CN105762093B - Processing chamber and judge wafer position on pallet whether Yi Chang method - Google Patents
Processing chamber and judge wafer position on pallet whether Yi Chang method Download PDFInfo
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- CN105762093B CN105762093B CN201410787483.4A CN201410787483A CN105762093B CN 105762093 B CN105762093 B CN 105762093B CN 201410787483 A CN201410787483 A CN 201410787483A CN 105762093 B CN105762093 B CN 105762093B
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Abstract
The present invention a kind of processing chamber is provided and judge wafer position on pallet whether Yi Chang method comprising pallet, driving unit and detection unit, driving unit is for driving pallet to rotate；Detection unit is arranged in above pallet at preset first test point, for detecting the vertical interval between the first test point and each point of intersection of tray surface when pallet bearing wafer rotates rotation angle corresponding with each intersection point；Judge whether vertical range corresponding to each intersection point exceeds preset distance threshold, if so, determining the chip in mounting groove corresponding with the intersection point, the edge of mounting groove is stretched out in inclination in the part of the intersection point side.Processing chamber provided by the invention not only can directly judge that " scrap (bridge) " phenomenon occurs in the which side of the chip in which mounting groove, but also can be informed in whether the process that manipulator places chip " scrap (bridge) " phenomenon occurs.
Description
Technical field
The present invention relates to semiconductor processing technology fields, and in particular, to a kind of processing chamber and judges crystalline substance on pallet
Piece position whether Yi Chang method.
Background technique
In the manufacturing process of semiconductor devices, usually place the wafer in the clean container of sealing or film magazine, and
It carries out picking and placing piece operation automatically between the container or film magazine and processing chamber using manipulator, to prevent foreign particle to chip
Pollution.For example, chemical vapor deposition (Chemical Vapor Deposition, CVD) equipment, general in processing chamber
All over using pallet bearing wafer is carried out, which generally is round, and is provided on pallet circumferential evenly arranged more along it
A mounting groove, to limit the position of chip.In addition, pallet is connect with rotating electric machine, and make under the driving of the rotating electric machine
Rotary motion.When progress manipulator carries out picking and placing piece operation, first under the drive of the motor, pallet rotates a certain angle,
So that one of mounting groove is located at specified pick-and-place piece position；Manipulator is moved to the surface of the mounting groove, to be taken
The operation of piece or film releasing.
But during rotating electric machine driving pallet rotation, often it will appear because between pallet and rotating electric machine
The problem of skidding and pallet is not operated synchronously with rotating electric machine, occurs for connector.For example, rotating electric machine has operated 2000
A pulse, but due to above-mentioned skidding, pallet is caused only to operate 1950 pulses, this rotate to pallet can not
Corresponding target position, to may go out because of chip relative to the position of mounting groove during manipulator places chip
Show deviation and " scrap (bridge) " phenomenon occur, this " scrap (bridge) " phenomenon specifically refers to: being provided with mounting groove on pallet, chip is normal
In the case of be located at the mounting groove in；Also, on pallet, and the part for being located at mounting groove periphery is low with one in thickness direction
In the step of tray upper surface, to prevent the chip being placed in mounting groove to be detached from mounting groove.
On the basis of this structure, manipulator often will appear following two improper feelings during placing chip
Condition: in the first abnormal condition, the center of chip shifts relative to the center of mounting groove, and the right part of chip
It rides on step；In second of abnormal condition, the center of chip shifts relative to the center of mounting groove, and its offset
It is bigger relative to the first abnormal condition, so that the right part of chip rides on the upper surface of pallet.It is above-mentioned in appearance
When two kinds of abnormal conditions, it is easy to appear silicon slags after technique for the chip after scrap (bridge), and resistivity and the thickness uniformity is caused to become
Difference, while will increase the difficulty that manipulator takes piece, it is easy to cause impression on silicon wafer, directly affects the yield of equipment.
