CN105826229A - Wafer clamping mechanism - Google Patents
Wafer clamping mechanism Download PDFInfo
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- CN105826229A CN105826229A CN201610011801.7A CN201610011801A CN105826229A CN 105826229 A CN105826229 A CN 105826229A CN 201610011801 A CN201610011801 A CN 201610011801A CN 105826229 A CN105826229 A CN 105826229A
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- wafer
- movable jaw
- clamping device
- induction pieces
- rotating disk
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention discloses a wafer clamping mechanism. The wafer clamping mechanism comprises a rotary disc, a plurality of clamping jaws, and a sensing assembly. The plurality of clamping jaws are composed of at least one movable clamping jaw and the movable clamping jaw is movably arranged on the rotary disc. When the at least one movable clamping jaw is at a clamping position, the movable clamping jaw clamps a wafer. When the at least one movable clamping jaw is at a non-clamping position, the wafer is disengaged from the at least one movable clamping jaw. The sensing assembly comprises a first sensing element and a second sensing element. The first sensing element is arranged on the at least one movable clamping jaw. The second sensing element is used for sensing the first sensing element and then sending out a signal when the movable clamping jaw is at the clamping position. Due to the arrangement of the sensing assembly, the position of the movable clamping jaw is judged through sensing the first sensing element by means of the second sensing element. Therefore, whether the wafer is on the rotary disc or not can be judged. As a result, the state of the wafer on the wafer clamping mechanism can be effectively known. Meanwhile, the wafer clamping security of the wafer clamping mechanism is improved and the wafer is effectively protected.
Description
Technical field
The present invention relates to wafer fabrication techniques field, particularly relate to a kind of wafer clamping device.
Background technology
In large scale integrated circuit production process, wafer needs to ultimately form product through multiple working procedure.In every one procedure, and during wafer transfer, it is required for clamping device and fixes wafer, make wafer keep certain state, or press certain way motion.
If in the case of not knowing clamping device state, send the order of clamping device motion, wafer may be caused damage, be likely to damage wafer clamping device simultaneously, security incident even occurs.During wafer clamping mechanism kinematic, if wafer crushes and cannot detect, it is impossible to make the timely stop motion of clamping device, will also result in the most serious consequence.
Summary of the invention
It is contemplated that one of technical problem solved the most to a certain extent in correlation technique.To this end, the present invention proposes a kind of wafer clamping device that can detect wafer state.
Wafer clamping device according to the present invention, including: rotating disk；Multiple claws, the plurality of claw includes at least one movable jaw, described movable jaw is movably arranged as on described rotating disk, when at least one movable jaw described is in clip position, described movable jaw clamps described wafer, and at least one movable jaw described is in described wafer during non-clamping position and departs from least one movable jaw described；Inductive component, described inductive component includes the first induction pieces and the second induction pieces, described first induction pieces is arranged at least one movable jaw described, and described second induction pieces is suitable to sense described first induction pieces when described movable jaw is positioned at described clip position and send signal.
Wafer clamping device according to the present invention; by arranging inductive component; the position of movable jaw can be judged by the way of the second induction pieces senses the first induction pieces; such that it is able to judge whether wafer is on rotating disk; can effectively understand the wafer state on wafer clamping device, and then can ensure that, when wafer clamping device works, multiple claws can effectively clamp wafer; the safety of wafer gripper mechanism grips wafer can be promoted, can effectively protect wafer.
It addition, can also have a following distinguishing feature according to the wafer clamping device of the present invention:
In some examples of the present invention, described first induction pieces is arranged on one end away from described wafer of at least one movable jaw described.
In some examples of the present invention, it is the most right with described first induction pieces that described second induction pieces is suitable to when described movable jaw is in clip position.
In some examples of the present invention, described first induction pieces is sensing chip, and described second induction pieces is sensor.
In some examples of the present invention, described wafer clamping device also includes: reflection sensor, the reception reference value that described reflection sensor sets is as T0, when described movable jaw is in described clip position, the reception signal value T1 ＞ T0 of described reflection sensor, described reflection sensor does not send signal；When described movable jaw is in described non-clamping position, the reception signal value T2 ＜ T0 of described reflection sensor, described reflection sensor sends signal.
