CN105843180A - Dispatching system and dispatching method based on semiconductor processing equipment production recipe - Google Patents
Dispatching system and dispatching method based on semiconductor processing equipment production recipe Download PDFInfo
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- CN105843180A CN105843180A CN201510021499.9A CN201510021499A CN105843180A CN 105843180 A CN105843180 A CN 105843180A CN 201510021499 A CN201510021499 A CN 201510021499A CN 105843180 A CN105843180 A CN 105843180A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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Abstract
Provided is a dispatching system based on a semiconductor processing equipment production recipe. The invention specifically relates to a dispatching system and a dispatching method. The system comprises an information acquisition module used for acquiring a production recipe in semiconductor processing equipment, a storage module used for storing the production recipe and the information of the semiconductor processing equipment to which the production recipe belongs, an analytical processing module used for analyzing the production recipe, carrying out matching and establishing a matching list, and a dispatching processing module used for judging whether set semiconductor processing equipment has a production recipe matching a wafer lot production recipe of a wafer lot to be processed, generating a judgment result and establishing a dispatching order of the wafer lot to be processed according to the judgment result and the matching list for dispatching. The dispatching order corresponding to a wafer lot can be accurately calculated in real time, the waiting time is reduced effectively for equipment, the utilization rate of equipment is improved greatly, the production cycle of wafer lots is shortened, and invalid operation of a transmission system and engineers is reduced.
Description
Technical field:
The present invention relates to technical field of manufacturing semiconductors, be specifically related to one and send goods system and side
Method.
Background technology:
In semiconductor fabrication, due to production technology and process and complexity thereof, every kind of product is being given birth to
Dissimilar, the semiconductor processing equipment of difference in functionality can be used during product.Engineer according to
Product arranges different factory formulas on each semiconductor processing equipment.Factory formula (EQP
Recipe) provide wafer (wafer) entrance semiconductor processing equipment to add used in man-hour
Whole parameters used in processing step and each processing step.Same semiconductor machining sets
Standby can be by arranging different factory formulas to produce different products.
The most state-of-the-art fab has been carried out full-automatic production (Full
Automation), realize the full-automation topmost part of production and use group in real time exactly
Goods system (RTD, Real Time Dispatching) is responsible for wafer batch on production line
(Lot) send goods, accurately wafer batch is sent to semiconductor processing equipment, it is ensured that wafer
Batch can produce on semiconductor processing equipment.Due to each in each step of every kind of product
On semiconductor processing equipment, need different factory formulas.In the past only by real for wafer batch
It is put on semiconductor processing equipment, just it is known that whether there is symbol on this semiconductor processing equipment
Close the factory formula of this wafer batch.If factory formula exists, then wafer batch is allowed to enter
In semiconductor processing equipment, produce；If factory formula does not exists, semiconductor machining
Equipment can refuse produce wafer batch, above-mentioned do not exist due to factory formula cause send goods in real time
Failure, can cause full-automatic producing unsuccessfully so that semiconductor processing equipment utilization rate is significantly
Reducing, the production cycle of product strengthens, and has a strong impact on the production efficiency of factory.
Summary of the invention
It is an object of the invention to, it is provided that a kind of group based on semiconductor processing equipment factory formula
Goods system, solves above technical problem；
The present invention also aims to, it is provided that a kind of based on semiconductor processing equipment factory formula
Send pallet piling up method, solve above technical problem.
Technical problem solved by the invention can realize by the following technical solutions:
Goods system of sending based on semiconductor processing equipment factory formula, wherein, including:
Data obtaining module, for obtaining the factory formula in semiconductor processing equipment；
Memory module, is connected with described data obtaining module, be used for storing described factory formula with
And the semiconductor processing equipment information belonging to described factory formula；
Dissection process module, is connected with described memory module, is used for resolving described factory formula,
And belonging to factory formula and wafer lot time factory formula after resolving and described factory formula
Semiconductor processing equipment information mate, set up a list of matches；
Send goods processing module, be connected with described dissection process module, it is judged that set semiconductor machining
Whether have what the described wafer lot with pending wafer batch time factory formula mated on equipment
Described factory formula, and generate a judged result, mate row in conjunction with described judged result with described
Table is set up the goods order of sending of pending wafer batch and is carried out sending goods.
