CN105805576B - Intelligence LED panel light lighting device - Google Patents
Intelligence LED panel light lighting device Download PDFInfo
- Publication number
- CN105805576B CN105805576B CN201610299167.1A CN201610299167A CN105805576B CN 105805576 B CN105805576 B CN 105805576B CN 201610299167 A CN201610299167 A CN 201610299167A CN 105805576 B CN105805576 B CN 105805576B
- Authority
- CN
- China
- Prior art keywords
- lighting device
- led panel
- intelligent led
- mounting surface
- splicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
- F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention provides an LED lighting device, which comprises a main board and an LED lamp, wherein the main board is provided with a light source; the mainboard is provided with a mounting surface and a bottom surface, the mounting surface is used for mounting components, the bottom surface is provided with a bonding pad, and a power supply layer and a grounding layer which are insulated from each other are arranged between the mounting surface and the bottom surface; the LED lamp is arranged on the mounting surface and connected to at least one bonding pad; and an extension body is further arranged and is connected with the grounding layer and extends to one side of the bottom surface, which is far away from the mounting surface. By adopting the scheme, the extension body connected with the conductive layer is designed, so that the heat of the conductive layer can be dissipated through the extension body, a better heat dissipation effect is achieved, and the circuit board can bear more components with higher density.
Description
Technical Field
The invention relates to the field of LEDs, in particular to an intelligent LED panel lamp lighting device.
Background
A PCB (Printed Circuit Board) is an important electronic component, is a support for an electronic component, and is a carrier for electrical connection of the electronic component. It is called a circuit "printed" board or a circuit "printed" board because it is made using electronic printing. After the electronic equipment adopts the printed board, because of the consistency of the printed boards of the same type, the error of manual wiring is avoided, the automatic insertion or mounting, the automatic tin soldering and the automatic detection of electronic components can be realized, the quality of the electronic equipment is ensured, the labor productivity is improved, the cost is reduced, and the maintenance is convenient.
However, as the number of LEDs mounted on a PCB increases, the amount of heat generated increases, and how to further propose innovative designs for the PCB and the LEDs mounted thereon is still a technical problem to be solved.
Disclosure of Invention
The invention aims to solve the technical problem of providing a novel intelligent LED panel lamp lighting device.
The technical scheme of the invention is as follows: an LED lighting device comprises a main board and an LED lamp; the mainboard is provided with a mounting surface and a bottom surface, the mounting surface is used for mounting components, the bottom surface is provided with a bonding pad, and a power supply layer and a grounding layer which are insulated from each other are arranged between the mounting surface and the bottom surface; the LED lamp is arranged on the mounting surface and connected to at least one bonding pad; and an extension body is further arranged and is connected with the grounding layer and extends to one side of the bottom surface, which is far away from the mounting surface.
Preferably, a plurality of the LED lamps are provided.
Preferably, a plurality of the LED lamps are arranged row by row.
Preferably, the plurality of LED lamps are arranged in two rows.
Preferably, the plurality of LED lamps are arranged in three rows.
Preferably, the LED lamp is a high-power LED lamp.
Preferably, the light emitting surface of the high-power LED lamp is provided with a scattering structure, and the scattering structure is fixed on the mounting surface.
Preferably, the scattering structure is in the shape of a flat plate.
Preferably, the scattering structure is part spherical in shape.
Preferably, the scattering structure is provided with a plurality of wavy through grooves, and the wavy through grooves are arranged asymmetrically and non-communicated.
By adopting the scheme, the extension body connected with the conductive layer is designed, so that the heat of the conductive layer can be dissipated through the extension body, a better heat dissipation effect is achieved, and the circuit board of the intelligent LED panel lamp lighting device can bear more components with higher density.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the present invention.
Detailed Description
The present invention will now be described in detail with reference to the drawings and specific embodiments thereof, which are combined and can be embodied in various forms without limitation to the specific embodiments described herein, which are provided for the purpose of providing a more thorough understanding of the present disclosure. It is further noted that when a structure is secured to another structure, it includes securing the structure directly or indirectly to the other structure, or securing the structure to the other structure through one or more other intermediate structures. When a structure is connected to another structure, it includes connecting the structure directly or indirectly to the other structure or connecting the structure to the other structure through one or more other intermediate structures. Also, the term "and/or" includes "and" or "two possible embodiments.
