CN105802107B - A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material and preparation method thereof - Google Patents
A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material and preparation method thereof Download PDFInfo
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- CN105802107B CN105802107B CN201610197240.4A CN201610197240A CN105802107B CN 105802107 B CN105802107 B CN 105802107B CN 201610197240 A CN201610197240 A CN 201610197240A CN 105802107 B CN105802107 B CN 105802107B
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- sheet material
- carrier tape
- resin
- electronic carrier
- middle layer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/141—Feedstock
Abstract
The present invention discloses a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material, it is combined by upper epidermis, middle layer and layer, it is characterized in that, the middle layer is made of the following components by mass percentage: HIPS resin 70.2-90.5%, PPO resin 5-25%, SEBS-g-MAH2-4%, SMA resin 1-2%, black masterbatch 1-3%, antioxidant 0.2-0.3%, composite auxiliary for processing 0.3-0.5%.The present invention effectively improves the heat resistance of electronic carrier tape sheet material by the Interlayer Formulation of a certain amount of PPO resin combination Cheng Xin of addition.Experiments verify that, using electronic carrier tape sheet material produced by the present invention compared with traditional electronic carrier tape sheet material, its heat resistance improves 10 DEG C or more, so that client possesses more broad punch forming temperature range, sheet material will not be perforated, is broken during die cavity punch forming.Meanwhile also there is good creep resistance using electronic carrier tape sheet material produced by the present invention, sheet material is after die cavity punch forming, dimensionally stable, and hollow problem will not occur after sealing with cover tape.
Description
Technical field
The present invention relates to electronic packaging carrier band more particularly to a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material and its preparations
Method.
Background technique
Electronic carrier tape sheet material is the common package packing supplies of man, Electronics Factory.Electronics producer need to be into when using electronic carrier tape sheet material
Row die cavity punch forming, to pack various electronic components.But perforated phenomenon can occur often during die cavity punch forming,
It is scrapped so as to cause sheet material.
Show through lot of experiment validation: the reason of electronic carrier tape sheet material is perforated during die cavity punch forming is substantially
Have following several: 1) temperature tolerance of electronic carrier tape sheet material itself is poor, 2) elongation at break of electronic carrier tape sheet material is insufficient, and 3) punching press
Molding die design is unreasonable, and 4) electronic carrier tape sheet surface has point etc..
Summary of the invention
Aiming at the problems existing in the prior art, that the purpose of the present invention is to provide a kind of heat resistances is good, shrinking percentage is low
Electronic carrier tape sheet material.
To achieve the above objectives, the present invention adopts the following technical scheme that.
A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material, is combined, feature exists by upper epidermis, middle layer and layer
In the middle layer is made of the following components by mass percentage: HIPS resin 70.2-90.5%, PPO resin 5-25%,
SEBS-g-MAH2-4%, SMA resin 1-2%, black masterbatch 1-3%, antioxidant 0.2-0.3%, composite auxiliary for processing 0.3-
0.5%.
As with improvement, the middle layer is made of the following components by mass percentage: HIPS resin 73.2%, PPO tree
Rouge 18%, SEBS-g-MAH4%, SMA resin 2%, black masterbatch 2%, antioxidant 0.3%, composite auxiliary for processing 0.5%.
As with improvement, the middle layer is made of the following components by mass percentage: HIPS resin 84.5%, PPO tree
Rouge 8%, SEBS-g-MAH2%, SMA resin 2%, black masterbatch 3%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
As with improvement, the upper epidermis is consistent with the component of the layer, by mass percentage all by following component
Composition: HIPS resin 66.5-76.5%, SBS resin 3-5%, conductive carbon black 20-28%, antioxidant 0.2%, Compound Machining helps
Agent 0.3%.
As with improvement, the upper epidermis is made of the following components by mass percentage: HIPS resin 70.5%, SBS tree
Rouge 5%, conductive carbon black 24%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
The present invention also provides a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet manufacturing process, which is characterized in that it is used to make
The standby high-temperature resistant and creep-resistant electronic carrier tape sheet material as described in any one of claim 1-5, includes the following steps:
1) it is granulated, each component of middle layer is poured into high-speed mixer to dual-screw pelletizer after mixing and is extruded into
Middle layer raw material is made in grain；The engine speed of dual-screw pelletizer is 350 ± 5 revs/min, and the revolving speed of feeder is 70 ± 5
Rev/min, operating temperature is controlled at 230-280 DEG C；The each component on upper and lower surface layer is poured into after mixing with high-speed mixer
Dual-screw pelletizer is extruded into particle, and upper and lower top layer raw material is made；The engine speed of dual-screw pelletizer is 380 ± 5 revs/min
Clock, the revolving speed of feeder are 85 ± 5 revs/min, and operating temperature is controlled at 200-260 DEG C.