In some examples of the present invention, described reflection sensor is oppositely arranged with the center of described rotating disk.
In some examples of the present invention, described wafer clamping device also includes: resilient clamping force assembly, and described resilient clamping force assembly is arranged for being supplied to described movable jaw and clamps the resilient clamping force of described wafer.
In some examples of the present invention, described resilient clamping force assembly includes: stage clip, and the two ends of described stage clip are connected on described movable jaw and described rotating disk.
In some examples of the present invention, described rotating disk includes: body and the support seat being arranged on described body side, the escape groove for installing described movable jaw it is provided with on described body, it is provided with mating groove on described support seat, being provided with support pin in described mating groove, the described pin that supports constitutes the pivotal axis of described movable jaw.
Accompanying drawing explanation
Fig. 1 is the structural representation of the wafer clamping device according to first embodiment of the invention；
Fig. 2 is the schematic diagram supporting seat in the wafer clamping device in Fig. 1；
Fig. 3 is the schematic diagram of the movable jaw in the wafer clamping device in Fig. 1；
Fig. 4 is the schematic diagram of the body of the rotating disk in the wafer clamping device in Fig. 1；
Fig. 5 is the structural representation of the wafer clamping device not being clamped with wafer；
Fig. 6 is the schematic diagram of the wafer clamping device being clamped with wafer, and wherein push rod promotes movable jaw to release clamp position；
Fig. 7 is the schematic diagram of the wafer clamping device of second embodiment according to the present invention；
Fig. 8 is the schematic diagram supporting seat of the wafer clamping device in Fig. 7；
Fig. 9 is the schematic diagram of the drive rod of the wafer clamping device in Fig. 7；
Figure 10 is the sectional view of the wafer clamping device of the 3rd embodiment according to the present invention；
Figure 11 is the schematic diagram of the movable jaw of the wafer clamping device in Figure 10.
Reference:
Wafer clamping device 1000；
Rotating disk 100；Body 110；Escape groove 111；Support seat 120；Mating groove 121；Support pin 130；End plate 140；Stage clip mounting groove 141；Extension spring mounting groove 142；
Movable jaw 200；Stationary jaw 210；Support pin installing hole 220；Stage clip bearing holes 230；Second magnetic part mounting groove 240；3rd magnetic part mounting groove 250；
Wafer 300；
First magnetic part 410；Second magnetic part 420；3rd magnetic part 430；4th magnetic part 440；
Push rod 500；
Resilient clamping force assembly 600；Stage clip 610；Extension spring 620；Drive rod 630；Extension spring bearing holes 631；Manomelia 632；Long limb 633；Through hole 640；
Inductive component 700；First induction pieces 710；Second induction pieces 720；
Reflection sensor 800.
Detailed description of the invention
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings.The embodiment described below with reference to accompanying drawing is exemplary, it is intended to is used for explaining the present invention, and is not considered as limiting the invention.
Below with reference to the accompanying drawings wafer clamping device 1000 according to embodiments of the present invention is described in detail.
Wafer clamping device 1000 according to embodiments of the present invention may include that rotating disk 100, multiple claw and inductive component 700.As shown in Figure 1, multiple claw can be provided with on rotating disk 100, multiple claws can include at least one movable jaw 200, movable jaw 200 is movably arranged as on rotating disk 100, when at least one movable jaw 200 is in clip position, movable jaw 200 clamps wafer 300, and when at least one movable jaw 200 is in non-clamping position, wafer 300 departs from least one movable jaw 200.It is understandable that, the quantity of movable jaw 200 can be adjusted according to practical situation, the reliability of multiple claw clamping wafer 300 can be kept by the quantity choosing rational movable jaw 200, but also can ensure that the high efficiency of multiple claw clamping wafer 300.