An example of the present invention is an LED lighting device, as shown in fig. 1, which includes a main board and an LED lamp 120; the mainboard is provided with a mounting surface 100 and a bottom surface 200, the mounting surface is used for mounting components, the bottom surface is provided with a bonding pad 110, and a power supply layer 300 and a grounding layer 500 which are insulated from each other are arranged between the mounting surface and the bottom surface; the LED lamp 120 is disposed on the mounting surface and connected to at least one of the pads 110; an extension body 600 is further provided, and is connected with the grounding layer and extends to one side of the bottom surface far away from the mounting surface. An insulating layer 400 is disposed between the power plane and the ground plane.
For example, an intelligent LED panel lamp lighting device includes a circuit board and an LED lamp; the circuit board comprises a main board; the main board is provided with a mounting surface and a bottom surface, for example, the main board is a single-layer board, one surface of the main board is a mounting surface which is externally displayed or mounted above a mounting position, and the other surface of the main board is a bottom surface which is not externally displayed or faces the mounting position; the mounting surface is used for mounting components, the bottom surface is provided with a bonding pad, and a power supply layer and a grounding layer which are insulated from each other are arranged between the mounting surface and the bottom surface. The bonding pads are metal holes for welding pins of the component. For another example, the mounting surface and the bottom surface are both provided with bonding pads. The bonding pads are connected to the power layer or the ground layer, for example, at least one of the bonding pads is connected to the power layer, and at least one of the bonding pads is connected to the ground layer.
For another example, the main board is a double-layer board or a multilayer board, one side of the main board is displayed or displayed outwards or is installed above the installation position and is the installation surface, and the other side of the main board is a bottom surface which is not displayed outwards or faces the installation position; at least one conductive layer is arranged between the mounting surface and the bottom surface; the conductive layer includes a power layer and a ground layer. A space is arranged between every two conducting layers, such as a spacer; for example, the conductive layers are arranged in an insulating manner by the gap. For another example, at least one power layer and at least one ground layer are disposed between the mounting surface and the bottom surface, the power layers are electrically connected to each other, the ground layers are electrically connected to each other, any power layer is disposed in an insulated manner with each ground layer, and any ground layer is disposed in an insulated manner with each power layer.
For example, the intelligent LED panel light illumination device includes a main board; the mainboard is provided with installation face and bottom surface. For example, the intelligent LED panel lamp lighting device is further provided with an extension body, and the extension body is connected with the grounding layer and extends to one side, away from the mounting surface, of the bottom surface. Like this, through the extension body of design and ground plane connection for the heat of ground plane can be through the extension body giving off, thereby has reached better radiating effect, makes the circuit board can bear the weight of the bigger a large number of components and parts of density. For example, the ground layer is integrally provided with each of the extending bodies, that is, the ground layer extends and provides each of the extending bodies to a side of the bottom surface away from the mounting surface; for another example, the antenna has multiple grounding layers, in each of the extending bodies, a plurality of the extending bodies are integrally disposed with one grounding layer, a plurality of the extending bodies are integrally disposed with another grounding layer, and so on. For another example, there are three ground planes, in each of the extending bodies, a plurality of the extending bodies are integrally disposed with the first ground plane, a plurality of the extending bodies are integrally disposed with the second ground plane, and the remaining extending bodies are integrally disposed with the third ground plane.
In order to better achieve the heat transfer effect, it is preferable that the bottom surface is provided with a plurality of the pads, and the extension is electrically connected to at least one of the pads of the bottom surface. And/or the extension body is connected with the ground wire of the main board. For example, each of the extending bodies is connected to one of the pads on the bottom surface, and for another example, each of the pads on the bottom surface is connected to one of the extending bodies. For example, in each of the extending bodies, each of the extending bodies is connected to at least one of the pads on the bottom surface, and each of the pads on the bottom surface is connected to one of the extending bodies. The connections, including contacts, or wire connections, allow heat from the pads to be dissipated through the extensions. Preferably, a plurality of the pads are arranged on the bottom surface, wherein a plurality of the pads are grounding pads for grounding, namely the pads are connected with a ground wire; the extension body is connected with at least one grounding pad on the bottom surface. For example, in each of the extending bodies, each of the extending bodies is connected to at least one of the ground pads of the bottom surface, and each of the ground pads of the bottom surface is connected to one of the extending bodies. For another example, the extension body is connected to the grounding layer and extends to a side of the bottom surface away from the mounting surface. As another example, the ground pad is coupled to the ground plane.
