CN105925935A - 应用于通信***组件取代水电镀的物理气相沉积工艺 - Google Patents
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Abstract
本发明公开了一种应用于通信***组件取代水电镀的物理气相沉积工艺,包括如下工艺处理步骤:1、工件表面去油污;2、超声波纯水洗;3、烘干;4、遮蔽;5、等离子清洁活化;6、物理气相沉积镀膜。本发明的工艺相比传统的高污染的水电镀,其产生的有害物质少,基本无污染,工艺环保,工艺流程较易实现标准化及自动化,质量稳定,膜层性能有提升。
Description
技术领域
本发明涉及一种应用于通信***组件取代水电镀的物理气相沉积(简称PVD)工艺。
背景技术
通信***组件表面覆盖铜、银金属膜层的主要作用是提高产品的电气性能。长期以来,公司对于通信***组件表面镀覆金属膜层的工艺一直采用传统的水电镀技术,已非常成熟,如在基材为铝合金的滤波器腔体、盖板上镀铜、镀镍、镀银。工艺流程包含:除油、除垢、清洗、沉锌、电镀铜、电镀银、后处理、烘干等,其中需要局部电镀的产品,采用耐酸碱的塑胶材料、胶带或粉末喷涂方式,遮蔽非电镀区域。
电镀对环境的影响及危害众所周知,尽管环保意识在加强,环保标准在提升,环保处理设施在升级,但电镀过程中不可避免地产生废液及废气排放,污染只是轻重问题。环保工艺取代传统电镀工艺大势所趋,也是作为传统电镀企业的一种社会责任。
目前亦有一些厂家运用PVD技术来制造涂层,应用于其它领域,取得了良好的社会及经济效益,但应用于通信***组件取代水电镀的技术还未有突破。
发明内容
本发明目的是:提供一种应用于通信***组件取代水电镀的物理气相沉积工艺,其工艺流程中产生的有害物质少,污染小,且工艺流程标准化,易操作,高效率,最终产品的镀膜质量也较高。
本发明的技术方案是:一种应用于通信***组件取代水电镀的物理气相沉积工艺,包括如下工艺处理步骤:
1)工件表面去油污;
2)超声波纯水洗;
3)烘干;
4)遮蔽;
5)等离子清洁活化;
6)物理气相沉积镀膜。
进一步的,本发明中所述步骤1)的工件表面去油污至少包含以下处理方式中的一种:
1)环保型脱脂液除油处理,脱脂液温度为40~70℃,处理时间为5~20min,除油干净后,以自来水冲洗;
2)喷砂或拉丝处理,压缩空气吹洗,再以自来水冲洗;
当同时采用上述1)和2)两种处理方式时,应先喷砂或拉丝处理,再除油。
进一步的,本发明中所述步骤2)的超声波纯水洗依次包含下述两个处理步骤:
1)在室温下用纯水超声波清洗5~20min;
2)在40~60℃条件下用纯水超声波清洗5~20min。
进一步的,本发明中所述步骤3)的烘干处理是指将工件置于烘箱内烘干,烘干温度为60~120℃,时间为30~60min;针对不同基材,烘干温度和时间有所变化。
进一步的,本发明中所述步骤4)的遮蔽是指在工件表面不要求镀膜的区域安装掩护材料,防止后续物理气相沉积镀膜工序中镀上膜层;如果工件要求全镀,则无需经过此工序,掩护材料及方案依据产品结构进行特别设计。
进一步的,本发明中所述步骤5)的等离子清洁活化依次包括以下步骤:
1)将遮蔽后的工件固定在挂架上,悬挂于真空室内;
2)抽真空使真空室内压力低于1Pa;
3)向真空室内充入氧气、氩气和氮气中的一种或几种的混合气体构成的工作气体以使真空室内气压维持在10~1000Pa,打开等离子激发电源以激发等离子体,实现对工件表面的清洁与活化,以保证下道工序物理气相沉积镀膜膜层的结合力。
进一步的,本发明中所述步骤6)的物理气相沉积镀膜是指采用溅射镀膜、多弧离子镀膜、激光蒸发镀膜这些物理气相沉积技术中的一种或多种方案的结合,在工件表面镀覆金属铜、银等金属的工序。
