CN105828517B - A kind of preparation method of the FPC plate of low-loss high flexibility high-frequency transmission - Google Patents
A kind of preparation method of the FPC plate of low-loss high flexibility high-frequency transmission Download PDFInfo
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- CN105828517B CN105828517B CN201610308653.5A CN201610308653A CN105828517B CN 105828517 B CN105828517 B CN 105828517B CN 201610308653 A CN201610308653 A CN 201610308653A CN 105828517 B CN105828517 B CN 105828517B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
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Abstract
Present invention discloses a kind of preparation methods of the FPC plate of low-loss high flexibility high-frequency transmission comprising following steps: S1) prepare FPC plate substrate and first screen layer, secondary shielding layer；S2) transmission line layer is obtained by preceding processing, pad pasting, exposure, development, etching on the FPC plate substrate；S3) transmission line layer is placed between the first screen layer and the secondary shielding layer, and adhesive layer and first medium layer are successively laid between the first screen layer and the transmission line layer, second dielectric layer is laid between secondary shielding layer and the transmission line layer；S4) solidification baking；S5 it) drills；S6) successively printing forms the first solder mask and the second solder mask on the outside of the first screen layer, the secondary shielding layer respectively, obtains FPC plate.The present invention can produce flexibility height, high-frequency transmission low-loss, can the high FPC plate of integrated level.
Description
[technical field]
The invention belongs to flexible circuit board manufacturing technology fields, more particularly to a kind of low-loss high flexibility high-frequency transmission
The preparation method of FPC plate.
[background technique]
When the deployment of 4G network carries out in high gear, prelude has also been pulled open in the research about 5G.2012, by European Union
Provide funds 270,000,000,000 Euros support 5G research project METIS [1] formally start, project be divided into eight groups respectively to scene demand,
Eat dishes without rice or wine technology, multi-antenna technology, the network architecture, spectrum analysis, emulation and test platform etc. is furtherd investigate；Britain's political affairs
Mansion joint many enterprises found 5G innovation center, are dedicated to future customer demand, 5G network key performance indicator, core technology
Research and assessment verify；South Korea is pushed jointly by the Department of Science and Technology, South Korea, ICT and prospective project portion and has set up South Korea " 5G
Forum " specially pushes its country 5G to be in progress；China, the Ministry of Industry and Information Technology, the Committee of Development and Reform and the Department of Science and Technology set up IMT- jointly
2020 propulsion groups, the platform as 5G work, it is intended to which pushing the 5G technology of domestic independent research becomes international standard.As it can be seen that right
In the research of 5G, many countries or tissue are all in energetically carrying out.According to the rule of development of 10 years generation of mobile communication standard,
5G has become global mobile communication field new round technology competition focus.
With the continuous development of wireless communication system, message capacity and frequency are continuously improved, and the weight as wireless communication
Want the requirement of carrier antenna and its transmission module also higher and higher, such as mobile terminal product such as mobile phone, PDA and popular in the recent period
Internet-of-things terminal etc., internal antenna module gradually increase, and the connection of mainboard and antenna also proposed more complicated and higher
The requirement of system design of capacity.
Mainboard in the prior art is connect with Anneta module common are two ways: 1) coaxial cable；2) common FPC.
Coaxial cable has lower loss in high-frequency transmission, but with the continuous appearance for pursuing " light " and " thin " of terminal device
Design requirement, available space constantly reduce, and the line footpath of coaxial cable is caused constantly to reduce in this way, while also just bringing loss not
Disconnected to increase, the high capacity of this and system requirements will run in the opposite direction.On the other hand, requirement of the coaxial cable to space is also not easy to more
The integrated transmission requirement of Anneta module.And common FPC can accomplish light, thin space requirement, but FPC traditional at present can not
Realize low-loss transmission requirement, with the continuous improvement of frequency, transmission loss is also continuously increased, need to be by constantly reducing aperture
And the highly difficult technique such as blind hole suitably to reduce loss, and cost will be increased in this way.
Therefore, it is necessary to provide a kind of preparation method of the FPC plate of new low-loss high flexibility high-frequency transmission to solve
State problem.
[summary of the invention]
The main purpose of the present invention is to provide a kind of preparation method of the FPC plate of low-loss high flexibility high-frequency transmission, energy
Enough produce flexibility height, high-frequency transmission low-loss, can the high FPC plate of integrated level.