Preferably, including multiple described data obtaining module, each described data obtaining module leads to
Cross the described factory formula specifying at least one semiconductor processing equipment of parameter acquiring.
Preferably, also include editor module, be connected with described memory module, be used for setting described
Specify parameter.
Preferably, described appointment parameter includes that semiconductor processing equipment mark, acquisition data start
At least one in the renewal frequency of time and acquisition data.
Preferably, including invalid data processing module, it is connected with described memory module, is used for sentencing
Invalid data in disconnected described factory formula, and described invalid data is carried out separating treatment.
Preferably, described dissection process module includes multiple sub-parsing module, each described son
The corresponding a type of semiconductor processing equipment of parsing module.
Preferably, set and on semiconductor processing equipment, there is the described crystalline substance with pending wafer batch
During the described factory formula that circle batch factory formula mates, arrange one for pending wafer batch and join
There is mark in side；
Set and do not exist and the described wafer lot of pending wafer batch on semiconductor processing equipment
During the described factory formula that secondary factory formula mates, for pending wafer batch, one formula is set not
There is mark, there is mark using described formula or formula does not exist mark and judges knot as described
Really；
Described send goods processing module to have described formula exist mark pending wafer batch
Preferentially send goods.
Preferably, also include a message transmission module, send goods processing module to be connected with described, right
Having described formula and there is not the pending wafer batch of mark, described message transmission module notifies
Object is specified to need to set up factory formula for pending wafer batch and/or point out other can be used for
Process the semiconductor processing equipment list of pending wafer batch.
The present invention also provides for a kind of based on semiconductor processing equipment factory formula sending pallet piling up method, its
In, comprise the following steps:
Step 1: obtain the factory formula in semiconductor processing equipment；
Step 2: store the semiconductor machining belonging to described factory formula and described factory formula
Facility information；
Step 3: resolve described factory formula, and the factory formula after resolving and wafer batch
Semiconductor processing equipment information belonging to factory formula and described factory formula is mated, and builds
A vertical list of matches；
Step 4: judge whether exist and pending wafer batch on setting semiconductor processing equipment
The described factory formula of described wafer lot time factory formula coupling, and generate a judged result,
Goods order is sent in conjunction with what described judged result and described list of matches set up pending wafer batch
Carry out sending goods.
Preferably, in step 4, set and exist and pending wafer lot on semiconductor processing equipment
During the described factory formula that secondary described wafer lot time factory formula mates, for pending wafer lot
There is mark in the secondary formula that arranges；
Set and do not exist and the described wafer lot of pending wafer batch on semiconductor processing equipment
During the described factory formula that secondary factory formula mates, for pending wafer batch, one formula is set not
There is mark, there is mark using described formula or formula does not exist mark and judges knot as described
Really；
Described send goods processing module to have described formula exist mark pending wafer batch
Preferentially send goods.
Preferably, to having described formula and do not exist the pending wafer batch of mark, notice refers to
Determining object is that pending wafer batch is set up factory formula and/or points out other to can be used for processing to treat
Process the semiconductor processing equipment list of wafer batch.
Beneficial effect: owing to using above technical scheme, the present invention can be according to semiconductor machining
Wafer batch is sent goods by equipment factory formula accurately, and can be with look-ahead and notice
Engineer creates factory formula on semiconductor processing equipment；Realize:
1) the wafer batch waiting time before semiconductor processing equipment is decreased, for priority
Higher wafer batch, as Bullet wafer batch and NTO (new tape out, newly
Product) wafer batch, it is greatly shortened the production cycle of product；
2) semiconductor processing equipment is decreased because the number of times of factory formula refusal wafer batch, real
The continuous production of existing semiconductor processing equipment, improves the utilization rate of semiconductor processing equipment；
3) send goods system can carry out sending goods accurately in real time, reduce operator and dolly carrying
The invalid carrying to wafer cassette (Front Opening Unified Pod, FOUP) of system
And the number of transmissions, reduce the routine work amount (loading) of operator；
4) system can with look-ahead and notify engineer wafer batch is set required for production join
Side, improves the work efficiency of engineer, reduces invalid semiconductor processing equipment operation.
