CN105470192A - Wafer clamping mechanism - Google Patents
Wafer clamping mechanism Download PDFInfo
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- CN105470192A CN105470192A CN201610010994.4A CN201610010994A CN105470192A CN 105470192 A CN105470192 A CN 105470192A CN 201610010994 A CN201610010994 A CN 201610010994A CN 105470192 A CN105470192 A CN 105470192A
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- wafer
- movable jaw
- rotating disk
- clamping force
- drive rod
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer clamping mechanism, which comprises a rotary plate, a plurality of claws and an elastic clamping force assembly, wherein the plurality of claws comprise at least one movable claw; the movable claw is movably arranged on the rotary plate; the claws are used for clamping wafers on the rotary plate; and the elastic clamping force assembly is arranged to provide elastic clamping force for the movable claw to clamp the wafers. Through the arranged elastic clamping force assembly, the clamping force of clamping the wafers can be provided for the movable claws; the clamping force, of clamping the wafers, of the movable clawis relatively large; autoroatation of the wafers can be prevented; and the wafers can be effectively protected.
Description
Technical field
The present invention relates to wafer fabrication techniques field, particularly relate to a kind of wafer fixture.
Background technology
In large scale integrated circuit production process, wafer needs finally to form product through multiple working procedure.In each procedure, and in wafer transfer process, all need fixture to fix wafer, make wafer keep certain state, or press certain way motion.
Existing wafer fixture, the mode of installing clamping wafer is mainly two kinds: a kind of is make driving holding parts step up wafer by the mode of contact, drives holding parts clamping wafer as used the actuators such as cylinder, spring, motor; Another kind is in fixture rotation process, steps up wafer by the centrifugal force of part.There is following problem in existing wafer fixture: the fixture of rotation clamps wafer by the centrifugal force of part, when starting rotation and rotation stopping, chucking power is very little, due to the inertia of wafer, can cause there is relative sliding between wafer and holding parts, can wearing and tearing be caused to crystal column surface, friction particles can be produced simultaneously and pollute.
Summary of the invention
The present invention is intended to solve one of technical problem in correlation technique at least to a certain extent.For this reason, the present invention proposes the larger wafer fixture of a kind of chucking power, and this wafer fixture effectively can prevent the rotation of wafer, good clamping effect.
According to wafer fixture of the present invention, comprising: rotating disk; Multiple claw, described multiple claw comprises at least one movable jaw, and described movable jaw is arranged on described rotating disk actively, and described claw is for being held in described rotating disk by described wafer clamp; Resilient clamping force assembly, described resilient clamping force assembly is arranged for and is supplied to the resilient clamping force that described movable jaw clamps described wafer.
According to wafer fixture of the present invention; by arranging resilient clamping force assembly; the chucking power of movable jaw clamping wafer can be supplied to; thus the rotation of wafer can be prevented; can available protecting wafer; and then wafer fixture can clamp wafer preferably in startup and stop phase, improve the stability of wafer.
In addition, wafer fixture according to the present invention can also have following difference technical characteristic:
In examples more of the present invention, described rotating disk is provided with pivotal axis, described movable jaw can around described pivot axis, and described resilient clamping force assembly is arranged on the side away from described wafer of described pivotal axis.
In examples more of the present invention, described resilient clamping force assembly comprises: stage clip, and the two ends of described stage clip are connected on described movable jaw and described rotating disk.
In examples more of the present invention, described rotating disk comprises: body and the supporting seat being arranged on described body side, described body is provided with the escape groove for installing described movable jaw, described supporting seat is provided with mating groove, wherein, be provided with supporting pin in described mating groove or described escape groove, described supporting pin forms described pivotal axis.
In examples more of the present invention, described supporting seat is provided with the end plate of relative with described movable jaw and contiguous described center of turntable, described stage clip is connected between the side of described end plate and described movable jaw.
In examples more of the present invention, described supporting seat is provided with the end plate of relative with described movable jaw and contiguous described center of turntable, described resilient clamping force assembly comprises: extension spring and drive rod, described extension spring is connected between the side away from described movable jaw of described end plate and described drive rod, and one end of described drive rod is only against on described movable jaw.
In examples more of the present invention, described end plate is provided with the through hole passed for described drive rod.
