CN105803247A - Low-expansion high-thermal-conducting copper-stainless invar alloy composite material and preparation method thereof - Google Patents
Low-expansion high-thermal-conducting copper-stainless invar alloy composite material and preparation method thereof Download PDFInfo
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- C22C9/00—Alloys based on copper
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C1/04—Making non-ferrous alloys by powder metallurgy
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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- B22—CASTING; POWDER METALLURGY
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Abstract
The invention relates to a composite material, in particular to a low-expansion high-thermal-conducting copper-stainless invar alloy composite material and a preparation method thereof. The low-expansion high-thermal-conducting copper-stainless invar alloy composite material is composed of, by mass, 20%-75% of Cu, 9%-30% of Fe, 12%-45% of Co, 2%-8% of Cr, and 0-5% of an additive. The preparation method includes the steps that through a phase diagram calculation method, the components of the composite material are designed, and a two-liquid-phase separated zone of a Cu-rich phase and a Fe-Co-Cr-rich phase is made to exist in the components of the composite material; various raw materials are weighed and put into gas-atomization powder making equipment, vacuumizing, induction smelting and gas atomization are carried out, and kernel/casting type self-wrapped composite powder is obtained; the obtained kernel/casting type self-wrapped composite powder is put into a sintering furnace and subjected to hot-pressing sintering under the argon protection, and a copper-stainless invar alloy composite material sintered body is obtained after cooling; and then annealing is carried out, so that the low-expansion high-thermal-conducting copper-stainless invar alloy composite material is obtained.
Description
Technical field
The present invention relates to a kind of composite, especially relate to a kind of low-expansion high heat conductivity copper-stainless invar alloy composite and
Preparation method.
Background technology
From 1958 first block semiconductor integrated circuit (IC) come out since, integrated antenna package technology constantly to Highgrade integration,
Miniaturization and lightweight development, this just performance to electronic package material propose the highest requirement (Zhang Chen, Shen Nengjue,
Electronic package material current situation and development [J], new material industry, 2003,3:5-11).Along with chip integration and arithmetic speed
Improving constantly, heat dissipation problem has become as the major issue that various encapsulating material is badly in need of solving.Especially for high power device, heat
If amount can not be conducted in time and distribute, operating temperature will be caused to raise, once the thermal coefficient of expansion between chip and encapsulating material
Do not mate, thermal stress at adjacent component and solder joint, will be produced, cause solder joint contact the most even come off, make electronic component failure,
Having a strong impact on service life and the reliability of product, therefore, exploitation possesses high heat conduction, low-expansion coefficient, easily processing and low cost
Electronic package material become the task of top priority (yellow strong, Gu Mingyuan, the present Research [J] of electronic package material, material Leader,
2000,14 (9): 28-32).
In conventional encapsulant, Cu and alloy thereof receive much concern because having high thermal conductivity and excellent electric conductivity.But Cu
Thermal coefficient of expansion the highest by (17 × 10-6K-1), with chip semi-conducting material (Si, GaAs) and substrate ceramic material
(Al2O3, BeO) thermal coefficient of expansion (its scope is 4～7 × 10-6K-1) do not match that, it is easily caused chip and encapsulation base
Produce big thermal stress between plate faying face, even crack and reduce electronic device service life (Shen Y L,
Metallurgical and Materials Transactions A, 1994,25 (4): 839-850).
On the other hand, stainless invar alloy (Fe37Co54Cr9) because there is extremely low thermal coefficient of expansion and decay resistance and by extensively
It is applied to Electronic Packaging field.Stainless invar alloy is a kind of special invar alloy, appears below so-called anti-at its Curie temperature
Often thermal expansion phenomenon, makes the change of the size with temperature of material show as almost nil expansion rate (i.e. invarable effect), thus quilt
(Chen Yun, Li Mingguang, invar alloy is sent out to be widely used in the fields such as electronics industry, fine measuring instrument, precision instrument and cryogenic engineering
Represent shape and application prospect [J], mechanical investigations and application, 2009, (4): 9-11).Although stainless invar alloy is attached in room temperature
Within the scope of nearly wider temperature, there is the lowest thermal coefficient of expansion and good welding performance, but owing to its capacity of heat transmission is very poor, only
Can be as the heat radiation of small-power commutator and connecting material.Further, the thermal coefficient of expansion of stainless invar alloy is to chemical composition very
Sensitivity, the deviation of composition will cause the increase of its thermal coefficient of expansion, have a strong impact on serviceability.Such as being both annealed state, cobalt contains
Measure the most identical, simply iron content 37%, containing chromium 9%, another iron content 36.5%, containing chromium 9.5%, the former heat of near room temperature is swollen
Swollen coefficient is-1.2 × 10-6/ DEG C, the latter is 0.05 × 10-6/ DEG C (Shiga M, Invar alloys [J], 1996,1 (3):
340-348)。
All cannot individually meet the requirement of electronic package material due to copper or stainless invar alloy, research and development composite causes
The extensive concern of researcher.