According to a preferred embodiment of the present invention, as shown in Figure 1, multiple claws can also include at least one stationary jaw 210, stationary jaw 210 and movable jaw 200 with the use of, after wafer 300 can first be pre-installed on stationary jaw 210, clamped by movable jaw 200 again, such that it is able to improve the installing/dismounting efficiency of wafer 300.
As shown in Figure 1, inductive component 700 includes the first induction pieces 710 and the second induction pieces 720, first induction pieces 710 is arranged at least one movable jaw 200, and the second induction pieces 720 is suitable to sense the first induction pieces 710 when movable jaw 200 is positioned at clip position and send signal.It is understandable that, the quantity of inductive component 700 can be identical with the quantity of movable jaw 200, when movable jaw 200 is one, by the first induction pieces 710, second induction pieces 720 senses that movable jaw 200 is in clip position after, second induction pieces 720 can send clamping signal, thus wafer clamping device 1000 can work, rotating disk 100 can drive wafer 300 synchronous axial system.When movable jaw 200 is multiple, if there being second induction pieces 720 cannot sense the first corresponding induction pieces 710, this second induction pieces 720 cannot send clamping signal, and wafer clamping device 1000 will be unable to start working.
Thus; wafer clamping device 1000 according to embodiments of the present invention; by arranging inductive component 700; the position of movable jaw 200 can be judged by the way of the second induction pieces 720 senses the first induction pieces 710; such that it is able to judge whether wafer 300 is clamped on rotating disk 100; can effectively understand wafer 300 state on wafer clamping device 1000; and then can ensure that when wafer clamping device 1000 works; multiple claws can effectively clamp wafer 300; wafer clamping device 1000 can be promoted and clamp the safety of wafer 300, can effectively protect wafer 300.
In some examples of the present invention, as shown in figures 1 and 3, the first induction pieces 710 is arranged on one end away from wafer 300 of at least one movable jaw 200.Thus, on the one hand the layout of the second induction pieces 720 on the other hand can also be easy to so that first induction pieces 710 layout on movable jaw 200, such that it is able to the connection and reasonable arrangement promoted between each parts of wafer clamping device 1000.
Alternatively, as it is shown in figure 1, the second induction pieces 720 be suitable to when movable jaw 200 is in clip position the most right with the first induction pieces 710.Thus, it is possible to ensure that the second induction pieces 720 senses the accuracy of the first induction pieces 710, such that it is able to improve the functional reliability of inductive component 700, the safety of wafer 300 can be promoted further.
As shown in Figure 5 and Figure 6, when wafer 300 is not clamped on rotating disk 100, relative second induction pieces 720 of movable jaw 200 is obliquely installed, thus the second induction pieces 720 cannot sense that the first induction pieces 710, the second induction pieces 720 cannot send clamping signal.
Alternatively, the first induction pieces 710 can be sensing chip, and the second induction pieces 720 can be sensor.
According to one embodiment of present invention, as shown in Fig. 1, Fig. 5 and Fig. 6, wafer clamping device 1000 can also include: reflection sensor 800, the reception reference value that reflection sensor 800 sets is as T0, when movable jaw 200 is in clip position, the reception signal value T1 ＞ T0 of reflection sensor 800, reflection sensor 800 does not send signal；When movable jaw 200 is in non-clamping position, the reception signal value T2 ＜ T0 of reflection sensor 800, reflection sensor 800 sends signal.When wafer clamping device 1000 normally works, reflection sensor 800 can receive the reflected signal of wafer 300, when receiving signal value T1 ＞ T0, illustrates that wafer 300 is normally clamped on rotating disk 100, and reflection sensor 800 does not send signal.When receiving signal value T2 ＜ T0, illustrating that wafer 300 is the most normally clamped on rotating disk 100, reflection sensor 800 sends signal, and wafer clamping device 1000 quits work.By arranging reflection sensor 800, wafer clamping device 1000 can be improved further and clamp the reliability of wafer 300, the safety of wafer 300 can be improved.
Alternatively, as shown in Fig. 1, Fig. 5 and Fig. 6, reflection sensor 800 can be oppositely arranged with the center of rotating disk 100.Certainly, the present invention is not limited to this, and reflection sensor 800 can also be arranged on other top positions of rotating disk 100.
