CN105784199B - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
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- CN105784199B CN105784199B CN201610153923.XA CN201610153923A CN105784199B CN 105784199 B CN105784199 B CN 105784199B CN 201610153923 A CN201610153923 A CN 201610153923A CN 105784199 B CN105784199 B CN 105784199B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- General Physics & Mathematics (AREA)
- Semiconductor Lasers (AREA)
Abstract
The present invention relates to field of communication technology more particularly to a kind of optical modules.The monitoring accuracy for improving laser temperature, improves laser performance.The monitoring temperature inaccuracy in the prior art to laser is overcome, so that the defect of the reduced performance of optical assembly.The embodiment of the present invention provides a kind of optical module, comprising: optical assembly and temperature monitoring module are packaged with laser in the optical assembly；Temperature monitoring module includes: temperature element, temperature element is connect with shell corresponding to laser in optical assembly by heat-conducting piece, the heat that heat-conducting piece is used to be distributed in laser is conducted to temperature element, temperature monitoring module is used to adjust the driving current of laser according to temperature element temperature detected, so that the driving current of laser and the optical power electric current of laser corresponding to the detection temperature match.The embodiment of the present invention is applied to the manufacturing of optical module.
Description
Technical field
The present invention relates to field of communication technology more particularly to a kind of optical modules.
Background technique
In optical module, temperature has a great impact to the characteristic of laser, due to the optical power electric current of the laser
Change with the temperature change of the laser, and the driving current of the laser needs and the optical power of laser electricity
Stream matches, and is therefore monitored by the temperature to laser with guaranteeing that laser can export required output signal
To control the driving current of the laser, so that the laser corresponding to the driving current of the laser and the temperature
Optical power electric current match, so as to improve the stability of laser output signal.
In the prior art, the chip with temperature sensor is generallyd use to examine the temperature of environment in optical module
It surveys, the temperature of laser is calculated on the basis of increasing offset, this mode detects temperature inaccuracy, it is difficult to realize to described
The progress of the temperature of laser accurately monitors, and then influences laser performance.
Summary of the invention
The present invention provides a kind of optical module, improves the monitoring accuracy of laser temperature, improves laser performance.
In order to achieve the above objectives, the present invention adopts the following technical scheme:
The embodiment of the present invention provides a kind of optical module, comprising: optical assembly and temperature monitoring module seal in the optical assembly
Equipped with laser；The temperature monitoring module includes:
Temperature element, the temperature element are connect with shell corresponding to laser in the optical assembly by heat-conducting piece,
The heat that the heat-conducting piece is used to be distributed in laser is conducted to the temperature element, and the temperature monitoring module is used for basis
The temperature element temperature detected adjusts the driving current of the laser so that the driving current of the laser with should
The optical power electric current of the laser at a temperature of detection matches.
The embodiment of the present invention provides a kind of optical module.Wherein, shell and institute corresponding to the laser in the optical assembly
It states temperature element to connect by heat-conducting piece, the heat that laser is distributed efficiently directly can be conducted to the temperature element,
Compared in the prior art, temperature change caused by the heat of additional conductive can be avoided, so as to improve monitoring temperature
Accuracy, and vary with temperature and the driving current of the laser be adjusted, so that the driving current of the laser
Match with the optical power electric current of the laser at a temperature of real-time detection, so as to improve the steady of laser output signal
It is qualitative.The monitoring temperature inaccuracy in the prior art to laser is overcome, so that the defect of the reduced performance of laser.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, embodiment will be described below
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is a kind of structural schematic diagram of optical module provided in an embodiment of the present invention；
Fig. 2 is a kind of entity structure schematic diagram of optical module provided in an embodiment of the present invention；
Fig. 3 is a kind of circuit connection diagram of temperature control modules provided in an embodiment of the present invention；
Fig. 4 is a kind of graph of relation of the voltage-temperature of the temperature element with PN junction provided in an embodiment of the present invention；
Fig. 5 is a kind of circuit of the temperature control modules of increase fixed value resistance based on Fig. 3 provided in an embodiment of the present invention
Connection schematic diagram；
Fig. 6 is a kind of temperature control modules of increase analog-to-digital conversion module based on Fig. 5 provided in an embodiment of the present invention
Circuit connection diagram；
Fig. 7 is a kind of circuit of the temperature control modules of the increase control module based on Fig. 6 provided in an embodiment of the present invention
Connection schematic diagram；
Fig. 8 is a kind of circuit connection of the temperature control modules of increase chip based on Fig. 7 provided in an embodiment of the present invention
Schematic diagram；
Fig. 9 is a kind of circuit of the temperature control modules of increase calibration module based on Fig. 8 provided in an embodiment of the present invention
Connection schematic diagram.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " center ", "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on the figure
Orientation or positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.?
