CN105772323B - Thick glued membrane coating unit and its application method is made in a kind of semiconductor - Google Patents
Thick glued membrane coating unit and its application method is made in a kind of semiconductor Download PDFInfo
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- CN105772323B CN105772323B CN201410803593.5A CN201410803593A CN105772323B CN 105772323 B CN105772323 B CN 105772323B CN 201410803593 A CN201410803593 A CN 201410803593A CN 105772323 B CN105772323 B CN 105772323B
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- electric cylinders
- suction tray
- glued membrane
- shower nozzle
- wafer
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Abstract
The present invention relates to field of semiconductor processing,Thick glued membrane coating unit and its application method is made in specifically a kind of semiconductor,Including electric cylinders,Shower nozzle,Glue cup component,Rotary adsorption mechanism and substrate,Wherein electric cylinders and glue cup component may be contained within substrate,The electric cylinders are provided with trave lling girder,Spacing and the adjustable shower nozzle of height are arranged on the trave lling girder,The Rotary adsorption mechanism, which is provided with, to be used to adsorb wafer and rotatable suction tray,The suction tray is arranged at the middle part of the glue cup component,The shower nozzle is driven by the trave lling girder of the electric cylinders when glued membrane coats and moved in the suction tray upper horizontal,Wafer to be processed is positioned on suction tray,Multiple shower nozzles drive level of synchronization movement sprinkling photoresist by electric cylinders,Then wafer is adsorbed by suction tray and fixed,Multiple shower nozzles drive the photoresistance of level of synchronization movement sprinkling atomization by electric cylinders.The present invention ensures that spraying is uniform, makes wafer entirety thickness unified, prevents crystal round fringes projection.
Description
Technical field
The present invention relates to field of semiconductor processing, specifically a kind of semiconductor is made thick glued membrane coating unit and its made
Use method.
Background technology
In field of semiconductor processing, existing spraying photolithographic techniques, the coating of thick glued membrane is by spin coating mode
Reason because glued membrane it is thicker, it is necessary to by more than 2 times coating and stand glue process it is slower, production capacity is very low, and the more difficult control of uniformity
System, and also have a circle raised at edge after wafer spin-coat process, causing the edge of wafer can not utilize, and reduce the profit of product
With rate.Require more and more higher with highly integrated as semiconductor production becomes more meticulous, wafer yield and yield rate also increasingly by
To attention, and in various processing procedures, the processing of wafer surface spraying photoresist is particularly important, and particularly wafer surface is sprayed
Apply the optimization of processing speed, to improve production capacity, reduce cost, increase benefit has a major impact, but spraying rate and spraying are thick
There is inevitable inverse relation in degree, when the photoresist layer for spraying crystal column surface will reach thicker thickness, it is necessary to back and forth enter again
Row repeatedly spraying, this also causes single-wafer spray process is time-consuming to increase considerably, causes production capacity to reduce.
The content of the invention
It is an object of the invention to provide a kind of semiconductor to be made thick glued membrane coating unit and its application method, by multiple
The coating of shower nozzle synchronous translational ensures that wafer entirety thickness is unified, prevents crystal round fringes projection.
The purpose of the present invention is achieved through the following technical solutions：
Thick glued membrane coating unit, including electric cylinders, shower nozzle, glue cup component, Rotary adsorption mechanism and base is made in a kind of semiconductor
Plate, wherein electric cylinders and glue cup component may be contained within substrate, and the electric cylinders are provided with trave lling girder, spacing and the adjustable spray of height
Head is arranged on the trave lling girder, and the Rotary adsorption mechanism, which is provided with, to be used to adsorb wafer and rotatable suction tray, institute
The middle part that suction tray is arranged at the glue cup component is stated, the shower nozzle is driven when glued membrane coats by the trave lling girder of the electric cylinders
Moved in the suction tray upper horizontal.
The shower nozzle is arranged on the trave lling girder of electric cylinders by scale and mounting bracket, and the trave lling girder is provided with a fixation
Plate, multiple mounting brackets are arranged in the fixed plate, and scale with a scale, each scale lower end are fitted with each mounting bracket
It is fixed with shower nozzle.
The mounting bracket both sides are provided with the elongated hole for being used for adjusting each mounting bracket spacing.
The mounting bracket is provided with clamping screw, and the shower nozzle moves adjustment height, institute by the scale along mounting bracket
State scale and fixation is withstood by the clamping screw.
The Rotary adsorption mechanism also includes motor, transmission mechanism and rotary shaft, wherein rotary shaft in addition to the suction tray
It is installed in rotation on the substrate, the motor is located at substrate downside and passes through the transmission mechanism and the rotary shaft phase
Even.