Described in examples more of the present invention, drive rod is configured to L shape structure, and the manomelia of described drive rod is connected with described extension spring, the long limb of described drive rod be located on described through hole and one end and be only against on described movable jaw.
In examples more of the present invention, one end of the described wafer of vicinity of described movable jaw is less than the moment of inertia of the other end to described pivotal axis to the moment of inertia of described pivotal axis.
In examples more of the present invention, described wafer fixture also comprises: push rod, and described push rod is suitable for driving the clamping of described movable jaw releasing to described wafer.
In examples more of the present invention, described multiple claw also comprises: at least one stationary jaw, and at least one stationary jaw described is fixed on described rotating disk.
In examples more of the present invention, the quantity of described stationary jaw is a, and the quantity of described movable jaw is b, a+b >=3.
In examples more of the present invention, two adjacent central angles corresponding to described claw are less than 180 °.
Accompanying drawing explanation
Fig. 1 is the structural representation of the wafer fixture according to first embodiment of the invention;
Fig. 2 is the schematic diagram of the supporting seat in the wafer fixture in Fig. 1;
Fig. 3 is the schematic diagram of the movable jaw in the wafer fixture in Fig. 1;
Fig. 4 is the schematic diagram of the body of rotating disk in the wafer fixture in Fig. 1;
Fig. 5 is the structural representation of the wafer fixture not being clamped with wafer;
Fig. 6 is the schematic diagram of the wafer fixture being clamped with wafer, and wherein push rod promotes movable jaw and removes clamp position;
Fig. 7 is the schematic diagram of the wafer fixture according to second embodiment of the present invention;
Fig. 8 is the schematic diagram of the supporting seat of wafer fixture in Fig. 7;
Fig. 9 is the schematic diagram of the drive rod of wafer fixture in Fig. 7;
Figure 10 is the cutaway view of the wafer fixture according to the 3rd embodiment of the present invention;
Figure 11 is the schematic diagram of the movable jaw of wafer fixture in Figure 10.
Reference numeral:
Wafer fixture 1000;
Rotating disk 100; Body 110; Escape groove 111; Supporting seat 120; Mating groove 121; Supporting pin 130; End plate 140; Stage clip mounting groove 141; Extension spring mounting groove 142;
Movable jaw 200; Stationary jaw 210; Supporting pin installing hole 220; Stage clip bearing holes 230; Second magnetic part mounting groove 240; 3rd magnetic part mounting groove 250;
Wafer 300;
First magnetic part 410; Second magnetic part 420; 3rd magnetic part 430; 4th magnetic part 440;
Push rod 500;
Resilient clamping force assembly 600; Stage clip 610; Extension spring 620; Drive rod 630; Extension spring bearing holes 631; Manomelia 632; Long limb 633; Through hole 640;
Inductive component 700; First induction pieces 710; Second induction pieces 720;
Reflection sensor 800.
Embodiment
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the present invention, and can not limitation of the present invention be interpreted as.
Below with reference to the accompanying drawings the wafer fixture 1000 according to the embodiment of the present invention is described in detail.
Wafer fixture 1000 according to the embodiment of the present invention can comprise: rotating disk 100, multiple claw and inductive component 700.As shown in Figure 1, rotating disk 100 can be provided with multiple claw, multiple claw can comprise at least one movable jaw 200, movable jaw 200 is arranged on rotating disk 100 actively, when at least one movable jaw 200 is in clip position, movable jaw 200 clamps wafer 300, and when at least one movable jaw 200 is in non-clamping position, wafer 300 departs from least one movable jaw 200.Be understandable that, the quantity of movable jaw 200 can adjust according to actual conditions, multiple claw can be kept to clamp the reliability of wafer 300 by the quantity choosing rational movable jaw 200, but also the high efficiency of multiple claw clamping wafer 300 can be ensured.
According to a preferred embodiment of the present invention, as shown in Figure 1, multiple claw can also comprise at least one stationary jaw 210, stationary jaw 210 and movable jaw 200 with the use of, after wafer 300 can first be pre-installed on stationary jaw 210, clamped by movable jaw 200 again, thus the installing/dismounting efficiency of wafer 300 can be improved.
