CN105884375A - 一种Si3N4-TiZrN2-TiN复合导电陶瓷的液相烧结法 - Google Patents
一种Si3N4-TiZrN2-TiN复合导电陶瓷的液相烧结法 Download PDFInfo
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Abstract
一种Si3N4‑TiZrN2‑TiN复合导电陶瓷,合成该复合导电陶瓷的原料包括:Si3N4、ZrN、TiN、Y2O3、La2O3、AlN;该复合导电陶瓷的最终产物里包括Si3N4相、TiN相和金属氮化物的固溶体TiZrN2相。其中,AlN的加入避免了常规方式中加入Al2O3所引起的挥发,并且加入AlN会使最终产品的表面比加入Al2O3光滑;本发明名还给出一种Si3N4‑TiZrN2‑TiN复合导电陶瓷的液相烧结法。本发明有益效果如下:1.电阻率低;本发明的复合导电陶瓷用SX1944四探针测试仪测试样品电阻为10‑2Ω·cm量级,远远低于同类产品。2.机械强度高;本发明的复合导电陶瓷用载荷为10kg,加压时间为5s的条件测量样品的维氏硬度为14.7GPa;利用硬度压痕四角处扩展的裂纹长度计算样品的断裂韧性为7.8MPa.m0.5保持了氮化硅陶瓷原有的强度和硬度。
Description
技术领域:
本发明涉及导电陶瓷技术领域,具体地说,涉及一种Si3N4-TiZrN2-TiN复合导电陶瓷的液相烧结法。
背景技术:
氮化硅(Si3N4)是一种性能很好的结构陶瓷材料,具有质量轻、高强度、高硬度、高耐腐蚀性等,可应用于各行各业。制备氮化硅陶瓷材料的方法很多,有热压、常压、反应等烧结方法,其中常压烧结方法简单易行,耗能少。由于氮化硅是共价键化合物,自扩散系数低,本身很难直接烧结成瓷,因此往往加入一些氧化物等作为烧结助剂进行烧结。常用的有Al2O3、Y2O3、MgO2等。这些添加物在烧结过程中形成液相促使氮化硅陶瓷烧结致密,以达到材料高强度、高硬度的要求。
由于Si3N4陶瓷本身高强度和高硬度的性能使得后期加工困难,常以金刚石刀具进行切割,但传统的金刚石加工的方法加工效率低且成本昂贵。成本低、效率高的放电(电火花)加工技术已成功用于金属制品加工,若能用于加工Si3N4陶瓷则会大大提高加工效率和降低加工成本,但能用放电加工的材料必须具有一定的导电性,其电阻率要求低达100Ω·cm量级及以下,但Si3N4陶瓷属于绝缘体,其电阻率约为1015Ω·cm量级,是不可能用放电方法进行加工的。所以人们想到了用另外一种导电性很好的材料加入Si3N4中制备成Si3N4基复合导电性材料,使其电阻率下降到能用于电火花加工的程度。在CN1272283C的专利里使用了金属Ti和Ta,从而使最终烧结的复合氮化硅电阻率降到100Ω·cm量级,刚刚达到放电加工的要求,并且其硬度和断裂韧性较未加导电助剂的氮化硅陶瓷差。
发明内容:
本发明旨在解决上述问题,提供一种电阻率低、硬度和断裂韧性优良的一种Si3N4-TiZrN2-TiN复合导电陶瓷;同时还提供一种Si3N4-TiZrN2-TiN复合导电陶瓷的液相烧结法。
一种Si3N4-TiZrN2-TiN复合导电陶瓷,合成该复合导电陶瓷的原料包括:Si3N4、ZrN、TiN、Y2O3、La2O3、AlN;该复合导电陶瓷的的最终产物里包括Si3N4相、TiN相和金属氮化物的固溶体TiZrN2相。其中,AlN的加入可避免常规方式中加入Al2O3所引起的低温挥发,并且加入AlN会使最终产品的表面比加入Al2O3光滑。
由于是采用烧结工艺来制作的复合导电陶瓷材料,各材料烧结过程中的热膨胀系数是至关重要的的,如果热膨胀系数相差大,则不利于烧结,会影响最终成品的密度、硬度和断裂韧性,故所选择的导电助剂的除了要电阻率低,还要热膨胀系数要与氮化硅相差不大。另外,如果还兼有其它好的机械性能则更为理想。氮化钛和氮化锆都有高电导率,两者的电阻率都在10-4Ω·cm量级,ZrN比TiN更低(TiN:2.07×10-4Ω·cm;ZrN:1.4×10-4Ω·cm);热膨胀系数和氮化硅在一个数量级,均为约10-6K-1,且ZrN更接近氮化硅(Si3N4:3.64×10-6K-1;ZrN:7.3×10-6K-1;TiN:9.35×10-6K-1);另外TiN、ZrN本身都的硬度都比氮化硅高很多,其中,ZrN的硬度比TiN碳化钛更高,ZrN作为添加剂有增强韧性的作用。
优选的,Si3N4∶TiN∶Y2O3∶La2O3∶AlN=(9~11)∶(5.4~6.6)∶(0.8~1.2)∶(0.8~1.2)∶(1.3~1.66),ZrN的加入量为8~15w.t%。
一种Si3N4-TiZrN2-TiN复合导电陶瓷的液相烧结法,包括以下步骤:
