CN105917418B - Back contact solar battery module electroconductive particle, conductive material and solar module - Google Patents
Back contact solar battery module electroconductive particle, conductive material and solar module Download PDFInfo
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- CN105917418B CN105917418B CN201580004075.XA CN201580004075A CN105917418B CN 105917418 B CN105917418 B CN 105917418B CN 201580004075 A CN201580004075 A CN 201580004075A CN 105917418 B CN105917418 B CN 105917418B
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- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- 239000004645 polyester resin Substances 0.000 description 1
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- 229920006393 polyether sulfone Polymers 0.000 description 1
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- 239000004848 polyfunctional curative Substances 0.000 description 1
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- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03926—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate comprising a flexible substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
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- Chemical & Material Sciences (AREA)
- Sustainable Energy (AREA)
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- Spectroscopy & Molecular Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
- Conductive Materials (AREA)
Abstract
The present invention provides a kind of back contact solar battery module electroconductive particle, and interelectrode conducting reliability can be improved in back contact solar battery module.The electroconductive particle of the present invention is used for back contact solar battery module, wherein, possess substrate particle and the conductive part being configured on the surface of above-mentioned substrate particle, there are multiple projections in the outer surface of above-mentioned conductive part, modulus of elasticity in comperssion during compression 10% is 1100N/mm2Above, 5000N/mm2Hereinafter, breaking strain is more than 55%.
Description
Technical field
The present invention relates to the electroconductive particle for back contact solar battery module.On having used
State the back contact solar battery module conductive material of electroconductive particle.The invention further relates to used above-mentioned conductive material
Back contact solar battery module.
Background technology
The mode of solar module includes belt and back-contact etc..In the past, the solar-electricity of belt is mainly used
Pond module.In recent years, the phase of the exploitation of the back contact solar battery module of high-output power and high conversion efficiency can be expected
15th day of a lunar month benefit increases.
In back contact solar battery module, in solar battery cell on the whole, make solar battery cell and
Flexible printing substrate is bonded.
There is a kind of manufacture method of solar module disclosed in following patent documents 1, it includes：First process, will
The back side of multiple solar battery cells towards it is upper and according to module configure carry out arranged in parallel, further utilize interconnecting feeder pair
The P-type electrode and N-type electrode of adjacent solar battery cell are electrically connected, so as to obtain a series of solar cell list
Member；Second process, by the guard block of encapsulant, above-mentioned a series of solar battery cell, encapsulant and rear side
It is stacked in successively on the guard block of front face side and carries out integration.Recorded in patent document 1 it is a kind of using Cu, Ag, Au,
Pt, Sn or alloy containing them etc. are attached to the cloth line electrode of flexible printing substrate and the electrode of solar battery cell
Method.
In addition, following Patent Document 2 discloses a kind of manufacture method of solar module, it includes：In the sun
On the surface electrode of energy battery unit, one end of lug line is configured via the conductive adhesive containing spherical electroconductive particle
Side, and in the backplate of the solar battery cell abutted with above-mentioned solar battery cell, via containing conductive grain
The process that the conductive adhesive of son configures the another side of above-mentioned lug line；Above-mentioned lug line heat is stressed on into above-mentioned surface electricity
Pole and above-mentioned backplate, above-mentioned lug line is connected to above-mentioned surface electrode and the above-mentioned back side using above-mentioned conductive adhesive
The process of electrode.In above-mentioned lug line, formed with jog in the one side being connected with above-mentioned conductive adhesive.Above-mentioned bumps
The average height (H) in portion and the average grain diameter (D) of electroconductive particle meet D >=H.
In addition, in recent years it has been proposed that optionally configure electroconductive particle on the cloth line electrode of flexible printing substrate.
It is following that Patent Document 3 discloses a kind of manufacture method of solar module, the solar cell to possess：Base
Material, be disposed in via bond layer the base material a surface aluminium wiring, there is the sun with the electrode of aluminium wiring connection
Can battery unit, seal the encapsulant of the solar battery cell, be configured at above-mentioned encapsulant with the opposite side of aluminium wiring
Face on translucency front panel.Manufacture method described in patent document 3 possesses：Remove above-mentioned aluminium cloth in advance using fluxing agent
The process of the oxide film thereon of line；Aluminium paste solder is coated on to the process of above-mentioned aluminium wiring by printing or distributor；Using above-mentioned
The process that aluminium paste solder is connected up to above-mentioned aluminium and the electrode of above-mentioned solar battery cell is attached.Above-mentioned aluminium paste solder contains
Aluminium powder body and synthetic resin.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2005-11869 publications
Patent document 2：Japanese Unexamined Patent Publication 2012-204388 publications
Patent document 3：Japanese Unexamined Patent Publication 2013-63443 publications
The content of the invention
The technical problems to be solved by the invention
Sometimes bumps on the electrode surface of solar battery cell be present.In addition, sometimes in the cloth of flexible printing substrate
There is also bumps on the surface of line electrode.In the case where having used the paste solder of the aluminium described in patent document 3, due to electrode table
The bumps in face, sometimes aluminium paste solder can not fully be contacted with electrode surface.Therefore, it is interelectrode to turn on reliability step-down sometimes.
In addition, as described in patent document 3, in recent years, because the price of thin copper film electrode is high, therefore, aluminium cloth is used
The expectation of line electrode is increasingly increased.But for aluminium cloth line electrode, oxide-film is easily formed on the surface.Therefore, conducting can
Reduction by property easily becomes the problem of more serious.The manufacture of solar module described in patent document 1~3 is used
Conductive material in, when being particularly electrically connected to aluminium cloth line electrode, exist be difficult to fully improve conducting reliability the problem of.
It is an object of the present invention to provide a kind of electroconductive particle, and it can be in back contact solar battery module
Improve interelectrode conducting reliability.Another object of the present invention is to, there is provided a kind of back contact solar battery module is used
Conductive material, it use the electroconductive particle.The present invention also provides a kind of back contact solar battery module, and it is used
The conductive material.
For solving the scheme of technical problem
According to extensive aspect of the invention, there is provided a kind of back contact solar battery module electroconductive particle, it is used
In back contact solar battery module, wherein, the electroconductive particle has：Substrate particle and it is configured at the substrate particle
Conductive part on surface, there are multiple projections on the outer surface of the conductive part, the electroconductive particle is when compressing 10%
Modulus of elasticity in comperssion be 1100N/mm2Above and 5000N/mm2Hereinafter, also, the breaking strain of the electroconductive particle is
More than 55%.
In some particular aspects of the electroconductive particle of the present invention, the average heights of multiple projections for more than 50nm and
Below 800nm.
In some particular aspects of the electroconductive particle of the present invention, average height and the conductive part of multiple projections
The ratio between thickness be more than 0.1, less than 8.
The electroconductive particle of the present invention is applied to surface with the flexible printing substrate of cloth line electrode or surface with cloth
The electrode that the cloth line electrode and the surface of the resin film of line electrode have the solar battery cell of electrode is electrically connected
Connect.
In some particular aspects of the electroconductive particle of the present invention, the flexible printing substrate or the resin film it is described
Cloth line electrode is aluminium cloth line electrode, or the electrode of the solar battery cell is aluminium electrode.
According to extensive aspect of the invention, there is provided a kind of back contact solar battery module conductive material, it is included
Above-mentioned back contact solar battery module electroconductive particle and adhesive resin.
In some particular aspects of the conductive material of the present invention, described adhesive resin contains Thermocurable compound and heat
Curing agent.
According to extensive aspect of the invention, there is provided a kind of back contact solar battery module, it possesses：Surface has cloth
The resin film of flexible printing substrate or surface with cloth line electrode of line electrode, solar battery cell of the surface with electrode,
The connecting portion that the flexible printing substrate or the resin film are linked together with the solar battery cell, the connection
Portion is by the back contact solar electricity containing above-mentioned back contact solar battery module electroconductive particle and adhesive resin
Pond module is formed with conductive material, and the cloth line electrode and the electrode realize electrical connection by the electroconductive particle.
Invention effect
The back contact solar battery module electroconductive particle of the present invention possesses substrate particle and is configured at the base material
Conductive part on the surface of particle, there is multiple projections, the electroconductive particle compression 10% in the outer surface of the conductive part
When modulus of elasticity in comperssion be 1100N/mm2Above, 5000N/mm2Hereinafter, the breaking strain of the electroconductive particle be 55% with
On, it is thus possible to improve interelectrode conducting reliability.