In description of the invention, unless otherwise indicated, the meaning of " plurality " is two or more.
The embodiment of the present invention provides a kind of optical module, referring to Fig. 1 and Fig. 2, comprising: optical assembly 1 and temperature monitoring module
2, laser is packaged in the optical assembly 1, and the temperature monitoring module 2 includes:
Temperature element 21, the temperature element 21 pass through heat-conducting piece with shell corresponding to laser in the optical assembly 1
22 connections, the heat that the heat-conducting piece 22 is used to be distributed in laser are conducted to the temperature element 21, the monitoring temperature
Module 2 is used to adjust the driving current of the laser according to the temperature element 21 temperature detected, so that the laser
The driving current of device and the optical power electric current of the laser at a temperature of the detection match.
Wherein, the optical assembly 1 refers to the opto-electronic device in optical module, is divided into optical transmitter module, optical receiver module, light
Receiver-transmitter integrated module and light forwarding module, here, the embodiment of the present invention is suitable for being packaged with the optical assembly of laser.
The embodiment of the present invention provides a kind of optical module.Wherein, shell and institute corresponding to the laser in the optical assembly 1
It states temperature element 21 to connect by heat-conducting piece 22, the heat that laser is distributed efficiently directly can be conducted to the thermometric member
Part 21 can be avoided compared with being detected in the prior art by the chip with temperature sensor to the temperature of laser
Temperature change caused by the heat of additional conductive so as to improve the accuracy of monitoring temperature, and is varied with temperature to institute
The driving current for stating laser is adjusted, so that the driving current of the laser and the laser at a temperature of real-time detection
The optical power electric current of device matches, so as to improve the stability of laser output signal.
Wherein, without limitation to the heat-conducting piece 22.
In one embodiment of the invention, the heat-conducting piece 22 is heat-conducting glue.
Heat-conducting glue is the heat transmission medium of electronic component, has high flexibility, it is possible to reduce the pressure needed between component
Power, while the surface of microcosmic out-of-flatness can be covered to make component come into full contact with and improve heat conduction efficiency.
Wherein, the connection type of the temperature element 21 and shell corresponding to laser in the optical assembly 1 is not done
It limits.
In one embodiment of the invention, the optical module further includes die casting bracket 3, the lower surface of the heat-conducting piece 22 and institute
The upper surface interference fit connection of die casting bracket 3 is stated, shell and the heat-conducting piece 22 corresponding to laser in the optical assembly 1
A part of upper surface be interference fitted connection, the upper surface interference of the temperature element 21 and another part of the heat-conducting piece 22
It is cooperatively connected.
In embodiments of the present invention, when the heat-conducting piece 22 is attached with remaining part, the company of the heat-conducting piece 22
Deformation occurs and to generate very big pressure between the heat-conducting piece 22 and the mating surface of remaining part for junction, can be realized
It is full of mating connection, conducts heat in such manner, it is possible to come into full contact with heat-conducting piece 22 closely with remaining part, improves heat transfer efficiency.Into
One step, since the heat-conducting piece 22 is heat-conducting glue, since heat-conducting glue 22 has good ductility, microcosmic injustice can be covered
Whole surface is to make component come into full contact with, so as to improve heat conduction efficiency to the full extent, and can be to the survey
The position of warm element 21 and the optical assembly 1 is fixed, and it is mobile to prevent position.
Wherein, without limitation to the ingredient of the heat-conducting glue 22.
Preferably, the heat-conducting glue 22 is HD6000 heat-conducting silica gel sheet.
Wherein, without limitation to the temperature element 21, the temperature element 21 can be thermistor, or three
Pole pipe.
In another embodiment of the present invention, the temperature element 21 is diode or triode.
Since diode and triode have a PN junction, in one piece of single crystal semiconductor, a part is p-type half mixed with acceptor impurity
Transition when conductor, another part mixed with donor impurity are N-type semiconductors, near the interface of P-type semiconductor and N-type semiconductor
Area is known as PN junction.The PN junction have very good temperature linearity, have it is small in size, thermal response speed is fast, deviation from linearity is small,
Therefore the good feature of interchangeability can be realized the accurate monitoring to the temperature of the laser.