Accompanying drawing explanation
Fig. 1 is the system architecture schematic diagram of the present invention；
Fig. 2 is data obtaining module and the appointment parameter of correspondence of a kind of specific embodiment of the present invention
Schematic diagram；
Fig. 3 is that the memory module storing semiconductor process equipment of a kind of specific embodiment of the present invention is raw
Produce the schematic diagram of formula；
Fig. 4 is the list of matches schematic diagram of a kind of specific embodiment of the present invention；
Fig. 5 is that the semiconductor processing equipment of specifying of a kind of specific embodiment of the present invention currently waits
Wafer batch list schematic diagram；
Fig. 6 is that the result sending goods processing module of a kind of specific embodiment of the present invention is illustrated
Figure；
Fig. 7 is that a kind of of the present invention points out other to can be used for processing partly leading of pending wafer batch
Body process equipment list schematic diagram；
Fig. 8 is the method flow schematic diagram of the present invention；
Fig. 9 is the comparison diagram that the present invention uses the reject rate of before and after's semiconductor processing equipment.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, to the technical side in the embodiment of the present invention
Case is clearly and completely described, it is clear that described embodiment is only the present invention one
Divide embodiment rather than whole embodiments.Based on the embodiment in the present invention, this area is general
The every other enforcement that logical technical staff is obtained on the premise of not making creative work
Example, broadly falls into the scope of protection of the invention.
It should be noted that in the case of not conflicting, the embodiment in the present invention and embodiment
In feature can be mutually combined.
The invention will be further described with specific embodiment below in conjunction with the accompanying drawings, but not as this
The restriction of invention.
With reference to Fig. 1, goods system of sending based on semiconductor processing equipment factory formula, wherein, wrap
Include:
Data obtaining module, for obtaining the factory formula in semiconductor processing equipment；
Memory module, is connected with data obtaining module, is used for storing factory formula and production is joined
Semiconductor processing equipment information belonging to side；
Dissection process module, is connected with memory module, is used for resolving factory formula, and will resolve
After factory formula and wafer lot time factory formula and semiconductor machining belonging to factory formula
Facility information mates, and sets up a list of matches；
Send goods processing module, be connected with dissection process module, it is judged that set semiconductor processing equipment
On whether there is the factory formula that time factory formula of the wafer lot with pending wafer batch mates,
And generate a judged result, set up pending wafer batch in conjunction with judged result and list of matches
Goods order is sent to carry out sending goods.
The present invention joins by combining semiconductor processing equipment production present on semiconductor processing equipment
Relation between side and wafer lot time factory formula, it is ensured that there is semiconductor processing equipment production and join
The wafer batch of side can preferentially be sent on semiconductor processing equipment, preferentially enters quasiconductor and adds
Construction equipment is processed.
As a kind of preferred embodiment of the present invention, multiple data obtaining module can be included,
Each data obtaining module can be by specifying at least one semiconductor processing equipment of parameter acquiring
Factory formula.Each data obtaining module may be used for obtaining a type of semiconductor machining
The all of factory formula of equipment.
As a kind of preferred embodiment of the present invention, with reference to Fig. 2, it is intended that parameter can include
Semiconductor processing equipment mark (EQPID), acquisition data time started (Start Time)
With at least one in the renewal frequency (Update Frequency) obtaining data.Each information
Acquisition module is represented by data obtaining module mark (Recipe Collector).