Brief description of the drawings
Fig. 1 is the section for the back contact solar battery module electroconductive particle for representing first embodiment of the invention
Figure；
Fig. 2 is the section for the back contact solar battery module electroconductive particle for representing second embodiment of the invention
Figure；
Fig. 3 is the section for the back contact solar battery module electroconductive particle for representing third embodiment of the invention
Figure；
Fig. 4 is to represent to be obtained with electroconductive particle using the back contact solar battery module of first embodiment of the invention
The sectional view of one of the back contact solar battery module arrived；
Fig. 5 (a)~(c) is the first manufacture method for illustrating the back contact solar battery module shown in Fig. 4
The sectional view of each operation；
Fig. 6 (a)~(c) is the second manufacture method for illustrating the back contact solar battery module shown in Fig. 4
The sectional view of each operation.
Description of symbols
1 ... solar module
2 ... flexible printing substrates
2a ... cloth line electrodes
3 ... solar battery cells
3a ... electrodes
4 ... connecting portions
4A ... conductive materials
4B ... connecting materials
5 ... back sheet materials
6 ... encapsulants
21st, 21A, 21B ... electroconductive particle
21a, 21Aa, 21Ba ... projection
22 ... substrate particles
23,23A, 23B ... conductive part
23a, 23Aa, 23Ba ... projection
The conductive parts of 23Bx ... first
The conductive parts of 23By ... second
24 ... core materials
Embodiment
Hereinafter, the details of the present invention are illustrated.
(back contact solar battery module electroconductive particle)
The back contact solar battery module electroconductive particle of the present invention has substrate particle and is configured at the base material
Conductive part on the surface of particle.The back contact solar battery module electroconductive particle of the present invention is in above-mentioned conductive part
Outer surface has multiple projections.By pressure of the back contact solar battery module of present invention during electroconductive particle compression 10%
Contracting modulus of elasticity (10%K values) is 1100N/mm2Above, 5000N/mm2Below.The back contact solar battery mould of the present invention
The breaking strain of block electroconductive particle is more than 55%.
The present invention possesses above-mentioned technical proposal, it is thus possible to improve back contact solar battery module is interelectrode
Turn on reliability.As a result, the energy conversion efficiency after energy conversion efficiency at initial stage and reliability test can be improved.
For example, in back contact solar battery module, surface has the flexible printing substrate or surface tool of cloth line electrode
There are the cloth line electrode of the resin film of cloth line electrode and surface that there is electrode described in the solar battery cell of electrode to implement electricity
Connection.
Above-mentioned electroconductive particle has substrate particle and the conductive part being configured on the surface of above-mentioned substrate particle, thus,
Interval that can accurately between coordination electrode.In addition, above-mentioned specific scope is in by above-mentioned 10%K values, can also be high-precision
Interval between degree ground coordination electrode.In addition, electroconductive particle easily deforms according to the variation at interelectrode interval, because
This, can improve concavo-convex interelectrode conducting reliability.As a result, energy conversion efficiency and the reliability examination at initial stage can be improved
Energy conversion efficiency after testing.
In addition, above-mentioned electroconductive particle has multiple projections in the outer surface of conductive part, thus, even in the table of conductive part
Face and the surface of electrode form oxide-film, can also puncture oxide-film using projection.Therefore, interelectrode conducting reliability carries
It is high.
In addition, on the surface of the electrode of solar battery cell, occasionally there are bumps.In addition, flexible printing substrate or resin
There is also bumps sometimes on the surface of the cloth line electrode of film.Therefore, interelectrode interval is uneven sometimes.In addition, flexible printing
Substrate or resin film are soft, therefore, upon connection, with the deformation of flexible printing substrate or resin film, interelectrode
Become when being separated with uneven.In contrast, it is more than 55% by the breaking strain of above-mentioned electroconductive particle, even between electrode
The narrow region in interval, electroconductive particle will not also rupture, realize and reliably turn on the electrode of solar battery cell and scratch
The effect of the cloth line electrode of property printed base plate or resin film.Further, since there are multiple projections in the outer surface of conductive part, in electricity
Interpolar is spaced in narrow region, and electrode is crushed or punctured by projection to realize conducting, broad at interelectrode interval
Region in, be implemented around turning in the front end of projection.Therefore, above-mentioned electroconductive particle has by the outer surface in conductive part
Multiple projections, conducting reliability can be improved.
In addition, if electroconductive particle has projection on the outer surface of conductive part (surface of electric conductivity), then the projection quilt
Embedded electrode.Therefore, impacted even if applying to solar module, be not easy to produce bad connection.Therefore, can be effectively
Conducting reliability is improved, the photoelectric transformation efficiency in solar module can be improved.
The present inventor etc. have found first：By using the conduction on conductive part outer surface (surface of electric conductivity) with projection
Property particle, for the electrode back contact solar battery module implement electrical connection, the effect above can be obtained.Particularly
When the average height of multiple above-mentioned projections of above-mentioned electroconductive particle is more than 50nm and below 800nm, can further have
Effect ground plays the effect above.In addition, the average height for the multiple above-mentioned projections for passing through above-mentioned electroconductive particle be more than 50nm and
Below 600nm, it further can effectively play the effect above.In addition, in order to back contact solar battery module
Electrode between be electrically connected, and make electroconductive particle on conductive part outer surface with projection importance and technical meaning
Justice, found first by the inventors of the present invention.
Hereinafter, electroconductive particle used in back contact solar battery module is illustrated more fully with reference to the accompanying.With
Under embodiment in, different portion of techniques schemes can exchange.
Fig. 1 is the section for the back contact solar battery module electroconductive particle for representing first embodiment of the invention
Figure.
Electroconductive particle 21 shown in Fig. 1 has substrate particle 22 and the conductive part being configured on the surface of substrate particle 22
23.Conductive part 23 is conductive layer.Conductive part 23 has coated the surface of substrate particle 22.Conductive part 23 connects with substrate particle 22.
Electroconductive particle 21 is the coating particles that the surface of substrate particle 22 is coated by conductive part 23.
Electroconductive particle 21 has multiple projection 21a on the outer surface of conductive part 23.Conductive part 23 has on the outer surface
There are multiple projection 23a.
Electroconductive particle 21 has multiple core materials 24 on the surface of substrate particle 22.Conductive part 23 is to substrate particle 22
Coated with core material 24.Core material 24 is coated by conductive part 23, electroconductive particle 21 is in the outer of conductive part 23
There are multiple projection 21a on surface.The outer surface of conductive part 23 is swelled due to core material 24, forms multiple projections 21a, 23a.
Fig. 2 is the section for the back contact solar battery module electroconductive particle for representing second embodiment of the invention
Figure.
Electroconductive particle 21A shown in Fig. 2 has substrate particle 22 and the conduction being configured on the surface of substrate particle 22
Portion 23A.Conductive part 23A is conductive layer.Electroconductive particle 21 and electroconductive particle 21A are not only on the presence or absence of core material 24
With.Electroconductive particle 21A does not have core material.
Electroconductive particle 21A has multiple projection 21Aa on conductive part 23A outer surface.Conductive part 23A is in outer surface
It is upper that there are multiple projection 23Aa.
Conductive part 23A has Part I and the thicker Part II of the thickness ratio Part I.Therefore, conductive part 23A
There is projection 23Aa on outer surface (outer surface of conductive layer).Part in addition to multiple projections 21Aa, 23Aa is conductive part
23A above-mentioned Part I.Multiple projections 21Aa, 23Aa are the thicker above-mentioned Part II of conductive part 23A thickness.
Such as electroconductive particle 21A, in order to form projection 21Aa, 23Aa, not necessarily using core material.
Fig. 3 is the section for the back contact solar battery module electroconductive particle for representing third embodiment of the invention
Figure.
Electroconductive particle 21B shown in Fig. 3 has substrate particle 22 and the conduction being configured on the surface of substrate particle 22
Portion 23B.Conductive part 23B is conductive layer.Conductive part 23B has the first conductive part 23Bx being configured on the surface of substrate particle 22
With the second conductive part 23By being configured on the first conductive part 23Bx surface.
Electroconductive particle 21B has multiple projection 21Ba on conductive part 23B outer surface.Conductive part 23B is in outer surface
It is upper that there are multiple projection 23Ba.
Electroconductive particle 21B has multiple core materials 24 on the first conductive part 23Bx surface.Second conductive part 23By
First conductive part 23Bx and core material 24 are coated.Substrate particle 22 and the interval of core material 24 and configure.In base material
The first conductive part 23Bx between particle 22 and core material 24 be present.Core material 24 is coated by the second conductive part 23By,
Electroconductive particle 21B has multiple projection 21Ba on conductive part 23B outer surface.Conductive part 23B and the second conductive part 23By
Surface swelled due to core material 24, and form multiple projections 21Ba, 23Ba.
As electroconductive particle 21B, conductive part 23B can have sandwich construction.In addition, in order to formed projection 21Ba and
23Ba, core material 24 can also be configured on the first conductive part of internal layer 23Bx, and using the second conductive part of outer layer 23By to core
The conductive part 23Bx of material 24 and first is coated.
