CN105828517A - Preparation method of low-loss and high-flexibility high frequency transmission FPC board - Google Patents
Preparation method of low-loss and high-flexibility high frequency transmission FPC board Download PDFInfo
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- CN105828517A CN105828517A CN201610308653.5A CN201610308653A CN105828517A CN 105828517 A CN105828517 A CN 105828517A CN 201610308653 A CN201610308653 A CN 201610308653A CN 105828517 A CN105828517 A CN 105828517A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
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Abstract
The invention discloses a preparation method of a low-loss and high-flexibility high frequency transmission FPC board. The preparation method includes the following steps: S1) preparing FPC board base material, a first shielding layer and a second shielding layer; S2) obtaining a transmission line layer by performing preprocessing, film pasting, exposure, development and etching on the FPC board base material; S3) placing the transmission line layer between the first shielding layer and the second shielding layer, successively laying a bonding layer and a second dielectric layer between the first shielding layer and the transmission line layer, and laying a second dielectric layer between the second shielding layer and the transmission line layer; S4) solidifying and baking; S5) drilling holes; and S6) respectively and successively printing and forming a first solder mask and a second solder mask at the outer side of the first shielding layer and the second shielding layer to obtain an FPC board. The preparation method of a low-loss and high-flexibility high frequency transmission FPC board can manufacture an FPC board with high flexibility, low loss in high frequency transmission and high integrated level.
Description
[technical field]
The invention belongs to flexible PCB manufacturing technology field, particularly relate to the preparation method of the FPC plate of a kind of low-loss high flexibility high-frequency transmission.
[background technology]
When 4G network design is carried out the most in high gear, prelude has also been pulled open in the research about 5G.2012, by European Union provide funds 270,000,000,000 Euros support 5G research projects METIS [1] formally start, project is divided into eight groups to further investigate the aspects such as scene demand, technology of eating dishes without rice or wine, multi-antenna technology, the network architecture, spectrum analysis, emulation and test platform respectively；Associating many enterprises of British government, found 5G innovation center, are devoted to research and the assessment checking of future customer demand, 5G network key performance indications, core technology；Korea S is jointly promoted by the Department of Science and Technology of Korea S, ICT and prospective project portion and has set up Korea S " 5GForum ", and special its domestic 5G of promotion is in progress；China, the Ministry of Industry and Information Technology, the Committee of Development and Reform and the Department of Science and Technology set up IMT-2020 propelling group jointly, as the platform of 5G work, it is intended to promote the 5G technology of domestic independent research to become international standard.Visible, for the research of 5G, many countries or tissue are all in carrying out energetically.According to the law of development of 10 years generation of mobile communication standard, 5G has become as global mobile communication field new round technology competition focus.
Development along with wireless communication system, message capacity and frequency improve constantly, and it is more and more higher as the important carrier antenna of radio communication and the requirement of transport module thereof, such as mobile terminal product such as mobile phone, PDA and the most popular internet-of-things terminal etc., its inside antenna module is gradually increased, and the connection for mainboard Yu antenna it is also proposed the more complicated and requirement of system design of more high power capacity.
Mainboard of the prior art is connected with Anneta module and common are two ways: 1) coaxial cable；2) common FPC.Coaxial cable is when high-frequency transmission, there is relatively low loss, but the appearance design requirement constantly pursuing " gently " and " thin " along with terminal unit, free space constantly reduces, the line footpath so causing coaxial cable constantly reduces, the most just bringing the continuous increase of loss, this will run in the opposite direction with the high power capacity of system requirements simultaneously.On the other hand, coaxial cable is also not easy to the integrated transmission requirement of multi-antenna module to the requirement in space.And commonly FPC can accomplish light, thin space requirement, but the most traditional FPC cannot realize low-loss transmission requirement, along with improving constantly of frequency, loss is also continuously increased, loss need to be suitably reduced by constantly reducing the highly difficult technique such as aperture and blind hole, and so cost will be increased.
Therefore, it is necessary to provide the preparation method of the FPC plate of a kind of new low-loss high flexibility high-frequency transmission to solve the problems referred to above.
