CN105864248A - Transistor assembling and dispensing machine - Google Patents
Transistor assembling and dispensing machine Download PDFInfo
- Publication number
- CN105864248A CN105864248A CN201610329108.4A CN201610329108A CN105864248A CN 105864248 A CN105864248 A CN 105864248A CN 201610329108 A CN201610329108 A CN 201610329108A CN 105864248 A CN105864248 A CN 105864248A
- Authority
- CN
- China
- Prior art keywords
- housing
- feeding
- mounting groove
- rotating disk
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 39
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 39
- 239000010703 silicon Substances 0.000 claims abstract description 39
- 238000007599 discharging Methods 0.000 claims abstract description 25
- 239000003292 glue Substances 0.000 claims description 44
- 238000010079 rubber tapping Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 abstract 5
- 230000000712 assembly Effects 0.000 abstract 2
- 238000000429 assembly Methods 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000715 Mucilage Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a transistor assembling and dispensing machine. A shell feeding device, a silicon wafer feeding device, a dispensing device and a discharging device are arranged on the periphery of a rotary disc. Due to rotation of the rotary disc, first shell installation grooves are sequentially switched among a shell feeding station, a silicon wafer feeding station, a dispensing station and a discharging station. During work, the shell feeding device is firstly used for feeding shells into the first shell installation grooves, then the silicon wafer feeding device is used for feeding silicon wafers to silicon wafer installation stations on the shells, finally, the dispensing mechanism is used for performing dispensing, the discharging device is used for discharging transistor assemblies subjected to dispensing, and assembling and dispensing of transistors are continuously completed. During feeding, a sliding block moves and is switched between a discharging channel of a discharging structure and a first shell installation station of the rotary disc, and therefore it is ensured that the shells are fed one by one, the feeding position is accurate, and the assembling and dispensing precision of the transistor assemblies is ensured.
Description
Technical field
The present invention relates to transistor processing technique field, particularly relate to a kind of transistor assembling point gum machine.
Background technology
During transistor assembling, some glue is one necessary operation, and some glue is exactly substantially at components and parts
Surface coating or other fluent material.Completed by hand by workman during initially some glue work, along with science and technology
Progress, also create a lot of Semi-automatic dispenser, also emerge more and more full-automatic glue-dropping machine successively.
And the appearance of the sophisticated product that gets more and more, a glue is required more and more higher, and transistor is in transport and charging
During, the easy extrusion of pin, a glue reliability and precision are affected relatively big, need during a glue
Pin being carried out shaping, to take considerable time, the most existing some glue process has had a strong impact on the life of whole line
Produce efficiency.
Summary of the invention
For solving technical problem present in background technology, the present invention proposes a kind of transistor assembling point gum machine.
A kind of transistor assembling point gum machine that the present invention proposes, for transistor component point glue, described crystal
Pipe assembly includes housing and silicon chip, and silicon chip is arranged on housing, and described transistor assembling point gum machine includes: work
Station, rotating disk, housing feeding device, silicon wafer loading device, point glue equipment, blanking device, driving means;
Rotating disk is horizontally disposed with on the table, is provided with the rotating shaft being vertically arranged and can be turned by rotating shaft in the middle part of rotating disk
On the table, driving means and rotating disk are connected to drive turntable rotation in dynamic installation, rotating disk periphery be provided with to
A few first housing mounting groove;
Housing feeding device, silicon wafer loading device, point glue equipment, blanking device are separately positioned on rotating disk periphery,
Housing feeding device is used for the first housing mounting groove feeding housing being positioned at the first feeding station, on silicon chip
Material device is for feeding silicon chip on the housing being positioned at the second feeding station, and point glue equipment is for being positioned at a glue
Putting glue on the transistor component of station, blanking device will be for completing transistor component blanking for dispensing glue;
Housing feeding device includes vibration feeding dish, the first slide rail, the second slide rail, pusher part, vibration feeding
The exit of dish is provided with discharging structure, and discharging structure is provided with to the tapping channel extended near rotating disk direction,
First slide rail is between the discharging opening and rotating disk of described tapping channel, and the first slide rail is provided with and is slidably mounted
Slide block, slide block is provided with the second housing mounting groove, and slide block is under primary importance state, described second shell
Body mounting groove the first end connects with the discharging opening of described tapping channel, and slide block is under second position state, institute
The second end stating the second housing mounting groove connects with the first housing mounting groove being positioned at the first feeding station, and second
Slide rail is positioned at described discharging structure side and is parallel to the setting of described tapping channel bearing of trend, and pusher part can be slided
Moving and be arranged on the second slide rail, pusher part is for installing the second housing under slide block is in second position state
Housing to be processed in groove pushes the first housing mounting groove being positioned at the first feeding station.