In order to avoid electric conduction or accidents, the intelligent LED panel lamp lighting device is preferably further provided with a first insulating net covering the extension body for isolating the extension body. Preferably, the mesh area of the insulating mesh is less than 0.5 square millimeter. In order to better achieve the heat transfer effect, it is preferable that the intelligent LED panel lamp lighting device is provided with a plurality of the extensions. Preferably, the lighting device of the intelligent LED panel lamp is further provided with a second insulating net covering all the extending bodies, and the second insulating net is used for isolating all the extending bodies. As another example, the lighting device of the intelligent LED panel light further includes a second insulating net for isolating all the extending bodies, and each extending body passes through one grid of the second insulating net. For example, a plurality of the extension bodies are arranged in an array, and all the extension bodies are isolated by the second insulating net. For example, the second insulating net has a grid shaped like a Chinese character 'jing', the extending bodies are quadrangular prisms, and the cross sections of the extending bodies are slightly smaller than the grid of the second insulating net, so that each extending body respectively penetrates through one grid of the second insulating net.
In order to better achieve the heat transfer effect, it is preferable that the extension is a cylinder, a prism, or a pyramid. And/or the height of the extension is less than 1 centimeter. Alternatively, the extensions are in the form of flakes having a thickness of less than 100 microns. For example, a plurality of sheet-like extensions are provided, and the sheet-like extensions are provided at intervals. As another example, a plurality of extensions having a height of 0.5 to 0.8 centimeters are provided. For example, a plurality of the extensions are arranged in an array.
In order to obtain a better heat dissipation effect, for example, a fan is further provided for accelerating convection heat dissipation. Preferably, the air guide groove is connected with the air outlet of the fan and used for controlling the air outlet direction of the fan, so that the convection heat dissipation effect is stronger. For example, the outlet slot of the air guide slot has a rectangular shape or an annular shape, for example, a shape like a Chinese character 'hui', and preferably, the outlet slot of the air guide slot is disposed at or near an edge of the main board. For example, the air outlet slot opening of the air guide slot is arranged at the edge position of the bottom surface of the main board or close to the edge position of the bottom surface of the main board.
In order to realize the three-dimensional design and to set up more components and parts in order to form the three-dimensional circuit structure, for example, intelligence LED panel light lighting device still sets up the structure of buckling, the structure of buckling includes curb plate and kink, the curb plate passes through the kink is fixed in the mainboard. Like this, be fixed in the structure of buckling of mainboard through the design, formed the intelligent LED panel light lighting device who easily realizes three-dimensional light-emitting to can set up various components and parts on mainboard and curb plate, be favorable to realizing further innovative design on this basis.
For example, the bent portion is a flexible member, for example, the bent portion is a rubber piece; for another example, a portion of the bent portion is a flexible member, for example, a portion of the bent portion is a rubber piece; for example, the bending portion includes a middle structure and two end structures, and the end structures are flexible components, such as rubber. And/or the bent structure further comprises an extension part for heat dissipation. For example, the circuit board of the lighting device of the intelligent LED panel lamp is a metal core board, the metal core board is bent, a part of the metal core board is the main board, a part of the metal core board is the side board, and a part of the metal core board is the bent part. For example, the circuit board is an aluminum core board or a copper core board. For another example, the metal core of the metal core plate is extended and exposed to form the extension portion. For another example, the metal core of the metal core plate is extended and exposed and has a plurality of notches to form a plurality of the extending portions, and each of the extending portions is discontinuously arranged.
In order to avoid mutual interference or contact between the board-mounted components, for example, the side plates and the main board form an angle of 80-120 degrees. Preferably, the side plate and the main plate form an angle of 90-100 degrees. For example, the side panels form a 90 degree angle with the main panel.
For convenience of production and manufacture, the bending structure is preferably integrally formed with the main plate. For example, the plate body is designed to be bent, a part of the plate body is the main plate, a part of the plate body is the side plate, and the part between the main plate and the side plate is the bent part. In order to avoid mutual interference or contact between the board-mounted components, the bent part is preferably arc-shaped or L-shaped. For example, the bent portion is arc-shaped and the radian thereof is 1 to 1.35. In order to adapt to innovation and manufacture of various industrial products, two groups of bending structures are preferably arranged. As another example, only one set of the bending structures is provided. In another example, four sets of the bending structures are provided.
For convenience of manufacturing, the main plate is preferably rectangular. Preferably, the two groups of bending structures are respectively arranged on two adjacent sides of the main board. Or the two groups of bending structures are respectively arranged on two opposite sides of the main board. Preferably, the two groups of bending structures are symmetrically arranged.
