CN105936748A - 一种应用于led植物生长灯芯片封装的改性硅胶导热聚光膜 - Google Patents
一种应用于led植物生长灯芯片封装的改性硅胶导热聚光膜 Download PDFInfo
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- 239000012528 membrane Substances 0.000 title abstract 6
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- 239000005083 Zinc sulfide Substances 0.000 claims abstract description 11
- 229910052984 zinc sulfide Inorganic materials 0.000 claims abstract description 11
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 claims abstract description 10
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- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 7
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 6
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- 229920005989 resin Polymers 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 abstract description 5
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- 239000002131 composite material Substances 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 abstract 3
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 3
- 229960001866 silicon dioxide Drugs 0.000 description 3
- 238000000605 extraction Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 239000003292 glue Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
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- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明公开了一种应用于LED植物生长灯芯片封装的改性硅胶导热聚光膜，该硅胶封装膜利用纳米硫化锌、异丙醇铝对硅胶进行改性处理，其中纳米硫化锌先经过硅烷偶联剂处理，提高其在硅胶中的分散性，用异丙醇铝溶胶代替传统的导热无机填料，分散结合性更佳，有效的提高了材料的导热性能，最终制得了室温即可固化的复合封装膜，其具有良好导热性和透光聚光的光学性能，极大地提高了LED灯的出光效率和有效照射率，使用时直接将其涂覆在芯片或者荧光粉层上固化即可。
Description
技术领域
本发明涉及LED封装胶技术领域，尤其涉及一种应用于LED植物生长灯芯片封装的改性硅胶导热聚光膜。
背景技术
植物生长过程中光照是一个至关重要的因素，在种植过程中，因为自然条件的变化，尤其是在晚秋和冬季，植物的光照明显不足，此时室内补充照明就显得尤为重要了。LED光源是近年来崛起的在农业领域较为理想的人工光源，较之传统光源，LED光源节能环保，光谱纯净，贴合植物生长的波长范围，拥有巨大的市场需求量。
LED植物生长灯多是由若干均匀分布的单灯组合而成，其中单灯是由若干个发光芯片封装而成，生产过程一般为固晶、焊线、灌封、切割、测试、包装这几个流程，其中灌封胶的性能将直接影响到芯片的出光效率和使用寿命，目前LED植物灯在应用过程中存在的问题主要是发光效率低，光分散度高，而大功率的芯片封装又存在散热性差、使用寿命短等问题。
发明内容
本发明目的就是为了弥补已有技术的缺陷，提供一种应用于LED植物生长灯芯片封装的改性硅胶导热聚光膜。
本发明是通过以下技术方案实现的：
一种应用于LED植物生长灯芯片封装的改性硅胶导热聚光膜，所述的改性硅胶导热聚光膜由以下重量份的原料制得：乙烯基MQ硅树脂30-40、乙烯基硅油20-40、含氢硅油3-5、硅烷偶联剂0.4-0.5、纳米硫化锌1-2、卡斯特铂金催化剂0.1、异丙醇铝0.4-0.5、丁基缩水甘油醚5-10。
所述的改性硅胶导热聚光膜由以下步骤制得：
（1）将纳米硫化锌与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶，随后投入步骤（1）制备的物料，继续超声分散2-3h，所得物料备用；
（3）将其它剩余物料混合搅拌混合均匀后滴加步骤（2）制备的物料，边滴加边搅拌，滴加完毕后混合物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全干燥后即完成封装。
本发明制备的硅胶封装膜利用纳米硫化锌、异丙醇铝对硅胶进行改性处理，其中纳米硫化锌先经过硅烷偶联剂处理，提高其在硅胶中的分散性，用异丙醇铝溶胶代替传统的导热无机填料，分散结合性更佳，有效的提高了材料的导热性能，最终制得了室温即可固化的复合封装膜，其具有良好导热性和透光聚光的光学性能，极大地提高了LED灯的出光效率和有效照射率，使用时直接将其涂覆在芯片或者荧光粉层上固化即可。
具体实施方式
本实施例的改性硅胶导热聚光膜由以下重量份的原料制得：乙烯基MQ硅树脂30、乙烯基硅油20、含氢硅油3、硅烷偶联剂0.4、纳米硫化锌1、卡斯特铂金催化剂0.1、异丙醇铝0.4、丁基缩水甘油醚5。
该改性硅胶导热聚光膜由以下步骤制得：
（1）将纳米硫化锌与硅烷偶联剂混合研磨分散20min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3h，制成透明溶胶，随后投入步骤（1）制备的物料，继续超声分散2h，所得物料备用；
（3）将其它剩余物料混合搅拌混合均匀后滴加步骤（2）制备的物料，边滴加边搅拌，滴加完毕后混合物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全干燥后即完成封装。
产品性能测试结果如下：
拉伸强度：52.4MPa；吸水率%（25℃）：0.45；折射率：1.572；透光率：90.2%；热导率：0.95W/(m.k)。
Claims (2)
1.一种应用于LED植物生长灯芯片封装的改性硅胶导热聚光膜，其特征在于，所述的改性硅胶导热聚光膜由以下重量份的原料制得：乙烯基MQ硅树脂30-40、乙烯基硅油20-40、含氢硅油3-5、硅烷偶联剂0.4-0.5、纳米硫化锌1-2、卡斯特铂金催化剂0.1、异丙醇铝0.4-0.5、丁基缩水甘油醚5-10。
2.如权利要求1所述的一种应用于LED植物生长灯芯片封装的改性硅胶导热聚光膜，其特征在于，所述的改性硅胶导热聚光膜由以下步骤制得：
（1）将纳米硫化锌与硅烷偶联剂混合研磨分散20-30min备用；
（2）将异丙醇铝投入丁基缩水甘油醚中，密闭超声搅拌混合3-5h，制成透明溶胶，随后投入步骤（1）制备的物料，继续超声分散2-3h，所得物料备用；
（3）将其它剩余物料混合搅拌混合均匀后滴加步骤（2）制备的物料，边滴加边搅拌，滴加完毕后混合物料经过滤、真空脱泡后涂覆于芯片或荧光层上，待其完全干燥后即完成封装。
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104130742A (zh) * | 2014-06-29 | 2014-11-05 | 惠州市永卓科技有限公司 | 一种cob-led有机硅灌封胶及其制备方法 |
| CN104130741A (zh) * | 2014-06-29 | 2014-11-05 | 惠州市永卓科技有限公司 | 一种cob-led灌封用透明有机硅胶及其制备方法 |
| CN105086468A (zh) * | 2015-08-16 | 2015-11-25 | 江龙 | 一种led封装用掺混纳米硫化锌的高性能有机硅树脂-聚甲基丙烯酸甲酯复合材料及其制备方法 |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104130742A (zh) * | 2014-06-29 | 2014-11-05 | 惠州市永卓科技有限公司 | 一种cob-led有机硅灌封胶及其制备方法 |
| CN104130741A (zh) * | 2014-06-29 | 2014-11-05 | 惠州市永卓科技有限公司 | 一种cob-led灌封用透明有机硅胶及其制备方法 |
| CN105086468A (zh) * | 2015-08-16 | 2015-11-25 | 江龙 | 一种led封装用掺混纳米硫化锌的高性能有机硅树脂-聚甲基丙烯酸甲酯复合材料及其制备方法 |
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