Is provided with vacuum passage in the rotary shaft, is provided with groove on the upside of the suction tray, on the groove and rotary shaft
Vacuum passage communicates, and the rotary shaft lower end is provided with a rotary slip ring, and the rotary shaft passes through the rotary slip ring and vacuum
Pipeline is connected.
The transmission mechanism is belt wheel transmission mechanism, including the driving wheel and driven pulley being connected by conveyer belt, wherein main
Driving wheel is packed on the output shaft of the motor, and driven pulley is packed in the rotary shaft.
The painting method of thick glued membrane coating unit is made in a kind of semiconductor, it is characterised in that：Wafer to be processed is positioned over
On suction tray, multiple shower nozzles drive level of synchronization movement sprinkling photoresist by electric cylinders, and then wafer is adsorbed solid by suction tray
Fixed, multiple shower nozzles drive the photoresistance of level of synchronization movement sprinkling atomization by electric cylinders.
The shower nozzle repeatedly moves back and forth the photoresistance of sprinkling atomization by electric cylinders driving, and wafer passes through absorption before sprinkling every time
Disk drives rotation.
Advantages of the present invention is with good effect：
1st, the present invention is coated by multiple shower nozzle synchronous translationals ensures that wafer entirety thickness is unified, and effectively prevents wafer
Edge protuberance.
2nd, multiple shower nozzle spacing of the invention are adjustable, and the height of each shower nozzle can also accurately be adjusted by scale, and spray
Head translational speed can also adjust, whole device easy to use and flexible.
Brief description of the drawings
Fig. 1 is the structural perspective of the present invention,
Fig. 2 is front view of the invention in Fig. 1,
Fig. 3 is rotation axis structure diagram of the invention in Fig. 2,
Fig. 4 is the top view of suction tray in Fig. 3,
Fig. 5 is the schematic cross-section after the spin-coated processing of wafer,
Fig. 6 is schematic cross-section of the wafer after present invention processing in Fig. 1.
Wherein, 1 is electric cylinders, and 2 be trave lling girder, and 3 be fixed plate, and 4 be scale, and 5 be mounting bracket, and 6 be shower nozzle, and 7 be glue cup group
Part, 8 be Rotary adsorption mechanism, and 9 be suction tray, and 10 be bearing support, and 11 be substrate, and 12 be motor, and 13 be driving wheel, and 14 be branch
Block, 15 be driven pulley, and 16 be rotary shaft, and 17 be rotary slip ring, and 18 clamping screws, 19 be vacuum passage, and 20 be groove.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings.
As shown in Fig. 1~2, the present invention includes electric cylinders 1, fixed plate 3, scale 4, shower nozzle 6, glue cup component 7, Rotary adsorption machine
Structure 8 and substrate 11, wherein substrate 11 are installed on the equipment support body outside the present invention, and electric cylinders 1 are installed by a bearing support 10
On the substrate 11, the electric cylinders 1 are provided with trave lling girder 2, the trave lling girder 2 relative to the bearing support 10 length direction
It is vertically arranged, the trave lling girder 2 is provided with a fixed plate 3, and multiple scales 4 are arranged on the fixation by mounting bracket 5 respectively
On plate 3, a shower nozzle 6 is fixed with each lower end of scale 4, all shower nozzles 6 are by the drives edge X of electric cylinders 1 to synchronization
Translation.The electric cylinders 1 and shower nozzle 6 are commercial products, in the present embodiment, the model ICSA2-BA1H-I- of the electric cylinders 1
50-40-T2-5L-CT, manufacturer are IAI companies, the model 120-2-16-11-230-030 of the shower nozzle 6, factory
Family is SONO-TEK companies.
The mounting bracket 5 is installed in the fixed plate 3 by screw, and the mounting hole of each both sides of mounting bracket 5 is edge
The elongated hole that the length direction of trave lling girder 2 is set, the elongated hole is used to adjust distance between each mounting bracket 5, and then adjusts
The distance between each shower nozzle 6, as shown in figure 1, the mounting bracket 5 is provided with clamping screw 18, scale 4 is by along mounting bracket 5
The height of adjustment shower nozzle 6 is moved up and down, after the position of shower nozzle 6 determines, is withstood scale 4 admittedly by screwing the clamping screw 18
Fixed, the scale 4 is provided with scale in order to accurately adjust.
