大学 | Laser hole making and opening method and device for aviation composite material |
| CN116727900B (en) * | 2023-08-11 | 2023-10-20 | 中国人民解放军空军工程大学 | Laser hole making and opening method and device for aviation composite material |
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