TIX is at tradition invar alloy (Fe64Ni36) the double-deck fine copper that covers is made for Cu/ invar alloy on sheet material
(Fe64Ni36)/Cu laminar composite (charles A, Harper, electronic package material and technique [M], Beijing: chemical industry goes out
Version society, 2006), wherein the thermal coefficient of expansion of composite is 6.5 × 10-6K-1.It should be noted that this composite is flat
The thermal conductivity of line direction (x-y plane) is 164W m-1·K-1But, on z-plane, its thermal conductivity only has 24.8W m-1·K-1,
There is obvious anisotropy in such laminar composite i.e. in terms of thermophysical property, exist between Cu and invar alloy layer simultaneously
Significantly interface resistance so that improving further of thermal conductivity is restricted, and limits its range.
Sunil et al. (Jha S.CUVAR-a new controlled expansion, high conductivity material
for electronic thermal management[C],Proceedings of the 45th Electronic Components
And Technology Conference.Las Vegas, Nevada.1995:542-547.) by pure copper powder and invar alloy
(Fe64Ni36) powder passes through the extruded copper/invar alloy composite that is prepared under room temperature after mixing, and it is swollen to obtain preferably heat
Swollen performance and heat conductivility.But, in order to obtain the composite of high-compactness at normal temperatures, powder is subject to when extruded
Powerful shearing force, thus cause the thermophysical property of material to there is anisotropic shortcoming, the use temperature of this material is wanted simultaneously
Ask less than 400 DEG C, in case because Fe, Ni and Cu at high temperature mutually diffusion couple thermal expansion character and heat conductivility causes unfavorable shadow
Ring.
It addition, Stolk et al. (Stolk J, Manthiram A.Chemical synthesis and properties of
nanocrystalline Cu–Fe–Ni alloys[J].Materials Science and Engineering:B,1999,
60 (2): 112-117) use hydrothermal reduction method to synthesize a certain proportion of Cu, Fe, Ni nanometer powder, then pass through powder metallurgic method
Preparation Cu-invar alloy (Fe64Ni36) nanometer crystal alloy, but powder is after 900 DEG C sinter, mutual because of Fe, Ni and Cu
Diffusion makes Cu-Fe64Ni36Nanoalloy cannot obtain good heat conduction and hot expansibility.
But so far, not yet have copper and the research report of stainless invar alloy composite, this is because Cu atom and Fe,
Co, Cr atom excludes each other, Cu and Fe, Co, Cr solid solubility each other is the lowest, uses traditional alloy melting
Method prepares Cu-Fe-Co-Cr alloy, serious component segregation will occur or be separated, thus cause the inequality of material property
Even, it is impossible to actual application.Therefore, research and development copper-stainless invar alloy effective complex method, preparation have low bulk,
The copper of high thermal conductivity-stainless invar alloy composite will have great theory significance and using value.
Summary of the invention
The present invention is directed to the performance requirements such as the low bulk of current electronic package material urgent need, high-termal conductivity, it is provided that a kind of low bulk is high
Conduction copper-stainless invar alloy composite and preparation method thereof.
Described low-expansion high heat conductivity copper-stainless invar alloy composite consisting of by mass percentage: Cu 20%～75%, Fe
9%～30%, Co 12%～45%, Cr 2%～8%, additive 0～5%, described additive is selected from W, Nb, Ta, Mo, C, B,
At least one in V etc..