Wherein, wafer clamping device 1000 can be provided with chucking power assembly, chucking power assembly can be arranged for being supplied to movable jaw 200 and clamp the chucking power of wafer 300.By arranging chucking power assembly, dynamics that movable jaw 200 clamp the chucking power of wafer 300 can be effectively ensured, thereby may be ensured that the safety that wafer 300 is clamped on rotating disk 100.
The arrangement of two kind chucking power assemblies is described in detail below.
According to one embodiment of present invention, as it is shown in fig. 7, chucking power assembly can be resilient clamping force assembly 600, resilient clamping force assembly 600 can be arranged for being supplied to movable jaw 200 and clamp the resilient clamping force of wafer 300.
Alternatively, rotating disk 100 can be provided with pivotal axis, movable jaw 200 can be around pivot axis, and resilient clamping force assembly 600 is arranged on the side away from wafer 300 of pivotal axis.Thus, movable jaw 200 can be configured to lever construction, and resilient clamping force assembly 600 can be supplied to movable jaw 200 1 and movable jaw 200 and clamp the power that the power of wafer 300 is reverse, so that movable jaw 200 can preferably clamp wafer 300.Additionally, by resilient clamping force assembly 600 being arranged on the side away from wafer 300 of pivotal axis, so that resilient clamping force assembly 600 is isolated from each other with wafer 300, thus can avoid the interference between wafer 300 and resilient clamping force assembly 600 the most to a certain extent, so that wafer clamping device 1000 is reasonable in design.
Alternatively, as shown in Figure 1 and Figure 7, resilient clamping force assembly 600 may include that stage clip 610, the two ends of stage clip 610 are connected on movable jaw 200 and rotating disk 100.Wherein it is desired to explanation, stage clip 610 can arrange certain pretightning force.Movable jaw 200 can rotate relative to rotating disk 100, as it is shown in figure 5, when wafer 300 is not clamped on rotating disk 100, stage clip 610 can be with extrapolated movable jaw 200, thus movable jaw 200 can rotate counterclockwise.As shown in Figure 1 and Figure 7, when wafer 300 is clamped on rotating disk 100, wafer 300 can stop activity to be blocked to rotate counterclockwise, and stage clip 610 can be supplied to movable jaw 200 and clamp the chucking power of wafer 300.
In an optional embodiment, shown in Fig. 4, Fig. 7 and Fig. 8, rotating disk 100 may include that body 110 and is arranged on the support seat 120 of body 110 side, the escape groove 111 for installation activity claw 200 it is provided with on body 110, support and be provided with mating groove 121 on seat 120, it is provided with support pin 130 in mating groove 121, supports pin 130 and constitute pivotal axis.In other words, movable jaw 200 can rotate around the support pin 130 supported on seat 120, thus movable jaw 200 can rotate relative to rotating disk 100.As in figs. 3 and 11, movable jaw 200 is provided with is suitable to support the support pin installing hole 220 that passes of pin 130.By arranging escape groove 111 and mating groove 121, can be so that the layout of movable jaw 200 and the rotation of movable jaw 200.Preferably, escape groove 111 can be identical with the shape of mating groove 121.
Alternatively, as shown in Figure 1, Figure 2 and Figure 7, supporting and can be provided with the end plate 140 relative with movable jaw 200 on seat 120, stage clip 610 is connected between the side of end plate 140 and movable jaw 200.By arranging end plate 140, can be stably arranged between end plate 140 and movable jaw 200 by stage clip 610, alternatively, the two ends of stage clip 610 are fixed be connected with end plates 140 and movable jaw 200 respectively.As in figure 2 it is shown, the stage clip mounting groove 141 for installing stage clip 610 can be provided with on end plate 140, movable jaw 200 can be provided with the stage clip bearing holes 230 for installing stage clip 610.