Whether current semiconductor processing equipment can only be by occurring to skid come indirectly between detection rotating electric machine and pallet
Judge whether chip above-mentioned " scrap (bridge) " phenomenon occurs.But this method does not simply fail to determine which mounting groove in pallet be in
Chip occur scrap (bridge), and can not be informed in manipulator place chip process whether there is above-mentioned " scrap (bridge) " phenomenon.
Summary of the invention
The present invention is directed at least solve one of the technical problems existing in the prior art, proposes a kind of processing chamber and sentence
Wafer position on disconnected pallet whether Yi Chang method, not only can directly judge the chip in which mounting groove where
There is " scrap (bridge) " phenomenon in side, and can be informed in whether the process that manipulator places chip " scrap (bridge) " phenomenon occurs.
A kind of processing chamber, including pallet are provided to achieve the purpose of the present invention, are provided on the pallet multiple
It is uniformly distributed for placing the mounting groove of chip, and along its circumferential direction, further includes driving unit and detection unit, wherein the drive
Moving cell is for driving the pallet to rotate；The detection unit is arranged in preset first test point above the pallet
Place, first test point is when the driving unit drives pallet rotation, the corresponding circle on the tray surface
Track and each mounting groove are crossed to form two intersection points；The detection unit be used for the pallet bearing wafer rotation with it is each
When the corresponding rotation angle of intersection point, detect between vertical between first test point and each point of intersection of the tray surface
Away from；Judge whether vertical range corresponding to each intersection point exceeds preset distance threshold, if so, determination is corresponding with the intersection point
Mounting groove in chip, in the part of the intersection point side, the edge of the mounting groove is stretched out in inclination.
Preferably, the distance threshold is the range upper limit value or Lower Range value of the detection unit；In the support
When load of circling or whirl in the air rotates, the vertical interval between first test point and each point of intersection of the tray surface is located at the detection
In intermediate range in the range of unit.
Preferably, the processing chamber further includes control unit, and described control unit is for receiving by the detection unit
Vertical range corresponding to each intersection point sent, and judge whether the vertical range exceeds preset distance threshold, if
It is, it is determined that the chip in mounting groove corresponding with the intersection point, in the part of the intersection point side, the peace is stretched out in inclination
Put the edge of slot.
Preferably, on the tray upper surface, and it is located on the outside of the mounting groove and is provided with origin mark part, it is described
Origin mark part is corresponding with the origin position of the pallet；Also, guide rail is provided with above the pallet, the guide rail edge
The pallet radially extends；The detection unit is arranged on the guide rail, and can be moved to described first along the guide rail
Test point or the second test point；Second test point is arranged above the pallet, and is located at and the origin mark part
At the corresponding position of place circumference；The detection unit be located at second test point when, for when the pallet from its
When origin position rotates a circle, the vertical interval between second test point and the tray surface is detected；Judge that this is vertical
Whether spacing is equal to the vertical interval of second test point and the tray surface between the origin mark part, if
It is, it is determined that the pallet does not skid；If not, it is determined that the pallet skids.
Preferably, on the tray upper surface, and it is located on the outside of the mounting groove and is provided with origin mark part, it is described
Origin mark part is corresponding with the origin position of the pallet；Also, the processing chamber further includes origin detection unit, is set
Set above the pallet at preset second test point, second test point be located at and the origin mark part where circumference
At corresponding position；The origin detection unit is used for when the pallet rotates a circle from its origin position, described in detection
Vertical interval between second test point and the tray surface；Judge the vertical interval whether be equal to second test point with
Vertical interval of the tray surface between the origin mark part, if so, determining that the pallet does not skid；If it is not,
Then determine that the pallet skids.
Preferably, the origin mark part is the notch being recessed from the tray surface, or for through the logical of its thickness
Hole.
Preferably, the detection unit is laser distance sensor.
Preferably, the driving unit includes stepper motor, and the stepper motor under the control of pulse signal for driving
Move the pallet rotation predetermined angle；According to the number of pulses of the pulse signal judge the pallet whether rotate to it is each
The corresponding rotation angle of intersection point.
