CN105881216A - Diverting mechanism used for copper polishing conditioning of wafer - Google Patents
Diverting mechanism used for copper polishing conditioning of wafer Download PDFInfo
- Publication number
- CN105881216A CN105881216A CN201610391751.XA CN201610391751A CN105881216A CN 105881216 A CN105881216 A CN 105881216A CN 201610391751 A CN201610391751 A CN 201610391751A CN 105881216 A CN105881216 A CN 105881216A
- Authority
- CN
- China
- Prior art keywords
- groove
- disk
- reel
- wafer
- lower disc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 29
- 239000010949 copper Substances 0.000 title claims abstract description 29
- 238000005498 polishing Methods 0.000 title abstract description 4
- 230000003750 conditioning effect Effects 0.000 title abstract 4
- 239000004677 Nylon Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 7
- 229920001778 nylon Polymers 0.000 claims abstract description 7
- -1 processing axle Chemical compound 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 abstract description 17
- 238000003754 machining Methods 0.000 abstract description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- XSAOTYCWGCRGCP-UHFFFAOYSA-K aluminum;diethylphosphinate Chemical compound [Al+3].CCP([O-])(=O)CC.CCP([O-])(=O)CC.CCP([O-])(=O)CC XSAOTYCWGCRGCP-UHFFFAOYSA-K 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005543 nano-size silicon particle Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a diverting mechanism used for copper polishing conditioning of a wafer. The diverting mechanism used for the copper polishing conditioning of the wafer comprises a machining shaft, a shaft disk, a diverting disk which is made of nylon material and bolts. A connecting flange is arranged at the bottom of the machining shaft. A first groove is formed in the bottom of the shaft disk. A plurality of fastening plates and ejecting mechanisms are arranged outside the shaft disk, wherein each ejecting mechanism comprises a supporting seat, an ejecting plate and a limiting block. A cavity is arranged in each supporting seat and guiding plates are arranged on both sides of each supporting seat. A through hole is formed in each guiding plate. One side of each ejecting plate is provided with a rotary plate and convexity screws are arranged on both sides of each rotary plate. The diverting disk comprises an upper disk and a lower disk, wherein the bottom of the lower disk is provided with a second groove and a cross-shaped square groove is formed in the second groove. The mechanism is reasonable in design, convenient to disassembly and assembly and high in practicability. Aimed at the differences between a small-sized machine and a large-sized machine, a large-sized ceramic disk can be diverted onto the small-sized machine for conditioning, so that the TTV of the wafer can be reduced, the requirement of flatness can be realized and the machining efficiency can be improved.
Description
Technical field
The present invention relates to a kind of changeover mechanism throwing finishing for wafer copper, belong to Sapphire Substrate sheet processing technique field.
Background technology
Flatness is an important quality index in Sapphire Substrate processing, and in substrate manufacturing procedure, copper is thrown as the important procedure moulding wafer flatness, poor for the wafer integral thickness after paster (TTV) is carried out and becomes key.
In copper throws processing, the heat that grinding between wafer and diamond polishing fluid produces can cause card to deform upon, thus affect wafer flatness, in current copper throws operation, the equipment of main flow has two kinds, a kind of little type being applicable to ceramic disk diameter 355mm, this type is less due to copper dish card diameter, it is easier to control the flatness of card, the wafer TTV processed is more excellent, but processing capacity is the highest, the another kind of big type for ceramic disk diameter 485mm, this type is big due to copper dish card diameter, the flatness of card is wayward, the wafer TTV processed does not reaches higher level.
Summary of the invention
It is an object of the invention to the defect for prior art, it is provided that a kind of changeover mechanism throwing finishing for wafer copper, for the difference of existence between the two, manage to be transferred to deep bid on little type repair, to reduce wafer TTV, it is achieved flatness requirement, improve working (machining) efficiency.
The present invention is achieved by the following technical solutions:
A kind of changeover mechanism throwing finishing for wafer copper, including processing axle, reel, the transfer panel being made up of nylon material and bolt, wherein, it is provided with adpting flange bottom described processing axle, described adpting flange is provided with some connecting holes, described some connecting holes are arranged around one week uniform intervals of adpting flange, realize processing axle through connecting hole with reel by bolt to be connected with reel, the first groove it is provided with bottom described reel, described reel is externally provided with some fastening plates and ejecting mechanism, described some fastening plates are arranged around one week uniform intervals of reel, described fastening plate is provided with trip bolt, described trip bolt end is placed in the first groove；
Described ejecting mechanism is positioned at both sides, reel top, described ejecting mechanism includes supporting seat, liftout plate and limited block, it is provided with cavity in described support seat, described cavity and the connection of the first groove, described support seat both sides are provided with guide plate, described guide plate is provided with through hole, described limited block is positioned at guide plate side, and be connected with supporting seat, described liftout plate is positioned at guide plate opposite side, described liftout plate side is provided with flap, described flap is placed between guide plate, and both sides are provided with nose bar, described nose bar is placed in through hole, described flap is provided with inclined plane, described inclined plane coordinates with limited block；
Described transfer panel includes disk and lower disc, described upper disk and lower disc are coaxially disposed with reel and processing axle, described upper disk bottom is connected with lower disc top, described upper disk outer wall and the first groove inner wall matched in clearance, described lower disc is placed between some fastening plates, is provided with the second groove bottom described lower disc, and described second groove is cylindrical groove, being provided with cross square groove in described second groove, the cross point of described cross square groove is positioned at the second groove top surface circle centre position.