In addition, electroconductive particle 21,21A, 21B conductive part 23,23A, 23B outer surface on be respectively provided with multiple projections
21a、21Aa、21Ba.Electroconductive particle 21,21A, 21B above-mentioned 10%K values and above-mentioned breaking strain are in above-mentioned specific model
Enclose.
Using electroconductive particle 21 as described above, 21A, 21B etc., back contact solar battery of the invention is made
Module.But as long as electroconductive particle has a substrate particle and the conductive part being configured on the surface of above-mentioned substrate particle, and
There is multiple projections, and the above-mentioned 10%K values of above-mentioned electroconductive particle and above-mentioned breaking strain on the outer surface of above-mentioned conductive part
In above-mentioned particular range, the electroconductive particle beyond electroconductive particle 21,21A, 21B can also be used.
Then, explanation uses the back contact solar battery mould of one embodiment of the present invention more fully with reference to the accompanying
One of the solar module that block is obtained with electroconductive particle.
Represent back contact solar battery module using an embodiment of the invention with leading with sectional view in Fig. 4
The back contact solar battery module that conductive particles obtain.
Solar module 1 shown in Fig. 4 possesses：Flexible printing substrate 2, solar battery cell 3, the flexible print of connection
The connecting portion 4 of brush substrate 2 and solar battery cell 3.Connecting portion 4 has：By the conductive material shape containing electroconductive particle 21
Into first connecting portion, the second connecting portion that is formed by the connecting material for not containing electroconductive particle.Except electroconductive particle 21
In addition, electroconductive particle 21A, 21B etc. can also be used.Above-mentioned connecting portion can also be by the conduction only containing electroconductive particle 21
Material is formed.
In addition, in solar module 1, match somebody with somebody on the surface of the side opposite with the side of connecting portion 4 of flexible printing substrate 2
It is equipped with back sheet material 5.Encapsulant 6 is configured with the surface opposite with the side of connecting portion 4 of solar battery cell 3.Also may be used
To configure light-transmitting substrate etc. on the surface opposite with the side of solar battery cell 3 of encapsulant 6.
Flexible printing substrate 2 has multiple cloth line electrode 2a on surface (upper surface).Solar battery cell 3 is on surface
There is multiple electrodes 3a on (lower surface, the back side).Cloth line electrode 2a and electrode 3a is electrically connected using one or more electroconductive particles 21
Connect.Therefore, flexible printing substrate 2 and solar battery cell 3 realize electrical connection using electroconductive particle 21.Above-mentioned first connects
Socket part is configured between cloth line electrode 2a and electrode 3a.What above-mentioned second connecting portion was configured at flexible printing substrate 2 is not provided with cloth
Line electrode 2a part and being not provided between electrode 3a part for solar battery cell 3.Above-mentioned second connecting portion can also
It is configured between cloth line electrode 2a and electrode 3a.
In addition to having cloth line electrode 2a flexible printing substrate 2 on surface, can also use has wiring on surface
The resin film of electrode.
Solar module shown in Fig. 4 can obtain via the process for example shown in figure 5 below (a)~(c).
Prepare the flexible printing substrate 2 on surface with cloth line electrode 2a.In addition, prepare containing electroconductive particle 21 and glue
The conductive material 4A of mixture resin.In present embodiment, adhesive resin, which uses, contains Thermocurable compound and thermal curing agents
And the conductive material 4A with Thermocurable.Conductive material 4A is also connecting material.Then, as shown in Fig. 5 (a), printed in flexibility
Conductive material 4A (the first arrangement step) is optionally configured on the cloth line electrode 2a of brush substrate 2.Can also be in solar cell
Conductive material 4A is optionally configured on the electrode 3a of unit 3, to replace selecting on the cloth line electrode 2a of flexible printing substrate 2
Configure conductive material 4A to property.
In present embodiment, in above-mentioned first arrangement step, equably applied to globality not on flexible printing substrate
Cloth conductive material.It is preferred that configuring conductive material using cloth line electrode as target as much as possible, and preferably only match somebody with somebody on cloth line electrode
Put conductive material.But it is also possible to configure conductive material in the part for being not provided with cloth line electrode of flexible printing substrate.In flexibility
The conductive material of the part for the being not provided with cloth line electrode configuration of printed base plate is more few better.
Therefore, in above-mentioned first arrangement step, the conduction material that is configured on above-mentioned flexible printing substrate or above-mentioned resin film
Expect in the weight % of total amount 100, or in the weight % of conductive material total amount 100 being configured on above-mentioned solar battery cell, preferably
The amount for the conductive material being configured on above-mentioned cloth line electrode or on above-mentioned electrode is set to more than 70 weight %, is more preferably set to 90
More than weight %, further preferably it is set to 100 weight % (whole amount).But it is also possible to above-mentioned flexible printing substrate or on
State on the cloth line electrode of resin film and the part for being not provided with cloth line electrode of above-mentioned flexible printing substrate or above-mentioned resin film is equal
Conductive material is configured evenly.Can also it be set with above-mentioned solar battery cell on the electrode of above-mentioned solar battery cell
The part for putting electrode equably configures conductive material.
From the viewpoint of further raising configuration precision, the configuration of above-mentioned conductive material is preferably by printing or distributing
Device is coated with to carry out.Therefore, above-mentioned conductive material is preferably conductive paste.But above-mentioned conductive material can also be conducting film.
If using conducting film, can suppress with the flowing for postponing conducting film transition.On the other hand, it is necessary to prepare leading for prescribed level
Electrolemma.
In addition, prepare the solar battery cell 3 on surface with electrode 3a.Preparation does not contain the connection of electroconductive particle
Material 4B.Connecting material 4B contains Thermocurable compound and thermal curing agents.As shown in Fig. 5 (b), in solar battery cell 3
The surface provided with electrode 3a sides on configuration do not contain the connecting material 4B (the second arrangement step) of electroconductive particle.In addition,
In the case of optionally configuring conductive material 4A on the electrode 3a of solar battery cell 3, prepare that there is wiring on surface
Electrode 2a flexible printing substrate.Conduction is not contained in the surface configuration provided with cloth line electrode 2a sides of flexible printing substrate 2
The connecting material 4B (the second arrangement step) of property particle.In addition it is also possible to the connecting material for not containing electroconductive particle is not configured.
Then, following process is carried out：To the flexibility for being configured with conductive material 4A obtained in above-mentioned first arrangement step
Printed base plate 2 and the solar battery cell 3 for being configured with connecting material 4B obtained in above-mentioned second arrangement step are pasted
Close.That is, as shown in Fig. 5 (c), flexible printing substrate 2 and solar battery cell 3 are bonded, and cause flexible printing base
The cloth line electrode 2a of plate 2 and the electrode 3a of solar battery cell 3 are electrically connected (bonding process) by electroconductive particle 21.
The conductive material 4A containing electroconductive particle 21 is configured between cloth line electrode 2a and electrode 3a.In flexible printing substrate 2
The part and solar battery cell 3 for being not provided with cloth line electrode are not provided with being configured with without conductive between the part of electrode
The connecting material 4B of particle.
It is preferred that pressurizeed in above-mentioned bonding process.By pressurization, projection can effectively puncture the surface of conductive part
Or the oxide-film of electrode surface.As a result, it can further improve conducting reliability.The pressure of above-mentioned pressurization is preferably 9.8
×104More than Pa, preferably 1.0 × 106Below Pa.When the pressure of above-mentioned pressurization is more than above-mentioned lower limit and below the above-mentioned upper limit
When, further improve interelectrode conducting reliability.
As described above, form connecting portion 4 using conductive material 4A and connecting material 4B.In addition, as needed, pass through and configure
Back sheet material 5 or encapsulant 6, it can obtain the solar module 1 shown in Fig. 4.
Additionally, it is preferred that conductive material 4A and connecting material 4B is heated in above-mentioned bonding process.By heating, make conduction material
Expect 4A and connecting material 4B solidifications, the connecting portion 4 by solidification can be formed.
The temperature of above-mentioned heating is preferably more than 50 DEG C, more preferably more than 80 DEG C, more preferably more than 100 DEG C,
Preferably less than 200 DEG C, more preferably less than 170 DEG C.When above-mentioned heating temperature for it is more than above-mentioned lower limit and the above-mentioned upper limit with
When lower, can fully it be solidified, and effectively improve connection reliability.
Solar module shown in Fig. 4 can also obtain via the process shown in for example following Fig. 6 (a)~(c).
Prepare the flexible printing substrate 2 on surface with cloth line electrode 2a.In addition, prepare containing electroconductive particle 21 and glue
The conductive material 4A of mixture resin.As shown in Fig. 6 (a), optionally configuration is led on the cloth line electrode 2a of flexible printing substrate 2
Electric material 4A (the first arrangement step).Conductive material 4A can be optionally configured on the electrode 3a of solar battery cell 3,
To replace optionally configuring conductive material 4A on the cloth line electrode 2a of flexible printing substrate 2.