As shown in Figure 1, inductive component 700 comprises the first induction pieces 710 and the second induction pieces 720, first induction pieces 710 is arranged at least one movable jaw 200, and the second induction pieces 720 is suitable for responding to the first induction pieces 710 when movable jaw 200 is positioned at clip position and sending signal.Be understandable that, the quantity of inductive component 700 can be identical with the quantity of movable jaw 200, when movable jaw 200 is one, by the first induction pieces 710, second induction pieces 720 senses that movable jaw 200 is in clip position after, second induction pieces 720 can send clamping signal, thus wafer fixture 1000 can work, rotating disk 100 can drive wafer 300 synchronous axial system.When movable jaw 200 is multiple, if there is second induction pieces 720 cannot sense the first corresponding induction pieces 710, this second induction pieces 720 cannot send clamping signal, and wafer fixture 1000 cannot be started working.
Thus, according to the wafer fixture 1000 of the embodiment of the present invention, by arranging inductive component 700, the mode can responding to the first induction pieces 710 by the second induction pieces 720 judges the position of movable jaw 200, thus can judge whether wafer 300 is clamped on rotating disk 100, effectively can understand wafer 300 state on wafer fixture 1000, and then can ensure when wafer fixture 1000 works, multiple claw can effectively clamp wafer 300, the fail safe that wafer fixture 1000 clamps wafer 300 can be promoted, can available protecting wafer 300.
In examples more of the present invention, as shown in figures 1 and 3, the first induction pieces 710 is arranged on one end away from wafer 300 of at least one movable jaw 200.Thus, on the one hand so that the layout of the first induction pieces 710 on movable jaw 200, the layout of the second induction pieces 720 can also be convenient on the other hand, thus the connection and reasonable arrangement between each parts that can promote wafer fixture 1000.
Alternatively, as shown in Figure 1, the second induction pieces 720 be suitable for when movable jaw 200 is in clip position and the first induction pieces 710 just right.Thus, can ensure that the second induction pieces 720 responds to the accuracy of the first induction pieces 710, thus the functional reliability of inductive component 700 can be improved, the fail safe of wafer 300 can be promoted further.
As shown in Figure 5 and Figure 6, when wafer 300 is not clamped on rotating disk 100, relative second induction pieces 720 of movable jaw 200 is obliquely installed, thus the second induction pieces 720 cannot sense that the first induction pieces 710, second induction pieces 720 cannot send clamping signal.
Alternatively, the first induction pieces 710 can be sensing chip, and the second induction pieces 720 can be transducer.
According to one embodiment of present invention, as shown in Fig. 1, Fig. 5 and Fig. 6, wafer fixture 1000 can also comprise: reflection sensor 800, the reception reference value that reflection sensor 800 sets is T0, when movable jaw 200 is in clip position, the Received signal strength value T1 > T0 of reflection sensor 800, reflection sensor 800 does not send signal; When movable jaw 200 is in non-clamping position, the Received signal strength value T2 < T0 of reflection sensor 800, reflection sensor 800 sends signal.When wafer fixture 1000 normally works, reflection sensor 800 can receive the reflected signal of wafer 300, as Received signal strength value T1 > T0, illustrate that wafer 300 is normally clamped on rotating disk 100, reflection sensor 800 does not send signal.As Received signal strength value T2 < T0, illustrate that wafer 300 is not normally clamped on rotating disk 100, reflection sensor 800 sends signal, and wafer fixture 1000 quits work.By arranging reflection sensor 800, the reliability that wafer fixture 1000 clamps wafer 300 can be improved further, the fail safe of wafer 300 can be improved.
Alternatively, as shown in Fig. 1, Fig. 5 and Fig. 6, reflection sensor 800 can be oppositely arranged with the center of rotating disk 100.Certainly, the present invention is not limited to this, and reflection sensor 800 can also be arranged on other top positions of rotating disk 100.
Wherein, wafer fixture 1000 can be provided with chucking power assembly, chucking power assembly can be arranged for and be supplied to the chucking power that movable jaw 200 clamps wafer 300.By arranging chucking power assembly, effectively can ensure that movable jaw 200 clamps the dynamics of the chucking power of wafer 300, can prevent the rotation of wafer, thus can ensure that wafer 300 is clamped in the fail safe on rotating disk 100.And do not contact between chucking power assembly with wafer 300, thus the wearing and tearing of wafer 300 can be avoided, and chucking power modular construction is simple, takes up room little, and structure is reliable, and clamping effect is better.