(1)配料混合:将Si3N4、TiN、Y2O3、La2O3、AlN以(9~11)∶(5.4~6.6)∶(0.8~1.2)∶(0.8~1.2)∶(1.3~1.66)的比例混合,ZrN的加入量为8~15w.t%,之后在研钵中加入酒精研磨1~3h后干燥;其中,Si3N4的α相含量高于70%,纯度高于97%,粒度为0.6~0.8μm,TiN粒度为18~22nm,ZrN粒度为16~21nm;
(2)成型及烧结:将干燥后的混合料用模具干压成型再经冷等静压后放入烧结炉中在N2保护气氛中进行烧结,烧结温度为1760±25℃,保温时间根据样品的大小可设为1~3h。
本发明有益效果如下:
1.电阻率低;本发明的复合导电陶瓷用SX1944四探针测试仪测试样品电阻为10-2Ω·cm量级,远低于同类产品。
2.机械强度高;本发明的复合导电陶瓷用载荷为10kg,加压时间为5s的条件测量样品的维氏硬度为14.7GPa;利用硬度压痕四角处扩展的裂纹长度计算样品的断裂韧性为7.8MPa.m0.5,达到了氮化硅陶瓷原有的高硬度和高断裂韧性。
具体实施方式:
一种Si3N4-TiZrN2-TiN复合导电陶瓷,合成该复合导电陶瓷的原料包括:Si3N4、ZrN、TiN、Y2O3、La2O3、AlN;该复合导电陶瓷的的最终产物里包括Si3N4相、TiN相和金属氮化物的固溶体TiZrN2相。
在本实施方式中,Si3N4∶TiN∶Y2O3∶La2O3∶AlN=(9~11)∶(5.4~6.6)∶(0.8~1.2)∶(0.8~1.2)∶(1.3~1.66),ZrN的加入量为8~15w.t%。
一种Si3N4-TiZrN2-TiN复合导电陶瓷的液相烧结法,Si3N4选用α相含量高于70%粉料,纯度高于97%,平均粒度0.7μm;Y2O3、La2O3和AlN为市售,化学纯;TiN购自合肥凯尔纳米能源科技股份有限公司,纯度为99.2%,平均粒度为20nm;ZrN购自锦州金鑫股份有限公司;将各成分按(9~11)∶()∶(5.4~6.6)∶(0.8~1.2)∶(0.8~1.2)∶(1.3~1.66)的比例称量配料,将配好的料加入酒精在玛瑙研钵中混磨2小时或加入酒精和ZrO2球在聚氨酯筒中球磨1小时后置于空气中干燥;再将干燥好的混合料用不锈钢磨具干压成方块后放入烧结炉中在N2保护气氛中进行烧结,烧结温度为1760℃±25℃,保温时间根据样品的大小可设为1-3h。
利用日本理学D/MAX-RB型X射线衍射仪对烧结进行样品的物相分析,证实样品内含有金属氮化物的固溶体TiZrN2。
Claims (3)
1.一种Si3N4-TiZrN2-TiN复合导电陶瓷,其特征在于:合成该复合导电陶瓷的原料包括:Si3N4、ZrN、TiN、Y2O3、La2O3、AlN;该复合导电陶瓷的的最终产物里包括Si3N4相、TiN相和金属氮化物的固溶体TiZrN2相。
2.如权利要求1所述的一种Si3N4-TiZrN2-TiN复合导电陶瓷,其特征在于:Si3N4∶TiN∶Y2O3∶La2O3∶AlN=(9~11)∶(5.4~6.6)∶(0.8~1.2)∶(0.8~1.2)∶(1.3~1.66),ZrN的加入量为8~15w.t%。
3.一种Si3N4-TiZrN2-TiN复合导电陶瓷的液相烧结法,其特征在于:包括以下步骤:
(1)配料混合:将Si3N4、TiN、Y2O3、La2O3、AlN以(9~11)∶(5.4~6.6)∶(0.8~1.2)∶(0.8~1.2)∶(1.3~1.66)的比例混合,ZrN的加入量为8~15w.t%,之后在研钵中加入酒精研磨1~3h后干燥;其中,Si3N4的α相含量高于70%,纯度高于97%,粒度为0.6~0.8μm,TiN粒度为18~22nm,ZrN粒度为16~21nm;
(2)成型及烧结:将干燥后的混合料用模具干压成型再经冷等静压后放入烧结炉中在N2保护气氛中进行烧结,烧结温度为1760±25℃,保温时间为1~3h。
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CN112679211A (zh) * | 2021-01-29 | 2021-04-20 | 北方民族大学 | 一种ZrN-镧氧化物复相陶瓷及其无压反应烧结制备方法 |
CN113121245A (zh) * | 2019-12-31 | 2021-07-16 | 辽宁省轻工科学研究院有限公司 | 一种可放电加工的氮化硅基复合导电陶瓷及其制备方法 |
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CN112679211A (zh) * | 2021-01-29 | 2021-04-20 | 北方民族大学 | 一种ZrN-镧氧化物复相陶瓷及其无压反应烧结制备方法 |
CN112679211B (zh) * | 2021-01-29 | 2022-05-06 | 北方民族大学 | 一种ZrN-镧氧化物复相陶瓷及其无压反应烧结制备方法 |
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