In addition, prepare not containing the connecting material 4B of electroconductive particle.Cloth line electrode is not provided with flexible printing substrate 2
2a part configuration connecting material 4B (the second arrangement step).In first arrangement step and the second arrangement step, can first it carry out
First arrangement step, it can also first carry out the second arrangement step.First arrangement step and the second arrangement step can be carried out simultaneously.
In addition, as shown in Fig. 6 (b), prepare the solar battery cell 3 on surface with electrode 3a.In addition, in solar energy
In the case of optionally configuring conductive material 4A on the electrode 3a of battery unit 3, prepare have cloth line electrode 2a's on surface
Flexible printing substrate 2.
Then, following process is carried out：To obtained in above-mentioned first, second arrangement step be configured with conductive material 4A and
Connecting material 4B flexible printing substrate 2 and solar battery cell 3 is bonded.As shown in Fig. 6 (c), to flexible printing base
Plate 2 and solar battery cell 3 are bonded, and cause the cloth line electrode 2a of flexible printing substrate 2 and the electricity of solar battery cell 3
Pole 3a realizes electrical connection (bonding process) by electroconductive particle 21.
As described above, form connecting portion 4 using conductive material 4A and connecting material 4B.In addition, as needed, it can pass through
Back sheet material 5 or encapsulant 6 are configured, obtains the solar module 1 shown in Fig. 4.
As located at the electrode of above-mentioned flexible printing substrate or above-mentioned resin film (cloth line electrode) and located at the above-mentioned sun
The electrode of energy battery unit, can be enumerated：Gold electrode, nickel electrode, tin electrode, aluminium electrode, copper electrode, silver electrode, molybdenum electrode and tungsten
The metal electrodes such as electrode.Wherein, preferably copper electrode (thin copper film electrode) or aluminium electrode (aluminium cloth line electrode), particularly preferably aluminium
Electrode (aluminium cloth line electrode).It is aluminium wiring electricity particularly preferably located at the cloth line electrode of above-mentioned flexible printing substrate or above-mentioned resin film
Pole, or located at the electrode of above-mentioned solar battery cell be aluminium electrode.In this case, located at above-mentioned flexible printing substrate or
The cloth line electrode of above-mentioned resin film and in the electrode of above-mentioned solar battery cell can be one of which electrode by aluminium
Formed or two kinds of electrodes are all formed by aluminium.Cloth line electrode located at above-mentioned flexible printing substrate or above-mentioned resin film can
To be aluminium cloth line electrode, the electrode located at above-mentioned solar battery cell can also be aluminium electrode.Using aluminium electrode (aluminium wiring
Electrode) in the case of, the effect of the present invention is further played, the further projection for playing electroconductive particle is particularly and produces
Effect.
Hereinafter, other details of electroconductive particle, conductive material and solar module are illustrated.
(electroconductive particle)
As above-mentioned substrate particle, can enumerate：Resin particle, the inorganic particulate in addition to metallic, organic-inorganic are miscellaneous
Change particle and metallic etc..Above-mentioned substrate particle is preferably the substrate particle in addition to metallic, more preferably resin particle
Son, the inorganic particulate in addition to metallic or organic inorganic hybridization particle.
Above-mentioned substrate particle is preferably the resin particle formed by resin.When being attached electrode, by conduction
After property particle is configured between electrode, typically electroconductive particle is compressed.If substrate particle is resin particle, electric conductivity
Particle is easy to deform because of compression, so as to which the contact area of electroconductive particle and electrode becomes big.Therefore, interelectrode conducting is reliable
Property improve.
As the resin for forming above-mentioned resin particle, preferably using various organic matters.As above-mentioned for being formed
The resin of resin particle, it can be used for example：Polyethylene, polypropylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, poly- isobutyl
The vistanexes such as alkene, polybutadiene；The acrylic resins such as polymethyl methacrylate, PMA；Poly- terephthaldehyde
Sour alkylidene diol ester, makrolon, polyamide, phenol formaldehyde resin, melamine resin, benzoguanamine formaldehyde tree
Fat, urea formaldehyde resin, phenolic resin, melmac, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester (UP)
Resin, saturated polyester resin, polysulfones, polyphenylene oxide, polyacetals, polyimides, polyamidoimide, polyether-ether-ketone, polyether sulfone and
Polymer etc. obtained from as a kind or the two or more various polymerizable monomers with ethylenically unsaturated group polymerize.
By being polymerize a kind or the two or more various polymerizable monomers with ethylenically unsaturated group, it can design and synthesize
The arbitrary resin particle with physical property when compressing suitable for conductive material.
In the case of being polymerize in the monomer for making there is ethylenically unsaturated group and obtaining above-mentioned resin particle, as upper
The monomer with ethylenically unsaturated group is stated, the monomer of non-crosslinked property and the monomer of bridging property can be enumerated.
As the monomer of above-mentioned non-crosslinked property, such as can enumerate：The styrene monomers such as styrene, α-methylstyrene；
The carboxylic monomers such as (methyl) acrylic acid, maleic acid, maleic anhydride；(methyl) methyl acrylate, (methyl) ethyl acrylate,
(methyl) propyl acrylate, (methyl) butyl acrylate, (methyl) 2-EHA, (methyl) lauryl acrylate,
(methyl) aliphatic acrylate, (methyl) stearyl acrylate ester, (methyl) cyclohexyl acrylate, the different ice of (methyl) acrylic acid
Piece ester etc. (methyl) alkyl-acrylates；(methyl) acrylic acid 2- hydroxy methacrylates, (methyl) glycerol acrylate, (methyl) third
Olefin(e) acid polyoxyethylene ester, (methyl) glycidyl acrylate, (methyl) acrylic acid dicyclopentenyl base ester, (methyl) acrylic acid two
Cyclopentene epoxide ethyl ester, (methyl) acrylic acid bicyclopentyl ester, 1,3- adamantane glycol two (methyl) acrylate etc. are containing aerobic
(methyl) esters of acrylic acid of atom；(methyl) acrylonitrile etc. contains nitrile monomer；Methyl vinyl ether, ethyl vinyl ether, propyl group
The vinyl ethers such as vinyl ethers；Vinyl-acetic ester, butyric acid vinyl esters, vinyl laurate, vinyl stearate base ester
Etc. sour vinyl ester；The unsaturated hydrocarbons such as ethene, propylene, isoprene, butadiene；(methyl) acrylic acid trifluoromethyl ester, (first
Base) halogen containing monomer such as five fluorine ethyl ester of acrylic acid, vinyl chloride, PVF, chlorostyrene etc..
From the viewpoint of making compression property further good, preferred aliphat (methyl) acrylate, more preferably
(methyl) cyclohexyl acrylate, (methyl) isobornyl acrylate, (methyl) acrylic acid dicyclopentenyl base ester, (methyl) acrylic acid
Dicyclopentenyl epoxide ethyl ester, (methyl) acrylic acid bicyclopentyl ester or 1,3- adamantane glycol two (methyl) acrylate.
As the monomer of above-mentioned bridging property, such as can enumerate：Tetramethylol methane four (methyl) acrylate, tetra methylol
Methane three (methyl) acrylate, tetramethylol methane two (methyl) acrylate, trimethylolpropane tris (methyl) acrylic acid
Ester, dipentaerythritol six (methyl) acrylate, dipentaerythritol five (methyl) acrylate, three (methyl) propylene acid glycerols
Ester, two (methyl) glycerol acrylates, (poly-) ethylene glycol two (methyl) acrylate, (poly-) propane diols two (methyl) acrylic acid
Ester, the multifunctional (first such as (poly-) tetramethylene glycol two (methyl) acrylate, Isosorbide-5-Nitrae-butanediol two (methyl) acrylate
Base) esters of acrylic acid；Triallyl (different) cyanurate, triallyl trimellitate, divinylbenzene, phthalic acid two
Allyl ester, diallyl acrylamide, diallyl ether, γ-(methyl) acryloxypropyl trimethoxy silane, trimethoxy
Silane-containing monomers such as base silicyl styrene, vinyltrimethoxy silane etc..
From the viewpoint of making compression property further good, preferably multifunctional (methyl) acrylate, more preferably
For (methyl) acrylate of (poly-) tetramethylene glycol two or 1,4- butanediols two (methyl) acrylate.
It polymerize the above-mentioned polymerizable monomer with ethylenically unsaturated group by using known method, can obtains
State resin particle.It can be enumerated as this method：For example, the side of suspension polymerisation is carried out in the presence of radical polymerization initiator
Method and the method that makes to be polymerize monomer swell together with radical polymerization initiator on noncrosslinking kind of particle etc..