Preferably, housing feeding device also includes keeper, keeper between rotating disk and the first slide rail,
Keeper is provided with deflector chute, and described deflector chute connects with described first housing mounting groove, and slide block is in second
Under location status, the second end of described second housing mounting groove by above-mentioned deflector chute be positioned at the first feeding work
First housing mounting groove connection of position.
Preferably, housing feeding device also includes block, and block is positioned on keeper, and slide block is in first
Under configuration state, block is positioned at the discharge outlet of described tapping channel.
Preferably, housing feeding device, silicon wafer loading device, point glue equipment, blanking device are in rotating disk periphery
Set gradually.
Preferably, rotating disk is provided with multiple first housing mounting groove, and the plurality of first housing mounting groove is along turning
Dish even circumferential is distributed.
Preferably, being provided with clamping device at described first housing mounting groove, clamping device includes the first holder
The first housing mounting groove both sides are laid respectively at the second holder, the first holder and the second holder.
In the present invention, the transistor assembling point gum machine proposed, housing feeding device, silicon wafer loading device,
Point glue equipment, blanking device are separately positioned on rotating disk periphery, and by turntable rotation, the first housing mounting groove depends on
Secondary in the switching between glue station, discharge station of housing feeding station, silicon chip feeding station, point, during work,
Housing feeding device first feeding housing in the first housing mounting groove, then silicon wafer loading device is on housing
Silicon chip installation position feeding silicon chip, rearmost point gluing mechanism carries out a glue, and blanking device is by the transistor after a glue
Assembly blanking, it is achieved the assembling point glue of transistor is continuously finished;During feeding, by slide block at discharging structure
Mobile handoff between tapping channel and the first housing installation position of rotating disk, it is ensured that housing feeding one by one and feeding
Position is accurate, thus ensures the assembling point glue precision of transistor component.
Accompanying drawing explanation
Fig. 1 is the structural representation of the transistor component of a kind of transistor assembling point gum machine processing that the present invention proposes
Figure.
Fig. 2 is the structural representation of a kind of transistor assembling point gum machine that the present invention proposes.
Detailed description of the invention
As illustrated in fig. 1 and 2, Fig. 1 is the crystal of a kind of transistor assembling point gum machine processing that the present invention proposes
The structural representation of pipe assembly, Fig. 2 is the structural representation of a kind of transistor assembling point gum machine that the present invention proposes
Figure.
With reference to Fig. 1, a kind of transistor assembling point gum machine that the present invention proposes, it is used for transistor component point glue,
Described transistor component includes housing 11 and silicon chip 12, and silicon chip 12 is arranged on housing 11.
