CN105924016A - Thinning liquid and glass substrate thinning method - Google Patents
Thinning liquid and glass substrate thinning method Download PDFInfo
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- CN105924016A CN105924016A CN201610270502.5A CN201610270502A CN105924016A CN 105924016 A CN105924016 A CN 105924016A CN 201610270502 A CN201610270502 A CN 201610270502A CN 105924016 A CN105924016 A CN 105924016A
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- thinning
- reducer
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
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Abstract
The invention relates to the technical field of glass substrate manufacturing, and especially relates to a thinning liquid and a glass substrate thinning method. The thinning liquid for etching glass substrates comprises, by mass, 10-30% of HF, 2-10% of NaCl, 6-25% of NH4HF2, 6-17% of a strong acid, and the balance of water. The thinning liquid is prepared through comprehensively considering the utilization values of different substance reaction resultants, and is used to carry out metal substrate thinning work, and has the advantages of simple production technology, high production yield, high efficiency, meeting of large batch production needs, and further reduction of the thinning thickness of the glass substrates of touch products.
Description
Technical field
The present invention relates to glass substrate manufacturing technology field, particularly relate to the thinning of reducer and glass substrate
Method.
Background technology
The development of touch-screen is extremely rapid in recent years, along with multimedia information inquiry is grown with each passing day, and people
The application of touch-screen is got more and more.It disclosure satisfy that people quickly consult the demand of useful information, and
Moving towards the road of a popular application.Display device in early days mainly based on electric resistance touch screen,
Nowadays under the drive of Apple, capacitance touch screen calculates accurately with it, high sensitivity, flexible operation
Etc. feature, increasingly favored by people.The critical piece capacitance type sensor of touch-screen is when making
According to function to be realized, pre-designed corresponding line map, then will be designed by gold-tinted processing procedure
Line map accomplish, on the glass of correspondence, thus to realize due touch controllable function, electronics in the market
Product, all has touch controllable function, and mobile phone is one of major product.
Along with the development of modern science and technology, electronic display unit increasingly tends to lightening, and generally we touch
The thickness of glass substrate of screen is all at more than 0.33mm, if it is desired to use more frivolous substrate, then subtract
Thin just become an indispensable process route.In the production and processing of touch screen functional sheet, glass base
The quality of the thinning effect of plate becomes the important step in production, and he directly influences the quality of product, mesh
The mode of front touch-control glass thinning is broadly divided into two kinds: a kind of is that the mode using the polishing of physical oxidation cerium is entered
Row is thinning, and thinning every time-consuming about 2～3h by polishing mode, this sample loading mode, because efficiency is the lowest, does not has
The possibility produced in enormous quantities；Another kind is the thinning glass of mode using hydrofluoric acid (HF) acid etching
Thickness, this mode efficiency is higher, can meet the demand of volume production.This route is increasingly becoming and subtracts in the industry
The first-selected process route of thin glass substrate.Produce recently as the ultra-thin touch-control with mobile phone, flat board as representative
The development of product, the product of traditional more than 0.33mm does not the most tend to saturated, does not has any competition excellent
Gesture, wanting there is the biggest development at this has been impossible, in conjunction with the market of whole market, wants product more
Adding frivolous, it has been extremely urgent for conceiving a thinning scheme efficient, quick.
The nitration mixture of the employing HF of prior art carries out thinning cardinal principle and is: the nitration mixture containing HF and glass
SiO in glass2And other metal oxide reacts, make the top layer of glass peel off, thus realize
Glass substrate thinning.The formula main formula of glass thinning liquid is in the market: 10%～20%
HF, the strong acid (H of 10%～20%2SO4、HCl、HNO3、H3PO4), the water of 60%～80%.Make
With this formula as thinning extremely inefficient, the waste disposal cost height of glass thinning liquid, it is primarily due to:
One, the H that the reducer of this process program generates in the reaction4SiO4(glass sand) affects glass etching speed
Rate and surface quality, easily make product salient point or the phenomenon of etching inequality occur；Two, raw in this reaction
The H produced2SiF6Being dissolved in reducer, make the thinning effect of glass be deteriorated, reducer cannot be continuing with
And cause waste liquid；Three, the program can produce a large amount of unserviceable danger wastes, and processing cost is the highest.