As another technical solution, the present invention also provides a kind of wafer position judged on pallet whether Yi Chang side
Method is provided with multiple mounting grooves for being used to place chip on the pallet, and is uniformly distributed along its circumferential direction, and the mounting groove is used
In placement chip comprising following steps:
The first test point is preset above the pallet, first test point drives the pallet in the driving unit
When rotation, the corresponding circular trace on the tray surface and each mounting groove are crossed to form two intersection points；
Driving carries the pallet rotation of chip；
When the pallet rotates rotation angle corresponding with each intersection point, first test point and the pallet are detected
Vertical interval between each point of intersection in surface；
Judge whether vertical range corresponding to each intersection point exceeds preset distance threshold, if so, the determining and friendship
Chip in the corresponding mounting groove of point, in the part of the intersection point side, the edge of the mounting groove is stretched out in inclination.
Preferably, the distance threshold is the range upper limit value or Lower Range value of the detection unit；In the support
When load of circling or whirl in the air rotates, the vertical interval between first test point and each point of intersection of the tray surface is located at the detection
In intermediate range in the range of unit.
The invention has the following advantages:
Processing chamber provided by the invention, presets the first test point above pallet, which is utilizing drive
When moving cell drives pallet rotation, the corresponding circular trace on tray surface and each mounting groove are crossed to form two intersection points；
By, when pallet bearing wafer is rotated to rotation angle corresponding with each intersection point, detecting first detection using detection unit
Vertical interval between point and each point of intersection of tray surface, and send it to control unit；Control unit for judge by
Whether vertical range corresponding to each intersection point that detection unit is sent exceeds preset distance threshold, if so, determining
Chip in mounting groove corresponding with the intersection point, in the part of the intersection point side, the side of the mounting groove is stretched out in inclination
Edge.It not only can directly judge that " scrap (bridge) " phenomenon occurs in the which side of the chip in which mounting groove as a result, but also can be with
It is informed in whether the process that manipulator places chip " scrap (bridge) " phenomenon occurs.
The wafer position provided by the invention judged on pallet whether Yi Chang method, which not only can directly judge
There is " scrap (bridge) " phenomenon in the which side of chip in one mounting groove, and the process that can be informed in manipulator placement chip is
No appearance " scrap (bridge) " phenomenon.
Detailed description of the invention
Fig. 1 is a kind of top view of processing chamber provided in an embodiment of the present invention；
Fig. 2A is the top view of the pallet of processing chamber provided in an embodiment of the present invention；
Fig. 2 B is the partial sectional view of the pallet of processing chamber provided in an embodiment of the present invention；
Fig. 3 is the top view of another processing chamber provided in an embodiment of the present invention；And
Fig. 4 be the wafer position provided in an embodiment of the present invention judged on pallet whether Yi Chang method.
Specific embodiment
To make those skilled in the art more fully understand technical solution of the present invention, come with reference to the accompanying drawing to the present invention
Whether Yi Chang method is described in detail for the processing chamber of offer and the wafer position for judging on pallet.
Fig. 1 is a kind of top view of processing chamber provided in an embodiment of the present invention.Fig. 2A is provided in an embodiment of the present invention
The top view of the pallet of processing chamber.Also referring to Fig. 1 and Fig. 2A, processing chamber 10 includes pallet 21, driving unit and inspection
Survey unit 12.Wherein, pallet 21 is arranged in processing chamber 10, and multiple peaces for being used to place chip are provided on pallet 21
Slot 22 is put, and along the circumferential uniformly arrangement of the pallet 21.Driving unit (not shown) passes through for driving pallet 21 to rotate
The pallet 21 is rotated, each mounting groove 22 can be made to be located at the pick-and-place piece position of manipulator one by one, to utilize manipulator will
Chip is transmitted in mounting groove 22, or takes out chip from the mounting groove 22.
Preferably, Fig. 2 B is the partial sectional view of the pallet of processing chamber provided in an embodiment of the present invention, as shown in Figure 2 B,
Pallet 21, which is located at the part on 22 periphery of mounting groove, has the step 23 for being lower than 21 upper surface of pallet in thickness direction, with to prevent
The chip 24 being only placed in mounting groove 22 is detached from mounting groove 21, to be conducive to improve production efficiency and technology stability.