The present invention is achieved through the following technical solutions above-mentioned purpose: a kind of FPC plate of low-loss high flexibility high-frequency transmission
Preparation method comprising following steps:
S1 FPC plate substrate and first screen layer, secondary shielding layer) are prepared；
S2) transmission line layer is obtained by preceding processing, pad pasting, exposure, development, etching on the FPC plate substrate；
S3) transmission line layer is placed between the first screen layer and the secondary shielding layer, and described
Adhesive layer and first medium layer are successively laid between one shielded layer and the transmission line layer, in secondary shielding layer and the transmission line
It is laid with second dielectric layer between layer, obtains six laminates；
S4) solidification baking；
S5) drilling forms penetrating via hole on six laminate；
S6) successively printing forms the first solder mask and the on the outside of the first screen layer, the secondary shielding layer respectively
Two solder masks obtain FPC plate.
Further, the FPC plate substrate in the S1 step is made using low roughness copper foil, with a thickness of
12~28um.
Further, the first screen layer and the secondary shielding layer are prolonged using copper foil and are pressed, with a thickness of 12~
28um。
Further, the transmission line layer include the signal wire formed on central axis, it is symmetrical along the signal wire
Transmission region, be provided with spacing between the signal wire and the transmission region.
Further, the first medium layer and the second dielectric layer select low dielectric coefficient polyimide material, institute
Second dielectric layer is stated with a thickness of 12~75um.
Further, thickness of the sum of the thickness of both the first medium layer and described adhesive layer with the second dielectric layer
It spends identical.
Further, the sum of dielectric loss of both the first medium layer and described adhesive layer and the second medium
Dielectric loss is identical.
Further, between the S5 and the S6 step, it is also necessary to handle the via hole, processing method
Specifically includes the following steps:
S51) plasma treatment removes residue, the burr for crossing hole surface；
S52) copper-coating forms a relatively thin layers of copper, in the via hole inner wall with a thickness of 0.4~0.7um；
S53) flash is handled, and thickeies the copper layer thickness of the via hole inner wall to 4~6um；
S54) partial exposure/development；
S55) parcel plating thickeies the copper layer thickness of the via hole inner wall to 20~22um；
S56) using exposure, develop, be etched in the first screen layer and the secondary shielding layer and form circuit.
Further, first solder mask and second solder mask are flexible bend-resistance ink.
Further, it also needs to be exposed after the S6 step, develops, solidifies baking, turmeric technique.
Compared with prior art, a kind of preparation method of the FPC plate of low-loss high flexibility high-frequency transmission of the present invention is beneficial
Effect is: by signal wire width design, spacing dimension design, stack-design, and the polyamides Asia excellent using dielectric properties
Amine material realizes the low-loss function of high-frequency transmission；By using prolonging pressure copper foil as first screen layer and secondary shielding layer,
In conjunction with partial exposure, part development, parcel plating technique, bending region is protected, the layers of copper of bending region is reduced
Thickness improves the flexibility of FPC plate；While realizing high-frequency transmission low-loss function, the height of electronic device is also achieved
Degree is integrated.
[Detailed description of the invention]
Fig. 1 is the cross section structure schematic diagram of the embodiment of the present invention；
Digital representation in figure:
The FPC plate and preparation method thereof of 100 low-loss high flexibility high-frequency transmissions；
1 first solder mask, 11 pads；2 first screen layers, 21 via holes；3 first medium layers；4 adhesive layers；5 transmission line layers,
51 signal wires, 52 transmission regions, 53 spacing；6 second dielectric layer；7 secondary shielding layers；8 second solder masks；9 electronic devices；10 mend
Strong layer.
[specific embodiment]
Embodiment one
Please refer to Fig. 1, a kind of FPC plate 100 of low-loss high flexibility high-frequency transmission of the present embodiment, cross-sectional structure is from upper
It successively include the first solder mask 1, first screen layer 2, first medium layer 3, adhesive layer 4, transmission line layer 5, second dielectric layer under and
6, secondary shielding layer 7, the second solder mask 8.
Transmission line layer 5 includes the signal wire 51 formed on central axis, along the symmetrical transmission region 52 of signal wire 51.