The preparation method of described low-expansion high heat conductivity copper-stainless invar alloy composite, comprises the following steps:
(1) by PHASE DIAGRAM CALCULATION method, the composition of design composite so that it is there is rich Cu phase and rich Fe-Co-Cr in composition
The liquid phase two-phase laminated flow district of phase；
(2) weighing various raw material by the result of calculation of step (1), put into gas-atomized powder equipment, evacuation, at argon
The lower induction melting of protection, treats that alloy is completely melt into liquid laggard circulation of qi promoting atomization, obtains core/shell type and certainly wrap up composite granule, make richness
Cu phase is shell, and rich Fe-Co-Cr phase forms stainless invar alloy and becomes the core of composite granule；
(3) core/shell type prepared in step (2) is put in sintering furnace from parcel composite granule, under argon shield, carry out heat
Pressure sintering, obtains copper-stainless invar alloy Composite Sintering body after cooling；
(4) copper obtained in step (3)-stainless invar alloy Composite Sintering body is made annealing treatment, obtain low swollen
Swollen high heat-conducting copper-stainless invar alloy composite.
In step (2), described core/shell type can be 20～320 μm from the particle diameter of parcel composite granule, can be monokaryon, also
Can be multinuclear, and the ratio of two kinds of powder can be by what the technological parameter of modifying ingredients and gas atomization carried out regulating and controlling.?
During sintering, different sintering process can be used, such as isostatic pressed or axially apply pressure；Additionally can be according to actual need
Ask, select the sintering mold of different sizes and shapes, thus prepare the composite of different sizes and shapes.
In step (3), the temperature of described hot pressed sintering can be 600～1000 DEG C, the pressure of hot pressed sintering can be 30MPa with
On.
In step (3), the temperature of described annealing can be 250～500 DEG C, and the time of annealing can be 4～72h.
Low-expansion high heat conductivity copper prepared by the present invention-stainless invar alloy composite can the most directly be applied, it is possible to
To come into operation again after the PROCESS FOR TREATMENT such as rolling again.It addition, the present invention can also be compound from parcel by copper-stainless invar alloy
Powder and pure Cu powder carry out mixed sintering, regulate thermal coefficient of expansion and the thermal conductivity of composite.
It is known that Cu atom and Fe, Co, Cr atom excludes each other, and under cryogenic, Cu is at Fe, Co, Cr
In solid solubility the lowest, and there is the liquid phase two-phase laminated flow district of rich Cu phase and rich Fe-Co-Cr phase under the high temperature conditions, employing
Common composite material and preparation method thereof is susceptible to segregation, it is impossible to by Cu and rich good the combining of Fe-Co-Cr phase.
The present invention exactly utilizes Cu atom and Fe, the mutually exclusive this point of Co, Cr atom, first passes through PHASE DIAGRAM CALCULATION technology,
The composition of design composite so that it is there is the liquid phase two-phase laminated flow district of rich Cu phase and rich Fe-Co-Cr phase in composition, and then adopt
Use gas-atomized powder technology, disposably prepare core/shell type and certainly wrap up composite granule, and make rich Cu phase form shell, rich
Fe-Co-Cr phase forms stainless invar alloy and becomes the core (as shown in Figure 1 and Figure 2) of composite granule, and wherein composite granule is permissible
Be monokaryon can also be multinuclear, the ratio of monokaryon powder body and multinuclear powder body can be carried out by control composition and gas atomization condition
Regulation.And then by hot-pressing sintering technique, by composite granule sinter molding, prepare the sintered material of even compact, finally
Sintered body is made annealing treatment, can be prepared by copper-stainless invar alloy composite.The process chart of the present invention such as Fig. 3 institute
Show.
Technical scheme has the advantage that 1) use gas-atomized powder technology to prepare copper-stainless invar alloy from parcel again
Close powder body, composite can be made simultaneously to have the excellent of Cu lead the most compound to mutually exclusive Cu and stainless invar alloy
The low bulk performance of hot property and stainless invar alloy.2) by composite granule by powder metallurgy process Thermocompressed sintering and forming, permissible
Make the copper-rich phase in composite be uniformly distributed mutually with stainless invar alloy, segregation will not occur, make the even tissue of composite
Stable, isotropism.3) in the sintering stage, the sintering mold of different sizes and shapes can according to actual needs, be selected, this
The composite granule of invention good can must be filled into sintering mold various piece, and then prepared different size, difform compound
Material, is particularly suitable for preparing large scale or the composite products of complicated shape.4) the rich Cu phase of composite granule of the present invention
Shell easily sinters, can sinter molding under cryogenic, and sintered body consistency is high.The reduction of sintering temperature, not only drops
Low production cost, but also be possible to prevent Cu atom and Fe, Co, Cr under hot conditions that counterdiffusion occurs and cause stainless because of
The deviation of watt alloying component, thus affect low bulk performance.5) final structure of composite of the present invention is on rich Cu phase matrix
Being uniform-distribution with the particle of stainless invar alloy phase, rich Cu phase can improve the processing characteristics that composite is overall, has expanded compound
The range of application of material.