Further, as it is shown in fig. 7, resilient clamping force assembly 600 can also include: extension spring 620 and drive rod 630, extension spring 620 is connected between the opposite side of end plate 140 and drive rod 630, and one end of drive rod 630 is only against on movable jaw 200.The side of end plate 140 refers to the outside of end plate 140, and the opposite side of end plate 140 refers to the inner side of end plate 140, and the inner side and outer side of end plate 140 sets according to the near remote of center of distance body 110.End plate 140 opposing body 110 fixes, extension spring 620 is arranged between drive rod 630 and end plate 140, pretightning force can be set with in extension spring 620, extension spring 620 can pull drive rod 630 towards the direction of end plate 140, thus extension spring 620 can pull drive rod 630 towards outside, drive rod 630 can be towards one end away from wafer 300 of outer side compression movable jaw 200, and then extension spring 620 and drive rod 630 can be supplied to movable jaw 200 and clamp the chucking power of wafer 300 larger, it is ensured that the safety of wafer 300.
Alternatively, extension spring 620 and stage clip 610 can be oppositely arranged about end plate 140.Thus, extension spring 620 and stage clip 610 arrange simply, can effectively simplify resilient clamping force assembly 600, such that it is able to simplify the structure of wafer clamping device 1000.
Alternatively, as shown in Figure 8, end plate 140 can be provided with the through hole 640 passed for drive rod 630.When drive rod 630 is located on through hole 640, end plate 140 can limit the moving direction of drive rod 630, it is ensured that extension spring 620 and the functional reliability of drive rod 630, can promote extension spring 620 and drive rod 630 is supplied to the chucking power of movable jaw 200.
Alternatively, as it is shown in figure 9, drive rod 630 structure can cause L-shaped structure, the manomelia 632 of drive rod 630 is connected with extension spring 620, the long limb 633 of drive rod 630 be located on through hole 640, and one end of long limb 633 is only against on movable jaw 200.Specifically, the manomelia 632 of drive rod 630 can be provided with extension spring mounting groove 142, as shown in Figure 8, the inner side of end plate 140 can be provided with extension spring bearing holes 631.
According to another embodiment of the invention, chucking power assembly can also be magnetic clamping force assembly, and magnetic clamping force assembly can be arranged for being supplied to movable jaw 200 and clamp the magnetic clamping force of wafer 300.
Alternatively, as shown in Figure 10, rotating disk 100 can be provided with pivotal axis, movable jaw 200 can be around pivot axis, and magnetic clamping force assembly is arranged at least side of pivotal axis.
The optional arrangement of magnetic clamping force assembly is described below in detail.As shown in Figure 10, magnetic clamping force assembly may include that the first magnetic part 410 and the second magnetic part 420 attracted each other, first magnetic part 410 is arranged on rotating disk 100, and the second magnetic part 420 is arranged on movable jaw 200, the first magnetic part 410 and the second magnetic part 420 are between pivotal axis and wafer 300.It is understood that the second magnetic part 420 is arranged on one end of the adjacent wafer 300 of movable jaw 200.Owing to the first magnetic part 410 and the second magnetic part 420 attract each other, second magnetic part 420 has the trend moved in the one end of the adjacent wafer 300 driving movable jaw 200 towards wafer 300, wafer 300 can stop the trend that movable jaw 200 moves, thus the second magnetic part 420 can be supplied to activity block the chucking power of clamping wafer 300 by coordinating with the first magnetic part 410 magnetic.By arranging the first magnetic part 410 and the second magnetic part 420 so that chucking power modular construction simple and work firm.
Alternatively, one in the first magnetic part 410 and the second magnetic part 420 can be Magnet, and another in the first magnetic part 410 and the second magnetic part 420 can be irony part.Or alternatively, the first magnetic part 410 and the second magnetic part 420 can be to be oppositely arranged and Magnet that magnetic is different.