With reference to Fig. 2, described transistor assembling point gum machine includes: workbench 2, rotating disk 3, housing feeding device,
Silicon wafer loading device 5, point glue equipment 6, blanking device 7, driving means;
Rotating disk 3 is horizontally set on workbench 2, is provided with the rotating shaft being vertically arranged and by turning in the middle part of rotating disk 3
Axle may be rotatably mounted on workbench 2, and driving means and rotating disk 3 are connected to drive rotating disk 3 to rotate, and turn
Dish 3 periphery is provided with multiple first housing mounting groove, and the plurality of first housing mounting groove is equal along rotating disk 3 circumference
Even distribution, is provided with clamping device 8 at described first housing mounting groove, clamping device 8 include the first holder and
Second holder, the first holder and the second holder lay respectively at the first housing mounting groove both sides;
Housing feeding device, silicon wafer loading device 5, point glue equipment 6, blanking device 7 are successively set on rotating disk
3 peripheries, housing feeding device is for the first housing mounting groove feeding housing being positioned at the first feeding station
11, silicon wafer loading device 5, for feeding silicon chip 12 on the housing 11 be positioned at the second feeding station, puts mucilage binding
Putting 6 for being positioned on a transistor component of glue station some glue, blanking device 7 is for dispensing glue for completing
Transistor component blanking;
Housing feeding device include vibration feeding dish the 41, first slide rail the 42, second slide rail 43, pusher part 44,
Keeper 46, block 47;The exit of vibration feeding dish 41 is provided with discharging structure, and discharging structure is provided with
To the tapping channel extended near rotating disk 3 direction, the first slide rail 42 be positioned at the discharging opening of described tapping channel with
Between rotating disk 3, the first slide rail 42 is provided with the slide block 45 being slidably mounted, and slide block 45 is provided with the second shell
Body mounting groove, slide block 45 is under primary importance state, described second housing mounting groove the first end with described go out
The discharging opening connection of material passage, slide block 45 is under second position state, the of described second housing mounting groove
Two ends connect with the first housing mounting groove being positioned at the first feeding station, and the second slide rail 43 is positioned at described discharging knot
Structure side and be parallel to described tapping channel bearing of trend arrange, pusher part 44 can be slidably mounted at the second slide rail
On 43, pusher part 44 is used for treating in the second housing mounting groove under slide block 45 is in second position state
Processing housing 11 pushes the first housing mounting groove being positioned at the first feeding station;Keeper 46 is positioned at rotating disk 3
With first between slide rail 42, keeper 46 is provided with deflector chute, described deflector chute and described first housing peace
Tankage connects, and slide block 45 is under second position state, and the second end of described second housing mounting groove is by upper
The the first housing mounting groove stating deflector chute and be positioned at the first feeding station connects;Block 47 is positioned at keeper 46
On, slide block 45 is under primary importance state, and block is positioned at the discharge outlet of described tapping channel.
During the specific works of the transistor assembling point gum machine of the present embodiment, during work, driving means drives
Turntable rotation carries out the first housing mounting groove and switches between multiple stations, and the first housing mounting groove is initially positioned at
Housing feeding station, housing feeding device is feeding housing in the first housing mounting groove;Specifically, in vibration
Housing marshalling is sent by charging tray through discharging structure, and first slide block moves to primary importance shape along the first slide rail
State, housing sent in the second housing mounting groove on slide block by discharging structure, and now the block on keeper supports
Live the other end of the second housing mounting groove, it is ensured that housing feeding in the second housing mounting groove puts in place, then slides
Block moves to second position state, and the second housing mounting groove is pacified with by deflector chute and first housing of keeper
Tankage connects, and pusher part moves to rotating disk direction along the second slide rail and passed through by the housing in the second housing mounting groove
Deflector chute pushes in the first housing mounting groove, the housing in gripping apparatus grips the first housing mounting groove, it is achieved
The accurate feeding of housing;
Rotating disk continues to rotate, and the first housing mounting groove moves to silicon chip feeding station, and silicon wafer loading device is by silicon
Sheet feeding is to the silicon chip installation position on housing;Then, rotating disk continue rotate, the first housing mounting groove move to
Point glue station, point glue equipment is to putting glue on the transistor component after assembling;Finally, after putting cementing bundle, first
Housing mounting groove moves to discharge station with rotating disk, and blanking device carries out blanking.