Summary of the invention
It is an object of the invention to provide the thining method of a kind of reducer and glass substrate, it is intended to solve existing
There are the thinning weak effect of the reducer of technology, thinning speed slow and produce the technology of a large amount of danger wastes and ask
Topic.
For achieving the above object, the technical scheme is that reducer, including following mass percent
Component:
Further, described reducer includes following mass percent component:
Further, described reducer includes following mass percent component:
Preferably, described strong acid is H2SO4With the one or two kinds of in HCl.
It is highly preferred that described strong acid is by 1～the H of 7%2SO4Form with the HCl of 5～10%.
Beneficial effects of the present invention: in the reducer of the present invention, NH4HF2As corrosion inhibiter, for thinning
Liquid supplements F-, make acid solution more durable, promote the utilization rate of acid solution, improve thinning effect；Because
The H that when reducer is operated, reaction generates2SiF6The thinning effect that can make glass is deteriorated, and reducer cannot
It is continuing with and becomes waste liquid；And the NaCl in the formula of the embodiment of the present invention can be with H2SiF6Reaction,
Generate precipitable Na2SiF6, so can remove the H in reducer2SiF6, promote the carrying out of reaction,
Promote thinning speed；Finally, the reducer of the embodiment of the present invention produces Na when working2SiF6Discarded object generation
For traditional H4SiO4Discarded object, this Na2SiF6Discarded object by further purifying, thus can enter
Row is sold again, substantially can realize zero-emission, and former reducer can be carried out by adding of raw material
Cycling and reutilization.
The thining method that another solution is that glass substrate of the present invention, comprises the steps:
Sealing: provide one to treat thinning glass substrate, carries out sealing process and exposes need this glass substrate
Carry out thinning surface；
Thinning: the described glass substrate after completing described sealing step is carried out in being placed in above-mentioned reducer
Etching；
Clean: the described glass substrate after completing described reduction steps is cleaned, cleans.
Further, in described reduction steps, complete the thickness evenness of the described glass substrate after etching
＜ 0.05%.
Further, in described reduction steps, the temperature of described reducer is 25～32 DEG C.
Further, in described reduction steps, the concentration deviation of described reducer is ± 4～± 6%.
Further, in described reduction steps, when described glass substrate is placed in the etching in described reducer
A length of 180～280s.
Further, in described reduction steps, the etching speed that described glass substrate is placed in described reducer
Rate is 12～20 μm/min.
By the thining method of the glass substrate of the present invention, glass substrate is carried out thinning work, it is ensured that
The generation of danger wastes is reduced, additionally it is possible to promote thinning speed and improve thinning effect in thinning process,
Meet large batch of Production requirement.
Accompanying drawing explanation
The flow chart of the thining method of the glass substrate that Fig. 1 provides for the embodiment of the present invention.
Detailed description of the invention
In order to make the technical problem to be solved in the present invention, technical scheme and beneficial effect clearer,
Below in conjunction with embodiment and accompanying drawing 1, the present invention is further elaborated.Should be appreciated that herein
Described specific embodiment, only in order to explain the present invention, is not intended to limit the present invention.
The reducer that the embodiment of the present invention provides, including following mass percent component:
In the formula of the embodiment of the present invention, NH4HF2As corrosion inhibiter, supplement F for reducer-, make acid
Liquid more durable, promotes the utilization rate of acid solution, improves thinning effect；Because reducer is operated
The H that Shi Fanying generates2SiF6The thinning effect that can make glass is deteriorated, and reducer cannot be continuing with and become
Waste liquid；And the NaCl in the formula of the embodiment of the present invention can be with H2SiF6Reaction, generates precipitable
Na2SiF6, so can remove the H in reducer2SiF6, promote the carrying out of reaction, promote thinning speed；
Finally, the reducer of the embodiment of the present invention produces Na when working2SiF6Discarded object replaces traditional H4SiO4
Discarded object, this Na2SiF6Discarded object by further purifying, thus can be sold, base again
Originally can realize zero-emission, and former reducer can be circulated recycling by adding of raw material.