In one embodiment of the invention, referring to Fig. 3, the temperature monitoring module 2 further include: constant-current source 23, the constant current
Source 23 is used to pass through constant current forward direction the PN junction of the temperature element 21, and the temperature element 21 is for detecting the laser
The temperature change of device, and exported the forward voltage drop at PN junction both ends as measuring signal.
Wherein, the constant-current source 23 is the current source for exporting constant current hold.Referring to fig. 4, the survey with PN junction
Warm element is a kind of negative temperature coefficient temperature-voltage switching device, i.e., temperature increases, and the decline of PN junction both end voltage utilizes PN junction
Forward voltage drop with the raising of detection temperature reduced principle, the forward voltage drop at the PN junction both ends is defeated as measuring signal
Out, the temperature of the laser can be monitored in real time.
Wherein, without limitation to the size of the constant current.
In one embodiment of the invention, the constant current is 100-300 μ A.
Electric current due to flowing through the PN junction of the temperature element 21 can be worked normally from tens microamperes, still, if institute
It is too small to state constant current, then be easy by external interference, if the constant current is excessive, the temperature element 21 itself heat up so that
Temperature measurement inaccuracy.Wherein, constant current changes in suitable range, will not influence the linear of the measurement of temperature element 21
Degree.
In one embodiment of the invention, referring to Fig. 5, the temperature monitoring module 2 further include: fixed value resistance 24, it is described fixed
The one end for being worth resistance 24 is connect with the anode of the constant-current source 23, the other end of the fixed value resistance 24 and the anode of the PN junction
Electrical connection, the cathode ground connection of the PN junction.
In embodiments of the present invention, by the way that fixed value resistance 24 is connected with the PN junction, play the role of partial pressure, it is exemplary
, if V is the voltage of constant-current source 23, fixed value resistance R then flows through the electric current i of PN junctionf=(V-Vf)/R, VfFor the output of PN junction
Voltage, since the cathode of the PN junction is grounded, the output voltage of the PN junction is the positive pressure at the PN junction both ends
Drop.
Wherein, it should be noted that diode is that one piece of P-type semiconductor and one piece of N-type semiconductor are closely incorporated in one
Rise and constitute.As soon as forming an interface on their interface, this interface claims PN junction.It is each in p-type and N-type semiconductor
In addition a lead, is then packaged, a diode is just constituted.The PN junction is just called the PN junction of diode.Three pole
Pipe is made of two PN junctions, and the triode has NPN type triode and PNP type triode, any one in the triode
PN junction can be connected serially in circuit and form temperature element.
In another embodiment of the present invention, the PN junction is the emitter junction of NPN type triode.
NPN type triode is made of 2 pieces of N-type semiconductor sandwich, one piece of P-type semiconductor, emitter region and base area it
Between the PN junction that is formed be known as emitter junction, in circuit connection, there are mainly two types of connection type, the first connection types for the PN junction
Are as follows: the base stage of the triode is electrically connected with the fixed value resistance, the emitter ground connection of the triode；Second of connection type
Are as follows: the base stage of the triode is electrically connected with the fixed value resistance, the emitter ground connection of the triode, and the triode
Collector and the triode base stage be shorted, in both modes, constant current can pass through the triode
Emitter junction.
In one embodiment of the invention, the base stage of the collector of the triode and the triode is shorted.
In one embodiment of the invention, referring to Fig. 6, the temperature monitoring module further include: analog-to-digital conversion module 25, it is described
Analog-to-digital conversion module 25 is connect with the voltage output end of the temperature element 21, for being converted to the forward voltage drop of the PN junction
Temperature signal.
Output signal generally, due to the temperature element 21 is an analog signal, passes through the analog-to-digital conversion module 25
The analog signal can be converted to temperature signal.
In another embodiment of the present invention, referring to Fig. 7, the temperature monitoring module further include: control module 26；The control
Molding block 26 is electrically connected with the signal output end of the analog-to-digital conversion module 25, and the control module 26 is for receiving the modulus
The temperature signal that conversion module 25 is sent, the driving current of the laser is controlled according to the temperature signal.
By the way that control module 26 is arranged, can driving current to the laser carried out according to actual temperature change situation
Real-time monitoring improves the reliability and accuracy of monitoring temperature.
In one embodiment of the invention, referring to Fig. 8, the temperature monitoring module includes: chip 27, the constant-current source 23 with
The control module 26 is integrated on the chip 27.