[summary of the invention]
Present invention is primarily targeted at the preparation method of the FPC plate that a kind of low-loss high flexibility high-frequency transmission is provided, it is possible to produce pliability height, high-frequency transmission low-loss, can the high FPC plate of integrated level.
The present invention is achieved through the following technical solutions above-mentioned purpose: the preparation method of the FPC plate of a kind of low-loss high flexibility high-frequency transmission, it comprises the steps:
S1) FPC plate substrate and the first screen layer, secondary shielding layer are prepared；
S2) on described FPC plate substrate through pre-treatment, pad pasting, expose, develop, etch and obtain transmission line layer；
S3) described transmission line layer is positioned between described first screen layer and described secondary shielding layer, and between described first screen layer and described transmission line layer, lay tack coat and first medium layer successively, between secondary shielding layer and described transmission line layer, lay second dielectric layer, obtain six laminates；
S4) solidification baking；
S5) on described six laminates, boring forms penetrating via；
S6) outside described first screen layer, described secondary shielding layer, print formation the first solder mask and the second solder mask respectively successively, obtain FPC plate.
Further, the described FPC plate substrate in described S1 step uses low roughness Copper Foil to be made, and its thickness is 12～28um.
Further, described first screen layer and described secondary shielding layer use Copper Foil to prolong pressure and form, and its thickness is 12～28um.
Further, described transmission line layer include on central axis formed holding wire, along the symmetrical transmission region of described holding wire, be provided with spacing between described holding wire and described transmission region.
Further, described first medium layer selects low dielectric coefficient polyimide material with described second dielectric layer, and described second medium layer thickness is 12～75um.
Further, described first medium layer is identical with the thickness of described second dielectric layer with the thickness sum of described tack coat.
Further, described first medium layer is identical with the dielectric loss of described second medium with the dielectric loss sum of described tack coat.
Further, between described S5 and described S6 step, in addition it is also necessary to process described via, its processing method specifically includes following steps:
S51) plasma treatment, removes the described residue of hole surface, burr excessively；
S52) heavy Copper treatment, forms a relatively thin layers of copper in described via inwall, and its thickness is 0.4～0.7um；
S53) flash processes, and thickeies the copper layer thickness of described via inwall to 4～6um；
S54) partial exposure/development；
S55) parcel plating, thickeies the copper layer thickness of described via inwall to 20～22um；
S56) again through overexposure, develop, be etched on described first screen layer and described secondary shielding layer and form circuit.
Further, described first solder mask and described second solder mask are flexible bend-resistance ink.
Further, also need to be exposed after described S6 step, develop, solidify baking, turmeric technique.
Compared with prior art, having the beneficial effects that of the preparation method of the FPC plate of the present invention a kind of low-loss high flexibility high-frequency transmission: by holding wire width design, spacing dimension design, stack-design, and use the polyimide material that dielectric properties are excellent, it is achieved that the low-loss function of high-frequency transmission；Prolonged by employing and press Copper Foil as the first screen layer and secondary shielding layer, in conjunction with partial exposure, local development, parcel plating technique, bending region is protected, reduces the copper layer thickness of bending region, improve the pliability of FPC plate；While achieving high-frequency transmission low-loss function, also achieve the highly integrated of electronic device.
[accompanying drawing explanation]
Fig. 1 is the cross section structure schematic diagram of the embodiment of the present invention；
In figure, numeral represents:
FPC plate of 100 low-loss high flexibility high-frequency transmission and preparation method thereof；
1 first solder mask, 11 pads；2 first screen layers, 21 vias；3 first medium layers；4 tack coats；5 transmission line layer, 51 holding wires, 52 transmission regions, 53 spacing；6 second dielectric layer；7 secondary shielding layers；8 second solder masks；9 electronic devices；10 strengthening courses.
[detailed description of the invention]
Embodiment one
Refer to Fig. 1, the FPC plate 100 of the present embodiment a kind of low-loss high flexibility high-frequency transmission, its cross-sectional structure includes first solder mask the 1, first screen layer 2, first medium layer 3, tack coat 4, transmission line layer 5, second dielectric layer 6, secondary shielding layer the 7, second solder mask 8 the most successively.