In the present embodiment, the transistor assembling point gum machine proposed, housing feeding device, silicon chip feeding fill
Put, point glue equipment, blanking device are separately positioned on rotating disk periphery, and by turntable rotation, the first housing is installed
Groove switches between glue station, discharge station at housing feeding station, silicon chip feeding station, point successively, work
Time, housing feeding device first feeding housing in the first housing mounting groove, then silicon wafer loading device is to shell
Silicon chip installation position feeding silicon chip on body, rearmost point gluing mechanism carries out a glue, and blanking device is by the crystalline substance after a glue
Body pipe assembly blanking, it is achieved the assembling point glue of transistor is continuously finished;During feeding, tied in discharging by slide block
Mobile handoff between tapping channel and the first housing installation position of rotating disk of structure, it is ensured that housing feeding one by one and
Feeding position is accurate, thus ensures the assembling point glue precision of transistor component.
The above, the only present invention preferably detailed description of the invention, but protection scope of the present invention not office
Being limited to this, any those familiar with the art is in the technical scope that the invention discloses, according to this
The technical scheme of invention and inventive concept thereof in addition equivalent or change, all should contain the protection in the present invention
Within the scope of.
Claims (6)
1. a transistor assembling point gum machine, for transistor component point glue, described transistor component includes
Housing (11) and silicon chip (12), silicon chip (12) is arranged on housing (11), it is characterised in that described
Transistor assembling point gum machine includes: workbench (2), rotating disk (3), housing feeding device, silicon chip feeding fill
Put (5), point glue equipment (6), blanking device (7), driving means;
Rotating disk (3) is horizontally set on workbench (2), and rotating disk (3) middle part is provided with the rotating shaft being vertically arranged
And may be rotatably mounted on workbench (2) by rotating shaft, driving means and rotating disk (3) are connected to drive
Rotating disk (3) rotates, and rotating disk (3) periphery is provided with at least one first housing mounting groove;
Housing feeding device, silicon wafer loading device (5), point glue equipment (6), blanking device (7) set respectively
Putting in rotating disk (3) periphery, housing feeding device is for the first housing mounting groove being positioned at the first feeding station
Interior feeding housing (11), silicon wafer loading device (5) is for the housing (11) being positioned at the second feeding station
Feeding silicon chip (12), point glue equipment (6) is used for being positioned on a transistor component of glue station some glue,
Blanking device (7) will be for completing transistor component blanking for dispensing glue;
Housing feeding device includes vibration feeding dish (41), the first slide rail (42), the second slide rail (43), pushes away
Materials and parts (44), the exit of vibration feeding dish (41) is provided with discharging structure, and discharging structure is provided with to close
The tapping channel that rotating disk (3) direction extends, the first slide rail (42) be positioned at the discharging opening of described tapping channel with
Between rotating disk (3), the first slide rail (42) is provided with the slide block (45) being slidably mounted, slide block (45)
Being provided with the second housing mounting groove, slide block (45) is under primary importance state, and described second housing is installed
Groove the first end connects with the discharging opening of described tapping channel, and slide block (45) is under second position state, institute
The second end stating the second housing mounting groove connects with the first housing mounting groove being positioned at the first feeding station, and second
Slide rail (43) is positioned at described discharging structure side and is parallel to the setting of described tapping channel bearing of trend, pusher
Part (44) can be slidably mounted on the second slide rail (43), and pusher part (44) is at slide block (45) place
Under second position state, the housing to be processed (11) in the second housing mounting groove is pushed and be positioned at the first feeding
In first housing mounting groove of station.
Transistor assembling point gum machine the most according to claim 1, it is characterised in that housing feeding device
Also include that keeper (46), keeper (46) are positioned between rotating disk (3) and the first slide rail (42), fixed
Position part (46) is provided with deflector chute, and described deflector chute connects with described first housing mounting groove, slide block (45)
Be under second position state, the second end of described second housing mounting groove by above-mentioned deflector chute be positioned at the
First housing mounting groove connection of one feeding station.
Transistor assembling point gum machine the most according to claim 2, it is characterised in that housing feeding device
Also including that block (47), block (47) are positioned on keeper (46), slide block (45) is in primary importance
Under state, block (47) is positioned at the discharge outlet of described tapping channel.
Transistor assembling point gum machine the most according to claim 1, it is characterised in that housing feeding device,
Silicon wafer loading device (5), point glue equipment (6), blanking device (7) set gradually in rotating disk (3) periphery.