Detection unit 12 is arranged above pallet 21, as shown in Figure 1, in the present embodiment, in the chamber of processing chamber 10
Top is provided with see-through medium window 11, and detection unit 12 is arranged above medium window 11, and is located at preset first detection
At point, which accordingly forms circular trace when driving unit driving pallet 21 rotates on tray surface
121, as shown in Figure 2 A, the circular trace 121 and each mounting groove 22 are crossed to form two intersection points, and the present embodiment is inverse with pallet 21
For hour hands rotation, in two intersection points, the intersection point for being located at front is known as the first intersection point 221；The intersection point being located behind is claimed
For the second intersection point 222.
Detection unit 12 is used for the detection first when 21 bearing wafer of pallet rotates rotation angle corresponding with each intersection point
Vertical interval between test point and each point of intersection of tray surface.So-called rotation angle corresponding with each intersection point, refers to support
Disk rotates to one of intersection point the lower section for being located at the first test point from its origin position, that is, the intersection point and the first test point it
Between line perpendicular to tray surface when, the rotation angle of pallet 21.The rotation angle of pallet 21 can obtain in the following ways
, it may be assumed that driving unit includes stepper motor, which is used to drive pallet to rotate preset angle under the control of pulse signal
Degree；Also, judge whether pallet 21 rotates to rotation angle corresponding with each intersection point according to the number of pulses of the pulse signal,
That is, the corresponding different number of pulses of each intersection point, the number of pulses can be obtained and debugging in advance.When
So, in practical applications, the rotation angle corresponding with each intersection point of pallet can also be obtained using other modes.Detection unit
12 can be laser distance sensor, to emit optical signal vertically towards pallet through medium window 11 from the first test point,
And it is each with tray surface can to obtain the first test point according to the reflection signal for reflection signal of the reception from tray surface
Vertical interval between point of intersection.
Preferably, above-mentioned preset distance threshold can be the range upper limit value or Lower Range value of detection unit 12；
Meanwhile in the unloaded rotation of pallet 21, the vertical interval between the first test point and each point of intersection of tray surface is located at detection
In intermediate range in the range of unit 12.Furtherly, when the edge of mounting groove 22, meeting are stretched out in a part inclination of chip
The intersection point where the edge is covered, the optical signal that detection unit 12 is emitted at this time is radiated on chip；When chip does not extend out this
When the edge of mounting groove 22, the optical signal that detection unit 12 is emitted at this time is radiated at the edge of mounting groove 22.Due to chip table
The reflectivity in face is greater than the reflectivity of tray surface, therefore, can be in chip by selecting the detection unit 12 of suitable range
When the edge of mounting groove 22 is stretched out in a part inclination, the reading of detection unit 12 is made to reach the upper limit or lower limit of its range；
Meanwhile when chip does not extend out the edge of the mounting groove 22, the reading of detection unit 12 is made to float up and down in some median,
So as to realize the discrimination to above-mentioned two situations.For example, if the range of detection unit 12 is 90mm~120mm；Work as chip
A part inclination when stretching out the edge of mounting groove 22, the reading of detection unit 12 is 90mm or 120mm；When chip does not extend out this
When the edge of mounting groove 22, the reading of detection unit 12 changes in the normal range (NR) of 5mm or so above or below 109mm.It needs to illustrate
, in practical applications, when the optical signal that detection unit is emitted is radiated on chip, because wafer surface reflectivity compared with
Greatly, the practical vertical interval at this time between the first test point and intersection point often exceeds the range of detection unit 12, and is not equal to
The upper limit or lower limit of the range, in this case, the reading of detection unit 12 can not be equal to the first test point and hand over
Point between practical vertical interval, but this have no effect on judge chip whether scrap (bridge).
It by taking pallet 21 in Fig. 2A as an example, rotates counterclockwise, and a mounting groove 22 for being located at 21 rightmost side of pallet,
Pallet 21 rotates counterclockwise, and in two intersection points, the intersection point for being located at front is known as the first intersection point 221；The friendship that will be located behind
Point is known as the second intersection point 222.