Transmission line layer 5 includes the holding wire 51 formed on central axis, along the symmetrical transmission region 52 of holding wire 51.Spacing 53 it is provided with between holding wire 51 and transmission region 52.
First solder mask 1 and the second solder mask 8 are flexible bend-resistance ink, its thickness is 12um, the first screen layer 2 being mainly used in preventing metal material is oxidized with secondary shielding layer 7 surface, simultaneously by retaining, on the first solder mask 1 surface, exposed pads 11 of windowing, facilitate welding electronic component, Contact antenna, hand set machine shell etc..Pad 11 is welded with electronic device 9, at the strengthening course 10 that the regional area that the second solder mask 8 lower surface is corresponding with electronic device 9 position is provided with, its thickness is 100um, its material uses steel disc or other rigid matter materials, local strengthening FPC plate, to realize the support of the welding to electronic device 9, it is simple to integrated.The design of pad 11 is to avoid bending region as principle, and with the pin of electronic device 9 with 0.95:1 ratio collocation be optimal, can preferably complete welding, be avoided that again stray inductance and parasitic capacitance that Yin Duoxi and big pad cause cause the phenomenon of distorted signals.
First screen layer 2 and secondary shielding layer 7 use Copper Foil to prolong pressure and form, and its thickness is 12um, and Main Function is the interference of shielding external electromagnetic ripple.It is formed with penetrating via 21, its a diameter of 0.10mm between first screen layer 2 and secondary shielding layer 7, is mainly used in electric connection the first screen layer 2 and secondary shielding layer 7.
First medium layer 3 and second dielectric layer 6 use low dielectric coefficient polyimide material, first medium layer 3 thickness to be 12um, and second dielectric layer 6 thickness is 18um.Polyimides is one of optimal high-molecular organic material of combination property, high temperature resistant reaches more than 400 DEG C, life-time service temperature range-200～300 DEG C, without sharp melting point, high insulating property, 103 hertz of lower dielectric constants 4.0, dielectric loss only 0.004～0.007, belongs to F to H class F insulating material F.Polyimides has good dielectric properties, and dielectric constant is about 3.4, introduces fluorine or by air nano-size dispersion in polyimides, and dielectric constant can drop to about 2.5.Dielectric loss is 10～3, and dielectric strength is 100～300KV/mm, and wide one-tenth TPI is 300KV/mm, and volume resistance is 1017 Ω cm.Polyimides material is used to form first medium layer 3 and second dielectric layer 6, it is possible to realize producing more low-loss function under high frequency signal transmission.
Tack coat 4 uses low-k resin material, and its thickness is 6.Tack coat 4 one aspect realizes low-loss high-frequency transmission signal；On the other hand, tack coat 4 some be filled in spacing 53, be used for the holding wire 51 that is adhesively fixed, prevent from affecting transmission signal because holding wire 51 shifts.
Transmission line layer 5 uses low roughness Copper Foil material, and its thickness is 12um, uses relatively thin thickness, and its Main Function is the loss reducing this conductor layer.
First medium layer 3 designs the dielectric loss to ensure signal transmission to referred to as principle with the thickness of the thickness of both tack coats 4, second dielectric layer 6.In the case of first medium layer 3, second dielectric layer 6, tack coat 4 use identical dielectric constant material, first medium layer 3 is identical with the thickness of second dielectric layer 6 with the thickness sum of both tack coats 4, equal with the distance of secondary shielding layer 7 to transmission line layer 5 to ensure first screen layer 2 distance to transmission line layer 5, ensure that signal propagation circuit is symmetrical, reduce loss and electromagnetic radiation.In the case of first medium layer 3, second dielectric layer 6 use differing dielectric constant material with adhesive linkage 4, by the frequency specified and emulation measured data storehouse, set first medium layer 3, second dielectric layer 6 symmetrical with dielectric loss with the thickness guarantee signal propagation circuit of tack coat 4.