A kind of preferred embodiment as the present invention, it is also possible to include editor module, with storage
Module connects, and is used for setting appointment parameter.Engineer first passes through editor module and sets in systems
Surely specifying parameter, data obtaining module obtains factory formula automatically according to appointment parameter.Such as information
Acquisition module RC1 can corresponding semiconductor processing equipment EQP1 and semiconductor processing equipment EQP2,
And time started of acquisition information and renewal frequency be set to realize automatically obtaining the information needed,
The corresponding multiple data obtaining module of one semiconductor processing equipment can also be set.
As a kind of preferred embodiment of the present invention, including invalid data processing module, and deposit
Storage module connects, for judging invalid factory formula data, and to invalid factory formula number
According to carrying out separating treatment.
Set owing to the information that data obtaining module obtains not comprising only the semiconductor machining of effect
Standby factory formula, it is also possible to include other backup information, by invalid data processing module,
Judge the invalid data in factory formula, invalid data is carried out separating treatment, by memory module
In effective factory formula preserve, to concentrate on the process of effective information.At invalid data
Reason module can be come by the naming rule of each type of semiconductor processing equipment factory formula
It is identified and judges.Partly lead if this semiconductor processing equipment factory formula meets this type
The naming rule of body process equipment factory formula, then these data are valid data；Otherwise, this number
According to for invalid data.With reference to Fig. 3, deposit effective factory formula in a storage module and include
Semiconductor processing equipment mark (EQPID), semiconductor processing equipment type (Eqp Type),
Factory formula data (Eqp Recipe) and the time of renewal (Update time).
As a kind of preferred embodiment of the present invention, dissection process module can include many height
Parsing module, the corresponding a type of semiconductor processing equipment of each sub-parsing module.Resolve
Processing module is made up of the sub-parsing module for different types of semiconductor processing equipment.
Dissection process module is mainly used in resolving efficient semiconductor process equipment factory formula, by
In the difference of the naming rule of each type semiconductor processing equipment, can resolve according to naming rule
Factory formula, and find out belonging to factory formula factory formula secondary with wafer lot and factory formula
Relatedness between semiconductor processing equipment, sets up the list of matches between them.
Factory formula is the process program instructing semiconductor processing equipment production and application, each production
Formula comprises whole parameters used during this semiconductor processing equipment produces.Due to the most of the same race
The semiconductor processing equipment of class is that different manufacturers produces, so for producing same product,
The factory formula needed on different semiconductor processing equipments is also different, and factory formula is through solving
After analysis processing module, it is possible to obtain corresponding wafer lot time factory formula, wafer lot time produces joins
Side comprises the production information of this wafer batch.
With reference to Fig. 4, as a kind of preferred embodiment of the present invention, list of matches predominantly half
Conductor process equipment mark (EQPID), semiconductor processing equipment type (Eqp Type),
Factory formula (Eqp Recipe), wafer lot time factory formula (Lot Recipe), life
Produce wafer lot type (Recipe Type Flag) and existence appointment life that formula is suitable for
Produce corresponding reflecting between semiconductor processing equipment mark (HasRecipeEqpList) of formula
Penetrate relation.In wafer lot type (Recipe Type Flag) in Fig. 4, P represents one
As the wafer batch (Production Lot) of the normal attribute of property；R represents provisional test
The wafer batch of/detection or title traveler wafer batch (RunCard Lot)；A represents monitoring
Wafer batch (Monitor Lot)；S represents the control wafer wafer batch (Season of warming-up
Lot)。
As a kind of preferred embodiment of the present invention, send goods processing module can include a judgement
Module, it is judged that module judge to set according to list of matches whether exist on semiconductor processing equipment and
The factory formula of the wafer lot of pending wafer batch time factory formula coupling, generates and judges knot
Really, it is judged that result is as the foundation sending goods to sort.Exist on semiconductor processing equipment and treat
Process the factory formula of the wafer lot time factory formula coupling of wafer batch, a formula can be set
There is mark (Recipe Exist Flag (REF)) or formula exists mark and is expressed as
" Y ", shows to wait that wafer batch may operate in this semiconductor processing equipment, quasiconductor adds
Exist on construction equipment and run the factory formula that this wafer batch is used；If semiconductor processing equipment
On there is not the factory formula that time factory formula of the wafer lot with pending wafer batch mates, can
With arrange a formula do not exist mark or formula exist mark (Recipe Exist Flag
(REF)) it is expressed as " N ", represents and wait that wafer batch can not operate in this semiconductor machining
Equipment, semiconductor processing equipment does not exist and runs the semiconductor machining used of this wafer batch and set
Standby factory formula.
