CN105811916B - Antivibration quartz oscillator and its processing method - Google Patents
Antivibration quartz oscillator and its processing method Download PDFInfo
- Publication number
- CN105811916B CN105811916B CN201610295042.1A CN201610295042A CN105811916B CN 105811916 B CN105811916 B CN 105811916B CN 201610295042 A CN201610295042 A CN 201610295042A CN 105811916 B CN105811916 B CN 105811916B
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- China
- Prior art keywords
- substrate
- small pieces
- point
- antivibration
- primer
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- 239000010453 quartz Substances 0.000 title claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 238000003672 processing method Methods 0.000 title claims abstract description 7
- 239000000758 substrate Substances 0.000 claims abstract description 128
- 239000003292 glue Substances 0.000 claims abstract description 51
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 33
- 238000009434 installation Methods 0.000 claims abstract description 9
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 230000000703 anti-shock Effects 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 239000013078 crystal Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention discloses a kind of antivibration quartz oscillator and its processing method, substrate base is equipped in the pedestal of antivibration quartz oscillator, substrate base is fixed on pedestal by the installation of substrate primer point；Substrate base edge part is equipped with substrate top glue point；Middle part, the edge part that antivibration small region is installed on substrate base are equipped with small pieces primer point, and small pieces primer point is connected and fixed with substrate base；Antivibration die edge portion is equipped with small pieces top glue point.Its procedure of processing includes: integrated circuit and pedestal Bonding；Substrate base assembling；The assembling of antivibration small pieces.Substrate base of the invention is not involved in vibration；By setting substrate base and antivibration small pieces, reduces the size of antivibration small pieces and increase relative thickness, deformation quantity when reducing its vibration, greatly improve the ability of its anti shock and vibration, to reduce the damage of chip in the course of work, the chip service life is improved, reduces maintenance and repair cost.
Description
Technical field
The present invention relates to antivibration quartz oscillator, specifically a kind of antivibration quartz oscillator and its processing side
Method.
Background technique
Existing Voltage Controlled Crystal Oscillator, use is all fundamental crystal oscillation mode.Common AT cuts fundamental crystal,
Frequency is high, then chip is than relatively thin, and wafer size is larger, thus decline the ability of crystal anti shock and vibration sharply, serious shadow
Ring reliability when using；Since the product use is on high-end communication equipment, once being damaged, maintenance and repair cost is very
It is high.
Summary of the invention
The technical problem to be solved by the present invention is to, a kind of antivibration quartz oscillator and its processing method are provided, it can
The ability of oscillator anti shock and vibration is greatly increased, to reduce the damage of chip in the course of work, is improved the chip service life, drop
Low-maintenance maintenance cost.
In order to solve the above technical problems, the present invention adopts the following technical scheme:
A kind of antivibration quartz oscillator is connect including pedestal, with the integrated circuit of pedestal Bonding, with pedestal
Antivibration small pieces, the pedestal is interior to be equipped with substrate base, and substrate base is fixed on pedestal by the installation of substrate primer point；Substrate
Substrate edge portion is equipped with substrate top glue point；Middle part, the edge part that antivibration small region is installed on substrate base are equipped with small pieces bottom
Glue point, small pieces primer point are connected and fixed with substrate base；Antivibration die edge portion is equipped with small pieces top glue point.
A kind of processing method of antivibration quartz oscillator, comprising the following steps:
(1) integrated circuit and pedestal Bonding: integrated circuit is fixed in pedestal, is then set with Wire Bonding
It is standby by integrated circuit together with pedestal Bonding；
(2) substrate base assembles: the region point substrate primer point of substrate base is installed in assembled pedestal, by substrate
Substrate is fixed on pedestal by the installation of substrate primer point；Again substrate base edge part order substrate top glue point to substrate base into
Row is further fixed；
(3) antivibration small pieces assemble: the middle part point small pieces primer point of antivibration small region is installed on substrate base；To substrate
Substrate top glue point and the solidification of small pieces primer point；The edge part point small pieces primer of antivibration small region is installed on substrate base again
Point；Then the installation of antivibration small pieces is fixed on substrate base；On antivibration die edge portion point small pieces top, glue point is small to antivibration again
Piece is further fixed.