Spacing 53 is provided between signal wire 51 and transmission region 52.
First solder mask 1 and the second solder mask 8 are that flexible bend-resistance ink is mainly used for preventing gold with a thickness of 12um
The first screen layer 2 for belonging to material is oxidized with 7 surface of secondary shielding layer, while being opened a window by retaining on 1 surface of the first solder mask
Exposed pads 11 facilitate welding electronic component, Contact antenna, hand set machine shell etc..Electronic device 9 is welded on pad 11,
The strengthening course 10 that regional area corresponding with 9 position of electronic device is provided in 8 lower surface of the second solder mask, with a thickness of
100um, material is using steel disc or other rigid material matter, local strengthening FPC plate, to realize the welding branch to electronic device 9
Support, convenient for integrated.The design of pad 11 is to avoid bending region as principle, and with the pin of electronic device 9 with 0.95:1 ratio
Collocation be it is best, can preferably complete to weld but Yin Duoxi and big pad caused by parasitic inductance and parasitic capacitance
And the phenomenon that causing distorted signals.
First screen layer 2, which is prolonged with secondary shielding layer 7 using copper foil, presses, and with a thickness of 12um, main function is shielding
The interference of external electromagnetic wave.Penetrating via hole 21 is formed between first screen layer 2 and secondary shielding layer 7, it is a diameter of
0.10mm is mainly used for electric connection first screen layer 2 and secondary shielding layer 7.
First medium layer 3 and second dielectric layer 6 use low dielectric coefficient polyimide material, first medium layer 3 with a thickness of
12um, second dielectric layer 6 is with a thickness of 18um.Polyimides is one of optimal high-molecular organic material of comprehensive performance, high temperature resistant
Up to 400 DEG C or more, -200~300 DEG C of long-term use temperature range, no sharp melting point, high insulating property, 103 hertz of lower dielectric constants
4.0, dielectric loss only 0.004~0.007 belongs to F to H class F insulating material F.Polyimides has good dielectric properties, and dielectric is normal
Number is 3.4 or so, is introduced into fluorine or by air nano-size dispersion in polyimides, dielectric constant can drop to 2.5 or so.It is situated between
Electrical loss is 10~3, and dielectric strength is 100~300KV/mm, is extensively 300KV/mm at thermoplastic polyimide, volume resistance is
1017Ω·cm.First medium layer 3 and second dielectric layer 6 are formed using polyimides material, can be realized and passed in high-frequency signal
The defeated lower more low-loss function of generation.
Adhesive layer 4 uses low-k resin material, with a thickness of 6.On the one hand adhesive layer 4 realizes that low-loss high-frequency passes
Defeated signal；On the other hand, adhesive layer 4 some be filled in spacing 53, for the signal wire 51 that is adhesively fixed, prevent because of signal
Line 51 shifts and influences transmission signal.
Transmission line layer 5 uses low roughness copper foil material, with a thickness of 12um, using relatively thin thickness, main function
It is the loss for reducing the conductor layer.
The thickness of both first medium layer 3 and adhesive layer 4, second dielectric layer 6 thickness design to guarantee signal transmission
Dielectric loss is to referred to as principle.When first medium layer 3, second dielectric layer 6, adhesive layer 4 use the feelings of identical dielectric constant material
Under condition, the sum of thickness of 4 the two of first medium layer 3 and adhesive layer is identical as the thickness of second dielectric layer 6, to guarantee the first shielding
Layer 2 to transmission line layer 5 distance with secondary shielding layer 7 being equidistant to transmission line layer 5, guarantee signal propagation circuit it is symmetrical,
Reduce loss and electromagnetic radiation.When first medium layer 3, second dielectric layer 6 and adhesive layer 4 are using the feelings of differing dielectric constant material
Under condition, pass through specified frequency and emulation measured data library, the thickness of setting first medium layer 3, second dielectric layer 6 and adhesive layer 4
Degree guarantees that signal propagation circuit and dielectric loss are symmetrical.