As a kind of preferred embodiment of the present invention, also include a message transmission module, with
Goods processing module is sent to connect, for notifying that specifying object needs is that the wafer batch set sets up half
Conductor process equipment factory formula and/or other quasiconductor that can be used for processing setting wafer batch
Process equipment list.
With reference to Fig. 5, Fig. 6, send in real time goods system when sending goods to sort, according to each wafer lot
There is priority (Lot Priority) meter of mark (REF) and wafer batch in secondary formula
Calculating and send goods sequence (RTD Dispatcher Sequence, RDS) value, system is according to group
Goods ranking value, by order arrangement display wafer batch from small to large.Goods of sending in Fig. 6 sorts
Value is to there is mark and a natural number from small to large of priority conditions imparting according to formula
Sequence valve.
If wait wafer batch send goods ranking value the least and formula exist be designated " Y ",
Then can preferentially send on semiconductor processing equipment；If wait wafer batch sends goods ranking value more
Big and formula existence is designated " N ", then system can pass through interface notifications engineer or engineering
Shi assistant: current semiconductor process equipment can not process this wafer batch, if there being same type
Other semiconductor processing equipments can process this wafer batch, then can point out in interface and list
All available semiconductor processing equipment lists.
By the prediction of this module, engineer can check that wafer batch is in ensuing process technique
The factory formula of this wafer batch whether is there is on the semiconductor processing equipment of website.If do not deposited
, engineer can be when wafer batch the most arrive semiconductor processing equipment, in advance half
Semiconductor processing equipment processing procedure factory formula is created on conductor process equipment.If priority is relatively
High wafer batch, such as Bullet wafer batch and NTO (new tape out, new product)
Wafer batch, sends goods processing module periodically can notify engineering with the form of mail (Email)
Teacher, prompting engineer joins for establishment production in these wafer batches to semiconductor processing equipment in time
Side.The present invention can reduce the waiting time at each station of wafer batch, reduces semiconductor machining
The equipment waiting time, improve the utilization rate of semiconductor processing equipment, thus reach semiconductor machining
Equipment capacity utilizes and maximizes, and reduces the production cycle of wafer batch.
The present invention also provides for a kind of pallet piling up method of sending based on semiconductor processing equipment factory formula, ginseng
According to Fig. 7, comprise the following steps:
Step 1: obtain the factory formula in semiconductor processing equipment；
Step 2: the semiconductor processing equipment information belonging to storage factory formula and factory formula；
Step 3: resolve factory formula, and factory formula and the wafer lot time after resolving produce
Semiconductor processing equipment information belonging to formula and factory formula is mated, and sets up a coupling
List；
Step 4: judge whether exist and pending wafer batch on setting semiconductor processing equipment
The factory formula of wafer lot time factory formula coupling, and generate a judged result, combine judgement
Result and list of matches are set up the goods order of sending of pending wafer batch and are carried out sending goods.
As a kind of preferred embodiment of the present invention, in step 4, it is judged that result is joined by one
There is mark and represent in side, sets and exist on semiconductor processing equipment and pending wafer batch
During the factory formula that wafer lot time factory formula mates, there is mark in the formula of pending wafer batch
Know for " Y "；Set and do not exist and the wafer of pending wafer batch on semiconductor processing equipment
During the factory formula that batch factory formula mates, the formula existence of pending wafer batch is designated
" N ", the pending wafer batch that formula existence is designated " Y " preferentially sends goods.