Introduce the arrangement of two kinds of chucking power assemblies below in detail.
According to one embodiment of present invention, as shown in Figure 7, chucking power assembly can be resilient clamping force assembly 600, and resilient clamping force assembly 600 can be arranged for and be supplied to the resilient clamping force that movable jaw 200 clamps wafer 300.When wafer fixture 1000 starts to start or stop operating, resilient clamping force assembly 600 can be supplied to the enough resilient clamping force of movable jaw 200, thus can prevent now wafer 300 from the phenomenon of rotation occurring, and then the fail safe of wafer 300 can be improved.
Alternatively, rotating disk 100 can be provided with pivotal axis, movable jaw 200 can around pivot axis, and resilient clamping force assembly 600 is arranged on the side away from wafer 300 of pivotal axis.Thus, movable jaw 200 can be configured to lever construction, resilient clamping force assembly 600 can be supplied to movable jaw 200 1 and movable jaw 200 and clamp the reverse power of the power of wafer 300, thus movable jaw 200 can be made can to clamp wafer 300 preferably.In addition, by resilient clamping force assembly 600 being arranged on the side away from wafer 300 of pivotal axis, resilient clamping force assembly 600 can be made to open with wafer 300 is mutually isolated, thus the interference between wafer 300 and resilient clamping force assembly 600 can be avoided at least to a certain extent, thus wafer fixture 1000 can be made reasonable in design.
Alternatively, as shown in Figure 1 and Figure 7, resilient clamping force assembly 600 can comprise: stage clip 610, and the two ends of stage clip 610 are connected on movable jaw 200 and rotating disk 100.Wherein, it should be noted that, stage clip 610 can arrange certain pretightning force.Movable jaw 200 can rotate relative to rotating disk 100, and as shown in Figure 5, when wafer 300 is not clamped on rotating disk 100, stage clip 610 can extrapolated movable jaw 200, thus movable jaw 200 can rotate counterclockwise.As shown in Figure 1 and Figure 7, when wafer 300 is clamped on rotating disk 100, wafer 300 can stop activity to be blocked to rotate counterclockwise, and stage clip 610 can be supplied to the chucking power that movable jaw 200 clamps wafer 300.
In an optional execution mode, shown in composition graphs 4, Fig. 7 and Fig. 8, rotating disk 100 can comprise: body 110 and the supporting seat 120 being arranged on body 110 side, body 110 is provided with the escape groove 111 for installing movable jaw 200, supporting seat 120 is provided with mating groove 121, be provided with supporting pin 130 in mating groove 121, supporting pin 130 forms pivotal axis.In other words, movable jaw 200 can rotate by the supporting pin 130 on supporting seat 120, thus movable jaw 200 can rotate relative to rotating disk 100.As in figs. 3 and 11, movable jaw 200 is provided with the supporting pin installing hole 220 being suitable for supporting pin 130 and passing.By arranging escape groove 111 and mating groove 121, can so that the layout of movable jaw 200 and the rotation of movable jaw 200.Preferably, escape groove 111 can be identical with the shape of mating groove 121.
It should be noted that, supporting pin 130 can also be arranged in escape groove 111.
Alternatively, as shown in Figure 1, Figure 2 and Figure 7, supporting seat 120 can be provided with the end plate 140 relative with movable jaw 200, stage clip 610 is connected between the side of end plate 140 and movable jaw 200, and the center of the contiguous rotating disk 100 of its end plates 140 is arranged.By arranging end plate 140, can be arranged between end plate 140 and movable jaw 200 by stable for stage clip 610, alternatively, the two ends of stage clip 610 are fixedly connected with movable jaw 200 with end plate 140 respectively.As shown in Figure 2, end plate 140 can being provided with the stage clip mounting groove 141 for installing stage clip 610, movable jaw 200 can being provided with the stage clip bearing holes 230 for installing stage clip 610.