更进一步的,所述步骤6)的工序至少包含以下方式中的一种:
1)采用物理气相沉积镀膜技术在工件表面镀覆一层铜膜;
2)采用物理气相沉积镀膜技术在工件表面镀覆一层银膜;
3)采用物理气相沉积镀膜技术在工件表面先镀覆一层铜膜,然后再在铜膜上镀覆一层银膜。
本发明主要用于通信***组件的表面镀膜,所述组件为通信***滤波器、功分器、双工器、耦合器、合路器、塔放器、电桥等器件的腔体、屏蔽盖、基板、面板等需要镀膜处理的结构件。
本发明的优点是:
本发明提供的工艺主要是能够取代传统的水电镀来对通信***组件实施表面镀膜作业,其工艺流程中产生的有害物质少,污染小,且工艺流程标准化,简化,易操作,高效率,最终产品的镀膜质量也得到了提高。
附图说明
下面结合附图及实施例对本发明作进一步描述:
图1是本发明的工艺流程简图。
具体实施方式
实施例1:本实施例以在铸铝的滤波器基材上依次镀铜膜和银膜为例,对本发明提供的这种应用于通信***组件取代水电镀的物理气相沉积工艺解释如下:
具体的工艺步骤如下:
1)工件表面去油污
环保型脱脂液除油处理,脱脂液温度为60℃,处理时间为20min,除油干净后,以自来水冲洗;
2)超声波纯水洗
依次包含下面两个步骤:
1)在室温下用纯水超声波清洗15min;
2)在50℃条件下用纯水超声波清洗15min。
3)烘干
将工件置于烘箱内烘干,烘干温度为110℃,时间为30min。
4)遮蔽
在工件表面不要求镀膜的区域安装铝合金或不锈钢掩膜板,防止后续磁控溅射镀膜工序中镀上膜层。
5)等离子清洁活化
依次包括以下步骤:
1)将遮蔽后的工件固定在挂架上,悬挂于真空室内;
2)抽真空使真空室内压力低于1Pa;
3)向真空室内充入氧气或氩气或氮气等一种或几种的混合气体构成的工作气体以使真空室内气压维持在10~1000Pa,打开等离子激发电源以激发等离子体,实现对工件表面的清洁与活化,以保证下道工序物理气相沉积镀膜膜层的结合力。
6)磁控溅射镀膜
将工件置于真空腔体内,抽真空至本底真空5×10-3Pa。调节氩气阀门,持续充入氩气至真空腔体内压强维持在0.5Pa左右,打开铜靶的磁控溅射直流电源,使铜靶溅射铜粒子沉积在工件需要镀膜的表面,铜膜厚达到8um后,关闭铜靶磁控溅射电源,打开银靶磁控溅射电源,使银靶溅射银粒子沉积在铜膜之上,直至银膜厚度达到0.5um后停止溅射镀膜。
实施例2:本实施例以在机加工的滤波器盖板上依次镀铜膜和银膜为例,对本发明提供的这种应用于通信***组件的取代水电镀的物理气相沉积镀膜工艺解释如下:
具体的工艺步骤如下:
1)工件表面去油污
先喷砂或拉丝处理,压缩空气吹洗,再以自来水冲洗;
然后采用环保型脱脂液除油处理,脱脂液温度为70℃,处理时间为15min,除油干净后,以自来水冲洗;
2)超声波纯水洗
依次包含下面两个步骤:
1)在室温下用纯水超声波清洗20min;
2)在60℃条件下用纯水超声波清洗10min。
3)烘干
将工件置于烘箱内烘干,烘干温度为105℃,时间为40min。
4)遮蔽
在工件表面不要求镀膜的区域安装铝合金或不锈钢掩膜板,防止后续磁控溅射镀膜工序中镀上膜层。
5)等离子清洁活化
依次包括以下步骤:
1)将遮蔽后的工件固定在挂架上,悬挂于真空室内;
2)抽真空使真空室内压力低于1Pa;
3)向真空室内充入氧气或氩气或氮气等一种或几种的混合气体构成的
工作气体以使真空室内气压维持在10~1000Pa,打开等离子激发电源以激发等离子体,实现对工件表面的清洁与活化,以保证下道工序物理气相沉积镀膜膜层的结合力。
6)磁控溅射镀膜