2) dry, middle layer feed particles, upper epidermis feed particles, layer feed particles are respectively put into baking oven and are dried
It is dry；The drying time of middle layer feed particles is 90 ± 2 minutes, and drying temperature is controlled at 80-90 DEG C；Upper and lower top layer raw material
The drying time of grain is 90 ± 2 minutes, and drying temperature is controlled at 90 ± 2 DEG C.
3) sheet material squeezes out, and dried middle layer feed particles and upper and lower top layer raw material particle are respectively implanted feeder,
Pass through three layers of composite sheet of same die extrusion by two extruders, the extrusion temperature of middle layer is 210-260 DEG C, upper and lower table
The extrusion temperature of layer is 200-260 DEG C.
As with improvement, the high-speed mixer is SHR-300A type high-speed mixer.
As with improvement, the dual-screw pelletizer is 50 double screw extruder of Φ.
Compared with prior art, the beneficial effects of the present invention are:
The present invention effectively improves electronic carrier tape piece by the Interlayer Formulation of a certain amount of PPO resin combination Cheng Xin of addition
The heat resistance of material.Experiments verify that utilizing general purpose polystyrene using electronic carrier tape sheet material produced by the present invention and traditional
Electronic carrier tape sheet material made from material is compared, and heat resistance improves 10 DEG C or more, so that client possesses more broad punching press
Forming temperature scope, sheet material will not be perforated, is broken during die cavity punch forming.Meanwhile utilizing electronics produced by the present invention
Carrier sheet also has good creep resistance, and sheet material is after die cavity punch forming, dimensionally stable, will not after sealing with cover tape
Hollow problem occurs.
Specific embodiment
Essence of the invention is more fully understood for convenience of those skilled in the art, below to a specific embodiment of the invention
It is described in detail.
Embodiment one
A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material, is combined by upper epidermis, middle layer and layer.
Wherein, the middle layer is made of the following components by mass percentage: HIPS resin (high impact polystyrene
Resin) 70.2%, PPO resin (polyphenylene oxide resin) 21%, SEBS-g-MAH (maleic anhydride graft phenylethene-ethylene-fourth two
Alkene-styrol copolymer) 4%, SMA resin (styrene-maleic anhydride copolymer) 2%, black masterbatch 2%, antioxidant 0.3%,
Composite auxiliary for processing 0.5%.
The upper epidermis is consistent with the component of the layer, is all made of the following components by mass percentage: HIPS tree
Rouge (high impact polystyrene resin) 66.5%, SBS resin (styrene-butadiene-styrene triblock copolymer)
5%, conductive carbon black 28%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
When practical preparation, carry out as follows:
Following steps:
1) intermediate layer material is granulated, and each component of middle layer is poured into twin-screw granulation after mixing with high-speed mixer
Machine is extruded into particle, and middle layer raw material is made；The engine speed of dual-screw pelletizer is 350 ± 5 revs/min, and feeder turns
Speed is 70 ± 5 revs/min, and operating temperature is controlled at 230-280 DEG C.
2) skin-material is granulated, and each component on upper and lower surface layer is poured into twin-screw with high-speed mixer after mixing and is made
Grain machine is extruded into particle, and upper and lower top layer raw material is made；The engine speed of dual-screw pelletizer is 380 ± 5 revs/min, feeder
Revolving speed be 85 ± 5 revs/min, operating temperature control at 200-260 DEG C.
3) dry, middle layer feed particles, upper epidermis feed particles, layer feed particles are respectively put into baking oven and are dried
It is dry；The drying time of middle layer feed particles is 90 ± 2 minutes, and drying temperature is controlled at 80-90 DEG C；Upper and lower top layer raw material
The drying time of grain is 90 ± 2 minutes, and drying temperature is controlled at 90 ± 2 DEG C.