The preparation method of the FPC plate 100 of the present embodiment low-loss high flexibility high-frequency transmission includes:
S1 FPC plate substrate and first screen layer 2, secondary shielding layer 7) are prepared, FPC plate substrate selects the copper of low roughness
Foil, first screen layer 2, which is prolonged with secondary shielding layer 7 using copper foil, presses；
S2) pre-treatment: being removed the oxidation greasy dirt impurity of FPC plate substrate surface by chemical cleaning, and be roughened copper foil surface,
Increase the binding force of pad pasting；
S3) pad pasting: by dry film uniform fold on the FPC plate substrate surface after S2 step process, turned with providing image
It diverts from one use to another；
S4) exposure/development: using UV exposure machine, and setting exposure energy is 6 grades, developer pressure 50psi, speed 5m/
The image of film on piece is transferred on the FPC plate substrate surface after S3 step process by min using the photoinduction of dry film,
It recycles certain density sodium carbonate or potassium carbonate liquid medicine that the region dry film that polymerization reaction not yet occurs is rinsed out, leaves and felt
The part of polymerization reaction occurs for light, becomes the resist film of etching or plating, and S4 step mainly turns the transmission line layer circuit of design
It moves on on dry film comprising width design size, the size of spacing 53 of signal wire 51；
S5) etch: etching spray pressure is set as 50psi, speed 6m/min, will pass through S4 step using corrosion technology
Treated, and the extra copper corrosion of FPC plate substrate surface falls, and obtains final transmission line layer 5；
S6 it) is laminated: using vacuum press, temperature setting is 120 degree, and pressure is set as 500psi, and the time is set as
Transmission line layer 5 is placed between first screen layer 2 and secondary shielding layer 7 by 200s, and in first screen layer 2 and transmission line layer 5
Between be successively laid with adhesive layer 4 and first medium layer 3, between secondary shielding layer 7 and transmission line layer 5 be laid with second dielectric layer 6,
Obtain six laminates；
S7) solidify baking: using six laminates of the baking oven baking after the lamination of S6 step, temperature setting is 120 degree, when
Between be set as 2H, main function is to make the completion of cure at high temperature of adhesive layer 4, forms preferable binding force；
S8 it) drills: penetrating via hole 21 is formed on six laminates after S7 step process using machine drilling mode,
Its revolving speed is set as 150kr/min, terminal-velocity 0.5m/min, Hui Su 8m/min, which promotes hole wall by parameter setting
Quality reduces via hole self-induction；
S9) plasma: plasma process uses argon gas and nitrogen, be mainly used for removing the residue formed in S8 step,
Burr etc. is bad；
S10) heavy copper: using oxide-reduction method on 21 hole wall of six lamina surfaces and via hole after S9 step process
One layer of thin copper of formation, which makes it have, conducts function, copper layer thickness 0.5um.
S11) flash: plating one layer of copper again on 21 inner wall of six lamina surfaces and via hole, thickeies copper layer thickness to 5um,
Bigger electric current can be connected；
S12) partial exposure/development: using UV exposure machine, and setting exposure energy is 6 grades, developer pressure 50psi, speed
For 5m/min, 21 position of via hole is exposed, bending region is protected will not be added plating up, is the part next step S13 electricity
Plating is prepared；
S13) parcel plating: 12ASF is set by electric current, the time, according to requiring to adjust, the pore wall thickness of via hole 21 was added
For thickness to 20um, plating is not added in bending region, and the step main lift precision of characteristic impedance improves the bending of FPC plate；
S14) exposure/development: UV exposure machine is used, setting exposure energy is 7 grades, developer pressure 50psi, and speed is
The circuit line of the first screen layer 2 of design and secondary shielding layer 7 is transferred to six layers after S13 step process by 5m/min
Plate surface；
S15) etch: etching spray pressure is set as 50psi, speed 4m/min, by six after S14 step process
The extra copper corrosion of lamina surface falls, and forms circuit in first screen layer 2 and secondary shielding layer 7；
S16 it) prints welding resistance: printing one layer of flexible bend-resistance ink in six lamina surfaces after S15 step process, obtain
To the first solder mask 1 and the second solder mask 8, eight laminates are formed, the scraper angle of printing equipment is set as 45 degree in this process, net
It is best that mesh, which is designed as 120T,；
S17) solder mask exposure/development: using UV exposure machine, and setting exposure energy is 6 grades, developer pressure 50psi, speed
Degree is 5m/min, and the region curing ink that 1 surface of the first solder mask needs to form pad 11 is removed.