The preparation method of the FPC plate 100 of the present embodiment low-loss high flexibility high-frequency transmission includes:
S1) preparing FPC plate substrate and the first screen layer 2, secondary shielding layer 7, FPC plate substrate selects the Copper Foil of low roughness, and the first screen layer 2 and secondary shielding layer 7 use Copper Foil to prolong pressure and form；
S2) pre-treatment: removed the oxidation greasy dirt impurity on FPC plate substrate surface by Chemical cleaning, and be roughened copper foil surface, increases the adhesion of pad pasting；
S3) pad pasting: by dry film uniform fold on the FPC plate substrate surface after S2 step process, to provide image transfer to use；
S4) exposure/development: use UV exposure machine, arranging exposure energy is 6 grades, developer pressure is 50psi, speed is 5m/min, utilize the photoinduction of dry film, image on film sheet is transferred on the FPC plate substrate surface after S3 step process, recycle certain density sodium carbonate or potassium carbonate liquid medicine the region dry film that polyreaction not yet occurs is rinsed out, leave the part of the most photosensitive generation polyreaction, become etching or the resist film of plating, the transmission line layer circuit of design is mainly transferred on dry film by S4 step, it includes the width design size of holding wire 51, the size of spacing 53；
S5) etching: etching spray pressure is set to 50psi, and speed is 6m/min, utilizes corrosion technology to be fallen by the copper corrosion of the FPC plate substrate excess surface after S4 step process, obtains final transmission line layer 5；
S6) lamination: use vacuum press, its temperature is set to 120 degree, pressure is set to 500psi, set of time is 200s, transmission line layer 5 is positioned between the first screen layer 2 and secondary shielding layer 7, and between the first screen layer 2 and transmission line layer 5, lay tack coat 4 and first medium layer 3 successively, between secondary shielding layer 7 and transmission line layer 5, lay second dielectric layer 6, obtain six laminates；
S7) solidification baking: utilizing the baking oven baking six laminates after S6 step is laminated, its temperature is set to 120 degree, and set of time is 2H, and its Main Function is to make tack coat 4 at high temperature completion of cure, forms preferable adhesion；
S8) boring: using machine drilling mode to form penetrating via 21 on six laminates after S7 step process, its rotating speed is set to 150kr/min, and terminal-velocity is 0.5m/min, Hui Su is 8m/min, this step is set by parameter, promotes hole wall quality, reduces via self-induction；
S9) plasma: plasma process uses argon and nitrogen, is mainly used in removing residue, the burr etc. formed in S8 step bad；
S10) heavy copper: utilizing oxide-reduction method to form one layer of thin copper on six lamina surface after S9 step process and via 21 hole wall and make it have and conduct function, its copper layer thickness is 0.5um.
S11) flash: again plating last layer copper on six lamina surface and via 21 inwall, thickening copper layer thickness is to 5um, can turn on bigger electric current；
S12) partial exposure/development: using UV exposure machine, arranging exposure energy is 6 grades, and developer pressure is 50psi, and speed is 5m/min, is exposed via 21 position, and bending region protects will not be plated by adding, and prepares for next step S13 parcel plating；
S13) parcel plating: electric current is set to 12ASF, the time adjusts as requested, thickeies the pore wall thickness of via 21 to 20um, bending region is not added with plating, this step main lift precision of characteristic impedance, improves the bending of FPC plate；
S14) exposure/development: using UV exposure machine, arranging exposure energy is 7 grades, and developer pressure is 50psi, and speed is 5m/min, transfers to six lamina surface after S13 step process by the circuit line of the first screen layer 2 of design with secondary shielding layer 7；
S15) etching: etching spray pressure is set to 50psi, and speed is 4m/min, is fallen by copper corrosion unnecessary for six lamina surface after S14 step process, forms circuit on the first screen layer 2 with secondary shielding layer 7；
S16) printing welding resistance: at six lamina surface one layer of flexible bend-resistance ink of printing after S15 step process, obtain the first solder mask 1 and the second solder mask 8, forming eight laminates, in this operation, the scraper angle of printing equipment is set to 45 degree, and it is optimal that mesh is designed as 120T；
S17) solder mask exposure/development: using UV exposure machine, arranging exposure energy is 6 grades, and developer pressure is 50psi, and speed is 5m/min, needs the region curing ink forming pad 11 to remove by the first solder mask 1 surface.