4) sheet material squeezes out, and dried middle layer feed particles and upper and lower top layer raw material particle are respectively implanted feeder,
Pass through three layers of composite sheet of same die extrusion by two extruders, the extrusion temperature of middle layer is 210-260 DEG C, upper and lower table
The extrusion temperature of layer is 200-260 DEG C.
In the present embodiment, the high-speed mixer selects SHR-300A high-speed mixer.The dual-screw pelletizer Φ 50
Double screw extruder, which according to their needs further optimizes screw combinations convenient for producer, so that material is fully dispersed.
Embodiment two
Its structure of a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material provided in this embodiment and component and embodiment one are basic
Unanimously, difference is:
One, the middle layer is made of the following components by mass percentage: HIPS resin 90.5%, PPO resin 5%,
SEBS-g-MAH2%, SMA resin 1%, black masterbatch 1%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Two, the upper epidermis, layer are all made of the following components by mass percentage: HIPS resin 76.5%, SBS tree
Rouge 3%, conductive carbon black 20%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Embodiment three
Its structure of a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material provided in this embodiment and component and embodiment one are basic
Unanimously, difference is:
One, the middle layer is made of the following components by mass percentage: HIPS resin 73.2%, PPO resin 18%,
SEBS-g-MAH4%, SMA resin 2%, black masterbatch 2%, antioxidant 0.3%, composite auxiliary for processing 0.5%.
Two, the upper epidermis, layer are all made of the following components by mass percentage: HIPS resin 70.5%, SBS tree
Rouge 5%, conductive carbon black 24%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Example IV
Its structure of a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material provided in this embodiment and component and embodiment one are basic
Unanimously, difference is:
One, the middle layer is made of the following components by mass percentage: HIPS resin 84.5%, PPO resin 8%,
SEBS-g-MAH2%, SMA resin 2%, black masterbatch 3%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Two, the upper epidermis, layer are all made of the following components by mass percentage: HIPS resin 68.5%, SBS tree
Rouge 4%, conductive carbon black 27%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Embodiment five
Its structure of a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material provided in this embodiment and component and embodiment one are basic
Unanimously, difference is:
One, the middle layer is made of the following components by mass percentage: HIPS resin 80.5%, PPO resin 12%,
SEBS-g-MAH4%, SMA resin 2%, black masterbatch 1%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Two, the upper epidermis, layer are all made of the following components by mass percentage: HIPS resin 73.5%, SBS tree
Rouge 4%, conductive carbon black 22%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
Comparative experiments
With existing electronic carrier tape sheet material and utilize electronic carrier tape made from the embodiment of the present invention one to embodiment five
Sheet material is tested for the property comparison, and test result is as shown in table 1.
1. performance comparison table of table
From table 1 it follows that highest stamping resistance forming temperature is than passing using electronic carrier tape sheet material produced by the present invention
High 10 DEG C of electronic carrier tape sheet material or more of system, shrinking percentage have very outstanding resistance to also below traditional electronic carrier tape sheet material
High-temperature behavior and creep resistance.
The above specific embodiment is described in detail for the essence of the present invention, but can not be come with this to of the invention
Protection scope is limited.It should be evident that under the inspiration of the essence of the present invention, those of ordinary skill in the art can also be into
The many improvement and modification of row, it should be noted that these improvement and modification all fall in claims of the invention it
It is interior.
Claims (7)
1. a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material, is combined, feature exists by upper epidermis, middle layer and layer
In the middle layer is made of the following components by mass percentage: HIPS resin 70.2-90.5%, PPO resin 5-21%, SEBS-
G-MAH2-4%, SMA resin 1-2%, black masterbatch 1-3%, antioxidant 0.2-0.3%, composite auxiliary for processing 0.3-0.5%；
Preparation method includes the following steps:
1) it is granulated, each component of middle layer is poured into dual-screw pelletizer with high-speed mixer after mixing and is extruded into particle,
Middle layer raw material is made；The engine speed of dual-screw pelletizer is 350 ± 5 revs/min, and the revolving speed of feeder is 70 ± 5 revs/min
Clock, operating temperature are controlled at 230-280 DEG C；
The each component on upper and lower surface layer is poured into dual-screw pelletizer with high-speed mixer after mixing and is extruded into particle, is made
Upper and lower top layer raw material；The engine speed of dual-screw pelletizer is 380 ± 5 revs/min, and the revolving speed of feeder is 85 ± 5 revs/min
Clock, operating temperature are controlled at 200-260 DEG C；
2) dry, middle layer feed particles, upper epidermis feed particles, layer feed particles are respectively put into baking oven drying；In
The drying time of interbed feed particles is 90 ± 2 minutes, and drying temperature is controlled at 80-90 DEG C；The baking of upper and lower top layer raw material particle
The dry time is 90 ± 2 minutes, and drying temperature is controlled at 90 ± 2 DEG C；
3) sheet material squeezes out, and dried middle layer feed particles and upper and lower top layer raw material particle is respectively implanted feeder, by two
Platform extruder passes through three layers of composite sheet of same die extrusion, and the extrusion temperature of middle layer is 210-260 DEG C, upper and lower surface layer
Extrusion temperature is 200-260 DEG C.