In order to facilitate innovative design and facilitate production and manufacture, for example, the circuit board is further provided with a splicing plate, the main board is provided with a splicing position, the splicing plate is provided with a splicing part, and the splicing plate is fixed on the splicing position of the main board through the splicing part. Therefore, by designing the splice plates fixed on the main board, the expansibility of the circuit board is improved, and the main board can be spliced and expanded in a plane space or a three-dimensional space, so that various components can be arranged on the main board and the splice plates, and the further innovative design is favorably realized on the basis of expanding the circuit board.
In order to realize various splicing designs, preferably, the splicing plates and the main plate are located on the same plane. Or the splicing plates and the main board form an angle of 60-150 degrees. For example, the splice plate and the main plate form an angle of 80-100 degrees. For example, the splice plate forms a 90 degree angle with the main plate. In order to realize quick and effective splicing, preferably, the splicing part is screwed or fastened and fixed on the splicing position. Or the splicing parts are fixed on the splicing positions in an interference fit mode.
In order to better obtain the convenience of splicing and improve the splicing selectivity, it is preferable that the splicing plate has a plurality of splicing parts, and the main board is provided with a plurality of corresponding splicing positions. Preferably, the circuit board is provided with two splicing plates. Preferably, the two splicing plates are symmetrically arranged relative to the main plate. Preferably, the circuit board is provided with at least three splice plates, and the main board is respectively spliced with a plurality of splice plates.
For illumination, for example, an LED lamp is further provided to form an LED illumination device. For example, the LED lamp is disposed on the mounting surface and connected to at least one of the pads. Preferably, a plurality of the LED lamps are provided.
In order to achieve a good lighting effect, it is preferable that the plurality of LED lamps are arranged row by row. For example, the plurality of LED lamps are arranged in two rows. Or the LED lamps are arranged in three rows.
In order to achieve good illumination brightness, preferably, the LED lamp is a high-power LED lamp. In order to avoid the light from being too concentrated, preferably, the light emitting surface of the high-power LED lamp is provided with a scattering structure, and the scattering structure is fixed on the mounting surface. For example, the scattering structure is in the shape of a flat plate. And/or the scattering structure is part spherical in shape. And/or the scattering structure is provided with a plurality of wavy through grooves, and the wavy through grooves are arranged asymmetrically and non-communicated. For example, a plurality of wave-shaped through grooves are arranged in disorder; for another example, each of the plurality of wave-shaped through grooves is provided with a plurality of partially spherical inner inlays. For another example, each of the wave-shaped through grooves is annular. In another example, each of the wave-shaped through grooves is distributed radially. Thus, a better light scattering effect can be achieved.
In order to avoid direct irradiation of light and improve the scattering effect, preferably, the LED lighting device further includes a lamp cover covering the main board. In order to improve the heat dissipation effect, preferably, the lamp cover is provided with a heat dissipation through hole. For example, the lamp cover is provided with a plurality of heat dissipation through holes. For example, the heat dissipation through-hole is circular or cylindrical. And/or the lampshade is provided with a heat dissipation through groove. Preferably, the lamp shade is provided with a plurality of heat dissipation through grooves. For example, the heat dissipation through groove is in a strip shape or a prism shape.
In order to avoid direct irradiation of light and improve the scattering effect, the lampshade is preferably provided with a scattering layer. Preferably, the scattering layer has a plurality of hollow cavities. For example, the hollow cavity is not vacuum, and has gas inside; as another example, the hollow cavity is formed by injecting a gas. For example, the gas is air or nitrogen. Preferably, the cavity bodies are randomly arranged. Or the hollow cavities are uniformly arranged. Thus, the scattering effect is improved, and the production is convenient.
For convenience of installation, preferably, the LED lighting device is further provided with a bracket, and the main board is fixed to the bracket. Preferably, the support is provided with a mounting groove, and the main board is fixed in the mounting groove in an inserting manner. For example, the bracket is provided with a pair of the mounting grooves in parallel.
In order to fix the splice plates, preferably, the support is further extended to form a support structure, and the end part of the support structure far away from the support is fixedly connected with the splice plates. For example, the splice plate fixedly connects at least two of the support structures. Preferably, the LED lighting device is provided with a plurality of splice plates, the bracket is further extended with a plurality of support structures, and each support structure is fixedly connected with one splice plate. Preferably, the support structure has a hollow interior cavity. Preferably, the end of the support structure far away from the bracket is in threaded connection with the splice plate. Preferably, the end part of the support structure far away from the bracket is spliced with the splice plate.