Further, as shown in Figure 7, resilient clamping force assembly 600 can also comprise: extension spring 620 and drive rod 630, and extension spring 620 is connected between the opposite side of end plate 140 and drive rod 630, and one end of drive rod 630 is only against on movable jaw 200.The side of end plate 140 refers to the outside of end plate 140, and the opposite side of end plate 140 refers to the inner side of end plate 140, and the inner side and outer side of end plate 140 is according to the setting near far away at the center of distance body 110.End plate 140 opposing body 110 fixes, extension spring 620 is arranged between drive rod 630 and end plate 140, extension spring 620 can be set with pretightning force, extension spring 620 can pull drive rod 630 towards the direction of end plate 140, thus extension spring 620 can pull drive rod 630 toward the outer side, drive rod 630 can compress one end away from wafer 300 of movable jaw 200 toward the outer side, and then extension spring 620 and drive rod 630 can be supplied to the chucking power that movable jaw 200 clamps wafer 300 larger, the fail safe of wafer 300 can be ensured.
Alternatively, extension spring 620 and stage clip 610 can be oppositely arranged about end plate 140.Thus, extension spring 620 and stage clip 610 arrange simply, can effectively simplify resilient clamping force assembly 600, thus can simplify the structure of wafer fixture 1000.
Alternatively, as shown in Figure 8, end plate 140 can be provided with the through hole 640 passed for drive rod 630.When drive rod 630 is located on through hole 640, end plate 140 can limit the moving direction of drive rod 630, can ensure the functional reliability of extension spring 620 and drive rod 630, can promote the chucking power that extension spring 620 and drive rod 630 are supplied to movable jaw 200.
Alternatively, as shown in Figure 9, drive rod 630 structure can cause L shape structure, and the manomelia 632 of drive rod 630 is connected with extension spring 620, the long limb of drive rod 630 633 be located on through hole 640, and one end of long limb 633 is only against on movable jaw 200.Particularly, the manomelia 632 of drive rod 630 can be provided with extension spring mounting groove 142, as shown in Figure 8, the inner side of end plate 140 can be provided with extension spring bearing holes 631.
According to another embodiment of the invention, chucking power assembly can also be magnetic clamping force assembly, and magnetic clamping force assembly can be arranged for and be supplied to the magnetic clamping force that movable jaw 200 clamps wafer 300.
Alternatively, as shown in Figure 10, rotating disk 100 can be provided with pivotal axis, movable jaw 200 can around pivot axis, and magnetic clamping force assembly is arranged at least side of pivotal axis.
The optional arrangement of magnetic clamping force assembly is described below in detail.As shown in Figure 10, magnetic clamping force assembly can comprise: the first magnetic part 410 and the second magnetic part 420 attracted each other, first magnetic part 410 is arranged on rotating disk 100, and second magnetic part 420 be arranged on movable jaw 200, the first magnetic part 410 and the second magnetic part 420 are between pivotal axis and wafer 300.Be understandable that, the second magnetic part 420 is arranged on one end of the adjacent wafer 300 of movable jaw 200.Because the first magnetic part 410 and the second magnetic part 420 attract each other, second magnetic part 420 has the trend driving one end of the adjacent wafer 300 of movable jaw 200 to move towards wafer 300, the trend that wafer 300 can stop movable jaw 200 to move, thus the second magnetic part 420 can be supplied to activity and blocks by coordinating with the first magnetic part 410 magnetic the chucking power clamping wafer 300.By arranging the first magnetic part 410 and the second magnetic part 420, chucking power modular construction can be made simple and work firm.
Alternatively, one in the first magnetic part 410 and the second magnetic part 420 can be magnet, and another in the first magnetic part 410 and the second magnetic part 420 can be irony part.Or alternatively, the first magnetic part 410 and the second magnetic part 420 can for being oppositely arranged and the different magnet of magnetic.
As shown in Figure 10, property chucking power assembly can also comprise: mutually repel the 3rd magnetic part 430 and the 4th magnetic part 440,3rd magnetic part 430 is arranged on movable jaw 200,4th magnetic part 440 is arranged on rotating disk 100, and the 3rd magnetic part 430 and the 4th magnetic part 440 axle that is pivoted relative to each other is positioned at one end away from wafer 300.Thus, coordinated by the magnetic of the 3rd magnetic part 430 and the 4th magnetic part 440, the 3rd magnetic part 430 can be supplied to the chucking power that movable jaw 200 clamps wafer 300.In addition, by arranging the 3rd magnetic part 430 and the 4th magnetic part 440, magnetic clamping force modular construction can be made simple and reliable operation.Alternatively, the 3rd magnetic part 430 and the 4th magnetic part 440 can for the same polarity magnet be oppositely arranged.