Above-mentioned a kind of changeover mechanism throwing finishing for wafer copper, wherein, described liftout plate is provided with some fixing holes.
Above-mentioned a kind of changeover mechanism throwing finishing for wafer copper, wherein, described upper disk and the second groove top surface are horizontal plane or omit concave surface.
Above-mentioned a kind of changeover mechanism throwing finishing for wafer copper, wherein, described upper disk diameter d1 is 355mm, and thickness h 1 is 15mm.
Above-mentioned a kind of changeover mechanism throwing finishing for wafer copper, wherein, described lower disc thickness h 2 is 32mm.
Above-mentioned a kind of changeover mechanism throwing finishing for wafer copper, wherein, described second groove diameter d2 is 485mm, and degree of depth h3 is 12mm.
Above-mentioned a kind of changeover mechanism throwing finishing for wafer copper, wherein, described cross square groove width d3 is 10mm, and degree of depth h4 is 5mm.
The invention have the benefit that
It is connected bottom processing axle with little type, the ceramic disk of a diameter of 485mm can be put in second groove, compressed by axial compression and realize transfer panel and ceramic disk compression installation, screw the trip bolt on fastening plate, ceramic disk can be driven to rotate when processing axle and rotating, it is achieved wafer copper throws finishing；During dismounting, unscrewing trip bolt, by the liftout plate of pull-up ejecting mechanism, flap end goes to, in the cavity of support seat, when inclined plane coordinates with limited block, support out transfer panel in being placed in the first groove, takes out transfer panel and ceramic disk subsequently.
In the present invention, disk and lower disc are coaxially disposed with reel and processing axle, prevent from rotating bias；Being fixed by liftout plate by fixing hole, when anti-locking mechanism rotates, liftout plate gets rid of de-；Upper disk diameter is 355, it is ensured that the first groove can put the ceramic disk of diameter 355mm, improves versatility；Upper disk and the second groove top surface are horizontal plane or omit concave surface, it is ensured that transfer panel is tight with the contact surface of ceramic disk, it is to avoid because certain goes out projection causes pressurization inequality；Cross square groove avoids contact with the most closely sealed between face and ceramic disk and forms vacuum increase and take the difficulty of ceramic disk；Second depth of groove is 12mm, less than the thickness of ceramic disk, prevents that copper is thrown machine card and causes scuffing；Transfer panel is nylon material, and hardness is high, is unlikely to deform, lighter.
To sum up, present configuration is reasonable, easy accessibility, and practicality is high, for the difference of the existence between minicomputer and large scale computer, can be transferred to big ceramic disk on little type repair, to reduce wafer TTV, it is achieved flatness requirement, improve working (machining) efficiency simultaneously.
Accompanying drawing explanation
Fig. 1 is present configuration schematic diagram.
Fig. 2 is this practicality cross-sectional schematic.
Fig. 3 is top view of the present invention.
Fig. 4 is transfer panel upward view of the present invention.
Detailed description of the invention
Below in conjunction with the accompanying drawings the detailed description of the invention of the present invention is described further.