Further, the embodiment of the invention further comprises an intelligent LED panel lamp lighting device formed by mutually combining the technical features of the above embodiments.
The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An intelligent LED panel lamp lighting device is characterized by comprising a main board and an LED lamp;
the mainboard is provided with a mounting surface and a bottom surface, the mounting surface is used for mounting components, the bottom surface is provided with a plurality of bonding pads, and a power supply layer and a grounding layer which are mutually insulated are arranged between the mounting surface and the bottom surface;
the LED lamp is arranged on the mounting surface and connected to at least one bonding pad;
the intelligent LED panel lamp lighting device is further provided with a plurality of extending bodies, the extending bodies are connected with the grounding layer and extend to one side, away from the mounting surface, of the bottom surface, in each extending body, each extending body is at least connected with one bonding pad of the bottom surface, and each bonding pad of the bottom surface is connected with one extending body;
the intelligent LED panel lamp lighting device is also provided with a first insulating net for coating the extending body and used for isolating the extending body;
the intelligent LED panel lamp lighting device is also provided with a second insulating net which coats all the extending bodies and is used for isolating all the extending bodies, and each extending body respectively penetrates through one grid of the second insulating net;
the intelligent LED panel lamp lighting device is also provided with a fan and an air guide groove connected with an air outlet of the fan; the air outlet groove is used for controlling the air outlet direction of the fan so that the convection heat dissipation effect is stronger, and the air outlet notch of the air guide groove is arranged at the edge position of the bottom surface of the mainboard or close to the edge position of the bottom surface of the mainboard;
the intelligent LED panel lamp lighting device is further provided with a bending structure, the bending structure comprises a side plate and a bending part, and the side plate is fixed on the main plate through the bending part; the bending part comprises a middle structure and two end structures, the end structures are flexible parts, and the bending structure further comprises an extension part for heat dissipation;
the circuit board of the intelligent LED panel lamp lighting device is further provided with a splicing plate, the main board is provided with a splicing position, the splicing plate is provided with a splicing part, and the splicing plate is fixed at the splicing position of the main board through the splicing part;
the LED illuminating device is further provided with a lampshade, the lampshade covers the main board, the lampshade is provided with a plurality of radiating through holes, the lampshade is provided with a scattering layer, the scattering layer is provided with a plurality of cavity bodies, the cavity bodies are formed by injected gas, and the cavity bodies are randomly arranged;
the intelligent LED panel lamp lighting device is characterized in that a support is further arranged, the main board is fixed on the support, a supporting structure is further extended from the support, and the supporting structure is far away from the end portion of the support and is fixedly connected with the splicing plates.
2. The intelligent LED panel light illumination device of claim 1, wherein a plurality of the LED lights are provided.
3. The intelligent LED panel light illumination device of claim 2, wherein a plurality of the LED lights are arranged row by row.
4. The intelligent LED panel light illumination device of claim 3, wherein the plurality of LED lights are arranged in two rows.
5. The intelligent LED panel light illumination device of claim 3, wherein the plurality of LED lights are arranged in three rows.
6. The lighting device of claim 1, wherein the LED lamp is a high power LED lamp.
7. The lighting device of claim 6, wherein the light emitting surface of the high power LED lamp is provided with a scattering structure, and the scattering structure is fixed on the mounting surface.
8. The intelligent LED panel light illumination device of claim 7, wherein the scattering structure is in the shape of a flat plate.
9. The intelligent LED panel light illumination device of claim 7, wherein the scattering structure is partially spherical in shape.