In the case where above-mentioned substrate particle is inorganic particulate or organic inorganic hybridization particle in addition to metallic, make
For the inorganic matter of substrate particle material, silica and carbon black etc. can be enumerated.Above-mentioned inorganic matter is inorganic preferably in addition to metal
Thing.As the particle formed by above-mentioned silica, it is not particularly limited, but can enumerates for example by more than 2
After the silicon compound of water-disintegrable alkoxysilyl is hydrolyzed and forms cross-linking polymer particle, by carrying out as needed
Particle obtained from burning till.As above-mentioned organic inorganic hybridization particle, it is polymerize for example, can enumerate by the alkoxy silicane being crosslinked
Organic inorganic hybridization particle that thing and acrylic resin are formed etc..
In the case where above-mentioned substrate particle is metallic, as the metal of the metallic material, can enumerate：Silver,
Copper, nickel, silicon, gold and titanium etc..But substrate particle is not preferably metallic.
The average grain diameter of above-mentioned substrate particle is preferably more than 0.5 μm, more preferably more than 1 μm, preferably 500 μm with
Under, more preferably less than 100 μm, more preferably less than 50 μm, particularly preferably less than 30 μm.Above-mentioned substrate particle is put down
Equal particle diameter can also be less than 20 μm.When the average grain diameter of substrate particle is more than above-mentioned lower limit and below the above-mentioned upper limit,
In the case of between electroconductive particle connection electrode, the contact area of electroconductive particle and electrode fully becomes big, and is being formed
During conductive layer, it is not easy to form the electroconductive particle of cohesion.In addition, the interelectrode interval connected via electroconductive particle will not mistake
Greatly, and conductive part is not easy the sur-face peeling from substrate particle.From the concavo-convex influence for absorbing solar battery cell circuit surface
From the viewpoint of, the average grain diameter of above-mentioned substrate particle is preferably more than 10 μm and less than 30 μm.
" average grain diameter " of above-mentioned substrate particle represents number average bead diameter.The average grain diameter of resin particle is by using electronic display
Micro mirror or any 50 resin particles of observation by light microscope, and calculate average value and try to achieve.
The thickness of above-mentioned conductive part is preferably more than 5nm, more preferably more than 10nm, more preferably more than 20nm,
Particularly preferably more than 50nm, preferably below 1000nm, more preferably below 800nm, more preferably below 500nm,
Particularly preferably below 400nm, most preferably below 300nm.In the case of with multiple conductive parts, the thickness of above-mentioned conductive part
Degree represents the gross thickness of multiple conductive parts.When the thickness of above-mentioned conductive part is more than above-mentioned lower limit, the conduction of electroconductive particle
Property become further good.When the thickness of above-mentioned conductive part is below the above-mentioned upper limit, substrate particle and conductive part it is hot swollen
The difference of swollen rate diminishes, and conductive part is not easy to peel off from substrate particle.
As the method that above-mentioned conductive part is formed on the surface of above-mentioned substrate particle, can enumerate conformal by electroless plating
Into the method for above-mentioned conductive part, and by electroplating method for forming above-mentioned conductive part etc..
Above-mentioned conductive part preferably comprises metal.Above-mentioned conductive part material is that metal is not particularly limited.As the metal, example
It can such as enumerate：Gold, silver, copper, platinum, palladium, zinc, lead, aluminium, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium, tungsten, molybdenum and cadmium and they
Alloy etc..In addition, as above-mentioned metal, tin-doped indium oxide (ITO) can also be used.Above-mentioned metal can be used alone,
It can also be applied in combination two or more.
Above-mentioned electroconductive particle has multiple projections on the outer surface of conductive part.It is above-mentioned by the way that above-mentioned core material is embedded to
In conductive part, projection can be readily formed on the outer surface of above-mentioned conductive part.Connect in most cases by electroconductive particle
Oxide-film is formed on the surface of the electrode connect.In the case where using the electroconductive particle with projection, by matching somebody with somebody between electrode
Put electroconductive particle and crimped, above-mentioned oxide-film is effectively excluded using projection.Therefore, electrode and electroconductive particle more enter
One step reliably contacts, the interelectrode connection further step-down of resistance.In addition, it can effectively exclude electric conductivity grain using projection
Adhesive resin between son and electrode.Therefore, interelectrode conducting reliability uprises.
As the method that projection is formed on the surface of above-mentioned electroconductive particle, can enumerate attached on the surface of substrate particle
After core material, pass through the conformal method into conductive part of electroless plating；And by non-electrolytic plating on the surface of substrate particle
Upper formation conductive part, then adheres to core material, further conformal into method of conductive part etc. by electroless plating.As in formation
Other methods of projection are stated, can be enumerated：After the first conductive part is formed on the surface of substrate particle, match somebody with somebody on first conductive part
Core material is put, the method for then forming the second conductive part；And the midway stage of conductive part is formed on the surface of substrate particle,
Method for adding core material etc..As the method for the surface attachment core material in above-mentioned substrate particle, can use currently known
Method.By the way that above-mentioned core material is embedded in above-mentioned conductive part, it is easy to make above-mentioned conductive part that there is multiple dash forward on the outer surface
Rise.But in order to form projection on the surface of electroconductive particle and conductive part, it must not necessarily use core material.Above-mentioned core
Material preferred disposition is in the inside of conductive part or inner side.
As the material of above-mentioned core material, conductive material and non-conducting material can be enumerated.As above-mentioned electric conductivity thing
Matter, for example, can enumerate：The electrically conductive, non-metallics and electric conductive polymer etc. such as metal, the oxide of metal, graphite.As above-mentioned
Electric conductive polymer can enumerate polyacetylene etc..It can be enumerated as above-mentioned non-conducting material：Silica, aluminum oxide and zirconium oxide
Deng.Wherein, due to electric conductivity can be improved, and connection resistance can be effectively further reduced, therefore preferred metal.Above-mentioned core
The preferred metallic of material.
As above-mentioned metal, such as can enumerate：Gold, silver, copper, platinum, zinc, iron, lead, tin, aluminium, cobalt, indium, nickel, chromium, titanium, antimony,
The metals such as bismuth, germanium and cadmium, and tin-lead alloy, tin-copper alloy, tin-silver alloy, tin-lead-silver alloy and tungsten carbide etc. are by two
Alloy that the metal of the kind above is formed etc..Particularly preferably nickel, copper, silver or gold., can be with as the metal of above-mentioned core material material
It is same with the metal phase as above-mentioned conductive part material, can also be different.The material of above-mentioned core material preferably comprises nickel.In addition, make
For the oxide of above-mentioned metal, aluminum oxide, silica and zirconium oxide etc. can be enumerated.
The shape of above-mentioned core material is not particularly limited.Core material is preferably shaped to bulk.As core material, such as can
Enumerate the block of particle shape, multiple fine particles condense the cohesion block formed and unbodied piece etc..
The average diameter (average grain diameter) of above-mentioned core material is preferably more than 0.001 μm, more preferably more than 0.05 μm, preferably
For less than 0.6 μm, more preferably less than 0.4 μm.The average diameter of above-mentioned core material can also be less than 0.9 μm, or 0.2
Below μm.When the average diameter of above-mentioned core material is more than above-mentioned lower limit and below the above-mentioned upper limit, electrode can be effectively reduced
Between connection resistance.
" average diameter (average grain diameter) " of above-mentioned core material represents number average diameter (number average bead diameter).The average diameter of core material leads to
Cross and utilize electron microscope or any 50 core materials of observation by light microscope, and calculate average value and try to achieve.
The above-mentioned number of projection of each above-mentioned electroconductive particle is preferably more than 10, more preferably more than 200,
Particularly it is more preferably more than 500.Above-mentioned number of projection can also be more than 3, or more than 5.It is above-mentioned prominent
The upper limit of the quantity risen is not particularly limited.The upper limit of above-mentioned number of projection is contemplated that particle diameter of electroconductive particle etc. and appropriate
Selection.Above-mentioned number of projection is preferably less than 1500, more preferably less than 1000.
From it is further improve conducting reliability from the viewpoint of, the average heights of multiple above-mentioned projections be preferably 50nm with
On, more preferably more than 200nm, preferably below 800nm, more preferably less than 700 μm, more preferably below 600nm,
Particularly preferably below 500nm.The average height of multiple above-mentioned projections is particularly preferably more than 50nm, below 800nm, further
Preferably more than 50nm, below 600nm.When the average height of above-mentioned projection is more than above-mentioned lower limit and below the above-mentioned upper limit,
It is effectively reduced interelectrode connection resistance.