A kind of changeover mechanism throwing finishing for wafer copper, including processing axle 1, reel 2, the transfer panel 3 being made up of nylon material and bolt 4, wherein, it is provided with adpting flange 5 bottom described processing axle 1, described adpting flange 5 is provided with some connecting holes 6, described some connecting holes 6 are arranged around 5 one weeks uniform intervals of adpting flange, realize processing axle 1 through connecting hole 6 with reel 2 by bolt 4 to be connected with reel 5, the first groove 7 it is provided with bottom described reel 5, described reel 7 is externally provided with some fastening plates 8 and ejecting mechanism 9, described some fastening plates 8 are arranged around 2 one weeks uniform intervals of reel, described fastening plate 8 is provided with trip bolt 10, described trip bolt 10 end is placed in the first groove 7；
Described ejecting mechanism 9 is positioned at both sides, reel 2 top, described ejecting mechanism 9 includes supporting seat 11, liftout plate 12 and limited block 13, it is provided with cavity 14 in described support seat 11, described cavity 14 connects with the first groove 7, described support seat 11 both sides are provided with guide plate 15, described guide plate 15 is provided with through hole 16, described limited block 13 is positioned at guide plate 15 side, and be connected with supporting seat 11, described liftout plate 12 is positioned at guide plate 15 opposite side, described liftout plate 12 is provided with some fixing holes 16, described liftout plate 12 side is provided with flap 17, described flap 17 is placed between guide plate 15, and both sides are provided with nose bar 18, described nose bar 18 is placed in through hole 16, described flap 17 is provided with inclined plane 19, described inclined plane 19 coordinates with limited block 13；
Described transfer panel 3 includes disk 20 and lower disc 21, described upper disk 20 and lower disc 31 are coaxially disposed with reel 2 and processing axle 1, it is connected with lower disc 21 top bottom described upper disk 20, described upper disk 20 outer wall and the first groove 7 inwall matched in clearance, described upper disk 20 diameter d1 is 355mm, and thickness h 1 is 15mm；
Described lower disc 21 is placed between some fastening plates 8, described lower disc 21 thickness h 2 is 32mm, the second groove 22 it is provided with bottom described lower disc 21, described upper disk 20 and the second groove 22 top surface are horizontal plane or omit concave surface, described second groove 22 is cylindrical groove, described second groove 22 diameter d2 is 485mm, degree of depth h3 is 12mm, it is provided with cross square groove 23 in described second groove 22, the cross point of described cross square groove 23 is positioned at the second groove 22 top surface circle centre position, described cross square groove width d3 is 10mm, and degree of depth h4 is 5mm.
Described nylon material is in harmonious proportion is formed by nylon 612, nylon66 fiber, carbon fiber, Graphene, nano silicon, aluminum diethylphosphinate, methyl cyclohexane diamidogen, toluene di-isocyanate(TDI) 40:50:14:10:7:9:3:2 in mass ratio.
The working method of the present invention is:
It is connected bottom processing axle with little type, the ceramic disk of a diameter of 485mm can be put in second groove, compressed by axial compression and realize transfer panel and ceramic disk compression installation, screw the trip bolt on fastening plate, ceramic disk can be driven to rotate when processing axle and rotating, it is achieved wafer copper throws finishing；During dismounting, unscrewing trip bolt, by the liftout plate of pull-up ejecting mechanism, flap end goes to, in the cavity of support seat, when inclined plane coordinates with limited block, support out transfer panel in being placed in the first groove, takes out transfer panel and ceramic disk subsequently.
It is high that nylon material of the present invention has ultrahigh hardness, and impact resistance is unlikely to deform, and the lightest, heat-proof combustion-resistant performance is good.
The above; being only the present invention preferably detailed description of the invention, but protection scope of the present invention is not limited thereto, any those familiar with the art is in the technical scope that the invention discloses; the change that can readily occur in or replacement, all should contain within the scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain of claims.
Claims (7)
1. the changeover mechanism throwing finishing for wafer copper, including processing axle, reel, the transfer panel being made up of nylon material and bolt, it is characterized by, it is provided with adpting flange bottom described processing axle, described adpting flange is provided with some connecting holes, described some connecting holes are arranged around one week uniform intervals of adpting flange, realize processing axle through connecting hole with reel by bolt to be connected with reel, the first groove it is provided with bottom described reel, described reel is externally provided with some fastening plates and ejecting mechanism, described some fastening plates are arranged around one week uniform intervals of reel, described fastening plate is provided with trip bolt, described trip bolt end is placed in the first groove；
Described ejecting mechanism is positioned at both sides, reel top, described ejecting mechanism includes supporting seat, liftout plate and limited block, it is provided with cavity in described support seat, described cavity and the connection of the first groove, described support seat both sides are provided with guide plate, described guide plate is provided with through hole, described limited block is positioned at guide plate side, and be connected with supporting seat, described liftout plate is positioned at guide plate opposite side, described liftout plate side is provided with flap, described flap is placed between guide plate, and both sides are provided with nose bar, described nose bar is placed in through hole, described flap is provided with inclined plane, described inclined plane coordinates with limited block；
Described transfer panel includes disk and lower disc, described upper disk and lower disc are coaxially disposed with reel and processing axle, described upper disk bottom is connected with lower disc top, described upper disk outer wall and the first groove inner wall matched in clearance, described lower disc is placed between some fastening plates, is provided with the second groove bottom described lower disc, and described second groove is cylindrical groove, being provided with cross square groove in described second groove, the cross point of described cross square groove is positioned at the second groove top surface circle centre position.
A kind of changeover mechanism throwing finishing for wafer copper, is characterized by, described liftout plate is provided with some fixing holes.
