CN105758891A - Performance detection method of PCB - Google Patents
Performance detection method of PCB Download PDFInfo
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- CN105758891A CN105758891A CN201510424811.9A CN201510424811A CN105758891A CN 105758891 A CN105758891 A CN 105758891A CN 201510424811 A CN201510424811 A CN 201510424811A CN 105758891 A CN105758891 A CN 105758891A
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Abstract
The invention discloses a performance detection method of a PCB.The method includes: under a welding condition, detecting the resistance variation condition of a to-be-detected blind hole, and judging the reliability of the to-be-detected blind hole according to the detection result.The performance detection method has the advantages that the method can effectively identify the reliability risks of the PCB blind hole, and the quality of the PCB product can be increased; the method is simple to operate and high in monitoring reliability; the method can detect the reliability of the blind hole without destroying the product, product consumption is reduced, the detection is performed on a detection sample, and influence on the actual product is avoided; the method can detect one metalized blind hole and a blind hole chain formed by a plurality of metalized blind holes and is high in detection flexibility and high in efficiency, the blind hole reliability is judged according to the resistance variation percentage, and the method is not influenced by the materials and structures of the metalized blind hole and is high in universality.
Description
Technical field
The present invention relates to printed circuit board and processing detection technique field thereof, relate to the method for testing performance of a kind of PCB, particularly relate to a kind of PCB metalized blind vias reliability checking method.
Background technology
Demand along with electronics techniques development and multifunction, multi-layer PCB arises at the historic moment, and its Main Function has: improves product overall performance, larger production packing density, reduction small product size and weight, increasing area of dissipation, strengthens the safety of surface element device and meet the demand of communication product high speed high information quantity.
Multi-layer PCB just needs to carry out hole metallization after being typically in boring, plated through-hole quality is closely bound up with multi-layer sheet quality and reliability, and plated through-hole plays a part multilayer printed-wiring electric interconnection.The metal part of plated through-hole plays a part electrical connection, due to the impact of processing technique in its metallization processes, metallization quality cannot be completely same, therefore the electrical connection performance of some plated through-hole can be poor, in the process that plated through-hole is welded, additionally often cause the damage of plated through-hole, also result in plated through-hole electrical connection performance not good, affect the quality of PCB product, therefore need in process of production the quality of plated through-hole is detected.
The detection mode monitoring PCB manual welding blind hole reliability at present is that this method has following weak point by, after related reliability test condition, carrying out plain grinding sections observation blind via bottom cracks:
1) for the blind hole micro-crack with security risk, after plain grinding is cut into slices, due to copper ductility reason, it is difficult to observe that micro-crack exists；
2) plain grinding blind hole section length consuming time, and require height to grinding microtomy.
Summary of the invention
It is an object of the invention to: the method for testing performance of a kind of PCB is provided, for detecting the quality of blind hole after metalized blind vias manual welding.
For reaching this purpose, the present invention by the following technical solutions:
The method for testing performance of a kind of PCB is provided, under soldering conditions the change in resistance situation of blind hole to be detected is detected, judge the reliability of blind hole to be detected according to testing result.
As a kind of optimal technical scheme of the method for testing performance of PCB, described blind hole to be detected is be arranged on the test sample at PCB imposite edge, and described test sample is identical with product unit structure in PCB imposite.
As a kind of optimal technical scheme of the method for testing performance of PCB, comprise the following steps:
Step S1, offer blind hole welding condition, carry out soldering to described blind hole to be detected；
Step S2, in described soldering process, the change in resistance situation of described blind hole to be detected is detected；
Step S3, testing result by described change in resistance situation, judge the reliability of described blind hole to be detected.
As a kind of optimal technical scheme of the method for testing performance of PCB, offer blind hole welding condition described in step S1 is: blind hole to be detected is carried out manual welding operation by the welding condition of simulation actual product.
As a kind of optimal technical scheme of the method for testing performance of PCB, described step S1 includes:
Step S11, in the welding of described blind hole two ends to be detected for the wire of connecting test instrument；
Blind hole to be detected is carried out soldering by step S12, employing lead-free tin cream and manual welding instrument.
As a kind of optimal technical scheme of the method for testing performance of PCB, described step S2 includes:
Step S21, change in resistance situation detect, and adopt change in resistance detecting device that blind hole change in resistance to be detected is detected；
Step S22, testing result export, by outut device output detections result.
As a kind of optimal technical scheme of the method for testing performance of PCB, by the testing result of described change in resistance situation described in step S3, the reliability of described blind hole to be detected is judged as:
If in welding process, blind hole resistance to be detected maintains certain numerical value after increasing, then blind hole good reliability；
If in welding process, increasing considerably occurs in blind hole resistance to be detected, and stops welding and recovers to room temperature state, has micro-crack to produce relative to resistance varying-ratio < 10% then blind via bottom in welding process；
If in welding process, blind hole resistance to be detected becomes infinity, then blind via bottom cracking, blind hole poor reliability.
As a kind of optimal technical scheme of the method for testing performance of PCB, described blind hole to be detected is single blind hole.