When chip is normally put into above-mentioned mounting groove 22, the first test point respectively with the first intersection point 221 and the second intersection point
Vertical interval between 222 is all recorded as L；When in the part of 221 side of the first intersection point, mounting groove 22 is stretched out in inclination to chip
Edge, that is, when chip is ridden over forward on step 23 or tray upper surface, between the first test point and the first intersection point 221
Vertical interval is recorded as H；When chip is at the edge of the part of 222 side of the second intersection point inclination stretching mounting groove 22, that is, brilliant
Vertical interval record when piece is ridden over backward on step 23 or tray upper surface, between the first test point and the second intersection point 222
For H.Vertical range and chip are listed in table 1, and whether there is or not the corresponding relationships of scrap (bridge).
Table 1
After detecting the vertical interval between the first test point and each point of intersection of tray surface using detection unit,
The vertical interval is compared with the range of detection unit, and above-mentioned table 1 is inquired according to comparison result, with each placement of determination
Chip in slot 22 whether scrap (bridge), and can be determined that the which side scrap (bridge) of the chip in which mounting groove 22.It completes all
After the scrap (bridge) of chip checks in mounting groove 22, the examination and maintenance in later period can be carried out according to the scrap (bridge) situation of each chip
Operation.For example, if all there is the case where scrap (bridge) in the chip in all mounting grooves 22, and scrap (bridge) situation be all rule consistently before
Take or after take, then need to check the case where connector between driving unit and pallet is with the presence or absence of damage, and need weight
The new flatness for checking pallet.If only the case where there are scrap (bridge)s of the chip in individual mounting grooves 22, needing to check corresponding peace
Put whether the number of pulses that the chip in slot 22 is configured needs to adjust, the umber of pulse configured to the mounting groove 22 taken before presence
Value is increased, and the number of pulses configured to the mounting groove 22 taken after presence is reduced.The increment of specific number of pulses
Or decrement can determine according to the actual situation.
It should be noted that in practical applications, detecting that the first test point and tray surface are each using detection unit
After vertical interval between a point of intersection, whether the chip in each mounting groove 22 can also be judged automatically using control unit
Scrap (bridge).Specifically, processing chamber further includes control unit, and detection unit is detecting the first test point and each friendship of tray surface
After vertical interval between point, which is sent to control unit, the control unit for judge this vertically away from
From whether preset distance threshold is exceeded, if so, the chip in mounting groove corresponding with the intersection point is determined, in the intersection point institute
The edge of mounting groove is stretched out in part inclination in side.
In the present embodiment, on the upper surface of pallet 21, and the outside for being located at mounting groove 22 is provided with origin mark part
31, as shown in Figure 2 A, the origin mark part 31 is corresponding with the origin position of pallet 22, can be to be recessed from tray surface
Notch, or for through the through-hole of its thickness.Moreover, above medium window 11, and be located at preset second test point and be arranged
There is origin detection unit 14, which is located at position corresponding with 31 place circumference of origin mark part, so that former
Point identification portion 31 can when pallet is rotated lower section by origin detection unit 14；Origin detection unit 14 is used to work as pallet 32
When rotating a circle from its origin position, the vertical interval between second test point and tray surface is detected, that is, detection origin mark
Knowledge portion 31 circumferentially each position vertical interval, origin detection unit 14 can be laser distance sensor.Due to original
Point identification portion 31 is the notch being recessed from tray surface, or for through the through-hole of its thickness, this make origin mark part 31 with
Vertical interval between second test point is different relative to the other positions of tray surface, rotates as a result, in pallet to making the original
When point identification portion 31 is located at the lower section of origin detection unit 14, origin detection unit 14 can recognize that the origin mark part 31,
So as to know whether pallet 21 reaches origin position.Specific identification method are as follows: the second test point of detection and pallet in advance
Vertical interval of the surface between origin mark part；Then stop after so that pallet 32 is rotated a circle from its origin position, again
Detect the vertical interval between the second test point and tray surface, and compare the vertical interval whether be equal in advance it is detected
Vertical interval, if so, determining that pallet does not skid；If not, it is determined that pallet skids.