As shown in Fig. 2 the Rotary adsorption mechanism 8 includes suction tray 9, motor 12, transmission mechanism, rotary shaft 16 and rotation
Slip ring 17, wherein rotary shaft 16 are installed in rotation on the substrate 11 by the supporting of bearing piece 14, and the suction tray 9 is packed in
The rotary shaft 16 is located at one end of the upside of substrate 11, as shown in figure 1, the substrate 11 is provided with the glue cup for preventing that gluing from overflowing
Component 7, the suction tray 9 are arranged at the middle part of the glue cup component 7.The motor 12 is arranged on substrate 11 by a support
Downside is simultaneously connected by a transmission mechanism with the rotary shaft 16, and the transmission mechanism is belt wheel transmission mechanism, including is passed through
Conveyer belt connected driving wheel 13 and driven pulley 15, wherein driving wheel 13 are packed on the output shaft of motor 12, and driven pulley 15 is solid
In the rotary shaft 16, the rotary shaft 16 passes through the motor 12 driving rotation.
As shown in figure 3, vacuum passage 19 is provided with the rotary shaft 16, as shown in figure 4, the upside of the suction tray 9 is provided with
Groove 20, the gash depth 0.2mm~3mm, 0.5~5mm of width (obvious deformation do not occur to be defined) after adsorbing wafer, institute
Groove 20 is stated to communicate with the vacuum passage 19 in rotary shaft 16.As shown in Fig. 2 the lower end of rotary shaft 16 is slided by a rotation
Ring 17 is connected with vacuum line, the lower end of rotary shaft 16 be rotationally placed in the rotary slip ring 17 and the rotation
Turn slip ring 17 with rotary shaft 16 to be tightly connected, the rotary slip ring 17, which is installed on equipment support body and sealed with vacuum line, to be connected
It is logical.
The present invention operation principle be：
As shown in figure 5, in the prior art, there is a circle raised after the spin-coated processing of wafer at edge, cause the side of wafer
Edge can not utilize.
For the present invention after the wafer of processing to be sprayed is positioned on suction tray 9, multiple shower nozzles 6 drive level by electric cylinders 1
Synchronizing moving sprays photoresist, sprinkling photoresist is continuously scanned whole wafer surface, and then wafer is inhaled by the vacuum of suction tray 9
Attached fixation, multiple shower nozzles 6 drive horizontal synchronization movement that the photoresistance of atomization is uniformly sprayed onto into crystal column surface, glued membrane by electric cylinders 1
Thickness and uniformity can be adjusted by the translational speed of shower nozzle 6 and the fountain height of photoresistance, in order to reach the glued membrane of requirement thickness
Degree, possible primary coating can not meet, as shown in fig. 6, the present invention can be driven by electric cylinders 1 shower nozzle 6 it is multiple back and forth at the uniform velocity
It is mobile, the photoresistance that shower nozzle 6 sprays is formed multilayer laminate on wafer, so as to reach the thickness of demand, adsorbed every time before sprinkling
Disk 9 can drive wafer to rotate with Arbitrary Rotation, the path of sprinkling is mutually staggered and reach complementary, obtained so as to reach
The even more preferable film of property.The trave lling girder 2 of electric cylinders 1 is provided with fixed plate 3, and shower nozzle 6 is arranged at described by scale 4 and mounting bracket 5
In fixed plate 3, the distance between each shower nozzle 6 is adjusted by the elongated hole on mounting bracket 5, and the height of each shower nozzle 6 passes through scale 4
Accurate adjustment.
Claims (8)
1. thick glued membrane coating unit is made in a kind of semiconductor, it is characterised in that：Including electric cylinders (1), shower nozzle (6), glue cup component
(7), Rotary adsorption mechanism (8) and substrate (11), wherein electric cylinders (1) and glue cup component (7) may be contained within substrate (11), described
Electric cylinders (1) are provided with trave lling girder (2), and spacing and the adjustable shower nozzle (6) of height are arranged on the trave lling girder (2), the rotation
Turn adsorbing mechanism (8) to be provided with for adsorbing wafer and rotatable suction tray (9), the suction tray (9) is arranged at described
The middle part of glue cup component (7), the shower nozzle (6) are driven described when glued membrane coats by the trave lling girder (2) of the electric cylinders (1)
Suction tray (9) upper horizontal moves；
The shower nozzle (6) is arranged on the trave lling girder (2) of electric cylinders (1) by scale (4) and mounting bracket (5), the trave lling girder (2)
A fixed plate (3) is provided with, multiple mounting brackets (5) are arranged in the fixed plate (3), inserted on each mounting bracket (5)
There is scale with a scale (4), each scale (4) lower end is fixed with shower nozzle (6).
2. thick glued membrane coating unit is made in semiconductor according to claim 1, it is characterised in that：The mounting bracket (5) two
Side is provided with the elongated hole for being used for adjusting each mounting bracket (5) spacing.
3. thick glued membrane coating unit is made in semiconductor according to claim 1 or 2, it is characterised in that：The mounting bracket (5)
Clamping screw (18) is provided with, the shower nozzle (6) adjusts height, the scale by the scale (4) along mounting bracket (5) is mobile
(4) fixation is withstood by the clamping screw (18).
