CN105826353B - Flip chip and display device - Google Patents
Flip chip and display device Download PDFInfo
- Publication number
- CN105826353B CN105826353B CN201610180206.6A CN201610180206A CN105826353B CN 105826353 B CN105826353 B CN 105826353B CN 201610180206 A CN201610180206 A CN 201610180206A CN 105826353 B CN105826353 B CN 105826353B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- conductive layer
- printed circuit
- layer
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of flip chip, including flexible circuit board, the flexible circuit board includes conductive layer, the conductive layer includes binding area positioned at the first binding area of the conductive layer first end and positioned at the second of the conductive layer second end, the first binding area is for binding display base plate, the second binding area is located at two opposite surfaces of the conductive layer for binding printed circuit board, the first binding area and second binding area.Correspondingly, the present invention also provides a kind of display devices.The present invention can reduce the integral thickness of display device, and the chip in flip chip is prevented to be squeezed.
Description
Technical field
The present invention relates to field of display technology, and in particular to a kind of flip chip and display device.
Background technique
Flip chip technology (Chip On Flex, or, Chip On Film, COF) is by hot pressing by driving chip
On pad and flexible circuit board on pin bound the technology of (bonding).Fig. 1 is flip chip in the prior art
Structural schematic diagram, flexible circuit board 20 include substrate 21, metal layer 22 and paint film 23, and paint film 23 reveals the both ends of metal layer 22
Out, two parts of exposing are bound with display base plate 30 and printed circuit board 40 respectively, as shown in Figure 2；It is organic for bottom emitting type
For luminous display unit, after flexible circuit board 20 is bound with display base plate 30 and printed circuit board 40 respectively, by flexible circuitry
After the side away from light direction of plate 20 towards display base plate 30 is bent, as shown in figure 3, be easy to causeing following problems: flexible
The leakage cruelly of driving chip 10 on wiring board 20 on the outside, is easy to be squeezed, and the border width of display device is caused to increase；Print
The binding area of element 41 on printed circuit board 40 and printed circuit board 40 be located at it is not ipsilateral, by printed circuit board 40 and flexible circuitry
When plate 20 is bound, element 41 is be easy to cause to weigh wounded；In addition, printed circuit board 40 is located at flexible wires after flexible circuit board 20 is bent
The top of road plate 20, so that in one timing of bending degree of flexible circuit board 20, the integral thickness of display device is larger.
Summary of the invention
The purpose of the present invention is to provide a kind of flip chip and display devices, so that using the aobvious of the flip chip
The thickness of showing device reduces.
To achieve the goals above, the present invention provides a kind of flip chip, including flexible circuit board, the flexible circuit board
Including conductive layer, the conductive layer includes positioned at the first binding area of the conductive layer first end and positioned at the conductive layer second end
Second binding area, the first binding area is for binding display base plate, and the second binding area is for binding printed circuit board, institute
It states the first binding area and second binding area and is located at two opposite surfaces of the conductive layer.
Preferably, the flexible circuit board further includes substrate and insulating layer, the substrate, the conductive layer and the insulation
Layer is sequentially stacked along the thickness direction of the substrate, and the first end of the conductive layer exceeds the substrate, and the of the conductive layer
Two ends exceed the insulating layer, and the surface away from the insulating layer of the part beyond the substrate of the conductive layer is formed as
First binding area, the surface away from the substrate of the part beyond insulating layer of the conductive layer is formed as described second
Bind area.
Preferably, the flip chip further include the driving chip being fixed on the conductive layer, and the conductive layer includes
Spaced two conductive parts, the first binding area and second binding area are respectively formed at two conductive parts
On, the input terminal and output end of the driving chip are connected with two conductive parts respectively, the driving chip and it is described absolutely
Edge layer is located at the same side of the conductive layer, is provided with opening corresponding with the driving chip, the drive on the insulating layer
Dynamic chip setting is in said opening.
Preferably, the end face of the first end of the conductive layer flushes in the end face of the insulating layer, and the of the conductive layer
The end face at two ends flushes in the end face of the substrate.
Preferably, the material for forming the insulating layer and the material for forming the substrate are each independently selected from polyphenylene sulfide
Ether, polybenzoate, polybenzimidazoles, any one in poly- friend's diphenyl siloxane.
Preferably, the material for forming the insulating layer is identical as the material of the substrate.