S18) solidification baking: temperature is set to 120 degree, and set of time is 2H, its objective is to dry the ink on the multi-layer sheet surface after S17 step process.
S19) turmeric: removing at eight lamina surface after S18 step process and plate last layer nickel and one layer of gold respectively on the region of ink, its nickel plating thickness is 3～5um, and gold plating thickness is 0.05～0.1um, forms pad 11；On the one hand this technique increase the oxidative resistance of contact surface, wearability, prevents pad 11 from aoxidizing；On the other hand the electric conductivity of pad 11 is increased, it is simple to welding electronic device 9；
S20) FPC plate outline shapes: utilize stamping machine that eight laminates after S19 step process are struck out the shape of design；
S21) strengthening course laminating: on the second solder mask 8 surface, constitutes strengthening course 10 corresponding to steel disc of fitting on the position of the first solder mask 1 surface soldered electronic device 9.
Having the beneficial effects that of the FPC plate 100 of the present embodiment low-loss high flexibility high-frequency transmission:
1) in prior art, the material that dielectric properties are excellent is since it is desired that add the materials such as the PTFE of high frequency, pliability is caused to decline, and first medium layer 3 and second dielectric layer 6 are used the polyimide material that dielectric properties are excellent by the present embodiment, by stack-design, may be implemented in 6GHz and the higher frequency transmission lower offer insertion loss less than 1dB；
2) first medium layer 3 and second dielectric layer 6 thickness are designed to 12～75um, and low thickness high flexibility design structure meets the demand that the pliability such as the installation of 3D solid and minor radius (R=1.0mm) dynamic bending below is high；
3) first medium layer 3 designs the dielectric loss to ensure signal transmission to referred to as principle with the thickness of the thickness of both tack coats 4, second dielectric layer 6, on the one hand ensure that the symmetry of signal propagation circuit, reduce loss and electromagnetic radiation, on the other hand can realize the mixed pressure of differing dielectric constant material；
4) needing the correspondence position local welding electronic device to arrange strengthening course, can increase the operability of FPC plate integrated device, can not affect again the buckling performance of bending region, improve FPC can integrated level；
5) by arranging penetrating via 21 between the first screen layer 2 and secondary shielding layer 7, it is not necessary to use HDI to form the highly difficult technique such as blind hole, filling perforation, improve the controllability of FPC plate making technology；
6) by the diameter design of via 21 is become 0.10～0.20mm, improve hole wall quality, reduce via 21 and be produced from induction electromotive force, thus reduce the loss in whole transmission loop；
7) in the design of flexible PCB, warping resistance performance is mainly limited by copper layer thickness, copper layer thickness more after, its buckling performance is the poorest, therefore the first screen layer 2 and secondary shielding layer 7 are used and the thinnest prolong pressure Copper Foil by the present embodiment, use parcel plating mode simultaneously, avoid bending region, improve impedance control precision, improve the pliability of FPC plate simultaneously.
The present embodiment can be according to application requirement, it is provided that desirable characteristics impedance matching, can meet the low-loss requirement of high-frequency transmission, the requirement that spatially integrate degree is high can be met again simultaneously, and there is screen effect, it is possible under the installation environment in the little space of multiple antennas, glitch-free transmission signal.Designed by optimization and preparation method simultaneously, without the complicated contour technological requirement of blind hole, cost can be reduced to a certain extent.
Embodiment two
The content of embodiment two is essentially identical with content described in embodiment one, and its difference is: the thickness of the first solder mask 1 and the second solder mask 8 is 18um；First screen layer 2 is 20um with the thickness of secondary shielding layer 7；The thickness of first medium layer 3 is 30um；The thickness of tack coat 4 is 18um；The thickness of transmission line layer 5 is 20um；The thickness of second dielectric layer 6 is 48um；The thickness of strengthening course 10 is 1300um；Via 21 is directly 0.15mm.