In the present embodiment, further, described reducer includes following mass percent component:
In the present embodiment, further, described reducer includes following mass percent component:
It is to say, in the reducer that the present embodiment provides；
The mass percent of HF can elect 10% as, 12%, 14%, 16%, 18%, 20%, 22%,
24%, 26%, 28% or 30%；
The mass percent of NaCl can be elected as；2%, 3%, 4%, 5%, 6%, 7%, 8%, 9%
Or 10%；
NH4HF2Mass percent can elect 6% as, 8%, 10%, 12%, 14%, 16%, 18%,
20%, 21%, 23% or 25%；
The mass percent of strong acid can elect 6% as, 7%, 8%, 9%, 10%, 11%, 12%, 13%,
14%, 15%, 16% or 17%；
Its surplus then selects water；Water preferably employs pure water.
Preferably, described strong acid is H2SO4With the one or two kinds of in HCl.Concrete, one, strong
Acid can all select to use H2SO4；Two, strong acid can all select to use HCl；Three, strong acid can
To select H2SO4With the mixture of HCl, concrete, strong acid is by 1～the H of 7%2SO4With 5～10%
HCl forms, i.e. in reducer, and H2SO4Mass percent be 1～7%, the mass percent of HCl
It is 5～10%.
Such as, the H of mixing2SO4With in HCl, H2SO4Account for the quality of the reducer that the present embodiment provides
The mass percent of the reducer that percentage is 6%, HCl accounts for the present embodiment offer is 6%；Or, H2SO4
The mass percent accounting for the reducer that the present embodiment provides is 8%, HCl accounts for the reducer that the present embodiment provides
Mass percent be 5%；Or H2SO4The mass percent accounting for the reducer that the present embodiment provides is
3%, HCl accounts for the mass percent of the reducer that the present embodiment provides is 7%；H2SO4Account for the present embodiment
The mass percent of reducer provided is 10%, HCl accounts for the quality hundred of the reducer that the present embodiment provides
Proportion by subtraction is 7%.
The reducer that the present embodiment provides uses above-mentioned strong acid, can avoid producing in the course of the work and contains
The discarded object of phosphorus, because phosphorus is as the essential element of body eutrophication, carries out strictly in each place
Discharge standard, it is to avoid the discharge of phosphorus such that it is able to reach the requirement of discharge, the beneficially guarantor of environment
Protect.
In the reducer that the present embodiment provides, HF acid is main active component in the solution, because with
The H-F key that hydrogen bond formation exists is more fragile than the H-F key in HF molecule, with SiO2More hold during reaction
Easy fracture, the main component of glass substrate is mainly SiO2, therefore, in the middle of reducer, HF serves as instead
Answer main part, and the strong acid added can increase the H in solution+(hydrogen ion), due to H+Increase
Make and glass main component SiO2The composition fluorination hydrogen radical (HF that the activity that reacts is the highest2-) complexing
Ion increases, in addition also due to H+The etching reaction of glass substrate there is is certain catalytic action, adds
Cl-And SO4 2-The introducing of acid ion changes partial reaction product, the salt of this acid ion composition
Being easier to remove from glass surface, the flatness of the most thinning glass substrate is easier to control.And
The effect of NaCl be can in reducer with H2SiF6Reaction generates Na2SiF6Precipitation, so can be by
Reducer hinders the H of thinning effect2SiF6Remove, promote the carrying out of reaction, and Na2SiF6Permissible
Pure Na is made through further processing2SiF6Sell, substantially can realize zero-emission.
NH in reducer4HF2As corrosion inhibiter, NH in the solution4HF2Ionization is occurred to produce H+、F-With
NH+ 4, NH4HF2F in course of reaction can be supplemented-Loss, thus can avoid simple by HF
F is provided-, because of F-Loss make acid solution to use, and become waste liquid.F-Slowly release can allow acid
Liquid more durable, promotes the utilization rate of acid solution.