10. The lighting device of claim 7, wherein the scattering structure is provided with a plurality of wave-shaped through grooves, and the wave-shaped through grooves are arranged asymmetrically and non-communicated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610299167.1A CN105805576B (en) | 2016-05-09 | 2016-05-09 | Intelligence LED panel light lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610299167.1A CN105805576B (en) | 2016-05-09 | 2016-05-09 | Intelligence LED panel light lighting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105805576A CN105805576A (en) | 2016-07-27 |
| CN105805576B true CN105805576B (en) | 2020-10-16 |
Family
ID=56456381
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610299167.1A Active CN105805576B (en) | 2016-05-09 | 2016-05-09 | Intelligence LED panel light lighting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105805576B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210021230A1 (en) * | 2018-03-19 | 2021-01-21 | Terra Firma Innovations Inc. | Photovoltaic microcell array with multi-stage concentrating optics |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201096282Y (en) * | 2007-10-23 | 2008-08-06 | 广州市鸿利光电子有限公司 | Large power LED illumination module group |
| CN101322450A (en) * | 2006-06-16 | 2008-12-10 | 香港应用科技研究院有限公司 | IC packages with internal heat dissipation structures |
| CN204349040U (en) * | 2015-02-07 | 2015-05-20 | 杭州神弓电子实业有限公司 | Binding post |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5937315B2 (en) * | 2011-08-11 | 2016-06-22 | シチズン電子株式会社 | Light emitting diode |
| CN205746068U (en) * | 2016-05-09 | 2016-11-30 | 中国葛洲坝集团房地产开发有限公司 | A kind of intelligent LED panel light illuminator |
-
2016
- 2016-05-09 CN CN201610299167.1A patent/CN105805576B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101322450A (en) * | 2006-06-16 | 2008-12-10 | 香港应用科技研究院有限公司 | IC packages with internal heat dissipation structures |
| CN201096282Y (en) * | 2007-10-23 | 2008-08-06 | 广州市鸿利光电子有限公司 | Large power LED illumination module group |
| CN204349040U (en) * | 2015-02-07 | 2015-05-20 | 杭州神弓电子实业有限公司 | Binding post |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105805576A (en) | 2016-07-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2392851A1 (en) | LED lighting device | |
| JP2012244018A (en) | Light-emitting module and illumination apparatus | |
| JP5503063B1 (en) | LED lighting device | |
| JP2009004129A (en) | Substrate, and illumination device | |
| EP2314913A1 (en) | Light emitting unit carrier and light source comprising such a carrier | |
| US20140286009A1 (en) | Modular solid state electronic display panels with electromagnetic radiation shielding | |
| JP2022019555A (en) | Surface light source type LED device | |
| US9541273B2 (en) | Heat dissipation structure of SMD LED | |
| CN104515046B (en) | A kind of combined lamp | |
| CN105805576B (en) | Intelligence LED panel light lighting device | |
| CN105873365A (en) | Circuit board | |
| CN214338203U (en) | Circuit structure and electric control device | |
| KR101321789B1 (en) | A method for fabricating module with led lamp | |
| JP2020181936A (en) | Light-emitting device and light-emitting module | |
| US10499487B2 (en) | Light-emitting diode (LED) lighting fixture solutions and methods | |
| KR101214982B1 (en) | The illumination angle is different and efficient expansion style one LED illuminating lamps | |
| JP6184559B2 (en) | Lighting lamps and luminaires | |
| CN205657909U (en) | A printed circuit board | |
| CN205755028U (en) | A kind of three-dimensional circuit board | |
| CN205746068U (en) | A kind of intelligent LED panel light illuminator | |
| CN205746444U (en) | A kind of energy-saving LED road lamp | |
| CN205746332U (en) | A kind of LED heat radiation street lamp | |
| KR20230009914A (en) | Lighting device comprising a support structure with improved thermal and optical properties | |
| CN112954887A (en) | Circuit structure and electric control device | |
| CN104322156A (en) | Mounting support for solid-state light radiation sources and light source therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200915 Address after: No.8 Xinhe Road, national entrepreneurship Park, Xinyuan Town, Siyang County, Suqian City, Jiangsu Province Applicant after: Siyang haoxuan Lighting Technology Co., Ltd Address before: 518000 Guangdong city of Shenzhen province Nanshan District Guangdong streets in a high road No. 2 Changyuan new material in Hong Kong 8 Building 5 floor 505 Applicant before: SHENZHEN AIYIRUI TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211015 Address after: 223700 national entrepreneurship Park, Xinyuan Town, Siyang County, Suqian City, Jiangsu Province Patentee after: Siyang Ningyi New Material Co., Ltd Address before: 223700 No. 8, Xinhe Road, national entrepreneurship Park, Xinyuan Town, Siyang County, Suqian City, Jiangsu Province Patentee before: Siyang haoxuan Lighting Technology Co., Ltd |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211203 Address after: 223700 No. 8, Xinhe Road, national entrepreneurship Park, Xinyuan Town, Siyang County, Suqian City, Jiangsu Province Patentee after: Siyang haoxuan Lighting Technology Co., Ltd Address before: 223700 national entrepreneurship Park, Xinyuan Town, Siyang County, Suqian City, Jiangsu Province Patentee before: Siyang Ningyi New Material Co., Ltd |
|
| TR01 | Transfer of patent right |