Transistor assembling point gum machine the most according to claim 1, it is characterised in that on rotating disk (3)
Being provided with multiple first housing mounting groove, the plurality of first housing mounting groove is distributed along rotating disk (3) even circumferential.
Transistor assembling point gum machine the most according to claim 1, it is characterised in that described first housing
Being provided with clamping device (8) at mounting groove, clamping device (8) includes the first holder and the second holder, the
One holder and the second holder lay respectively at the first housing mounting groove both sides.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610329108.4A CN105864248A (en) | 2016-05-17 | 2016-05-17 | Transistor assembling and dispensing machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610329108.4A CN105864248A (en) | 2016-05-17 | 2016-05-17 | Transistor assembling and dispensing machine |
Publications (1)
Publication Number | Publication Date |
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CN105864248A true CN105864248A (en) | 2016-08-17 |
Family
ID=56635121
Family Applications (1)
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CN201610329108.4A Pending CN105864248A (en) | 2016-05-17 | 2016-05-17 | Transistor assembling and dispensing machine |
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Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005079388A (en) * | 2003-09-01 | 2005-03-24 | Sumitomo Mitsubishi Silicon Corp | Method and device for separating laminated wafer |
US7279363B2 (en) * | 2004-03-23 | 2007-10-09 | Texas Instruments Incorporated | Vertically stacked semiconductor device |
US20080138922A1 (en) * | 1999-12-15 | 2008-06-12 | Chang-Feng Wan | Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore |
CN103317321A (en) * | 2013-06-06 | 2013-09-25 | 苏州阿斯兰自动化科技有限公司 | Automatic assembly machine for cooling fins and transistors |
CN204128609U (en) * | 2014-04-18 | 2015-01-28 | 宁波久博源自动化科技有限公司 | Water meter turbine lining vibration conveying mechanism |
CN204384441U (en) * | 2015-01-07 | 2015-06-10 | 浙江尚源实业有限公司 | A kind of silicon chip processing feeding device |
CN105196048A (en) * | 2015-09-30 | 2015-12-30 | 江苏比微曼智能科技有限公司 | Cooling fin part assembling machine |
CN205200804U (en) * | 2015-11-10 | 2016-05-04 | 宁波中物东方光电技术有限公司 | A laser removes mucilage binding and puts for axle type part |
CN205744753U (en) * | 2016-05-17 | 2016-11-30 | 安庆友仁电子有限公司 | A kind of transistor assembling point gum machine |
-
2016
- 2016-05-17 CN CN201610329108.4A patent/CN105864248A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080138922A1 (en) * | 1999-12-15 | 2008-06-12 | Chang-Feng Wan | Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore |
JP2005079388A (en) * | 2003-09-01 | 2005-03-24 | Sumitomo Mitsubishi Silicon Corp | Method and device for separating laminated wafer |
US7279363B2 (en) * | 2004-03-23 | 2007-10-09 | Texas Instruments Incorporated | Vertically stacked semiconductor device |
CN103317321A (en) * | 2013-06-06 | 2013-09-25 | 苏州阿斯兰自动化科技有限公司 | Automatic assembly machine for cooling fins and transistors |
CN204128609U (en) * | 2014-04-18 | 2015-01-28 | 宁波久博源自动化科技有限公司 | Water meter turbine lining vibration conveying mechanism |
CN204384441U (en) * | 2015-01-07 | 2015-06-10 | 浙江尚源实业有限公司 | A kind of silicon chip processing feeding device |
CN105196048A (en) * | 2015-09-30 | 2015-12-30 | 江苏比微曼智能科技有限公司 | Cooling fin part assembling machine |
CN205200804U (en) * | 2015-11-10 | 2016-05-04 | 宁波中物东方光电技术有限公司 | A laser removes mucilage binding and puts for axle type part |
CN205744753U (en) * | 2016-05-17 | 2016-11-30 | 安庆友仁电子有限公司 | A kind of transistor assembling point gum machine |
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PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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Application publication date: 20160817 |