S18) solidification baking: temperature setting is 120 degree, and the time is set as 2H, and the purpose is to dry by S17 step process
The ink of multilayer plate surface afterwards.
S19) turmeric: one layer is plated respectively on the region of the eight lamina surfaces removal ink after S18 step process
Nickel and one layer of gold, nickel plating thickness are 3~5um, and gold plating thickness is 0.05~0.1um, form pad 11；On the one hand this technique increases
Oxidative resistance, the wearability of contact surface prevent pad 11 from aoxidizing；On the other hand increase the electric conductivity of pad 11, convenient for welding electricity
Sub- device 9；
S20) FPC plate outer profile shapes: eight laminates after S19 step process being struck out design using press machine
Shape；
S21) strengthening course is bonded: on 8 surface of the second solder mask, being corresponded to 1 surface of the first solder mask and is welded electronic device 9
Position on fitting steel disc constitute strengthening course 10.
The beneficial effect of the FPC plate 100 of the present embodiment low-loss high flexibility high-frequency transmission is:
1) in the prior art, the excellent material of dielectric properties is since it is desired that the materials such as PTFE of addition high frequency, cause flexible
Property decline, and the polyimide material that the present embodiment is excellent using dielectric properties by first medium layer 3 and second dielectric layer 6 leads to
Stack-design is crossed, it can be achieved that providing the insertion loss for being less than 1dB at 6GHz and higher frequency transmission；
2) by first medium layer 3 and 6 thickness design of second dielectric layer at 12~75um, low thickness high flexibility design structure is full
The high demand of flexibilities such as the installation of foot 3D solid and minor radius (R=1.0mm) following dynamic bending；
3) thickness of both first medium layer 3 and adhesive layer 4, second dielectric layer 6 thickness design to guarantee that signal transmits
Dielectric loss to referred to as principle, on the one hand ensure that the symmetry of signal propagation circuit, reduce loss and electromagnetic radiation, separately
On the one hand the mixed pressure of differing dielectric constant material can be achieved；
4) in the corresponding position local setting strengthening course for needing to weld electronic device, FPC plate integrated device had both been can increase
Operability, and can not influence the buckling performance of bending region, improve FPC can integrated level；
5) it by the way that penetrating via hole 21 is arranged between first screen layer 2 and secondary shielding layer 7, is formed without HDI
The highly difficult technique such as blind hole, filling perforation, improves the controllability of FPC plate making technology；
6) by the way that the diameter design of via hole 21 at 0.10~0.20mm, is improved hole wall quality, the production of via hole 21 is reduced
It is born from induction electromotive force, to reduce the loss in entire transmission circuit；
7) in the design of flexible circuit board, warping resistance performance is mainly limited by copper layer thickness, copper layer thickness more after,
Its buckling performance is poorer, therefore first screen layer 2 and secondary shielding layer 7 are prolonged pressure copper foil using very thin by the present embodiment, together
Shi Caiyong parcel plating mode, avoids bending region, improves impedance control precision, while improving the flexibility of FPC plate.
The present embodiment can provide required characteristic impedance matching, both be able to satisfy the low-loss of high-frequency transmission according to application requirement
It is required that while be able to satisfy the high requirement of spatially integrate degree again, and have screen effect, can be in the mounting ring in the small space of multiple antennas
Under border, glitch-free transmission signal.Simultaneously by optimization design and preparation method, wanted without high technologies such as complicated blind holes
It asks, cost can be reduced to a certain extent.
Embodiment two
The content of embodiment two and content described in embodiment one are essentially identical, and difference is: the first solder mask 1 and second
Solder mask 8 with a thickness of 18um；First screen layer 2 is with secondary shielding layer 7 with a thickness of 20um；First medium layer 3 with a thickness of
30um；Adhesive layer 4 with a thickness of 18um；Transmission line layer 5 with a thickness of 20um；Second dielectric layer 6 with a thickness of 48um；Strengthening course
10 with a thickness of 1300um；Via hole 21 is directly 0.15mm.