Preferably, above-mentioned detection unit 12 is used as to the range sensor for identifying the origin mark part 31, to reduce equipment
Cost.Specific implementation are as follows: Fig. 3 is the top view of another processing chamber provided in an embodiment of the present invention.As shown in figure 3,
Guide rail 13 is provided with above pallet 21, which extends along the radial direction (X-direction as shown in Figure 3) of pallet 21；Detection
Unit 12 is arranged on guide rail 13, and above-mentioned first test point or the second test point can be moved to along guide rail 13.
When detection unit 12 is located at above-mentioned first test point, the first test point and each friendship of tray surface can detecte
Vertical interval between point, with judge the chip in each mounting groove 22 whether scrap (bridge).When detection unit 12 is positioned at upper
When stating the second test point, the second test point and tray surface can be detected when pallet 21 rotates a circle from its origin position
Between vertical interval, with judge determine pallet whether skid.
In practical applications, processing chamber provided by the invention can also be informed in manipulator place chip process whether
There is " scrap (bridge) " phenomenon.It, can be to each that is, in manipulator to after mounting groove film releasing, or before taking piece from mounting groove
Chip in mounting groove carries out a scrap (bridge) inspection, piece operation is picked and placed to ensure that manipulator can be normally carried out, so as to mention
Height picks and places the success rate of piece, and then yields can be improved.
In conclusion processing chamber provided by the invention, not only can directly judge the crystalline substance in which mounting groove
There is " scrap (bridge) " phenomenon in the which side of piece, and can be informed in whether the process that manipulator places chip " scrap (bridge) " occurs now
As.
As another technical solution, whether the embodiment of the present invention also provides a kind of wafer position judged on pallet abnormal
Method, can apply in above-mentioned processing chamber provided in an embodiment of the present invention, comprising the following steps:
Firstly, presetting the first test point above pallet, first test point is right in driving unit driving pallet rotation
Two intersection points should be crossed to form with each mounting groove in the circular trace on tray surface.
Drive pallet rotation；
When pallet is rotated to rotation angle corresponding with each intersection point, detects first test point and tray surface is each
Vertical interval between point of intersection；
Judge whether vertical range corresponding to each intersection point exceeds preset distance threshold, if so, the determining and friendship
Chip in the corresponding mounting groove of point, in the part of the intersection point side, the edge of the mounting groove is stretched out in inclination.
A specific embodiment of the above method is described in detail below.Specifically, Fig. 4 mentions for the embodiment of the present invention
The wafer position of confession judged on pallet whether Yi Chang method.Referring to Fig. 4, judging whether the wafer position on pallet is abnormal
Method, comprising the following steps:
Current pocket ID (serial number of mounting groove) initial value is set to 1 by S1, that is, one of mounting groove is selected, if
Its fixed serial number 1, and the serial number of each mounting groove on pallet is successively set as 2~n towards the direction of rotation of pallet, n is peace
The sum of slot is put, the present embodiment is by taking the sum of mounting groove is 5 as an example.It is readily appreciated that, every inspection for completing a mounting groove, then
Start to carry out the inspection of next mounting groove, that is, pocket ID adds 1.
S2, judges whether pocket ID is less than or equal to 5, if so, process enters step S3；If it is not, then process terminates,
That is, the equal inspected of all mounting grooves finishes.
S3 rotates rotation angle corresponding with the first intersection point of pocket ID in pallet, and the first intersection point is (in pallet at this time
Direction of rotation on be located at mounting groove on front side of intersection point) be located at the first test point lower section when, detect and record this first detection
Vertical interval between point and the first point of intersection of tray surface；
S4 rotates rotation angle corresponding with the second intersection point of pocket ID in pallet, and the second intersection point is (in pallet at this time
Direction of rotation on be located at mounting groove on rear side of intersection point) be located at the first test point lower section when, detect and record this first detection
Vertical interval between point and the second point of intersection of tray surface；
S5, judges whether two vertical intervals obtained in step S3 and step S4 exceed preset safety threshold respectively
Value, if so, process enters step S6；If it is not, then process enters step S7.