The height of above-mentioned projection refers to：Line (the dotted line shown in Fig. 1 of the front end of connecting conductive particle centre and projection
L1 it is on), from the dummy line (the dotted line L2 shown in Fig. 1) of conductive part when assuming no projection (it is assumed that ball during without projection
On the outer surface of shape electroconductive particle) to projection front end distance.That is, in Fig. 1, the intersection point from dotted line L1 and dotted line L2 is represented
To the distance of the front end of projection.
From the viewpoint of further raising conducting reliability, average height and the above-mentioned conductive part of multiple above-mentioned projections
The ratio between thickness be preferably more than 1, more preferably more than 2, preferably less than 7, more preferably less than 6.
It is 1100N/mm by the modulus of elasticity in comperssion (10%K values) during above-mentioned electroconductive particle compression 10%2More than,
5000N/mm2Below.From the viewpoint of further raising conducting reliability, above-mentioned 10%K values are preferably 1300N/mm2With
On, more preferably 1500N/mm2More than, it is still more preferably 1600N/mm2More than, more preferably 1800N/mm2With
On, particularly preferably 2000N/mm2More than, preferably 4500N/mm2Hereinafter, more preferably 4000N/mm2Below.
The above-mentioned modulus of elasticity in comperssion (10%K values) of above-mentioned electroconductive particle can be measured.
Using micro-compression tester, using cylinder (50 μm of diameter, diamond is made) smooth pressure head end face 25 DEG C,
Compression conductive particle under conditions of compression speed 2.6mN/ seconds and maximum test load 10gf.The load value (N) of measure now
And compression displacement (mm).Above-mentioned modulus of elasticity in comperssion can be tried to achieve according to following formula according to obtained measured value.As above-mentioned micro-
Small compression test, such as " Fischer Scope H-100 " etc. of Fischer companies manufacture can be used.
K values (N/mm2)=(3/21/2)·F·S-3/2·R-1/2
F：Electroconductive particle carries out the load value (N) when 10%, 30% or 50% compression
S：Electroconductive particle carries out the compression displacement (mm) when 10%, 30% or 50% compression
R：The radius (mm) of electroconductive particle
Above-mentioned modulus of elasticity in comperssion is universal and quantitatively represents the hardness of electroconductive particle.Pass through above-mentioned modulus of elasticity in comperssion
Use, can quantify and uniquely represent electroconductive particle hardness.
The breaking strain of above-mentioned electroconductive particle is more than 55%.Come from the further viewpoint for improving conducting reliability
See, the breaking strain of above-mentioned electroconductive particle is preferably more than 60%, more preferably more than 65%, more preferably 70% with
On.In addition, in the case of unbroken, breaking strain actually exceeds 70%.
Above-mentioned breaking strain can be measured.
Using micro-compression tester, using cylinder (50 μm of diameter, diamond is made) smooth pressure head end face 25 DEG C,
Compression conductive particle under conditions of compression speed 2.6mN/ seconds and maximum test load 10gf.Breaking strain is according to compression
During compression displacement of electroconductive particle when rupturing the value tried to achieve according to following formula of measured value.
Breaking strain (%)=(B/D) × 100
B：Compression displacement (mm) when electroconductive particle ruptures
D：The diameter (mm) of electroconductive particle
For example, can be by adjusting the composition of the monomer for forming substrate particle, by above-mentioned modulus of elasticity in comperssion and above-mentioned broken
Split strain controlling within the above range.
(conductive material and connecting material)
The back contact solar battery module of the present invention includes above-mentioned electroconductive particle and adhesive with conductive material
Resin.Above-mentioned adhesive resin is not particularly limited.As above-mentioned adhesive resin, known insulative resin can be used.
Above-mentioned adhesive resin, above-mentioned conductive material and above-mentioned connecting material preferably comprise thermoplastic composition or Thermocurable
Composition.Above-mentioned adhesive resin, above-mentioned conductive material and above-mentioned connecting material can also contain thermoplastic composition, can also contain
Thermocurable composition.Above-mentioned adhesive resin, above-mentioned conductive material and above-mentioned connecting material preferably comprise Thermocurable composition.On
State adhesive resin, above-mentioned conductive material and above-mentioned connecting material preferably comprise can be by heating to solidify curability compound
(Thermocurable compound) and thermal curing agents.It is above-mentioned can by heating and the curability compound that solidifies and above-mentioned thermal curing agents with
Appropriate match ratio uses, so that above-mentioned adhesive resin solidifies.
As above-mentioned Thermocurable compound, can enumerate：Epoxide, episulfide compounds, (methyl) acrylic acid chemical combination
Thing, oxybenzene compound, amino-compound, unsaturated polyester compound, urethanes, organo-silicon compound and polyimides
Compound etc..Above-mentioned Thermocurable compound can be used only a kind, can also be applied in combination two or more.
As above-mentioned thermal curing agents, can enumerate：Imidazole curing agent, amine hardener, phenol cured agent, polythiol curing agent,
Acid anhydrides and hot cationic curing initiator etc..Above-mentioned thermal curing agents can be used alone, can also be applied in combination two kinds with
On.
In the above-mentioned weight % of conductive material 100, the content of above-mentioned adhesive resin is preferably more than 10 weight %, more preferably
For more than 30 weight %, more preferably more than 50 weight %, particularly preferably more than 70 weight %, preferably 99.99 weights
Below % is measured, more preferably below 99.9 weight %.The content of above-mentioned adhesive resin is more than above-mentioned lower limit and the above-mentioned upper limit
When following, electroconductive particle can be effectively configured between electrode, further improves connection reliability.
In the above-mentioned weight % of conductive material 100, the content of above-mentioned electroconductive particle is preferably more than 0.01 weight %, more excellent
Elect as more than 0.1 weight %, preferably below 80 weight %, more preferably below 60 weight %, more preferably 40 weights
Below % is measured, particularly preferably below 20 weight %, most preferably below 10 weight %.When the content of above-mentioned electroconductive particle is
When more than above-mentioned lower limit and below the above-mentioned upper limit, interelectrode conducting reliability is further improved.
Hereinafter, enumerate embodiment and comparative example specifically describes the present invention.The present invention is not limited to following embodiment.
(embodiment 1)
(1) making of electroconductive particle
(making of polymer seeds particle dispersion)
Ion exchange water 2500g, styrene 250g, octyl mercaptan 50g and sodium chloride 0.5g are put into separate type flask,
Stirred under nitrogen atmosphere.Then, 70 DEG C are heated to, adds potassium peroxide 2.5g, and react within 24 hours, thus, is gathered
Compound seed grain.
Obtained polymer seeds particle 5g, ion exchange water 500g, the weight % aqueous solution 100g of polyvinyl alcohol 5 are mixed
Close, after being disperseed by ultrasonic wave, be put into separate type flask and be stirred, obtain polymer seeds particle dispersion.
(making of polymer particle)
By 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 95g, divinylbenzene 90g, benzoyl peroxide
2.6g, dodecyltriethanolamine sulfate 10g, ethanol 130g are added in ion exchange water 1000g and are stirred, and are emulsified
Liquid.Obtained emulsion fraction time is added in polymer seeds particle dispersion, stirred 12 hours.Then, poly- second is added
The weight % aqueous solution 500g of enol 5, carried out under 85 DEG C of nitrogen atmosphere 9 hours react, obtain polymer particle (resin particle,
10.0 μm of average grain diameter).
The making of electroconductive particle：
Water-filling of going forward side by side is etched to above-mentioned polymer particle to wash.Then, urged to the palladium of the palladium catalyst containing 8 weight %
Polymer particle is added in agent liquid 100mL and is stirred.Then, filtered, washing.To pH6 0.5 weight % bis-
Polymer particle is added in methylamine borine liquid, obtains being attached with the polymer particle of palladium.
The polymer particle of adhesion palladium is stirred 3 minutes in ion exchange water 300mL and is allowed to scattered, obtains dispersion liquid.
Then, disperse by the use of 3 minutes nickel particles slurries (as the average grain diameter 400nm of the nickel particles of core material) using 1g added to above-mentioned
In liquid, obtain being attached with the polymer particle of core material.
Using the polymer particle for being attached with core material, formed by non-electrolytic plating on the surface of polymer particle
Nickel dam.Being produced on has the electroconductive particle of multiple projections on the outer surface of nickel dam.It should be noted that the thickness of nickel dam is
0.3μm.The average height of multiple projections is 400nm.
(2) making of conductive material (conductive paste)
Mix epoxide (" EP-3300P " of the manufacture of ADEKA companies) 20 weight as Thermocurable compound
Part, epoxide (DIC companies manufacture " EPICLON HP-4032D ") 15 parts by weight as Thermocurable compound, make
For amine additives (" PN-F " of the manufacture of Ajinomoto Fine-Techno companies) 10 parts by weight of the imidazoles of thermal curing agents, make
Aluminum oxide (0.5 μm of average grain diameter) 20 weight for the parts by weight of 2-ethyl-4-methylimidazole 1 of curing accelerator, as filler
Part, further add electroconductive particle, so as to get the weight % of conductive paste 100 in the content of electroconductive particle turn into 10 weights
% is measured, then, is stirred 5 minutes with 2000rpm using planetary stirring machine, thus, obtains conductive material.