As shown in Figure 10, property chucking power assembly can also include: mutually exclusive 3rd magnetic part 430 and the 4th magnetic part 440,3rd magnetic part 430 is arranged on movable jaw 200,4th magnetic part 440 is arranged on rotating disk 100, and the 3rd magnetic part 430 and the 4th magnetic part 440 axle that is pivoted relative to each other is located remotely from one end of wafer 300.Thus, being coordinated by the magnetic of the 3rd magnetic part 430 and the 4th magnetic part 440, the 3rd magnetic part 430 can be supplied to movable jaw 200 and clamp the chucking power of wafer 300.It addition, by arranging the 3rd magnetic part 430 and the 4th magnetic part 440, so that magnetic clamping force modular construction is simple and reliable operation.Alternatively, the 3rd magnetic part 430 and the 4th magnetic part 440 can be the same polarity Magnet being oppositely arranged.
In an optional embodiment, shown in Fig. 4 and Figure 10, rotating disk 100 may include that body 110 and is arranged on the support seat 120 of body 110 side, the escape groove 111 for installation activity claw 200 it is provided with on body 110, support and be provided with mating groove 121 on seat 120, it is provided with support pin 130 in mating groove 121, supports pin 130 and constitute pivotal axis.In other words, movable jaw 200 can rotate around the support pin 130 supported on seat 120, thus movable jaw 200 can rotate relative to rotating disk 100.By arranging escape groove 111 and mating groove 121, can be so that the layout of movable jaw 200 and the rotation of movable jaw 200.Preferably, escape groove 111 can be identical with the shape of mating groove 121.
Alternatively, as shown in Figure 10, supporting and can be provided with the end plate 140 relative with movable jaw 200 on seat 120, the 4th magnetic part 440 is arranged on end plate 140, and the 3rd magnetic part 430 is oppositely arranged with the 4th magnetic part 440.Preferably, end plate 140 can be provided with the groove-like structure for installing the 4th magnetic part 440.
As shown in figure 11, movable jaw 200 can be respectively arranged with the second magnetic part mounting groove 240 and the 3rd magnetic part mounting groove 250, the second magnetic part mounting groove 240 and the 3rd magnetic part mounting groove 250 may be located at the both sides of pivotal axis.Preferably, the second magnetic part mounting groove 240 and the 3rd magnetic part mounting groove 250 can be arranged symmetrically with about pivotal axis.
In some examples of the present invention, the moment of inertia of one end of the adjacent wafer 300 of movable jaw 200 to pivotal axis can be less than the moment of inertia of the other end of movable jaw 200 to pivotal axis.Thus, chucking power assembly can be supplied to movable jaw 200 and clamp the chucking power of wafer 300 larger.
Alternatively, as shown in Fig. 1, Fig. 7 and Figure 10, wafer clamping device 1000 can also include: push rod 500, and push rod 500 is suitable to drive movable jaw 200 to release the clamping to wafer 300.Push rod 500 can quickly promote movable jaw 200 to release the clamping to wafer 300, such that it is able to improve the work efficiency of wafer clamping device 1000.The promote-side of push rod 500 can be configured to circular arc alternatively.
Alternatively, the quantity of stationary jaw 210 is a, and the quantity of movable jaw 200 is b, a+b >=3.When the quantity of claw is more than or equal to 3, multiple claws can preferably clamp wafer 300, such that it is able to improve wafer 300 to be clamped in the safety on rotating disk 100.Preferably, the quantity of stationary jaw 210 can be 2, and the quantity of movable jaw 200 is 1.
Alternatively, as shown in Figure 4, rotating disk 100 being provided with the escape groove 111 for installing claw, two adjacent central angles corresponding to escape groove 111 are less than 180 °.Meet the rotating disk 100 of above-mentioned numerical relation so that multiple claw connection and reasonable arrangement, thus multiple claw can preferably clamp wafer 300, it is ensured that the safety of wafer 300.
In describing the invention, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " length ", " width ", " thickness ", on " ", D score, " front ", " afterwards ", " left ", " right ", " vertically ", " level ", " push up ", " end " " interior ", " outward ", " clockwise ", " counterclockwise ", " axially ", " radially ", orientation or the position relationship of the instruction such as " circumferential " are based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not considered as limiting the invention.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or implicitly include at least one this feature.In describing the invention, " multiple " are meant that at least two, such as two, three etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, term " is installed ", " being connected ", " connection ", the term such as " fixing " should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be mechanically connected, it is also possible to be electrical connection or each other can communication；Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, can be connection or the interaction relationship of two elements of two element internals, unless otherwise clear and definite restriction.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary mediate contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be fisrt feature immediately below second feature or obliquely downward, or be merely representative of fisrt feature level height less than second feature.