2. a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material according to claim 1, which is characterized in that the middle layer is pressed
Mass percent is made of the following components: HIPS resin 73.2%, PPO resin 18%, SEBS-g-MAH4%, SMA resin 2%, black
Mother 2%, antioxidant 0.3%, composite auxiliary for processing 0.5%.
3. a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material according to claim 1, which is characterized in that the middle layer is pressed
Mass percent is made of the following components: HIPS resin 84.5%, PPO resin 8%, SEBS-g-MAH2%, SMA resin 2%, black
Mother 3%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
4. a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material according to claim 1, which is characterized in that the upper epidermis and
The component of the layer is consistent, is all made of the following components by mass percentage: HIPS resin 66.5-76.5%, SBS resin
3-5%, conductive carbon black 20-28%, antioxidant 0.2%, composite auxiliary for processing 0.3%.
5. a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material according to claim 4, which is characterized in that the upper epidermis is pressed
Mass percent is made of the following components: HIPS resin 70.5%, SBS resin 5%, conductive carbon black 24%, and antioxidant 0.2% is compound
Processing aid 0.3%.
6. a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material according to claim 1, which is characterized in that the mixed at high speed
Machine is SHR-300A type high-speed mixer.
7. a kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material according to claim 1, which is characterized in that the twin-screw is made
Grain machine is 50 double screw extruder of Φ.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610197240.4A CN105802107B (en) | 2016-03-31 | 2016-03-31 | A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610197240.4A CN105802107B (en) | 2016-03-31 | 2016-03-31 | A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material and preparation method thereof |
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| CN105802107A CN105802107A (en) | 2016-07-27 |
| CN105802107B true CN105802107B (en) | 2019-04-26 |
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| CN201610197240.4A Active CN105802107B (en) | 2016-03-31 | 2016-03-31 | A kind of high-temperature resistant and creep-resistant electronic carrier tape sheet material and preparation method thereof |
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| CN113956562A (en) * | 2021-12-10 | 2022-01-21 | 东莞市诺义包装材料有限公司 | Electronic component carrier tape sheet and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4163620B2 (en) * | 2001-11-16 | 2008-10-08 | 電気化学工業株式会社 | Multi-layer sheet for packaging electronic parts |
| CN1326921C (en) * | 2002-01-07 | 2007-07-18 | 电气化学工业株式会社 | Electroconductive resin composition |
| JP2002264272A (en) * | 2002-01-15 | 2002-09-18 | Denki Kagaku Kogyo Kk | Conductive composite plastic sheet and molding |
| CN101475721B (en) * | 2009-01-13 | 2012-09-05 | 浙江三和塑料有限公司 | Antistatic plastic for SMT carrier band, and preparation and use thereof |
| CN104893223B (en) * | 2015-06-18 | 2018-09-14 | 青岛海信电器股份有限公司 | Sheathing material of a kind of electronic equipment and preparation method thereof |
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Effective date of registration: 20230418 Address after: 512000 first floor and workshop of office building of Shaoguan Gaoxin plastic products Co., Ltd., No. 1, Xingye Road, industrial transfer industrial park, Zhenjiang District, Shaoguan City, Guangdong Province Patentee after: Shaoguan Gaoxin plastic products Co.,Ltd. Address before: 528325 No. 22 Liangjun Road, First Industrial Zone, Maicun Village Committee, Xingtan Town, Shunde District, Foshan City, Guangdong Province Patentee before: GUANGDONG DITONG NEW MATERIAL Co.,Ltd. |