(3) making of connecting material (paste)
Mix epoxide (" EP-3300P " of the manufacture of ADEKA companies) 20 weight as Thermocurable compound
Part, epoxide (DIC companies manufacture " EPICLON HP-4032D ") 15 parts by weight as Thermocurable compound, make
For amine additives (" PN-F " of the manufacture of Ajinomoto Fine-Techno companies) 10 parts by weight of the imidazoles of thermal curing agents, make
Aluminum oxide (0.5 μm of average grain diameter) 20 weight for the parts by weight of 2-ethyl-4-methylimidazole 1 of curing accelerator, as filler
Part, obtain connecting material.
(4) making of solar module
Preparing surface has the flexible printing substrate (L/S=300 μm/300 μm) of aluminium cloth line electrode.In addition, prepare surface
Solar battery cell (L/S=300 μm/300 μm) with copper electrode.
On the cloth line electrode of flexible printing substrate, using distributor optionally applying conductive material, and it is partially formed
The conductive material layer that 60 μm of thickness.Whole conductive materials on flexible printing substrate are configured on cloth line electrode.That is, it is configured at
In the weight % of conductive material total amount 100 on flexible printing substrate, the amount for the conductive material being configured on cloth line electrode is 100 weights
Measure %.
In addition, in the whole surface of the side provided with electrode of solar battery cell, connecting material is coated with by printing,
Form the connecting material layer of 40 μm of thickness.
Then, it is bonded flexible printing substrate and solar battery cell, and causes the aluminium wiring electricity of flexible printing substrate
The copper electrode of pole and solar battery cell is realized by electroconductive particle and electrically connected.Now, flexible printing substrate and too is configured
Positive energy battery unit makes them be sandwiched in glass baseplate and EVA film, and the vacuum layer of 5 minutes is carried out under 150 DEG C of atmosphere
Pressure.Pass through heating during lamination, conductive material layer and connecting material layer is solidified to form connecting portion.Obtain flexible printing substrate
Aluminium cloth line electrode and the copper electrode of solar battery cell the solar cell mould of electrical connection is realized by electroconductive particle
Block.
(embodiment 2)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, isobornyl acrylate 133g, polytetramethylene glycol diacrylate are used
Ester 48g, cyclohexyl acrylate 9g, to replace 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 95g, divinyl
Beyond benzene 90g, in the same manner as in Example 1, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.3 μm.It is multiple prominent
The average height risen is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 3)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, isobornyl acrylate 133g, polytetramethylene glycol diacrylate are used
Ester 28g, cyclohexyl acrylate 29g, to replace 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 95g, divinyl
Beyond benzene 90g, in the same manner as in Example 1, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.3 μm.It is multiple prominent
The average height risen is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 4)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, isobornyl acrylate 133g, polytetramethylene glycol diacrylate are used
Ester 38g, cyclohexyl acrylate 19g, to replace 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 95g, divinyl
Beyond benzene 90g, in the same manner as in Example 1, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.3 μm.It is multiple prominent
The average height risen is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 5)
Except changing the average grain diameter of core material and the average height of multiple projections of electroconductive particle being altered into 50nm
In addition, in the same manner as in Example 1, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.3 μm.Multiple projections are put down
Height is 50nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 6)
Except changing the average grain diameter of core material and the average height of multiple projections of electroconductive particle being altered into 750nm
In addition, in the same manner as in Example 1, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.3 μm.Multiple projections are put down
Height is 750nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 7)
In addition to the electrode of solar battery cell is altered into aluminium electrode by copper electrode, in the same manner as in Example 1, obtain
Solar module.
(embodiment 8)
In addition to the average grain diameter of polymer particle is altered into 20 μm in the making polymer beads period of the day from 11 p.m. to 1 a.m, with embodiment 1
Equally, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.2 μm.The average height of multiple projections is 400nm.
Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 9)
Except changing the average grain diameter of core material and the average height of multiple projections of electroconductive particle being altered into 200nm
In addition, in the same manner as in Example 8, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.2 μm.Multiple projections are put down
Height is 200nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 10)
Except changing the average grain diameter of core material and the average height of multiple projections of electroconductive particle being altered into 600nm
In addition, in the same manner as in Example 8, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.2 μm.Multiple projections are put down
Height is 600nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 11)
Using the polymer particle used in embodiment 1, without using nickel particles slurry, but by reacting the life in plating bath
Into nickel core material, and an electroless nickel plate is eutectoid out together with the core material of generation, thus, obtain having on the outer surface of nickel dam
The electroconductive particle of multiple projections.The thickness of the nickel dam of electroconductive particle is 0.1 μm, and the average height of multiple projections is 250nm.
In addition to using obtained electroconductive particle, in the same manner as in Example 1, solar module is obtained.
(embodiment 12)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, isobornyl acrylate 133g, polytetramethylene glycol diacrylate are used
Ester 48g, cyclohexyl acrylate 9g, to replace 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 95g, divinyl
Beyond benzene 90g, in the same manner as in Example 8, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.2 μm.It is multiple prominent
The average height risen is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 13)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, isobornyl acrylate 133g, polytetramethylene glycol diacrylate are used
Ester 28g, cyclohexyl acrylate 29g, to replace 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 95g, divinyl
Beyond benzene 90g, in the same manner as in Example 8, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.2 μm.It is multiple prominent
The average height risen is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 14)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, isobornyl acrylate 133g, polytetramethylene glycol diacrylate are used
Ester 38g, cyclohexyl acrylate 19g, to replace 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 95g, divinyl
Beyond benzene 90g, in the same manner as in Example 8, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.3 μm.It is multiple prominent
The average height risen is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 15)
In addition to the thickness of nickel dam is altered to 0.8 μm and change the height of projection, in the same manner as in Example 8, obtain
Electroconductive particle.The average height of multiple projections is 500nm.Using obtained electroconductive particle in the same manner as in Example 1, obtain too
Positive energy battery module.
(embodiment 16)
In addition to the thickness of nickel dam is altered into 0.1 μm, in the same manner as in Example 8, electroconductive particle is obtained.Multiple projections
Average height be 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 17)
Except using electroless plating gold to embodiment 8 in obtained electroconductive particle implement it is gold-plated in addition to, with embodiment 8 one
Sample, obtain electroconductive particle.In addition, nickel dam and the aggregate thickness of layer gold are 0.25 μm (0.2 μm of nickel dam).Multiple projections are averaged
Highly it is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 18)
In addition to the coating of electroconductive particle is changed into only layers of copper, in the same manner as in Example 8, electric conductivity grain is obtained
Son.In addition, the thickness of layers of copper is 0.2 μm.The average height of multiple projections is 400nm.Use obtained electroconductive particle and reality
As applying example 1, solar module is obtained.
(embodiment 19)
In addition to the outermost layer of the coating of electroconductive particle is altered into palladium layers, as embodiment 17, conduction is obtained
Property particle.In addition, nickel dam and the aggregate thickness of palladium layers are 0.25 μm (0.2 μm of nickel dam).The average height of multiple projections is
400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 20)
Except the nickel dam as electroconductive particle coating is changed into layers of copper, and the outermost layer as coating is altered to palladium layers
In addition, as embodiment 17, electroconductive particle is obtained.In addition, the aggregate thickness of layers of copper and palladium layers is 0.25 μm of (μ of layers of copper 0.2
m).The average height of multiple projections is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar cell is obtained
Module.
(embodiment 21)
In addition to the outermost layer of the coating of electroconductive particle is altered into silver layer, as embodiment 17, conduction is obtained
Property particle.In addition, the aggregate thickness of nickel dam and silver layer is 0.25 μm (0.2 μm of nickel dam).The average height of multiple projections is
400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 22)
In addition to the thickness of nickel dam is altered into 1.3 μm, in the same manner as in Example 8, electroconductive particle is obtained.Multiple projections
Average height be 600nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(embodiment 23)
In addition to the thickness of nickel dam is altered into 0.09 μm, in the same manner as in Example 8, electroconductive particle is obtained.It is multiple prominent
The average height risen is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(comparative example 1)
Prepare the polymer particle obtained in embodiment 1.Using the polymer particle, it is being polymerize by non-electrolytic plating
Nickel dam is formed on the surface of thing particle, makes electroconductive particle.In comparative example 1, not electroconductive particle conductive part table
Projection is formed on face.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(comparative example 2)
In addition to conductive material (conductive paste) is altered into solder paste, in the same manner as in Example 1, solar-electricity is obtained
Pond module.