A kind of changeover mechanism throwing finishing for wafer copper, is characterized by, described upper disk and the second groove top surface are horizontal plane or omit concave surface.
A kind of changeover mechanism throwing finishing for wafer copper, is characterized by, described upper disk diameter d1 is 355mm, and thickness h 1 is 15mm.
A kind of changeover mechanism throwing finishing for wafer copper, is characterized by, described lower disc thickness h 2 is 32mm.
A kind of changeover mechanism throwing finishing for wafer copper, is characterized by, described second groove diameter d2 is 485mm, and degree of depth h3 is 12mm.
A kind of changeover mechanism throwing finishing for wafer copper, is characterized by, described cross square groove width d3 is 10mm, and degree of depth h4 is 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610391751.XA CN105881216B (en) | 2016-06-06 | 2016-06-06 | A kind of changeover mechanism that finishing is thrown for chip copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610391751.XA CN105881216B (en) | 2016-06-06 | 2016-06-06 | A kind of changeover mechanism that finishing is thrown for chip copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105881216A true CN105881216A (en) | 2016-08-24 |
| CN105881216B CN105881216B (en) | 2018-02-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610391751.XA Active CN105881216B (en) | 2016-06-06 | 2016-06-06 | A kind of changeover mechanism that finishing is thrown for chip copper |
Country Status (1)
| Country | Link |
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| CN (1) | CN105881216B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1357431A (en) * | 2000-12-07 | 2002-07-10 | C.&E.法因两合公司 | Cutting tool fixture for fixing cutting tool to driving shaft and its adaptor |
| US20060267338A1 (en) * | 2004-07-30 | 2006-11-30 | Hull Eric G | Transition adapter for electrical conduit |
| CN1905170A (en) * | 2005-07-25 | 2007-01-31 | 华信精密股份有限公司 | Fan device with transfer mechanism |
| CN201483468U (en) * | 2009-09-02 | 2010-05-26 | 苏州宝时得电动工具有限公司 | Adapter |
| CN201659552U (en) * | 2010-03-19 | 2010-12-01 | 南京德朔实业有限公司 | Multifunctional tool adapter |
| CN103448034A (en) * | 2013-09-16 | 2013-12-18 | 宁波汉浦工具有限公司 | Tool switching device |
| CN205674035U (en) * | 2016-06-06 | 2016-11-09 | 江苏吉星新材料有限公司 | A kind of changeover mechanism throwing finishing for wafer copper |
-
2016
- 2016-06-06 CN CN201610391751.XA patent/CN105881216B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1357431A (en) * | 2000-12-07 | 2002-07-10 | C.&E.法因两合公司 | Cutting tool fixture for fixing cutting tool to driving shaft and its adaptor |
| US20060267338A1 (en) * | 2004-07-30 | 2006-11-30 | Hull Eric G | Transition adapter for electrical conduit |
| CN1905170A (en) * | 2005-07-25 | 2007-01-31 | 华信精密股份有限公司 | Fan device with transfer mechanism |
| CN201483468U (en) * | 2009-09-02 | 2010-05-26 | 苏州宝时得电动工具有限公司 | Adapter |
| CN201659552U (en) * | 2010-03-19 | 2010-12-01 | 南京德朔实业有限公司 | Multifunctional tool adapter |
| CN103448034A (en) * | 2013-09-16 | 2013-12-18 | 宁波汉浦工具有限公司 | Tool switching device |
| CN205674035U (en) * | 2016-06-06 | 2016-11-09 | 江苏吉星新材料有限公司 | A kind of changeover mechanism throwing finishing for wafer copper |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105881216B (en) | 2018-02-13 |
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Application publication date: 20160824 Assignee: Zhejiang Zhaojing New Material Technology Co.,Ltd. Assignor: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. Contract record no.: X2022980008188 Denomination of invention: A transfer mechanism for wafer copper polishing and trimming Granted publication date: 20180213 License type: Common License Record date: 20220627 |
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Effective date of registration: 20230109 Address after: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee after: Youran Walker (Beijing) Technology Co.,Ltd. Address before: 212200 new materials Industrial Park, Youfang Town, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. |
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Effective date of registration: 20230621 Address after: 050035 No. 369, Zhujiang Avenue, high tech Zone, Shijiazhuang, Hebei Patentee after: TUNGHSU GROUP Co.,Ltd. Address before: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee before: Youran Walker (Beijing) Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20160824 Assignee: Hunan Lanxin Microelectronics Technology Co.,Ltd. Assignor: TUNGHSU GROUP Co.,Ltd. Contract record no.: X2023110000125 Denomination of invention: A transfer mechanism for copper wafer polishing and trimming Granted publication date: 20180213 License type: Common License Record date: 20230925 |
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| EE01 | Entry into force of recordation of patent licensing contract |