The present invention by adopting the above technical scheme, compared with prior art, the beneficial effect is that:
In the case where not changing the main materials such as existing pedestal, according to the crystalline substance of the size design minimum dimension of pedestal dispensing PAD
Piece, that is, antivibration small pieces, then consolidate antivibration small pieces on wafer substrates substrate；Substrate base conducting resinl and pedestal connect
It connects, substrate base is not involved in vibration；Wafer size is smaller, and deformation quantity is smaller when vibrating；Substrate base is increased, increasing is equivalent to
The relative thickness of antivibration chip is added, deformation quantity is with regard to smaller, that is to say, that the technical program is by setting substrate base and resists
Shake small pieces, and by reducing the size of antivibration small pieces and increasing relative thickness, deformation quantity when reducing its vibration is greatly improved
The ability of its anti shock and vibration improves the chip service life to reduce the damage of chip in the course of work, reduce maintenance and repair at
This.
Preferably, the further technical solution of the present invention is:
The substrate primer select in some substrate primer select and be correspondingly arranged with substrate top glue point, the base being correspondingly arranged
Piece primer, which is selected, grips substrate base with substrate top glue point.By be correspondingly arranged substrate primer select with substrate top glue point, can be with
Substrate base is preferably fixed.
The substrate base is selected by four substrate primers and is connected and fixed with two substrate top glue points with pedestal；Four bases
Piece primer point in isosceles trapezoid be arranged, four substrate primers select in there are two substrate primer select respectively with two substrate top glue points pair
It should be arranged.Four substrate primer points are arranged in isosceles trapezoid, and every two substrate primer is selected and any one other substrate primer
Point forms triangle, and stability is higher.
Some small pieces primer point is correspondingly arranged with small pieces top glue point in the small pieces primer point, and what is be correspondingly arranged is small
Piece primer point and small pieces top glue point grip antivibration small pieces.It, can be with by being correspondingly arranged small pieces primer point and small pieces top glue point
Antivibration small pieces are preferably connected and fixed.
The antivibration small pieces are connected and fixed with two small pieces top glue points with substrate base by three small pieces primer points, and three
The setting triangular in shape of a small pieces primer point, three small pieces primer points there are two small pieces primer point respectively with two small pieces top glue points pair
It should be arranged.Since antivibration chip size is smaller, design less glue point be fixed it is more convenient；Three small pieces primer points are in
Triangle setting can provide the stability of higher connection.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the embodiment of the present invention；
Fig. 2 is the left view of Fig. 1；
Fig. 3 is the top view of Fig. 2；
Description of symbols: 1- pedestal；2- integrated circuit；3- substrate base；4- antivibration small pieces；5- substrate top glue
Point；6- small pieces top glue point；7- small pieces primer point；8- substrate primer point.
Specific embodiment
Below with reference to embodiment, the present invention is further illustrated.
Referring to Fig. 1, Fig. 2, Fig. 3, a kind of antivibration quartz oscillator, by the integrated electricity of pedestal 1 and pedestal 1Bonding
The antivibration small pieces 4 that road 2, pedestal 1 connect form, and substrate base 3 is equipped in pedestal 1, and substrate base 3 is pacified by substrate primer point 8
Dress is fixed on pedestal 1；3 edge part of substrate base is equipped with substrate top glue point 5；4 region of antivibration small pieces is installed on substrate base 3
Middle part, edge part are equipped with small pieces primer point 7；The small pieces primer point 7 of antivibration small pieces 4 is connected and fixed with substrate base 3；Antivibration is small
4 edge part of piece is equipped with small pieces top glue point 6.
Substrate primer is selected some in 8 and is correspondingly arranged with substrate top glue point 5, the substrate primer point 8 and base being correspondingly arranged
Piece top glue point 5 grips substrate base 3.
Substrate base 3 is selected 8 by four substrate primers and is connected and fixed with two substrate top glue points 5 with pedestal 1；Four substrates
Primer point 8 is arranged in isosceles trapezoid, and four substrate primers are selected in 8 there are two being correspondingly arranged respectively with two substrate top glue points 5.