In the description of this specification, the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means that the specific features, structure, material or the feature that combine this embodiment or example description are contained at least one embodiment or the example of the present invention.In this manual, the schematic representation of above-mentioned term is necessarily directed to identical embodiment or example.And, the specific features of description, structure, material or feature can be to combine in one or more embodiments in office or example in an appropriate manner.Additionally, in the case of the most conflicting, the feature of the different embodiments described in this specification or example and different embodiment or example can be combined and combine by those skilled in the art.
Although above it has been shown and described that embodiments of the invention, it is understandable that, above-described embodiment is exemplary, it is impossible to be interpreted as limitation of the present invention, and above-described embodiment can be changed, revises, replace and modification by those of ordinary skill in the art within the scope of the invention.
Claims (9)
1. a wafer clamping device, it is characterised in that including:
Rotating disk；
Multiple claws, the plurality of claw includes at least one movable jaw, described movable jaw is movably arranged as on described rotating disk, when at least one movable jaw described is in clip position, described movable jaw clamps described wafer, and at least one movable jaw described is in described wafer during non-clamping position and departs from least one movable jaw described；
Inductive component, described inductive component includes the first induction pieces and the second induction pieces, described first induction pieces is arranged at least one movable jaw described, and described second induction pieces is suitable to sense described first induction pieces when described movable jaw is positioned at described clip position and send signal.
Wafer clamping device the most according to claim 1, it is characterised in that described first induction pieces is arranged on one end away from described wafer of at least one movable jaw described.
Wafer clamping device the most according to claim 2, it is characterised in that it is the most right with described first induction pieces that described second induction pieces is suitable to when described movable jaw is in clip position.
Wafer clamping device the most according to claim 1, it is characterised in that described first induction pieces is sensing chip, described second induction pieces is sensor.
Wafer clamping device the most according to claim 1, it is characterized in that, also include: reflection sensor, the reception reference value that described reflection sensor sets is as T0, when described movable jaw is in described clip position, the reception signal value T1 ＞ T0 of described reflection sensor, described reflection sensor does not send signal；
When described movable jaw is in described non-clamping position, the reception signal value T2 ＜ T0 of described reflection sensor, described reflection sensor sends signal.
Wafer clamping device the most according to claim 5, it is characterised in that described reflection sensor is oppositely arranged with the center of described rotating disk.
Wafer clamping device the most according to claim 1, it is characterised in that also include: resilient clamping force assembly, described resilient clamping force assembly is arranged for being supplied to described movable jaw and clamps the resilient clamping force of described wafer.
Wafer clamping device the most according to claim 7, it is characterised in that described resilient clamping force assembly includes: stage clip, the two ends of described stage clip are connected on described movable jaw and described rotating disk.