Correspondingly, the present invention also provides a kind of display device, including display base plate, printed circuit board and provided by the invention
Above-mentioned flip chip, the display base plate include viewing area and the lead district around the viewing area, the flexible circuitry
First binding area of plate and the lead district of the display base plate are bound, the second binding area of the flexible circuit board and the printing
Circuit board binding, the printed circuit board are fixed at the side away from light direction of the display base plate.
Preferably, the display base plate includes underlay substrate and multiple bottoms for being arranged on the underlay substrate are illuminated has
Machine light emitting diode, the display device further include the encapsulated layer being oppositely arranged with the display base plate.
Preferably, the encapsulated layer can be conductive, is provided with low-level input, the low electricity on the printed circuit board
Flat input terminal is electrically connected with the encapsulated layer.
Preferably, it is provided with conducting resinl between the printed circuit board and encapsulated layer, it will be on the printed circuit board
Low-level input is electrically connected with the encapsulated layer.
In the present invention, since the first binding area and second binding area are located at opposite two of conductive layer
On a surface, therefore, respectively and after display base plate and printed circuit board binding, display base plate is located at the flexible circuit board not bent
Below conductive layer, printed circuit board is located at the top of conductive layer, for bottom emitting type organic light-emitting display device, by flexible circuitry
After plate is bent to the backlight side of display base plate, the second binding area is towards display base plate, so that printed circuit board is located at second
It binds between area and display base plate, therefore, the flexible circuit board and flexible circuit board in the prior art in of the invention are curved
When folding degree is identical, the present invention enables to the thinner of the display device of application flexibility wiring board；Also, due to printing electricity
The binding area of element and printed circuit board on the plate of road is located at the same side of printed circuit board, by printed circuit board and flexible wires
When the binding connection of road plate, the phenomenon that part on printed circuit board is weighed wounded appearance can be reduced, the yield of product is improved.
Detailed description of the invention
The drawings are intended to provide a further understanding of the invention, and constitutes part of specification, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram of flip chip in the prior art；
Fig. 2 is the flip chip not bent in the prior art and the binding schematic diagram of display base plate and printed circuit board；
Fig. 3 is by the status diagram after the flip chip bending in Fig. 2；
Fig. 4 is the structural schematic diagram of the flip chip provided in the embodiment of the present invention；
Fig. 5 is to illustrate the flip chip not bent and the binding of display base plate and printed circuit board in the embodiment of the present invention
Figure；
Fig. 6 is by the status diagram after the flip chip bending in Fig. 5；
Fig. 7 is the structural schematic diagram of the display device provided in the embodiment of the present invention.
Wherein, appended drawing reference are as follows: 10, chip；20, flexible circuit board in the prior art；21, base in the prior art
Bottom；22, metal layer；23, paint film；30, display base plate；31, underlay substrate；32, bottom emitting formula Organic Light Emitting Diode；40, it prints
Printed circuit board；41, the element of printed circuit board；50, encapsulated layer；60, the flexible circuit board in the present invention；61, in the present invention
Substrate；62, conductive layer；621, the first binding area；622, the second binding area；62a, conductive part；63, insulating layer；70, conducting resinl；
80, adhesive glue.
Specific embodiment
Below in conjunction with attached drawing, detailed description of the preferred embodiments.It should be understood that this place is retouched
The specific embodiment stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
As an aspect of of the present present invention, a kind of flip chip are provided, as shown in Figure 4 and Figure 5, the flip chip include soft
Property wiring board 60, flexible circuit board 60 includes conductive layer 62, and conductive layer 62 includes first tying up positioned at 62 first end of conductive layer
Determine area 621 and bind area 622 positioned at the second of the conductive layer second end 62, the first binding area 621 is aobvious for binding (bonding)
Show substrate 30, position is distinguished for binding printed circuit board 40, the first binding area 621 and the second binding area 622 by the second binding area 622
In two opposite surfaces of conductive layer 62.