Whether the vertical interval in S6, judgment step S5 beyond secure threshold is between the first test point and the first intersection point
Vertical range, if it is not, then process enters step S7；If so, process enters step S8.
S7 determines that chip stretches out the edge of mounting groove in the inclination of the part of the first intersection point side, that is, chip is taken forward
On step or tray upper surface, and issue alarm signal；Then process return step S2.
S8 determines that chip stretches out the edge of mounting groove in the inclination of the part of the second intersection point side, that is, chip is taken backward
On step or tray upper surface, and issue alarm signal；Then process return step S2.
Preferably, above-mentioned preset distance threshold can be the range upper limit value or Lower Range value of detection unit；Together
When, in pallet zero load rotation, the vertical interval between the first test point and each point of intersection of tray surface is located at detection unit
In intermediate range in 12 range, in this way, can directly judge chip with the degree of self-test unit, whether there is or not scrap (bridge)s.For example,
If the range of detection unit 12 is 90mm~120mm；When the edge of mounting groove 22 is stretched out in a part inclination of chip, detection is single
The reading of member 12 is 90mm or 120mm when chip does not extend out the edge of the mounting groove 22, and the reading of detection unit 12 is in 109mm
Variation in the normal range (NR) of upper and lower 5mm or so.
In conclusion the above-mentioned wafer position judged on pallet provided in an embodiment of the present invention whether Yi Chang method,
It not only can directly judge that " scrap (bridge) " phenomenon occurs in the which side of the chip in which mounting groove, but also machine can be informed in
Whether the process that tool hand places chip there is " scrap (bridge) " phenomenon.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, essence of the invention is not being departed from
In the case where mind and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of processing chamber, including pallet are provided with multiple mounting grooves for being used to place chip on the pallet, and along it
It is circumferentially uniformly distributed, which is characterized in that further include driving unit and detection unit, wherein
The driving unit is for driving the pallet to rotate；
The detection unit is arranged in above the pallet at preset first test point, and first test point is described
When driving unit drives pallet rotation, the corresponding circular trace on the tray surface is crossed to form with each mounting groove
Two intersection points；The detection unit is used for the inspection when the pallet bearing wafer rotates rotation angle corresponding with each intersection point
Survey the vertical interval between first test point and each point of intersection of the tray surface；
Judge whether vertical range corresponding to each intersection point exceeds preset distance threshold, if so, the determining and intersection point pair
The chip in mounting groove answered, in the part of the intersection point side, the edge of the mounting groove is stretched out in inclination.
2. processing chamber according to claim 1, which is characterized in that the distance threshold is the range of the detection unit
Upper limit value or Lower Range value；
Vertical interval in pallet zero load rotation, between first test point and each point of intersection of the tray surface
In the intermediate range in the range of the detection unit.
3. processing chamber according to claim 1, which is characterized in that the processing chamber further includes control unit,
Described control unit be used to receive by the detection unit send from each intersection point corresponding to vertical range, and sentence
Whether the vertical range of breaking exceeds preset distance threshold, if so, determine the chip in mounting groove corresponding with the intersection point,
In the part of the intersection point side, the edge of the mounting groove is stretched out in inclination.
4. processing chamber according to claim 2 or 3, which is characterized in that on the tray upper surface, and be located at described
Origin mark part is provided on the outside of mounting groove, the origin mark part is corresponding with the origin position of the pallet；Also,
It is provided with guide rail above the pallet, the guide rail is radially extended along the pallet；
The detection unit is arranged on the guide rail, and first test point or the second inspection can be moved to along the guide rail
Measuring point；Second test point is arranged above the pallet, and is located at corresponding with circumference where the origin mark part
At position；The detection unit is when being located at second test point, for rotating a circle when the pallet from its origin position
When, detect the vertical interval between second test point and the tray surface；
Judge whether the vertical interval is equal to second test point and the tray surface between the origin mark part
Vertical interval, if so, determining that the pallet does not skid；If not, it is determined that the pallet skids.