Specifically compared expression by formulas below:
The reaction equation mainly generated in traditional reducer formula is:
4HF+SiO2→H4SiO4↓+SiF4；The product of this reaction is sediment H4SiO4, this precipitation
The deposition of thing has a strong impact on thinning effect, is difficult to filter, and sediment H4SiO4There is no value, only
Can be discarded.
And the reaction equation mainly generated in the formula of the reducer that the embodiment of the present invention provides is:
4HF+SiO2→SiF4+2H2O；
SiF4+2HF→H2SiF6；
H2SiF6+NaCl→Na2SiF6↓+2HCl；Because it has NaCl, can and H2SiF6Reaction is raw
Become sediment Na2SiF6, thus remove sediment H2SiF6, promote that the reaction equation in formula is the most to the right and carry out,
So can accelerate the carrying out of whole reaction.
It addition, because Na2SiF6It is a kind of weak electrolyte, during ionization, produces Na+And SiF6 2-Ion
(Na2SiF6→2Na++SiF6 2-), owing to, in metal substrate reducer, there is the NaCl of strong electrolyte,
Na can be produced during its ionization+And Cl--Ion (NaCl → Na++Cl--), because at weak electrolyte
(Na2SiF6) solution in add containing same ion easily hold strong electrolyte (NaCl), can make weak
Electrolyte (Na2SiF6) degree of ionization reduce, make Na2SiF6Ionization equation left shift, reduce
Na2SiF6Degree of ionization, and then improve sediment Na2SiF6Removal effect, be beneficial to improve whole
The carrying out of individual thinning work.
The reducer that the embodiment of the present invention provides, according to the value of different material reaction product, enters
Row considers, and utilizes its thinning work of metal substrate carried out, and production technology is relatively simple, produces yield
Height, efficiency is fast, it is also possible to meets the needs produced in enormous quantities, can reduce further touch-control product
The thickness thinning of glass substrate.
The reducer that the embodiment of the present invention provides, in generating during thoroughly solving thinning glass substrate
Between product, the reluctant problem of discarded object, and the utilization rate of reducer is also substantially improved, and thus may be used
To be greatly improved the competitiveness of enterprise.
The reducer that the embodiment of the present invention provides, uses chemical substance price also ratio less expensive, work in formula
Product in work can also be sold after processing further, substantially can realize zero-emission.
As it is shown in figure 1, the embodiment of the present invention additionally provides the thining method of a kind of glass substrate, including such as
Lower step:
Sealing: provide one to treat thinning glass substrate, carries out sealing process and exposes need this glass substrate
Carry out thinning surface；Concrete, the surrounding side of glass substrate needs to carry out sealing process, then may be used
To use UV solidification；
Thinning: the described glass substrate after completing described sealing step is carried out in being placed in above-mentioned reducer
Etching；Concrete, glass substrate is etched by reducer fast and effectively, thus real to glass substrate
Now thickness is thinning；
Clean: the described glass substrate after completing described reduction steps is cleaned, cleans；Complete erosion
Carve thinning after glass substrate after over cleaning, air-dry, in order to carry out the production and processing of next step.
In the present embodiment, in described reduction steps, the thickness completing the described glass substrate after etching is uniform
Property ＜ 0.05%.Concrete, by above-mentioned method complete to etch thinning after glass substrate, its surface
Thickness evenness ＜ 0.05%, surface is without projection, and does not haves a concave point and phenomenon that crackle expands,
Thickness evenness is the best.
In the present embodiment, in described reduction steps, the temperature of described reducer is 25～32 DEG C.Concrete,
Keep reducer at the temperature disclosed above that glass substrate is carried out thinning work, it can be ensured that each in reducer
The chemical property of composition is more stable, and to the thinning effect of glass substrate more, speed is faster.