In the present invention, since the first binding area 621 and the second binding area 622 are located at opposite two of conductive layer 62
On a surface, therefore, after the flexible circuit board 60 not bent is bound with display base plate 30 and printed circuit board 40 respectively, base is shown
Plate 30 is located at 62 lower section of conductive layer, and printed circuit board 40 is located at the top of conductive layer 62, for bottom emitting type organic light emitting display
Device, after flexible circuit board 60 is bent to the backlight side of display base plate, second binds area 622 towards display base plate 30, thus
So that printed circuit board 40 is located between the second binding area 622 and display base plate 30, and therefore, the flexible circuitry in of the invention
When plate 60 is identical with 20 bending degree of flexible circuit board in the prior art, the present invention enables to application flexibility wiring board 20
Display device it is thinner；Also, due on printed circuit board 40 element 41 and the binding area of printed circuit board 40 be located at
The same side of printed circuit board 40 can reduce printing electricity when connecting printed circuit board 40 and the binding of flexible circuit board 60
The phenomenon that part 41 on road plate 40 is weighed wounded appearance, improves the yield of product；In addition, working as the driving chip 10 of flip chip
When being respectively positioned on the same side of conductive layer 62 with the second binding area 622, after flexible circuit board 60 is bent, driving chip 10 is located at soft
The inside of property wiring board 60, so that driving chip 10 be prevented to be squeezed, and the bezel locations of display device without for
Driving chip 10 reserves space, to be conducive to the realization of narrow frame.
Specifically, as shown in figure 4, flexible circuit board 60 further includes substrate 61 and insulating layer 63, substrate 61,62 and of conductive layer
Insulating layer 63 is sequentially stacked along the thickness direction of substrate 61, and the first end of conductive layer 62 exceeds substrate 61, and the second of conductive layer 62
End exceeds insulating layer 63, and the surface away from insulating layer 63 of the part beyond substrate 61 of conductive layer 62 is formed as the first binding area
621, the surface away from substrate 61 of the part beyond insulating layer 63 of conductive layer 62 is formed as the second binding area 622.
It should be understood that the substrate 61, insulating layer 62 and conductive layer 63 in the present invention are flexibles, so that
Flexible circuit board 60 is whole to be bent, substrate 61 and insulating layer 63 with 62 insulated contact of conductive layer.The present invention is to conduction
The material of layer 60 is not construed as limiting, as long as can be conductive and conductive layer 60 is enabled to bend.In order to enable conductive layer 60
With satisfactory electrical conductivity and bendable folding endurance, the material of conductive layer 60 may include copper.
Further, it as shown in figure 4, the flip chip further include the driving chip 10 being fixed on conductive layer 62, leads
Electric layer 62 includes spaced two conductive parts 62a, and the first binding area 621 and the second binding area 622 are respectively formed at two
On conductive part 622, the input terminal and output end of driving chip 10 are connected with two conductive parts 622 respectively, driving chip 10 and absolutely
Edge layer 63 is located at the same side of conductive layer 62, and opening corresponding with driving chip 10, driving chip 10 are provided on insulating layer 63
Setting is in said opening.Therefore, when flexible circuit board 60 is bound with printed circuit board 40 and display base plate 30 respectively, such as scheme
Shown in 5, display base plate 30 and driving chip 10 are located at the not ipsilateral of conductive layer 60, for bottom emitting type organic light emitting display
For device, by flexible circuit board 60 to display base plate 30 away from the side of light direction when, as shown in fig. 6, driving chip
10 are located at the inside of the flexible circuit board 60 of bending, and driving chip 10 is prevented to be squeezed.
Further, the end face of the first end of conductive layer 62 flushes in the end face of insulating layer 63, the second end of conductive layer 62
End face flush in the end face of substrate 61.
When flexible circuit board 60 is bound with printed circuit board 40 and display base plate 30 respectively, can using heat pressing process into
Row binding, in order to enable when carrying out hot pressing to flexible circuit board 60 from the two sides of flexible circuit board 60, the equal energy of flexible circuit board 60
Enough bear higher temperature and pressure, it is preferable that form the material of insulating layer 63 and form the material of substrate 61 each independently
Any one in polyphenylene sulfide, polybenzoate, polybenzimidazoles, poly- friend's diphenyl siloxane.
Further, the material for forming insulating layer 63 is identical with the material of substrate 61 is formed, in order to flexible circuit board 60
Production.
As another aspect of the present invention, a kind of display device is provided, as shown in fig. 7, the display device includes display
Substrate 30, printed circuit board 40 and above-mentioned flip chip, display base plate 30 is including viewing area and around the viewing area
Lead district, the first binding area 621 of flexible circuit board 60 and the lead district of display base plate 30 are bound, and the second of flexible circuit board 60
Area 621 and printed circuit board 40 is bound to bind, printed circuit board 40 be fixed at display base plate 30 away from light direction
Side.
As can be seen that the second binding area 621 is directed towards the backlight surface of display base plate after flexible circuit board 60 is bent,
So that printed circuit board 40 is located at the inside of flexible circuit board 60, the integral thickness of display device is reduced.Also, due to
The element 41 of printed circuit board 40 and the binding area of printed circuit board 40 are located on the same surface of printed circuit board 40, thus,
So that either liquid crystal display device or organic light-emitting display device, can use identical bound device to printed circuit
Plate 40 and flexible circuit board 60 are bound.