Embodiment three
The content of embodiment three and content described in embodiment one are essentially identical, and difference is: the first solder mask 1 and second
Solder mask 8 with a thickness of 25um；First screen layer 2 is with secondary shielding layer 7 with a thickness of 28um；First medium layer 3 with a thickness of
50um；Adhesive layer 4 with a thickness of 25um；Transmission line layer 5 with a thickness of 28um；Second dielectric layer 6 with a thickness of 75um；Strengthening course
10 with a thickness of 2500um；Via hole 21 is directly 0.2mm.
Above-described is only some embodiments of the present invention.For those of ordinary skill in the art, not
Under the premise of being detached from the invention design, various modifications and improvements can be made, these belong to protection model of the invention
It encloses.
Claims (6)
1. a kind of preparation method of the FPC plate of low-loss high flexibility high-frequency transmission, which is characterized in that it includes the following steps:
S1 FPC plate substrate and first screen layer, secondary shielding layer) are prepared, the FPC plate substrate is made of low roughness copper foil
It forms, the first screen layer, which is prolonged with the secondary shielding layer using copper foil, presses；
S2 transmission line layer, the transmission line) are obtained by preceding processing, pad pasting, exposure, development, etching on the FPC plate substrate
Layer includes the signal wire formed on central axis, along the symmetrical transmission region of the signal wire, the signal wire with it is described
Spacing is provided between transmission region；
S3) transmission line layer is placed between the first screen layer and the secondary shielding layer, and in first screen
It covers and is successively laid with adhesive layer and first medium layer between layer and the transmission line layer, in the secondary shielding layer and the transmission line
It is laid with second dielectric layer between layer, obtains six laminates；The sum of thickness of both the first medium layer and the adhesive layer and institute
The thickness for stating second dielectric layer is identical, and the sum of dielectric loss of the two is identical as the dielectric loss of the second dielectric layer；
S4) solidification baking；
S5) drilling forms penetrating via hole on six laminate；
S6) using exposure, develop, be etched in the first screen layer and the secondary shielding layer and form circuit；
S7) successively printing forms the first solder mask and the second resistance on the outside of the first screen layer, the secondary shielding layer respectively
Layer, obtains FPC plate, and first solder mask and second solder mask are flexible bend-resistance ink.
2. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as described in claim 1, which is characterized in that described
The FPC plate substrate in S1 step with a thickness of 12~28um.
3. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as described in claim 1, which is characterized in that described
First screen layer is with the secondary shielding layer with a thickness of 12~28um.
4. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as described in claim 1, which is characterized in that described
First medium layer and the second dielectric layer select low dielectric coefficient polyimide material, the second dielectric layer with a thickness of 12~
75um。
5. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as described in claim 1, which is characterized in that in institute
State between S5 and the S6 step, it is also necessary to the via hole is handled, processing method specifically includes the following steps:
S51) plasma treatment removes residue, the burr for crossing hole surface；
S52) copper-coating forms a relatively thin layers of copper, in the via hole inner wall with a thickness of 0.4~0.7um；
S53) flash is handled, and thickeies the copper layer thickness of the via hole inner wall to 4~6um；
S54) partial exposure/development；
S55) parcel plating thickeies the copper layer thickness of the via hole inner wall to 20~22um.
6. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as described in claim 1, which is characterized in that in institute
It states and also needs to be exposed after S6 step, develop, solidify baking, turmeric technique.
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| CN106170175B (en) * | 2016-08-04 | 2019-04-26 | 同健(惠阳)电子有限公司 | A kind of high-fidelity high frequency circuit board |
| CN106817850A (en) * | 2017-03-06 | 2017-06-09 | 深圳市三德冠精密电路科技有限公司 | The preparation method of FPC cover layers |
| WO2021232322A1 (en) * | 2020-05-20 | 2021-11-25 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method therefor |
| CN112654135A (en) * | 2020-12-11 | 2021-04-13 | 珠海景旺柔性电路有限公司 | FPC flat coaxial line and manufacturing method thereof |
| CN113675602B (en) * | 2021-08-13 | 2024-03-26 | 昆山联滔电子有限公司 | Antenna module, preparation method thereof and terminal |
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| CN104349574A (en) * | 2013-07-31 | 2015-02-11 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN104754855A (en) * | 2013-12-31 | 2015-07-01 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN204721707U (en) * | 2015-05-06 | 2015-10-21 | 住友电工印刷电路株式会社 | Flexible printed circuit board |
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