As a kind of preferred embodiment of the present invention, there is mark in the formula of pending wafer batch
When knowing for " N ", notice specifies object to be that pending wafer batch is set up factory formula and/or carries
Show other semiconductor processing equipment list that can be used for processing pending wafer batch.
In prior art when waiting that wafer batch can not operate on this semiconductor processing equipment,
Equipment automatization (Equipment Automatic Program, EAP) system can point out production
Wafer batch is moved away from semiconductor processing equipment by assistant or dolly.Produce assistant to be led to by phone
Know that process engineers checks to semiconductor processing equipment or goes to create factory formula.Until
Process engineers has created factory formula on semiconductor processing equipment, sends goods by enforcement, brilliant
After circle batch just can be moved on semiconductor processing equipment again, by EAP systems inspection
After, just can be produced by semiconductor processing equipment.The present invention passes through prediction and prompt facility,
Engineer can be pointed out to shift to an earlier date on semiconductor processing equipment and to create factory formula, with reference to Fig. 9,
For using the semiconductor processing equipment reject rate sending goods system before the present invention before dotted line
(Track In Failure Ratio=semiconductor processing equipment refusal wafer batch (Lot)
Number of times/semiconductor processing equipment accept the number of times of wafer batch), for using this after dotted line
Semiconductor processing equipment reject rate after invention, after dotted line, along with half added in system
Being stepped up and produce the execution combining ability of assistant of conductor process equipment steps up, and partly leads
Body process equipment reject rate is in the trend being gradually lowered, it can be appreciated that use the present invention's
System makes semiconductor processing equipment reject rate 17.3% before the timing node shown in dotted line
It is down to less than 1.5%, the effective waiting time reducing semiconductor processing equipment, is greatly improved
Semiconductor processing equipment utilization rate, shorten wafer batch production cycle, reduce transmission system with
And the invalid operation of engineer.
These are only preferred embodiment of the present invention, not thereby limit embodiments of the present invention
And protection domain, to those skilled in the art, it should can appreciate that all utilizations this
Obtained by equivalent done by bright description and diagramatic content and obvious change
Scheme, all should be included in protection scope of the present invention.
Claims (11)
1. based on semiconductor processing equipment factory formula send goods system, it is characterised in that bag
Include:
Data obtaining module, for obtaining the factory formula in semiconductor processing equipment；
Memory module, is connected with described data obtaining module, be used for storing described factory formula with
And the semiconductor processing equipment information belonging to described factory formula；
Dissection process module, is connected with described memory module, is used for resolving described factory formula,
And belonging to factory formula and wafer lot time factory formula after resolving and described factory formula
Semiconductor processing equipment information mate, set up a list of matches；
Send goods processing module, be connected with described dissection process module, it is judged that set semiconductor machining
Whether have what the described wafer lot with pending wafer batch time factory formula mated on equipment
Described factory formula, and generate a judged result, mate row in conjunction with described judged result with described
Table is set up the goods order of sending of pending wafer batch and is carried out sending goods.
The most according to claim 1 based on semiconductor processing equipment factory formula send goods
System, it is characterised in that include multiple described data obtaining module, each described acquisition of information
Module is by specifying the described factory formula of at least one semiconductor processing equipment of parameter acquiring.
The most according to claim 2 based on semiconductor processing equipment factory formula send goods
System, it is characterised in that also include editor module, is connected with described memory module, is used for setting
Fixed described appointment parameter.
The most according to claim 2 based on semiconductor processing equipment factory formula send goods
System, it is characterised in that described appointment parameter includes semiconductor processing equipment mark, obtains number
According at least one in the renewal frequency of time started and acquisition data.
The most according to claim 1 based on semiconductor processing equipment factory formula send goods
System, it is characterised in that include invalid data processing module, is connected with described memory module,
For judging the invalid data in described factory formula, and described invalid data is carried out at separation
Reason.
The most according to claim 1 based on semiconductor processing equipment factory formula send goods
System, it is characterised in that described dissection process module includes multiple sub-parsing module, each
The corresponding a type of semiconductor processing equipment of described sub-parsing module.