将工件置于真空腔体内,抽真空至本底真空5×10-3Pa。调节氩气阀门,持续充入氩气至真空腔体内压强维持在0.5Pa左右,打开铜靶的磁控溅射直流电源,使铜靶溅射铜粒子沉积在工件需要镀膜的表面,铜膜厚达到5um后,关闭铜靶磁控溅射电源,打开银靶磁控溅射电源,使银靶溅射银粒子沉积在铜膜之上,直至银膜厚度达到0.5um后停止溅射镀膜。
当然上述实施例只为说明本发明的技术构思及特点,其目的在于让熟悉此项技术的人能够了解本发明的内容并据以实施,并不能以此限制本发明的保护范围。凡根据本发明主要技术方案的精神实质所做的修饰,都应涵盖在本发明的保护范围之内。
Claims (9)
1.一种应用于通信***组件取代水电镀的物理气相沉积工艺,包括如下工艺处理步骤:
1)工件表面去油污;
2)超声波纯水洗;
3)烘干;
4)遮蔽;
5)等离子清洁活化;
6)物理气相沉积镀膜。
2.根据权利要求1所述的应用于通信***组件取代水电镀的物理气相沉积工艺,其特征在于所述步骤1)的工件表面去油污至少包含以下处理方式中的一种:
环保型脱脂液除油处理,脱脂液温度为40~70℃,处理时间为5~20min,除油干净后,以自来水冲洗;
喷砂或拉丝处理,压缩空气吹洗,再以自来水冲洗;
当同时采用上述1)和2)两种处理方式时,应先喷砂或拉丝处理,再除油。
3.根据权利要求1所述的应用于通信***组件取代水电镀的物理气相沉积工艺,其特征在于所述步骤2)的超声波纯水洗依次包含下述两个处理步骤:
1)在室温下用纯水超声波清洗5~20min;
2)在40~60℃条件下用纯水超声波清洗5~20min。
4.根据权利要求1所述的应用于通信***组件取代水电镀的物理气相沉积工艺,其特征在于所述步骤3)的烘干处理是指将工件置于烘箱内烘干,烘干温度60~120℃,时间30~60min;针对不同基材,烘干温度和时间有所变化。
5.根据权利要求1所述的应用于通信***组件取代水电镀的物理气相沉积工艺,其特征在于所述步骤4)的遮蔽是指在工件表面不要求镀膜的区域安装掩护材料,防止后续物理气相沉积镀膜工序中镀上膜层;如果工件要求全镀,则无需经过此工序,掩护材料及方案依据产品结构进行特别设计。
6. 根据权利要求1所述的应用于通信***组件取代水电镀的物理气相沉积工艺,其特征在于所述步骤5)的等离子清洁活化依次包括以下步骤:
将遮蔽后的工件固定在挂架上,悬挂于真空室内;
抽真空使真空室内压力低于1Pa;
向真空室内充入氧气、氩气和氮气中的一种或几种的混合气体构成的工作气体以使真空室内气压维持在10~1000Pa,打开等离子激发电源以激发等离子体,实现对工件表面的清洁与活化,以保证下道工序物理气相沉积镀膜膜层的结合力。
7.根据权利要求1所述的应用于通信***组件取代水电镀的物理气相沉积工艺,其特征在于所述步骤6)的物理气相沉积镀膜是指采用溅射镀膜、多弧离子镀膜、激光蒸发镀膜这些物理气相沉积技术中的一种或多种方案的结合,在工件表面镀覆金属铜、银等金属的工序。
8.根据权利要求1或7所述的应用于通信***组件取代水电镀的物理气相沉积工艺,其特征在于所述步骤6)至少包含以下方式中的一种:
1)采用物理气相沉积镀膜技术在工件表面镀覆一层铜膜;
2)采用物理气相沉积镀膜技术在工件表面镀覆一层银膜;
3)采用物理气相沉积镀膜技术在工件表面先镀覆一层铜膜,然后再在铜膜上镀覆一层银膜。
9.根据权利要求1所述的应用于通信***组件取代水电镀的物理气相沉积工艺,其特征在于所述组件为通信***滤波器、功分器、双工器、耦合器、合路器、塔放器、电桥等器件的腔体、屏蔽盖、基板、面板等需要镀膜处理的结构件。
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