In an optional execution mode, shown in composition graphs 4 and Figure 10, rotating disk 100 can comprise: body 110 and the supporting seat 120 being arranged on body 110 side, body 110 is provided with the escape groove 111 for installing movable jaw 200, supporting seat 120 is provided with mating groove 121, be provided with supporting pin 130 in mating groove 121, supporting pin 130 forms pivotal axis.In other words, movable jaw 200 can rotate by the supporting pin 130 on supporting seat 120, thus movable jaw 200 can rotate relative to rotating disk 100.By arranging escape groove 111 and mating groove 121, can so that the layout of movable jaw 200 and the rotation of movable jaw 200.Preferably, escape groove 111 can be identical with the shape of mating groove 121.
Alternatively, as shown in Figure 10, supporting seat 120 can be provided with end plate 140, four magnetic part 440 relative with movable jaw 200 and be arranged on end plate 140, the 3rd magnetic part 430 and the 4th magnetic part 440 are oppositely arranged.Preferably, end plate 140 can be provided with the channel-shaped structure for installing the 4th magnetic part 440.
As shown in figure 11, movable jaw 200 can be respectively arranged with the both sides that the second magnetic part mounting groove 240 and the 3rd magnetic part mounting groove 250, second magnetic part mounting groove 240 and the 3rd magnetic part mounting groove 250 can be positioned at pivotal axis.Preferably, the second magnetic part mounting groove 240 and the 3rd magnetic part mounting groove 250 can be arranged symmetrically with about pivotal axis.
In examples more of the present invention, one end of the adjacent wafer 300 of movable jaw 200 can be less than the moment of inertia of the other end to pivotal axis of movable jaw 200 to the moment of inertia of pivotal axis.Thus, chucking power assembly can increase chucking power by centrifugal force in rotary course, effectively can prevent the rotation of wafer 300.
Alternatively, as shown in Fig. 1, Fig. 7 and Figure 10, wafer fixture 1000 can also comprise: push rod 500, and push rod 500 is suitable for driving movable jaw 200 to remove clamping to wafer 300.Push rod 500 can promote movable jaw 200 fast and remove clamping to wafer 300, thus can improve the operating efficiency of wafer fixture 1000.The promote-side of push rod 500 can be configured to circular arc alternatively.
Alternatively, the quantity of stationary jaw 210 is a, and the quantity of movable jaw 200 is b, a+b >=3.When the quantity of claw is more than or equal to 3, multiple claw can clamp wafer 300 preferably, thus can improve wafer 300 and be clamped in fail safe on rotating disk 100.Preferably, the quantity of stationary jaw 210 can be 2, and the quantity of movable jaw 200 is 1.
Alternatively, two adjacent central angles corresponding to claw can be less than 180 °.The rotating disk 100 meeting above-mentioned numerical relation can make multiple claw connection and reasonable arrangement, thus multiple claw can clamp wafer 300 preferably, can ensure the fail safe of wafer 300.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", " counterclockwise ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise at least one this feature.In describing the invention, the implication of " multiple " is at least two, such as two, three etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection or each other can communication; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements, unless otherwise clear and definite restriction.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary indirect contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, to the schematic representation of above-mentioned term not must for be identical embodiment or example.And the specific features of description, structure, material or feature can combine in one or more embodiment in office or example in an appropriate manner.In addition, when not conflicting, the feature of the different embodiment described in this specification or example and different embodiment or example can carry out combining and combining by those skilled in the art.
Although illustrate and describe embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, and those of ordinary skill in the art can change above-described embodiment within the scope of the invention, revises, replace and modification.
Claims (13)
1. wafer accommodates a mechanism, it is characterized in that, comprising:
Rotating disk;
Multiple claw, described multiple claw comprises at least one movable jaw, and described movable jaw is arranged on described rotating disk actively, and described claw is for being held in described rotating disk by described wafer clamp;
Resilient clamping force assembly, described resilient clamping force assembly is arranged for and is supplied to the resilient clamping force that described movable jaw clamps described wafer.