Some in small pieces primer point 7 is correspondingly arranged with small pieces top glue point 6, the small pieces primer point 7 being correspondingly arranged with it is small
Piece top glue point 6 grips antivibration small pieces 4.
Antivibration small pieces 4 are connected and fixed with two small pieces top glue points 6 with substrate base 3 by three small pieces primer points 7, and three
The setting triangular in shape of small pieces primer point 7, there are two be correspondingly arranged with two small pieces top glue points 6 three small pieces primer points 7 respectively.
Substrate base 3 in the present embodiment is with a thickness of 24MHZ；Glue point needs to select conducting resinl according to electrical connection.
The processing method of above-mentioned antivibration quartz oscillator, comprising the following steps:
(1) integrated circuit 2 and pedestal 1Bonding: integrated circuit 2 is fixed in pedestal 1, Wire is then used
Bonding equipment is by integrated circuit 2 together with pedestal 1Bonding；
(2) substrate base 3 assembles: the region point substrate primer point 8 of substrate base 3 is installed in assembled pedestal 1, it will
Substrate base 3 is fixed on pedestal 1 by the installation of substrate primer point 8；It is right that substrate top glue point 5 is ordered in 3 edge part of substrate base again
Substrate base 3 is further fixed；
(3) antivibration small pieces 4 assemble: the middle part point small pieces primer point 7 in 4 region of antivibration small pieces is installed on substrate base 3；To
Substrate top glue point 5 and small pieces primer point 7 solidify；The edge part point small pieces bottom in 4 region of antivibration small pieces is installed on substrate base 3 again
Glue point 7；Then the installation of antivibration small pieces 4 is fixed on substrate base 3；It is right in 4 edge part point small pieces top glue point 6 of antivibration small pieces again
Antivibration small pieces 4 are further fixed.
Antivibration quartz oscillator and conventionally produced quartz-crystal using detection device, to the present embodiment production
Oscillation body device does comparative experiments, it can be deduced that: the ability integration judgement of product of the present invention anti shock and vibration is substantially better than conventional set
Meter.
The foregoing is merely a specific embodiment of the invention, but protection of the invention is without being limited thereto, any this technology neck
The technical staff in domain the thinkable variation or substitution being equal with the technical program technical characteristic, all cover in guarantor of the invention
Within the scope of shield.
Claims (6)
1. a kind of antivibration quartz oscillator, what is connect including pedestal, with the integrated circuit of pedestal Bonding, with pedestal is anti-
Shake small pieces, it is characterised in that:
Substrate base is equipped in the pedestal, substrate base is fixed on pedestal by the installation of substrate primer point；Substrate base
It is selected by four substrate primers and is connected and fixed with two substrate top glue points with pedestal；Four substrate primer points are distributed in substrate base
Four corner areas, substrate base edge part be equipped with substrate top glue point；
Middle part, the edge part that antivibration small region is installed on substrate base are equipped with small pieces primer point, small pieces primer point and substrate
Substrate is connected and fixed；Antivibration die edge portion is equipped with small pieces top glue point, and small pieces primer point and small pieces top glue point grip antivibration
Small pieces.
2. antivibration quartz oscillator according to claim 1, it is characterised in that: have one in the substrate primer point
Partial substrate primer is selected to be correspondingly arranged with substrate top glue point, and the substrate primer being correspondingly arranged, which is selected, grips lining with substrate top glue point
Bottom substrate.
3. antivibration quartz oscillator according to claim 2, it is characterised in that: the substrate base passes through four
Substrate primer, which is selected, to be connected and fixed with two substrate top glue points with pedestal；Four substrate primer points are arranged in isosceles trapezoid, four bases
Piece primer is selected and is correspondingly arranged respectively with two substrate top glue points there are two substrate primer in selecting.
4. antivibration quartz oscillator according to claim 1, it is characterised in that: have one in the small pieces primer point
Part small pieces primer point is correspondingly arranged with small pieces top glue point, and the small pieces primer point being correspondingly arranged grips anti-with small pieces top glue point
Shake small pieces.
5. antivibration quartz oscillator according to claim 4, it is characterised in that: the antivibration small pieces pass through three
Small pieces primer point is connected and fixed with two small pieces top glue points with substrate base, three small pieces primer point settings triangular in shape, and three
Small pieces primer point is correspondingly arranged with two small pieces top glue points respectively there are two small pieces primer point.