In another embodiment of the present invention, referring to Fig. 9, the temperature monitoring module further include: calibration module 28, the school
Signal input part of the quasi-mode block 28 respectively with the signal output end of the analog-to-digital conversion module 25 and the control module 26 is electrically connected
It connects, the calibration module 28 is used to receive the temperature signal that the analog-to-digital conversion module 25 is sent, and carries out to the temperature signal
Calibration, so that the temperature detected of the temperature element 21 is consistent with the actual temperature of shell corresponding to the laser,
And the temperature signal after calibration is sent to the control module 26.
During temperature conduction, although the heat-conducting glue 22 has the preferable capacity of heat transmission, also have part heat
Amount is scattered and disappeared by heat-conducting glue 22 and die casting bracket 3, so that temperature detection has certain error, by the way that calibrating die is arranged
Block 28 can reduce error, further increase the accuracy of monitoring temperature.
Wherein, the calibration module 28 can be the application software for being stored with matched curve.
It is set as thermometric member by the temperature of shell corresponding to laser described in thermometer real-time detection, then by the temperature
The calibration temperature reference point of part, by fitting software can obtain shell corresponding to laser temperature and the temperature element
Detection temperature matched curve, so as to guarantee temperature element measurement temperature accuracy.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (9)
1. a kind of optical module, comprising: optical assembly and temperature monitoring module are packaged with laser in the optical assembly；Its feature
It is,
The optical module further includes die casting bracket；
The temperature monitoring module includes:
The upper surface of temperature element and heat-conducting piece, the lower surface of the heat-conducting piece and the die casting bracket, which is interference fitted, to be connected,
A part of upper surface of shell corresponding to laser and the heat-conducting piece, which is interference fitted, in the optical assembly connects, the thermometric
The upper surface of another part of element and the heat-conducting piece is interference fitted and connects；
The temperature monitoring module is used to adjust the driving current of the laser according to temperature element temperature detected,
So that the driving current of the laser and the optical power electric current of the laser corresponding to the detection temperature match；
Wherein, the heat-conducting piece is thermally conductive film.
2. optical module according to claim 1, which is characterized in that
The temperature element is diode or triode.
3. optical module according to claim 2, which is characterized in that
The temperature monitoring module further include: constant-current source, the constant-current source are used to constant current forward direction passing through the thermometric member
The PN junction of part, the temperature element are used to detect the temperature change of the laser, and using the forward voltage drop at PN junction both ends as
Measuring signal output.
4. optical module according to claim 3, which is characterized in that
The temperature monitoring module further include: fixed value resistance, one end of the fixed value resistance are connect with the anode of the constant-current source,
The other end of the fixed value resistance is electrically connected with the anode of the PN junction, the cathode ground connection of the PN junction.
5. optical module according to claim 3, which is characterized in that
The PN junction is the emitter junction of NPN triode.
6. optical module according to claim 3, which is characterized in that the temperature monitoring module further include: analog-to-digital conversion mould
Block, the analog-to-digital conversion module are connect with the voltage output end of the PN junction, for being converted to the forward voltage drop of the PN junction
Temperature signal.
7. optical module according to claim 6, which is characterized in that the temperature monitoring module further include: control module；Institute
It states control module to be electrically connected with the signal output end of the analog-to-digital conversion module, the control module turns for receiving the modulus
The temperature signal that block is sent is changed the mold, and adjusts the driving current of the laser according to the temperature signal.
8. optical module according to claim 7, which is characterized in that the temperature monitoring module further include: chip, the perseverance
Stream source and the control module are integrated on the chip.
9. optical module according to claim 7, which is characterized in that the temperature monitoring module further include: calibration module, institute
Calibration module is stated to be electrically connected with the signal input part of the signal output end of the analog-to-digital conversion module and the control module respectively,
The calibration module is used to receive the temperature signal that the analog-to-digital conversion module is sent, and calibrates to the temperature signal, makes
It is consistent with the actual temperature of shell corresponding to the laser to obtain the temperature element temperature detected, and will be after calibration
Temperature signal be sent to the control module.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610153923.XA CN105784199B (en) | 2016-03-17 | 2016-03-17 | A kind of optical module |
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| CN201610153923.XA CN105784199B (en) | 2016-03-17 | 2016-03-17 | A kind of optical module |
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| CN105784199A CN105784199A (en) | 2016-07-20 |
| CN105784199B true CN105784199B (en) | 2019-06-14 |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107967009A (en) * | 2018-01-05 | 2018-04-27 | 北京是卓科技有限公司 | A kind of laser that can be temperature automatically controlled |
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