(comparative example 3)
In addition to conductive material (conductive paste) is altered into Ag pastes, in the same manner as in Example 1, solar cell is obtained
Module.
(comparative example 4)
Except make the polymer beads period of the day from 11 p.m. to 1 a.m, using 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 135g,
Divinylbenzene 50g, come replace 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 95g, divinylbenzene 90g with
Outside, in the same manner as in Example 1, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.3 μm.Multiple projections are averaged
Highly it is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(comparative example 5)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, isobornyl acrylate 113g, polytetramethylene glycol diacrylate are used
Ester 68g, cyclohexyl acrylate 9g, to replace 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 95g, divinyl
Beyond benzene 90g, in the same manner as in Example 1, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.3 μm.It is multiple prominent
The average height risen is 400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(comparative example 6)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, 1,3- adamantane glycol diacrylates are replaced using divinylbenzene 190g
Beyond ester 5g, 2-ethyl hexyl acrylate 95g, divinylbenzene 90g, in the same manner as in Example 1, electroconductive particle is obtained.Need what is illustrated
It is that the thickness of nickel dam is 0.3 μm.The average height of multiple projections is 400nm.Use obtained electroconductive particle and embodiment 1
Equally, solar module is obtained.
(comparative example 7)
Except making the polymer beads period of the day from 11 p.m. to 1 a.m, polytetramethylene glycol diacrylate 152g, divinylbenzene are used
38g, to replace beyond 1,3- adamantane omega-diol diacrylates 5g, 2-ethyl hexyl acrylate 95g, divinylbenzene 90g, with embodiment
As 1, electroconductive particle is obtained.It should be noted that the thickness of nickel dam is 0.3 μm.The average height of multiple projections is
400nm.Using obtained electroconductive particle in the same manner as in Example 1, solar module is obtained.
(evaluation)
(1) modulus of elasticity in comperssion (10%K values) of electroconductive particle
By above-mentioned method, micro-compression tester (" the Fischer Scope H- that Fischer companies manufacture are used
100 ") modulus of elasticity in comperssion (10%K values) for the electroconductive particle that measure obtains.
(2) breaking strain of electroconductive particle
By above-mentioned method, micro-compression tester (" the Fischer Scope H- that Fischer companies manufacture are used
100 ") breaking strain for the electroconductive particle that measure obtains.
(3) energy conversion efficiency at initial stage
Determine the energy conversion efficiency of obtained solar module.In addition, initial stage is judged by following benchmark
Energy conversion efficiency.
The metewand of energy conversion efficiency [initial stage]
○○○○：Energy conversion efficiency is more than 22%
○○○：Energy conversion efficiency is more than 20% and less than 22%
○○：Energy conversion efficiency is more than 18% and less than 20%
○：Energy conversion efficiency is more than 16% and less than 18%
△：Energy conversion efficiency is more than 14% and less than 16%
×：Energy conversion efficiency is less than 14%
(4) energy conversion efficiency after reliability test
For obtained solar module, following cyclic tests of 200 circulations are carried out using circulation testing machine：
At -40 DEG C~90 DEG C, the retention time be 30 minutes, rate of temperature change be 87 DEG C/h, then, determine energy conversion efficiency.
The energy conversion efficiency after reliability test is judged by following benchmark.
[metewand of the energy conversion efficiency after reliability test]
○○○○：Energy conversion efficiency is more than 22%
○○○：Energy conversion efficiency is more than 20% and less than 22%
○○：Energy conversion efficiency is more than 18% and less than 20%
○：Energy conversion efficiency is more than 16% and less than 18%
△：Energy conversion efficiency is more than 14% and less than 16%
×：Energy conversion efficiency is less than 14%
(5) clearance control
Under the flexible printing substrate and solar battery cell that determine 4 angles of unit in obtained solar module
The wide length in portion, is judged by following benchmark.
[determinating reference of clearance control]
○：The minimum value of width and the difference of maximum are more than 50 μm
△：The minimum value of width and the difference of maximum are 20 μm less than 50 μm
×：The minimum value of width and the difference of maximum are less than 20 μm
Result is shown in table 1 below.
[table 1]
In addition, in embodiment 1, solar battery cell uses copper electrode, and in embodiment 7, solar battery cell uses
Aluminium electrode.In embodiment 1 and embodiment 7, drawn by said reference initial stage energy conversion efficiency and reliability test after
Energy conversion efficiency evaluation result it is identical, but for aluminium electrode, by using the electric conductivity of the composition with the present invention
Particle, compared with using the situation of the electroconductive particle of the composition without the present invention, confirm and more effectively embody the present invention
Effect.In addition, the projection quantity of each single-particle of embodiment 1~23 and comparative example 4~7 is about 300~about 900.
Claims (8)
1. a kind of back contact solar battery module electroconductive particle, it is used for back contact solar battery module, its
In,
The electroconductive particle has：Substrate particle and the conductive part being configured on the substrate particle surface,
There are multiple projections on the outer surface of the conductive part,
Modulus of elasticity in comperssion of the electroconductive particle when compressing 10% is 1100N/mm2Above and 5000N/mm2Hereinafter, and
And
The breaking strain of the electroconductive particle is more than 55%.
2. back contact solar battery module electroconductive particle as claimed in claim 1, wherein,
The average height of multiple projections is more than 50nm and below 800nm.
3. back contact solar battery module electroconductive particle as claimed in claim 1 or 2, wherein,
The ratio between the average height of multiple projections and the thickness of the conductive part are more than 0.1 and less than 8.
4. back contact solar battery module electroconductive particle as claimed in claim 1 or 2, it is used to have surface
The cloth line electrode of the resin film of flexible printing substrate or surface with cloth line electrode of cloth line electrode is with surface with electrode
The electrode of solar battery cell be electrically connected.
5. back contact solar battery module electroconductive particle as claimed in claim 4, wherein,
The cloth line electrode of the flexible printing substrate or the resin film is aluminium cloth line electrode, or the solar cell
The electrode of unit is aluminium electrode.
6. a kind of back contact solar battery module conductive material, it includes the back of the body according to any one of claims 1 to 5
Contact solar battery module electroconductive particle and adhesive resin.
7. back contact solar battery module conductive material as claimed in claim 6, wherein,
Described adhesive resin contains Thermocurable compound and thermal curing agents.
8. a kind of back contact solar battery module, it includes：
Flexible printing substrate or surface resin film with cloth line electrode of the surface with cloth line electrode,
Surface have electrode solar battery cell,
The connecting portion that the flexible printing substrate or the resin film are linked together with the solar battery cell,
The connecting portion is by containing back contact solar battery module electric conductivity according to any one of claims 1 to 5
The back contact solar battery module of particle and adhesive resin is formed with conductive material,
The cloth line electrode and the electrode realize electrical connection by the electroconductive particle.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-001589 | 2014-01-08 | ||
| JP2014001589 | 2014-01-08 | ||
| PCT/JP2015/050233 WO2015105120A1 (en) | 2014-01-08 | 2015-01-07 | Conductive particles for back contact solar cell modules, conductive material, and solar cell module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105917418A CN105917418A (en) | 2016-08-31 |
| CN105917418B true CN105917418B (en) | 2018-02-13 |
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| CN201580004075.XA Expired - Fee Related CN105917418B (en) | 2014-01-08 | 2015-01-07 | Back contact solar battery module electroconductive particle, conductive material and solar module |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2015105120A1 (en) |
| KR (1) | KR20160106562A (en) |
| CN (1) | CN105917418B (en) |
| WO (1) | WO2015105120A1 (en) |
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| KR101781976B1 (en) * | 2015-04-08 | 2017-10-23 | 한국과학기술연구원 | Nano-structured hybrid particle, manufacturing method thereof, and device containing the particle |
| CN110660880B (en) * | 2019-08-29 | 2021-08-10 | 泰州隆基乐叶光伏科技有限公司 | Back contact solar cell module production method and back contact solar cell module |
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| CN103124999A (en) * | 2010-09-30 | 2013-05-29 | 积水化学工业株式会社 | Conductive particles, anisotropic conductive material and connection structure |
| JP2013030479A (en) * | 2011-06-22 | 2013-02-07 | Sekisui Chem Co Ltd | Conductive particle with insulative particle, anisotropic conductive material, and connection structure |
| JP2013063443A (en) * | 2011-09-15 | 2013-04-11 | Toppan Printing Co Ltd | Aluminum paste solder, method for joining aluminum conductive member, and method for manufacturing solar battery module |
| JP2013197343A (en) * | 2012-03-21 | 2013-09-30 | Dexerials Corp | Solar cell module and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2015105120A1 (en) | 2017-03-23 |
| KR20160106562A (en) | 2016-09-12 |
| WO2015105120A1 (en) | 2015-07-16 |
| CN105917418A (en) | 2016-08-31 |
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