2. wafer according to claim 1 accommodates mechanism, and it is characterized in that, described rotating disk is provided with pivotal axis, described movable jaw can around described pivot axis, and described resilient clamping force assembly is arranged on the side away from described wafer of described pivotal axis.
3. wafer according to claim 2 accommodates mechanism, and it is characterized in that, described resilient clamping force assembly comprises: stage clip, and the two ends of described stage clip are connected on described movable jaw and described rotating disk.
4. wafer according to claim 3 accommodates mechanism, it is characterized in that, described rotating disk comprises: body and the supporting seat being arranged on described body side, described body is provided with the escape groove for installing described movable jaw, described supporting seat is provided with mating groove
Wherein, be provided with supporting pin in described mating groove or described escape groove, described supporting pin forms described pivotal axis.
5. wafer according to claim 4 accommodates mechanism, it is characterized in that, described supporting seat is provided with the end plate of relative with described movable jaw and contiguous described center of turntable, described stage clip is connected between the side of described end plate and described movable jaw.
6. the wafer according to any one of claim 2-5 accommodates mechanism, it is characterized in that, described supporting seat is provided with the end plate of relative with described movable jaw and contiguous described center of turntable, described resilient clamping force assembly comprises: extension spring and drive rod, described extension spring is connected between the side away from described movable jaw of described end plate and described drive rod, and one end of described drive rod is only against on described movable jaw.
7. wafer according to claim 6 accommodates mechanism, it is characterized in that, described end plate is provided with the through hole passed for described drive rod.
8. wafer according to claim 7 accommodates mechanism, it is characterized in that, described drive rod is configured to L shape structure, and the manomelia of described drive rod is connected with described extension spring, and the long limb of described drive rod is located on described through hole and one end and is only against on described movable jaw.
9. wafer according to claim 2 accommodates mechanism, it is characterized in that, one end of the described wafer of vicinity of described movable jaw is less than the moment of inertia of the other end to described pivotal axis to the moment of inertia of described pivotal axis.
10. wafer according to claim 1 accommodates mechanism, it is characterized in that, also comprises: push rod, and described push rod is suitable for driving the clamping of described movable jaw releasing to described wafer.
11. wafers according to claim 1 accommodate mechanism, and it is characterized in that, described multiple claw also comprises: at least one stationary jaw, and at least one stationary jaw described is fixed on described rotating disk.
12. wafers according to claim 12 accommodate mechanism, and it is characterized in that, the quantity of described stationary jaw is a, and the quantity of described movable jaw is b, a+b >=3.
13. wafers according to claim 1 accommodate mechanisms, it is characterized in that, two adjacent central angles corresponding to described claw are less than 180 °.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610010994.4A CN105470192A (en) | 2016-01-05 | 2016-01-05 | Wafer clamping mechanism |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610010994.4A CN105470192A (en) | 2016-01-05 | 2016-01-05 | Wafer clamping mechanism |
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| CN105470192A true CN105470192A (en) | 2016-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610010994.4A Pending CN105470192A (en) | 2016-01-05 | 2016-01-05 | Wafer clamping mechanism |
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| CN106449511A (en) * | 2016-09-30 | 2017-02-22 | 无锡宏纳科技有限公司 | Wafer clamping device with multiple detent devices |
| CN109244181A (en) * | 2018-08-28 | 2019-01-18 | 湖州景盛新能源有限公司 | A kind of solar battery sheet placement clip |
| CN109686696A (en) * | 2018-12-27 | 2019-04-26 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | A kind of chuck assembly |
| CN111081583A (en) * | 2019-12-12 | 2020-04-28 | 淮安芯测半导体有限公司 | A test fixture for image sensor wafer detects |
| CN113097114A (en) * | 2021-03-02 | 2021-07-09 | 长江存储科技有限责任公司 | Wafer conveying device and method |
| CN113334320A (en) * | 2021-06-10 | 2021-09-03 | 蔡丽芳 | Motor draws copper machine |
| WO2022007204A1 (en) * | 2020-07-07 | 2022-01-13 | 北京京仪自动化装备技术有限公司 | Material positioning and gripping device, and turning manipulator |
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Application publication date: 20160406 |