Wafer clamping device the most according to claim 8, it is characterized in that, described rotating disk includes: body and the support seat being arranged on described body side, the escape groove for installing described movable jaw it is provided with on described body, it is provided with mating groove on described support seat, being provided with support pin in described mating groove, the described pin that supports constitutes the pivotal axis of described movable jaw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610011801.7A CN105826229A (en) | 2016-01-05 | 2016-01-05 | Wafer clamping mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610011801.7A CN105826229A (en) | 2016-01-05 | 2016-01-05 | Wafer clamping mechanism |
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| CN105826229A true CN105826229A (en) | 2016-08-03 |
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| CN201610011801.7A Pending CN105826229A (en) | 2016-01-05 | 2016-01-05 | Wafer clamping mechanism |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731729A (en) * | 2017-09-30 | 2018-02-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer transfer clamping device and apply its CMP tool |
| CN108962807A (en) * | 2018-09-07 | 2018-12-07 | 先进光电器材（深圳）有限公司 | Automatic catching mechanism |
| CN109850569A (en) * | 2019-03-02 | 2019-06-07 | 上海大族富创得科技有限公司 | A kind of centering mechanism and mechanical device |
| CN111725129A (en) * | 2020-06-29 | 2020-09-29 | 北京北方华创微电子装备有限公司 | Wafer bearing device and semiconductor process equipment |
| CN111883475A (en) * | 2020-07-17 | 2020-11-03 | 北京北方华创微电子装备有限公司 | Chuck device in wafer cleaning equipment and wafer cleaning equipment |
| CN112846521A (en) * | 2020-12-31 | 2021-05-28 | 大族激光科技产业集团股份有限公司 | Clamp and laser marking system |
| CN113471135A (en) * | 2021-07-06 | 2021-10-01 | 华海清科股份有限公司 | Wafer clamping device and wafer cleaning device |
| CN115338804A (en) * | 2022-10-13 | 2022-11-15 | 吾拾微电子(苏州)有限公司 | Adjustable wafer fixture device |
| CN116405043A (en) * | 2023-04-13 | 2023-07-07 | 无锡宇邦半导体科技有限公司 | Multi-unit signal collection device and collection method based on semiconductor equipment |
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| CN101587851A (en) * | 2009-06-23 | 2009-11-25 | 北京七星华创电子股份有限公司 | A kind of device that is used for holding plate-like article |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731729B (en) * | 2017-09-30 | 2020-07-07 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer transmission clamping mechanism and CMP equipment applying same |
| CN107731729A (en) * | 2017-09-30 | 2018-02-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wafer transfer clamping device and apply its CMP tool |
| CN108962807A (en) * | 2018-09-07 | 2018-12-07 | 先进光电器材（深圳）有限公司 | Automatic catching mechanism |
| CN109850569B (en) * | 2019-03-02 | 2020-11-13 | 上海大族富创得科技有限公司 | Centering mechanism and mechanical device |
| CN109850569A (en) * | 2019-03-02 | 2019-06-07 | 上海大族富创得科技有限公司 | A kind of centering mechanism and mechanical device |
| CN111725129B (en) * | 2020-06-29 | 2023-02-14 | 北京北方华创微电子装备有限公司 | Wafer bearing device and semiconductor process equipment |
| CN111725129A (en) * | 2020-06-29 | 2020-09-29 | 北京北方华创微电子装备有限公司 | Wafer bearing device and semiconductor process equipment |
| CN111883475A (en) * | 2020-07-17 | 2020-11-03 | 北京北方华创微电子装备有限公司 | Chuck device in wafer cleaning equipment and wafer cleaning equipment |
| CN112846521A (en) * | 2020-12-31 | 2021-05-28 | 大族激光科技产业集团股份有限公司 | Clamp and laser marking system |
| CN112846521B (en) * | 2020-12-31 | 2024-03-12 | 大族激光科技产业集团股份有限公司 | Clamp and laser marking system |
| CN113471135A (en) * | 2021-07-06 | 2021-10-01 | 华海清科股份有限公司 | Wafer clamping device and wafer cleaning device |
| CN113471135B (en) * | 2021-07-06 | 2022-07-29 | 华海清科股份有限公司 | Wafer clamping device and wafer cleaning device |
| CN115338804A (en) * | 2022-10-13 | 2022-11-15 | 吾拾微电子(苏州)有限公司 | Adjustable wafer fixture device |
| CN115338804B (en) * | 2022-10-13 | 2023-02-03 | 吾拾微电子(苏州)有限公司 | Adjustable wafer fixture device |
| CN116405043A (en) * | 2023-04-13 | 2023-07-07 | 无锡宇邦半导体科技有限公司 | Multi-unit signal collection device and collection method based on semiconductor equipment |
| CN116405043B (en) * | 2023-04-13 | 2023-10-31 | 无锡宇邦半导体科技有限公司 | Multi-unit signal collection device and collection method based on semiconductor equipment |
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