Embodiment three
The content of embodiment three is essentially identical with content described in embodiment one, and its difference is: the thickness of the first solder mask 1 and the second solder mask 8 is 25um；First screen layer 2 is 28um with the thickness of secondary shielding layer 7；The thickness of first medium layer 3 is 50um；The thickness of tack coat 4 is 25um；The thickness of transmission line layer 5 is 28um；The thickness of second dielectric layer 6 is 75um；The thickness of strengthening course 10 is 2500um；Via 21 is directly 0.2mm.
Above-described is only some embodiments of the present invention.For the person of ordinary skill of the art, without departing from the concept of the premise of the invention, it is also possible to make some deformation and improvement, these broadly fall into protection scope of the present invention.
Claims (10)
1. the preparation method of the FPC plate of a low-loss high flexibility high-frequency transmission, it is characterised in that it comprises the steps:
S1) FPC plate substrate and the first screen layer, secondary shielding layer are prepared；
S2) on described FPC plate substrate through pre-treatment, pad pasting, expose, develop, etch and obtain transmission line layer；
S3) described transmission line layer is positioned between described first screen layer and described secondary shielding layer, and between described first screen layer and described transmission line layer, lay tack coat and first medium layer successively, between described secondary shielding layer and described transmission line layer, lay second dielectric layer, obtain six laminates；
S4) solidification baking；
S5) on described six laminates, boring forms penetrating via；
S6) again through overexposure, develop, be etched on described first screen layer and described secondary shielding layer and form circuit；
S7) outside described first screen layer, described secondary shielding layer, print formation the first solder mask and the second solder mask respectively successively, obtain FPC plate.
2. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as claimed in claim 1, it is characterised in that the described FPC plate substrate in described S1 step uses low roughness Copper Foil to be made, and its thickness is 12～28um.
3. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as claimed in claim 1, it is characterised in that described first screen layer and described secondary shielding layer use Copper Foil to prolong pressure and form, and its thickness is 12～28um.
4. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as claimed in claim 1, it is characterized in that, described transmission line layer include on central axis formed holding wire, along the symmetrical transmission region of described holding wire, be provided with spacing between described holding wire and described transmission region.
5. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as claimed in claim 1, it is characterised in that described first medium layer selects low dielectric coefficient polyimide material with described second dielectric layer, and described second medium layer thickness is 12～75um.
6. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as claimed in claim 5, it is characterised in that described first medium layer is identical with the thickness of described second dielectric layer with the thickness sum of described tack coat.
7. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as claimed in claim 5, it is characterised in that described first medium layer is identical with the dielectric loss of described second medium with the dielectric loss sum of described tack coat.
8. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as claimed in claim 1, it is characterised in that between described S5 and described S6 step, in addition it is also necessary to described via is processed, its processing method specifically includes following steps:
S51) plasma treatment, removes the described residue of hole surface, burr excessively；
S52) heavy Copper treatment, forms a relatively thin layers of copper in described via inwall, and its thickness is 0.4～0.7um；
S53) flash processes, and thickeies the copper layer thickness of described via inwall to 4～6um；
S54) partial exposure/development；
S55) parcel plating, thickeies the copper layer thickness of described via inwall to 20～22um.
9. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as claimed in claim 1, it is characterised in that described first solder mask and described second solder mask are flexible bend-resistance ink.
10. the preparation method of the FPC plate of low-loss high flexibility high-frequency transmission as claimed in claim 1, it is characterised in that also need to be exposed after described S6 step, develop, solidify baking, turmeric technique.
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| CN106817850A (en) * | 2017-03-06 | 2017-06-09 | 深圳市三德冠精密电路科技有限公司 | The preparation method of FPC cover layers |
| CN112654135A (en) * | 2020-12-11 | 2021-04-13 | 珠海景旺柔性电路有限公司 | FPC flat coaxial line and manufacturing method thereof |
| CN113675602A (en) * | 2021-08-13 | 2021-11-19 | 昆山联滔电子有限公司 | Antenna module, preparation method thereof and terminal |
| WO2021232322A1 (en) * | 2020-05-20 | 2021-11-25 | 鹏鼎控股(深圳)股份有限公司 | Circuit board and manufacturing method therefor |
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