Specifically, as shown in fig. 7, display base plate 30 is organic light emitting display substrate comprising underlay substrate 31 and setting
The illuminated Organic Light Emitting Diode 32 in multiple bottoms on underlay substrate 31, the display device further include and 30 phase of display base plate
To the encapsulated layer 50 of setting, adhesive glue 80 can also be set between encapsulated layer 50 and display base plate 30.It is illuminated the bottom of for organic
Display device, encapsulated layer 50 and printed circuit board 40 are respectively positioned on the inside of the flexible circuit board 60 of bending, therefore, encapsulated layer 50,
The integral thickness of display base plate 30, printed circuit board 40 and flip chip is the bending degree and underlay substrate 31 by flip chip
Thickness determine, encapsulated layer 40 no longer occupies additional thickness, so that display device is integrally relatively thin.
In order to reduce the electrostatic generated on encapsulated layer 50, it is preferable that encapsulated layer 50 can be conductive, sets on printed circuit board 40
It is equipped with low-level input, the low-level input is electrically connected with encapsulated layer 50.Therefore, when generating electrostatic on encapsulated layer 50
When, the low-level input can guide electrostatic charge, to improve the antistatic effect of display device.Wherein, encapsulated layer
50 can be metal cover board.
Specifically, as shown in fig. 7, being provided with conducting resinl 70 between printed circuit board 40 and encapsulated layer 50, electricity will be printed
Low-level input on road plate 40 is electrically connected with encapsulated layer 50.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (6)
1. a kind of display device, which is characterized in that including display base plate, printed circuit board and flip chip, the flip chip
Including flexible circuit board, the flexible circuit board includes conductive layer, and the conductive layer includes positioned at the of the conductive layer first end
One binds area and binds area positioned at the second of the conductive layer second end, and the first binding area is described for binding display base plate
Second binding area is located at the conductive layer for binding printed circuit board, the first binding area and second binding area
Two opposite surfaces；The printed circuit board is located at second binding area towards the side of the display base plate,
The display base plate includes viewing area and the lead district around the viewing area, and the first of the flexible circuit board is tied up
The lead district for determining area and the display base plate is bound, and the second binding area of the flexible circuit board is tied up with the printed circuit board
Fixed, the printed circuit board is fixed at the side away from light direction of the display base plate；
The flexible circuit board further includes substrate and insulating layer, and the substrate, the conductive layer and the insulating layer are along the base
The thickness direction at bottom is sequentially stacked, and the first end of the conductive layer exceeds the substrate, and the second end of the conductive layer exceeds institute
Insulating layer is stated, the surface away from the insulating layer of the part beyond the substrate of the conductive layer is formed as described first and ties up
Determine area, the surface away from the substrate of the part beyond insulating layer of the conductive layer is formed as second binding area；
The flip chip further include the driving chip being fixed on the conductive layer, and the conductive layer includes spaced two
A conductive part, the first binding area and second binding area are respectively formed on two conductive parts, the driving core
The input terminal and output end of piece are connected with two conductive parts respectively, and the driving chip and the insulating layer are located at described lead
The same side of electric layer, opening corresponding with the driving chip is provided on the insulating layer, and the driving chip is arranged in institute
It states in opening；After the flexible circuit board bending, the driving chip is located at the inside of the flexible circuit board；
The display device further includes the encapsulated layer being oppositely arranged with the display base plate；The encapsulated layer can be conductive, described
Low-level input is provided on printed circuit board, the low-level input is electrically connected with the encapsulated layer.
2. display device according to claim 1, which is characterized in that the end face of the first end of the conductive layer flushes in institute
The end face of insulating layer is stated, the end face of the second end of the conductive layer flushes in the end face of the substrate.
3. display device according to claim 1, which is characterized in that form the material of the insulating layer and form the base
The material at bottom is each independently selected from polyphenylene sulfide, polybenzoate, polybenzimidazoles, any one in poly- friend's diphenyl siloxane
Kind.
4. display device according to claim 1, which is characterized in that formed the insulating layer material and the substrate
Material is identical.
5. display device according to claim 1, which is characterized in that the display base plate includes that underlay substrate and setting exist
The illuminated Organic Light Emitting Diode in multiple bottoms on the underlay substrate.