More specifically, the temperature of reducer can be 25 DEG C, 26 DEG C, 27 DEG C, 28 DEG C, 29 DEG C, 30 DEG C,
31 DEG C or 32 DEG C.
In the present embodiment, in described reduction steps, the concentration deviation of described reducer is ± 4～± 6%.Tool
Body, the reducer in above-mentioned concentration deviation range value has more wellability, it is possible to glass base
Plate needs thinning surface preferably to contact, and promotes the thinning quality to glass substrate.
More specifically, the concentration deviation of reducer can be ± 4%, ± 5% or ± 6%.
In the present embodiment, in described reduction steps, described glass substrate is placed in the etching in described reducer
Time is 180～280s.Concrete, typically glass substrate is immersed in the reducer that the present embodiment provides
180～280s can complete thinning work, because the reducer that the present embodiment provides has faster thinning speed
Degree, it is possible to be completed in a relatively short time the thinning work to glass substrate.
More specifically, the etching period length in glass substrate is placed in reducer can be 180s, 190s,
200s, 210s, 220s, 230s, 240s, 250s, 260s, 270s or 280s.
In the present embodiment, in described reduction steps, described glass substrate is placed in the etching in described reducer
Speed is 12～20 μm/min.Concrete, use above-mentioned reducer that glass substrate is etched thinning
Work, so that etch thinning speed to reach 12～20 μm/min, ratio traditional 4～7 μm/min far away
Etch-rate a lot of soon, be suitable for glass substrate is carried out large batch of production, bring for enterprise higher
Economic benefit.
More specifically, the etch-rate in glass substrate is placed in reducer reach 12 μm/min, 13 μm/min,
14 μm/min, 15 μm/min, 16 μm/min, 17 μm/min, 18 μm/min, 19 μm/min or
20μm/min。
The thining method of the glass substrate provided by the embodiment of the present invention carries out thinning work to glass substrate
Make, it is ensured that in thinning process, reduce the generation of danger wastes, additionally it is possible to promote thinning speed and
Improve thinning effect, meet large batch of Production requirement.
Certainly, before carrying out sealing step, first glass substrate can be carried out and air-dry.And
After completing cleaning step, the grinding and polishing that can proceed next step operation processes, quality testing,
After carry out being packaged into storehouse.
It is exemplified below six specific embodiments:
Embodiment one:
The mass percent of each component of reducer is: the HF of 10%, the H of 6%2SO4, the NaCl of 4%,
The NH of 10%4HF2Water with surplus.Glass substrate is etched thinning under the conditions of temperature is 25 DEG C
Work, a length of 180s during thinning etching, etch-rate reaches 15 μm/min, thinning after glass substrate
Thickness evenness ＜ 0.08%, in the concentration deviation of ± 5% keep thinning speed the most stable, thinning
The utilization rate of liquid is 20%.
Embodiment two:
The mass percent of each component of reducer is: the HF of 15%, the H of 10%2SO4, the NaCl of 8%,
The NH of 12%4HF2Water with surplus.Glass substrate is etched thinning under the conditions of temperature is 27 DEG C
Work, a length of 200s during thinning etching, etch-rate reaches 12 μm/min, thinning after thickness uniform
Property ＜ 0.08%, in the concentration deviation of ± 4% keep thinning speed the most stable, the utilization rate of reducer
20%.
Embodiment three:
The mass percent of each component of reducer is: the HF of 20%, the H of 6%2SO4, the HCl of 6%,
The NaCl of 5%, the NH of 8%4HF2Water with surplus.Under the conditions of temperature is 28 DEG C, glass substrate is entered
Row etches thinning work, a length of 220s during thinning etching, and etch-rate reaches 20 μm/min, thinning after
The thickness evenness ＜ 0.08% of glass substrate, keep thinning speed relative in the concentration deviation of ± 6%
Stable, the utilization rate of reducer is 20%.