Compared with prior art, present invention have the advantage that
1. the composite property of the present invention is excellent.
The present invention, initially with gas-atomized powder technology, prepares copper-stainless invar alloy from wrapping up composite granule, by mutually exclusive
Cu and stainless invar alloy be effectively combined, make composite have the excellent heat conductivity performance of Cu simultaneously and stainless invar close
The low bulk performance of gold and corrosion resistance, meet the requirement that the performance of electronic package material is improved constantly by people.
In order to evaluate the performance of composite of the present invention, the researcher of the present invention is prepared for also by vacuum arc melting method
Cu(Fe64Ni36) alloy, and pure Cu powder is directly sintered with stainless invar alloy powder, and the heat testing each sample is swollen
Swollen coefficient and thermal conductivity, its result is as shown in table 1.It is not difficult to find out from table 1, with Cu-Fe64Ni36Alloy and pure Cu powder/no
The alloy that rust invar alloy powder direct sintering obtains is compared, and the copper of the present invention-stainless invar alloy composite possesses the most comprehensive
Physical property.
2. the composite property of the present invention is stable, the most all has excellent performance, isotropism.
Composite granule by powder metallurgy process Thermocompressed sintering and forming, can be made the copper-rich phase in composite and stainless by the present invention
Invar alloy is uniformly distributed mutually, and segregation will not occur, and the even tissue making composite is stable, the most all has excellent
Good performance, i.e. isotropism.Compared with laminar composite, the present invention has clear superiority.
Product the most of the present invention is not limited by size or shape, can be block, sheet material, lamellar or other complicated shapes.
The present invention, can according to actual needs in the sintering stage, the sintering mold of selection different sizes and shapes, on the other hand,
The composite granule of the present invention good can must be filled into sintering mold various piece, and then prepared different size, difform multiple
Condensation material, is particularly suitable for preparing large scale or the composite products of complicated shape.
Processing method the most of the present invention is simple, it is not necessary to the complicated procedures of forming such as forging, high pressure rolling, product one-shot forming, production cost
Low；Gas-atomized powder and powder metallurgy are to have evolved into ripe industrial technology, can be with large-scale batch production, and production efficiency is high.
5. the present invention can also optionally add the elements such as W, Mo, the performance such as intensity improving composite, special to adapt to
The use demand of occasion.
The excellent heat conductivity performance of copper alloy and the low bulk performance of stainless invar alloy are organically blended by the composite of the present invention
Together, compensate for the defect of homogenous material, and the even tissue of composite is stable, the most all has excellent
Performance, i.e. isotropism.Production cost of the present invention is low, and processing method is simple, it is not necessary to the complicated procedures of forming such as forging, high pressure rolling,
Product one-shot forming, is not limited by size and dimension, can prepare large-size device and complex-shaped device；Aerosol simultaneously
Change powder process and powder metallurgy is to have evolved into ripe industrial technology, can be with large-scale batch production.It addition, what selectivity added
The elements such as W, Mo can improve the performances such as the intensity of composite, to adapt to different serviceability requirements.The present invention's is compound
Material all has broad application prospects in fields such as Electronic Packaging, precision instrumentation, moulds.
Accompanying drawing explanation
Fig. 1 is from coated composite granule interior tissue schematic diagram in the present invention.
Fig. 2 is to scheme from coated composite granule interior tissue SEM in the present invention.Figure (a) is monokaryon；B () is multinuclear.
Fig. 3 is the process chart of the present invention.
Fig. 4 is the organization charts of composite granule sintered body of the present invention.
Detailed description of the invention
Embodiment 1:
With high purity metal Cu, Fe, Co, Cr as raw material, join by Cu 700g, Fe 110g, Co 160g, Cr 30g
Putting, the error during actual disposition ensures within 0.001g.First by after load weighted alloy raw material ultrasonic cleaning, it is placed in mist
In the vaccum sensitive stove of change equipment.Atomization plant cavity is evacuated to 1 × 10-3The vacuum of Pa, applying argon gas is to big slightly larger than 1
Air pressure, starts pneumatic shuttle after alloy is completely melt into liquid, makes melt liquid flow into aerochamber, opens rapidly high pressure simultaneously
Argon valve (air pressure is 3～10MPa) injection gases at high pressure make metal liquid be atomized.When melt liquid all flows in aerochamber, i.e.