4. thick glued membrane coating unit is made in semiconductor according to claim 1, it is characterised in that：The Rotary adsorption mechanism
(8) motor (12), transmission mechanism and rotary shaft (16) are also included in addition to the suction tray (9), wherein rotary shaft (16) is rotatable
Ground is arranged on the substrate (11), and the motor (12) is located at substrate (11) downside and passes through the transmission mechanism and the rotation
Rotating shaft (16) is connected.
5. thick glued membrane coating unit is made in semiconductor according to claim 4, it is characterised in that：In the rotary shaft (16)
Provided with vacuum passage (19), be provided with groove (20) on the upside of the suction tray (9), the groove (20) with it is true in rotary shaft (16)
Empty passage (19) communicates, and rotary shaft (16) lower end is provided with a rotary slip ring (17), and the rotary shaft (16) is by described
Rotary slip ring (17) is connected with vacuum line.
6. thick glued membrane coating unit is made in semiconductor according to claim 4, it is characterised in that：The transmission mechanism is band
Wheel drive mechanism, including the driving wheel (13) and driven pulley (15) being connected by conveyer belt, wherein driving wheel (13) are packed in institute
On the output shaft for stating motor (12), driven pulley (15) is packed in the rotary shaft (16).
7. the painting method of thick glued membrane coating unit is made in the semiconductor according to claim 1~6 any claim, its
It is characterised by：Wafer to be processed is positioned on suction tray (9), and multiple shower nozzles (6) drive level of synchronization to move by electric cylinders (1)
Photoresist is sprayed, then wafer is adsorbed by suction tray (9) and fixed, and multiple shower nozzles (6) drive level of synchronization to move by electric cylinders (1)
The photoresistance of dynamic sprinkling atomization.
8. the painting method of thick glued membrane coating unit is made in semiconductor according to claim 7, it is characterised in that：The spray
Head (6) repeatedly moves back and forth the photoresistance of sprinkling atomization by electric cylinders (1) driving, and wafer passes through suction tray (9) band before sprinkling every time
Dynamic rotation.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410803593.5A CN105772323B (en) | 2014-12-18 | 2014-12-18 | Thick glued membrane coating unit and its application method is made in a kind of semiconductor |
| TW104109137A TWI515515B (en) | 2014-12-18 | 2015-03-23 | A semiconductor film making thick film coating apparatus and a method of using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410803593.5A CN105772323B (en) | 2014-12-18 | 2014-12-18 | Thick glued membrane coating unit and its application method is made in a kind of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105772323A CN105772323A (en) | 2016-07-20 |
| CN105772323B true CN105772323B (en) | 2018-02-02 |
Family
ID=55640279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410803593.5A Active CN105772323B (en) | 2014-12-18 | 2014-12-18 | Thick glued membrane coating unit and its application method is made in a kind of semiconductor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105772323B (en) |
| TW (1) | TWI515515B (en) |
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| CN106252262A (en) * | 2016-10-09 | 2016-12-21 | 无锡宏纳科技有限公司 | The spray structure of wafer |
| CN106646952A (en) * | 2017-01-23 | 2017-05-10 | 深圳市华星光电技术有限公司 | Rotary spray head and wet etching machine |
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| CN109807003A (en) * | 2017-11-20 | 2019-05-28 | 沈阳芯源微电子设备股份有限公司 | A kind of glue spreader |
| CN107930917A (en) * | 2017-12-21 | 2018-04-20 | 上海华力微电子有限公司 | A kind of photoresist coating system and method |
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| CN112558418A (en) * | 2020-12-16 | 2021-03-26 | 上海华力微电子有限公司 | Photoresist coating device |
| CN113380666B (en) * | 2021-04-28 | 2022-08-09 | 华研伟福科技(深圳)有限公司 | Device for multilayer composite film passivation structure of table-board high-power semiconductor device |
| CN113385397B (en) * | 2021-06-21 | 2022-06-03 | 杭州美迪凯光电科技股份有限公司 | Coating process integrating dispensing and spin coating of lens film |
| CN113993295B (en) * | 2021-10-13 | 2023-04-25 | 苏州康尼格电子科技股份有限公司 | PCBA board packaging equipment |
| CN114082575B (en) * | 2021-11-04 | 2022-07-29 | 江苏绿派环保科技有限公司 | Multifunctional automatic spraying device |
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| CN1721082A (en) * | 2004-07-12 | 2006-01-18 | 株式会社东芝 | Coating apparatus and coating method |
| CN101905205A (en) * | 2009-06-08 | 2010-12-08 | 株式会社东芝 | Film formation device and film build method |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201624140A (en) | 2016-07-01 |
| CN105772323A (en) | 2016-07-20 |
| TWI515515B (en) | 2016-01-01 |
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