The most according to claim 1 based on semiconductor processing equipment factory formula send goods
System, it is characterised in that set and exist on semiconductor processing equipment and pending wafer batch
During the described factory formula that described wafer lot time factory formula mates, set for pending wafer batch
Put a formula and there is mark；
Set and do not exist and the described wafer lot of pending wafer batch on semiconductor processing equipment
During the described factory formula that secondary factory formula mates, for pending wafer batch, one formula is set not
There is mark, there is mark using described formula or formula does not exist mark and judges knot as described
Really；
Described send goods processing module to have described formula exist mark pending wafer batch
Preferentially send goods.
The most according to claim 7 based on semiconductor processing equipment factory formula send goods
System, it is characterised in that also include a message transmission module, sends goods processing module even with described
Connecing, to having described formula and do not exist the pending wafer batch of mark, described message sends mould
Block notice specifies object to need set up factory formula for pending wafer batch and/or point out other
Can be used for processing the semiconductor processing equipment list of pending wafer batch.
9. based on semiconductor processing equipment factory formula send pallet piling up method, it is characterised in that bag
Include following steps:
Step 1: obtain the factory formula in semiconductor processing equipment；
Step 2: store the semiconductor machining belonging to described factory formula and described factory formula
Facility information；
Step 3: resolve described factory formula, and the factory formula after resolving and wafer batch
Semiconductor processing equipment information belonging to factory formula and described factory formula is mated, and builds
A vertical list of matches；
Step 4: judge whether exist and pending wafer batch on setting semiconductor processing equipment
The described factory formula of described wafer lot time factory formula coupling, and generate a judged result,
Goods order is sent in conjunction with what described judged result and described list of matches set up pending wafer batch
Carry out sending goods.
The most according to claim 9 based on semiconductor processing equipment factory formula send goods
Method, it is characterised in that in step 4, sets and exists with pending on semiconductor processing equipment
During the described factory formula that the described wafer lot of wafer batch time factory formula mates, for pending
Wafer batch arranges a formula and there is mark；
Set and do not exist and the described wafer lot of pending wafer batch on semiconductor processing equipment
During the described factory formula that secondary factory formula mates, for pending wafer batch, one formula is set not
There is mark, there is mark using described formula or formula does not exist mark and judges knot as described
Really；
Described send goods processing module to have described formula exist mark pending wafer batch
Preferentially send goods.
11. groups based on semiconductor processing equipment factory formula according to claim 10
Pallet piling up method, it is characterised in that to there is described formula not existing the pending wafer batch of mark,
Notice specifies object to be that pending wafer batch is set up factory formula and/or points out other can be used for
Process the semiconductor processing equipment list of pending wafer batch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510021499.9A CN105843180A (en) | 2015-01-15 | 2015-01-15 | Dispatching system and dispatching method based on semiconductor processing equipment production recipe |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510021499.9A CN105843180A (en) | 2015-01-15 | 2015-01-15 | Dispatching system and dispatching method based on semiconductor processing equipment production recipe |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108063101A (en) * | 2017-12-15 | 2018-05-22 | 武汉新芯集成电路制造有限公司 | A kind of methods of sampling of wafer defect test |
| CN110850830A (en) * | 2019-11-20 | 2020-02-28 | 常州捷佳创精密机械有限公司 | Slot type equipment for automatic process treatment and formula scheduling method thereof |
| CN111356988A (en) * | 2020-02-21 | 2020-06-30 | 长江存储科技有限责任公司 | Method and system for scheduling semiconductor processing |
| CN113777109A (en) * | 2021-08-25 | 2021-12-10 | 深圳市青虹激光科技有限公司 | Workpiece detection method, system, equipment and storage medium |
| CN114068347A (en) * | 2020-08-06 | 2022-02-18 | 长鑫存储技术有限公司 | Semiconductor process detection system and semiconductor process detection method |
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Application publication date: 20160810 |