5. processing chamber according to claim 2 or 3, which is characterized in that on the tray upper surface, and be located at described
Origin mark part is provided on the outside of mounting groove, the origin mark part is corresponding with the origin position of the pallet；Also, institute
Stating processing chamber further includes origin detection unit, and setting is above the pallet at preset second test point, and described second
Test point is located at position corresponding with circumference where the origin mark part；
The origin detection unit is used for when the pallet rotates a circle from its origin position, detect second test point with
Vertical interval between the tray surface；
Judge whether the vertical interval is equal to second test point and the tray surface between the origin mark part
Vertical interval, if so, determining that the pallet does not skid；If not, it is determined that the pallet skids.
6. processing chamber according to claim 5, which is characterized in that the origin mark part is recessed from the tray surface
Into notch, or for through the through-hole of its thickness.
7. processing chamber according to claim 2 or 3, which is characterized in that the detection unit is laser distance sensor.
8. processing chamber according to claim 1, which is characterized in that the driving unit includes stepper motor, the step
It is used to drive the pallet rotation predetermined angle under the control of pulse signal into motor；
Judge whether the pallet rotates to rotation angle corresponding with each intersection point according to the number of pulses of the pulse signal.
9. a kind of wafer position judged on pallet whether Yi Chang method, be provided on the pallet multiple for placing crystalline substance
The mounting groove of piece, and be uniformly distributed along its circumferential direction, the mounting groove is for placing chip, which comprises the following steps:
Above the pallet preset the first test point, first test point driving unit drive the pallet rotation when,
The corresponding circular trace on the tray surface and each mounting groove are crossed to form two intersection points；
Driving carries the pallet rotation of chip；
When the pallet rotates rotation angle corresponding with each intersection point, first test point and the tray surface are detected
Vertical interval between each point of intersection；
Judge whether vertical range corresponding to each intersection point exceeds preset distance threshold, if so, the determining and intersection point pair
The chip in mounting groove answered, in the part of the intersection point side, the edge of the mounting groove is stretched out in inclination.
10. the wafer position according to claim 9 judged on pallet whether Yi Chang method, which is characterized in that it is described
Distance threshold is the range upper limit value or Lower Range value of the detection unit；
Vertical interval in pallet zero load rotation, between first test point and each point of intersection of the tray surface
In the intermediate range in the range of the detection unit.
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| CN108899288B (en) * | 2018-07-20 | 2020-11-13 | 上海华虹宏力半导体制造有限公司 | Wafer mark monitoring method and method for judging alignment position of laser marking machine |
| CN110797277B (en) * | 2018-08-01 | 2022-05-27 | 北京北方华创微电子装备有限公司 | Silicon wafer position detection method and device and semiconductor processing equipment |
| CN111288889B (en) * | 2020-01-17 | 2022-08-16 | 北京北方华创微电子装备有限公司 | Position detection device and position detection method of chamber process assembly |
| CN111501099A (en) * | 2020-04-26 | 2020-08-07 | 北京北方华创微电子装备有限公司 | Semiconductor processing equipment |
| CN112151423A (en) * | 2020-10-09 | 2020-12-29 | 西安奕斯伟硅片技术有限公司 | Method and system for depositing back sealing film on silicon wafer |
| CN115332136B (en) * | 2022-10-12 | 2022-12-27 | 芯三代半导体科技(苏州)有限公司 | Transmission device for wafer and tray combination and control method |
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| JPH11330204A (en) * | 1998-05-20 | 1999-11-30 | Mitsubishi Electric Corp | Wafer parallelism measuring equipment |
| KR20070053540A (en) * | 2005-11-21 | 2007-05-25 | 삼성전자주식회사 | Bake apparatus |
| JP5593384B2 (en) * | 2010-06-01 | 2014-09-24 | パナソニック株式会社 | Plasma processing apparatus and plasma processing method |
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| CN102738028A (en) * | 2011-04-07 | 2012-10-17 | 旺宏电子股份有限公司 | System for detecting chip inclination |
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