Argon stream valve can be closed.After equipment to be atomized cooling, powdered samples can be obtained in the aggregate tank of atomization plant bottom.
The sintering process of the present invention is carried out under argon shield atmosphere, and sintering temperature is 850 DEG C, and pressure is 30MPa.To be sintered
After body cooling, carry out making annealing treatment air cooling after 8h at 500 DEG C, i.e. can get copper-stainless invar alloy composite.EPMA
Analysis result shows, in composite, the composition of rich Fe-Co-Cr phase is approximately Fe37Co54Cr9, i.e. define stainless invar alloy.
After tested, the thermal coefficient of expansion of this composite is 10.66 × 10-6K-1, thermal conductivity is 107.4W m-1·K-1, such as table 1 institute
Show.
Embodiment 2:
With high purity metal Cu, Fe, Co, Cr as raw material, join by Cu 400g, Fe 220g, Co 320g, Cr 60g
Putting, the error during actual disposition ensures within 0.001g.First by after load weighted alloy raw material ultrasonic cleaning, it is placed in mist
In the vaccum sensitive stove of change equipment.Atomization plant cavity is evacuated to 1 × 10-3The vacuum of Pa, applying argon gas is to big slightly larger than 1
Air pressure, starts pneumatic shuttle after alloy is completely melt into liquid, makes melt liquid flow into aerochamber, opens rapidly high pressure simultaneously
Argon valve (air pressure is 3～10MPa) injection gases at high pressure make metal liquid be atomized.When melt liquid all flows in aerochamber, i.e.
Argon stream valve can be closed.After equipment to be atomized cooling, powdered samples can be obtained in the aggregate tank of atomization plant bottom.
The sintering process of the present invention is carried out under argon shield atmosphere, and sintering temperature is 900 DEG C, and pressure is 30MPa.To be sintered
After body cooling, carry out making annealing treatment air cooling after 12h at 300 DEG C, i.e. can get copper-stainless invar alloy composite.EPMA
Analysis result shows, in composite, the composition of rich Fe-Co-Cr phase is approximately Fe37Co54Cr9, i.e. define stainless invar alloy.
After tested, the thermal coefficient of expansion of this composite is 6.78 × 10-6K-1, thermal conductivity is 56.4W m-1·K-1, as shown in table 1.
Embodiment 3:
With high purity metal Cu, Fe, Co, Cr as raw material, join by Cu 250g, Fe 280g, Co 400g, Cr 70g
Putting, the error during actual disposition ensures within 0.001g.First by after load weighted alloy raw material ultrasonic cleaning, it is placed in mist
In the vaccum sensitive stove of change equipment.Atomization plant cavity is evacuated to 1 × 10-3The vacuum of Pa, applying argon gas is to big slightly larger than 1
Air pressure, starts pneumatic shuttle after alloy is completely melt into liquid, makes melt liquid flow into aerochamber, opens rapidly high pressure simultaneously
Argon valve (air pressure is 3～10MPa) injection gases at high pressure make metal liquid be atomized.When melt liquid all flows in aerochamber, i.e.
Argon stream valve can be closed.After equipment to be atomized cooling, powdered samples can be obtained in the aggregate tank of atomization plant bottom.
The sintering process of the present invention is carried out under argon shield atmosphere, and sintering temperature is 600 DEG C, and pressure is 40MPa.To be sintered
After body cooling, carry out making annealing treatment air cooling after 10h at 400 DEG C, i.e. can get copper-stainless invar alloy composite.EPMA
Analysis result shows, in composite, the composition of rich Fe-Co-Cr phase is approximately Fe37Co54Cr9, i.e. define stainless invar alloy.
After tested, the thermal coefficient of expansion of this composite is 5.75 × 10-6K-1, thermal conductivity is 42.2W m-1·K-1, the present invention is combined
Thermal coefficient of expansion and the thermal conductivity test result of material are as shown in table 1.