6. display device according to claim 1, which is characterized in that be provided between the printed circuit board and encapsulated layer
Low-level input on the printed circuit board is electrically connected by conducting resinl with the encapsulated layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610180206.6A CN105826353B (en) | 2016-03-25 | 2016-03-25 | Flip chip and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610180206.6A CN105826353B (en) | 2016-03-25 | 2016-03-25 | Flip chip and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105826353A CN105826353A (en) | 2016-08-03 |
| CN105826353B true CN105826353B (en) | 2019-08-16 |
Family
ID=56524854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610180206.6A Expired - Fee Related CN105826353B (en) | 2016-03-25 | 2016-03-25 | Flip chip and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105826353B (en) |
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| KR102516353B1 (en) * | 2016-12-28 | 2023-04-03 | 엘지디스플레이 주식회사 | Flexible display device method for manufacturing the same |
| CN107357068A (en) * | 2017-07-21 | 2017-11-17 | 武汉华星光电技术有限公司 | A kind of narrow frame display panel and manufacture method |
| CN107238958B (en) * | 2017-08-01 | 2024-02-02 | 惠科股份有限公司 | Display panel display device |
| CN107393422B (en) * | 2017-09-04 | 2019-09-27 | 武汉华星光电半导体显示技术有限公司 | Display panel and display equipment |
| CN107561764A (en) | 2017-10-30 | 2018-01-09 | 上海天马微电子有限公司 | Display panel and display device thereof |
| CN107589579A (en) * | 2017-10-31 | 2018-01-16 | 武汉华星光电技术有限公司 | Narrow frame display panel and preparation method thereof, display device |
| WO2019174041A1 (en) * | 2018-03-16 | 2019-09-19 | 华为技术有限公司 | Display panel module and electronic device |
| CN108684134B (en) | 2018-05-10 | 2020-04-24 | 京东方科技集团股份有限公司 | Circuit board and display device |
| CN108828812A (en) * | 2018-05-18 | 2018-11-16 | 信利半导体有限公司 | A kind of flexible display apparatus |
| CN109471277B (en) * | 2018-11-23 | 2024-02-20 | 深圳市美视达技术有限公司 | Display convenient to assemble |
| WO2020107399A1 (en) * | 2018-11-30 | 2020-06-04 | 深圳市柔宇科技有限公司 | Chip-on-film module, display panel and display device |
| CN111292612B (en) * | 2018-12-10 | 2022-02-11 | 北京小米移动软件有限公司 | Display module and mobile terminal |
| CN109671638A (en) * | 2018-12-12 | 2019-04-23 | 武汉华星光电半导体显示技术有限公司 | For measuring the structure and detection device of luminescent panel adhesive strength |
| CN109459896A (en) * | 2018-12-29 | 2019-03-12 | 武汉华星光电技术有限公司 | Narrow frame display module and its display device |
| CN111915984B (en) * | 2019-05-09 | 2022-10-21 | 上海和辉光电股份有限公司 | Display device |
| CN110619816A (en) * | 2019-08-19 | 2019-12-27 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN110930884B (en) * | 2019-12-20 | 2021-10-01 | 京东方科技集团股份有限公司 | Display module and display device |
| CN111292614B (en) * | 2020-01-15 | 2022-07-12 | 京东方科技集团股份有限公司 | Display module and display device |
| CN111192865A (en) * | 2020-03-05 | 2020-05-22 | 江苏壹光科技有限公司 | Double-sided light-emitting leadless OLED module |
| CN111554195B (en) * | 2020-05-30 | 2022-06-14 | 京东方科技集团股份有限公司 | Flexible display module, preparation method thereof and electronic equipment |
| CN112188830B (en) * | 2020-10-16 | 2021-09-03 | Tcl华星光电技术有限公司 | Adsorption mechanism, pressing device and pressing method of display module |
| US11252822B1 (en) * | 2020-11-16 | 2022-02-15 | Himax Technologies Limited | Flexible printed circuit board and display apparatus having the same |
| CN114783291B (en) * | 2022-04-18 | 2023-12-22 | 京东方科技集团股份有限公司 | Display substrate, flexible circuit board and display device |
| CN114935860A (en) * | 2022-05-19 | 2022-08-23 | Tcl华星光电技术有限公司 | Display panel, display device and splicing display device |
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| WO2012147672A1 (en) * | 2011-04-28 | 2012-11-01 | シャープ株式会社 | Display module and display device |
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| CN105826353A (en) | 2016-08-03 |
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