Embodiment four:
The mass percent of each component of reducer is: the HF of 20%, the H of 8%2SO4, the HCl of 5%,
The NaCl of 3%, the NH of 10%4HF2Water with surplus.To glass substrate under the conditions of temperature is 30 DEG C
Being etched thinning work, a length of 240s during thinning etching, etch-rate reaches 18 μm/min, thinning
After the thickness evenness ＜ 0.05% of glass substrate, in the concentration deviation of ± 5%, keep thinning speed phase
To stable, the utilization rate of reducer is 20%.
Embodiment five:
The mass percent of each component of reducer is: the HF of 25%, the HCl of 8%, the NaCl of 6%, 15%
NH4HF2Water with surplus.Under the conditions of temperature is 31 DEG C, glass substrate is etched thinning work,
A length of 260s during thinning etching, etch-rate reaches 15 μm/min, thinning after the thickness of glass substrate
Uniformity ＜ 0.08%, keeps thinning speed the most stable, the profit of reducer in the concentration deviation of ± 5%
By rate 20%.
Embodiment six:
The mass percent of each component of reducer is: the HF of 30%, the HCl of 8%, the NaCl of 7%, 20%
NH4HF2Water with surplus.Under the conditions of temperature is 32 DEG C, glass substrate is etched thinning work,
A length of 280s during thinning etching, etch-rate reaches 15 μm/min, thinning after the thickness of glass substrate
Uniformity ＜ 0.08%, keeps thinning speed the most stable, the profit of reducer in the concentration deviation of ± 5%
By rate 20%.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all at this
Any amendment, equivalent or the improvement etc. made within the thought of invention and principle, should be included in this
Within the protection domain of invention.
Claims (10)
1. reducer, for etching glass substrate, it is characterised in that: described reducer includes following quality
Percent composition:
Reducer the most according to claim 1, it is characterised in that: described reducer includes following matter
Amount percent composition:
Reducer the most according to claim 1, it is characterised in that: described reducer includes following matter
Amount percent composition:
4. according to the reducer described in any one of claims 1 to 3, it is characterised in that: described strong acid is
H2SO4With the one or two kinds of in HCl.
5. according to the reducer described in any one of claims 1 to 3, it is characterised in that: described strong acid by
1～the H of 7%2SO4Form with the HCl of 5～10%.
6. the thining method of glass substrate, it is characterised in that: comprise the steps:
Sealing: provide one to treat thinning glass substrate, carries out sealing process and exposes need this glass substrate
Carry out thinning surface；
Thinning: the described glass substrate after completing described sealing step is placed in any one of Claims 1 to 5
It is etched in described reducer；
Clean: the described glass substrate after completing described reduction steps is cleaned, cleans.
The thining method of glass substrate the most according to claim 6, it is characterised in that: described thinning
In step, complete the thickness evenness ＜ 0.05% of the described glass substrate after etching.
The thining method of glass substrate the most according to claim 6, it is characterised in that: described thinning
In step, the temperature of described reducer is 25～32 DEG C.
The thining method of glass substrate the most according to claim 6, it is characterised in that: described thinning
In step, the concentration deviation of described reducer is ± 4～± 6%.
The thining method of glass substrate the most according to claim 5, it is characterised in that subtract described in:
In thin step, described glass substrate is placed in during the etching in described reducer a length of 180～280s；Described glass
It is 12～20 μm/min that glass substrate is placed in the etch-rate in described reducer.
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| CN107324662A (en) * | 2017-06-02 | 2017-11-07 | 合肥市惠科精密模具有限公司 | A kind of TFT thinning glass substrates handling process |
| CN108874225A (en) * | 2018-06-27 | 2018-11-23 | 信利光电股份有限公司 | A kind of production method of ultra-thin touch screen functional sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107324662A (en) * | 2017-06-02 | 2017-11-07 | 合肥市惠科精密模具有限公司 | A kind of TFT thinning glass substrates handling process |
| CN108874225A (en) * | 2018-06-27 | 2018-11-23 | 信利光电股份有限公司 | A kind of production method of ultra-thin touch screen functional sheet |
| CN108874225B (en) * | 2018-06-27 | 2021-07-30 | 信利光电股份有限公司 | Manufacturing method of ultrathin touch screen functional sheet |
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