6. a kind of processing method of antivibration quartz oscillator as described in claim 1, which is characterized in that including following step
It is rapid:
(1) integrated circuit and pedestal Bonding: integrated circuit is fixed in pedestal, then will with Wire Bonding equipment
Integrated circuit is together with pedestal Bonding；
(2) substrate base assembles: the region point substrate primer point of substrate base is installed in assembled pedestal, by substrate base
It is fixed on pedestal by the installation of substrate primer point；Again substrate base edge part order substrate top glue point to substrate base carry out into
The fixation of one step；
(3) antivibration small pieces assemble: the middle part point small pieces primer point of antivibration small region is installed on substrate base；To substrate base
Push up glue point and the solidification of small pieces primer point；The edge part point small pieces primer point of antivibration small region is installed on substrate base again；So
The installation of antivibration small pieces is fixed on substrate base afterwards；Antivibration small pieces are carried out in antivibration die edge portion point small pieces top glue point again
It further fixes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610295042.1A CN105811916B (en) | 2016-05-06 | 2016-05-06 | Antivibration quartz oscillator and its processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610295042.1A CN105811916B (en) | 2016-05-06 | 2016-05-06 | Antivibration quartz oscillator and its processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105811916A CN105811916A (en) | 2016-07-27 |
| CN105811916B true CN105811916B (en) | 2018-12-21 |
Family
ID=56455308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610295042.1A Active CN105811916B (en) | 2016-05-06 | 2016-05-06 | Antivibration quartz oscillator and its processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105811916B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000278079A (en) * | 1999-03-24 | 2000-10-06 | Toyo Commun Equip Co Ltd | Piezoelectric device |
| CN101331681A (en) * | 2005-12-21 | 2008-12-24 | 株式会社大真空 | Piezoelectric vibration piece and piezoelectric vibration device |
| CN101895269A (en) * | 2010-07-30 | 2010-11-24 | 中国科学院声学研究所 | Method for preparing piezoelectric film bulk acoustic wave resonator |
| CN102082557A (en) * | 2010-11-29 | 2011-06-01 | 南京中电熊猫晶体科技有限公司 | Design method for performing multi-point adhesive dispensing on surface mount type quartz crystal resonator |
| CN203788251U (en) * | 2014-03-21 | 2014-08-20 | 浙江东晶电子股份有限公司 | Small-size quartz crystal resonator |
| CN204465477U (en) * | 2015-03-17 | 2015-07-08 | 浙江东晶电子股份有限公司 | A kind of low-frequency small-sized crystal resonator |
| CN205566243U (en) * | 2016-05-06 | 2016-09-07 | 唐山国芯晶源电子有限公司 | Anti vibration crystal oscillator |
-
2016
- 2016-05-06 CN CN201610295042.1A patent/CN105811916B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000278079A (en) * | 1999-03-24 | 2000-10-06 | Toyo Commun Equip Co Ltd | Piezoelectric device |
| CN101331681A (en) * | 2005-12-21 | 2008-12-24 | 株式会社大真空 | Piezoelectric vibration piece and piezoelectric vibration device |
| CN101895269A (en) * | 2010-07-30 | 2010-11-24 | 中国科学院声学研究所 | Method for preparing piezoelectric film bulk acoustic wave resonator |
| CN102082557A (en) * | 2010-11-29 | 2011-06-01 | 南京中电熊猫晶体科技有限公司 | Design method for performing multi-point adhesive dispensing on surface mount type quartz crystal resonator |
| CN203788251U (en) * | 2014-03-21 | 2014-08-20 | 浙江东晶电子股份有限公司 | Small-size quartz crystal resonator |
| CN204465477U (en) * | 2015-03-17 | 2015-07-08 | 浙江东晶电子股份有限公司 | A kind of low-frequency small-sized crystal resonator |
| CN205566243U (en) * | 2016-05-06 | 2016-09-07 | 唐山国芯晶源电子有限公司 | Anti vibration crystal oscillator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105811916A (en) | 2016-07-27 |
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