Table 1
The present invention sees Fig. 1, in the present invention inside coated composite granule from coated composite granule interior tissue schematic diagram
Tissue SEM figure sees Fig. 2, and the process chart of the present invention sees Fig. 3, and the organization charts of composite granule sintered body of the present invention sees figure
4。
The present invention is first with PHASE DIAGRAM CALCULATION Technology design alloying component so that it is there is rich Cu phase and rich Fe-Co-Cr phase liquid phase two
Phase separation region；Use gas-atomized powder method again, disposably prepare core/shell type and certainly wrap up composite granule, and make rich Cu phase
Forming shell, rich Fe-Co-Cr phase forms stainless invar alloy and becomes the core of composite granule；And then employing powder metallurgical technique,
Composite granule is carried out hot pressed sintering, prepares the sintered material of even compact；Finally sintered body is made annealing treatment, i.e.
Obtain low-expansion high heat conductivity copper-stainless invar alloy composite.The composition of this composite is by mass percentage: Cu 20%～
75%, Fe 9%～30%, Co 12%～45%, Cr 2%～8%, and add W, Nb, Ta, Mo, C the most on a small quantity,
B, V etc. 0～5%.The microstructure of composite of the present invention is uniform, stable performance, isotropism；Production cost of the present invention is low, adds
Work method is simple, can be with large-scale batch production, and product is not limited by size and dimension, at Electronic Packaging, precision instrument instrument
The field such as table, mould all has broad application prospects.
Claims (5)
1. low-expansion high heat conductivity copper-stainless invar alloy composite, it is characterised in that its consisting of by mass percentage: Cu
20%～75%, Fe 9%～30%, Co 12%～45%, Cr 2%～8%, additive 0～5%, described additive is selected from W, Nb,
At least one in Ta, Mo, C, B, V.
Described low-expansion high heat conductivity copper the most as claimed in claim 1-stainless invar alloy composite, it is characterised in that low bulk
The preparation method of high heat-conducting copper-stainless invar alloy composite, comprises the following steps:
(1) by PHASE DIAGRAM CALCULATION method, the composition of design composite so that it is there is rich Cu phase and rich Fe-Co-Cr in composition
The liquid phase two-phase laminated flow district of phase；
(2) weighing various raw material by the result of calculation of step (1), put into gas-atomized powder equipment, evacuation, at argon
The lower induction melting of protection, treats that alloy is completely melt into liquid laggard circulation of qi promoting atomization, obtains core/shell type and certainly wrap up composite granule, make richness
Cu phase is shell, and rich Fe-Co-Cr phase forms stainless invar alloy and becomes the core of composite granule；
(3) core/shell type prepared in step (2) is put in sintering furnace from parcel composite granule, under argon shield, carry out heat
Pressure sintering, obtains copper-stainless invar alloy Composite Sintering body after cooling；
(4) copper obtained in step (3)-stainless invar alloy Composite Sintering body is made annealing treatment, obtain low swollen
Swollen high heat-conducting copper-stainless invar alloy composite.
Described low-expansion high heat conductivity copper the most as claimed in claim 1-stainless invar alloy composite, it is characterised in that in step
(2), in, described core/shell type is 20～320 μm from the particle diameter of parcel composite granule.
Described low-expansion high heat conductivity copper the most as claimed in claim 1-stainless invar alloy composite, it is characterised in that in step
(3), in, the temperature of described hot pressed sintering is 600～1000 DEG C, and the pressure of hot pressed sintering is more than 30MPa.
Described low-expansion high heat conductivity copper the most as claimed in claim 1-stainless invar alloy composite, it is characterised in that in step
(3) in, the temperature of described annealing is 250～500 DEG C, and the time of annealing is 4～72h.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113667852A (en) * | 2021-09-03 | 2021-11-19 | 合肥工业大学 | Powder metallurgy preparation method of high-thermal-conductivity Cu-Invar bimetal-based composite material |
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| US4089711A (en) * | 1976-04-03 | 1978-05-16 | The Research Institute For Iron, Steel And Other Metals Of The Tohoku University | Antiferromagnetic chromium base invar-type alloys and a method of producing the same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113667852A (en) * | 2021-09-03 | 2021-11-19 | 合肥工业大学 | Powder metallurgy preparation method of high-thermal-conductivity Cu-Invar bimetal-based composite material |
| CN113667852B (en) * | 2021-09-03 | 2022-05-31 | 合肥工业大学 | Powder metallurgy preparation method of high-thermal-conductivity Cu-Invar bimetal-based composite material |
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