As a kind of optimal technical scheme of the method for testing performance of PCB, described blind hole to be detected is the blind hole chain that two or more blind holes are formed by wired in series.
A kind of optimal technical scheme as the method for testing performance of PCB, described blind hole to be detected is carried out soldering by step S1 and repeats several times, monitoring change in resistance in each soldering process, the resistance of described blind hole to be detected is detected after completing and be down to room temperature by soldering.
The invention have the benefit that the security risk that can effectively identify PCB blind hole, improve the quality of PCB product；Simple to operate, monitoring reliability is high；When not destroying product, blind hole reliability can being detected, reduce the consumption to product, detection process carries out on test sample, it is to avoid actual product is impacted.Can individually detect a metalized blind vias and also can detect a blind hole chain being made up of some metalized blind vias simultaneously, motility is strong, efficiency is high in detection, blind hole reliability judgement is carried out, not by the impact of metalized blind vias material and structure, highly versatile by resistance variations percentage ratio.
Accompanying drawing explanation
Below according to drawings and Examples, the present invention is described in further detail.
Fig. 1 is the method for testing performance flow chart of PCB described in embodiment.
Fig. 2 is blind via bottom flawless structural representation to be detected described in embodiment.
Fig. 3 is that described in embodiment, blind via bottom to be detected has micro-cracked structure schematic diagram.
Fig. 4 is blind via bottom instant of complete cracking structural representation to be detected described in embodiment.
In figure:
100, blind hole to be detected.
Detailed description of the invention
Technical scheme is further illustrated below in conjunction with accompanying drawing and by detailed description of the invention.
As shown in figures 1-4, in the present embodiment, the method for testing performance of a kind of PCB of the present invention, specifically for detecting the reliability of the PCB metalized blind vias with metalized blind vias.Under soldering conditions the change in resistance situation of blind hole 100 to be detected is detected, judge blind hole 100 reliability to be detected according to testing result.
Concrete, the method for testing performance of the PCB described in the present embodiment, comprise the following steps:
Step S1, offer blind hole welding condition, carry out soldering to described blind hole 100 to be detected；
Step S2, in described soldering process, the change in resistance situation of described blind hole 100 to be detected is detected；
Step S3, testing result by described change in resistance situation, judge described blind hole 100 reliability to be detected.
In the method for testing performance of the PCB described in the present embodiment, described offer blind hole welding condition is: blind hole 100 to be detected is carried out manual welding operation by the welding condition of simulation actual product.Under the welding condition of actual product, blind hole 100 to be detected being detected, the result drawn can react the quality of product on PCB imposite the most accurately.
In one embodiment of the invention, in order to implement technical solution of the present invention more accurately, above-mentioned steps S1 has been carried out concrete refinement so that step S1 includes:
Step S11, in the welding of described blind hole 100 two ends to be detected for the wire of connecting test instrument；
Blind hole to be detected is carried out soldering by step S12, employing lead-free tin cream and manual welding instrument.
In another embodiment of the method for testing performance of PCB of the present invention, described step S2 includes:
Step S21, change in resistance situation detect, and adopt change in resistance detecting device that blind hole 100 change in resistance to be detected is detected；
Step S22, testing result export, by outut device output detections result.
Also include after step s 11 step S111, by the wire in step S11 described blind hole 100 two ends to be detected connect low resistance tester；Adopt low resistance tester as described change in resistance detecting device, blind hole 100 change in resistance to be detected is detected.
In the present embodiment, described low resistance tester adopts Estimate of Resistance for DC Low Resistance tester.Owing to the resistance value in PCB metalized blind vias is generally less, low resistance tester is therefore adopted can effectively to improve the precision of test in test process, it is to avoid the reliability of metalized blind vias is judged to impact by measuring accuracy problem.
In step S1, described blind hole 100 to be detected being carried out soldering and repeat several times, monitor change in resistance in each soldering process, the resistance of described blind hole 100 to be detected is detected after completing and be down to room temperature by soldering.
In another embodiment of the method for testing performance of PCB of the present invention, the testing result by described change in resistance situation described in step S3, described blind hole 100 reliability to be detected is judged as:
If in welding process, blind hole 100 resistance to be detected maintains certain numerical value after increasing, then blind hole 100 good reliability to be detected；Its structure is as shown in Figure 2.
If in welding process, increasing considerably occurs in blind hole 100 resistance to be detected, and stops welding and recovers to room temperature state, has micro-crack to produce relative to bottom resistance varying-ratio < 10% in welding process then blind hole 100 to be detected；Its structure is as shown in Figure 3.
If in welding process, blind hole 100 resistance to be detected becomes infinity, and resistance does not change in follow-up test process, then blind via bottom cracking, blind hole poor reliability；Its structure is as shown in Figure 4.
Below by concrete test data, technical solution of the present invention is explained:
As shown in table 1, the test equipment adopted in the present embodiment is TH2512B type intelligent DC low resistance tester, Reflow Soldering is performed twice at initially with lead-free tin cream, manual welding in 10 seconds is carried out afterwards under 350 DEG C of conditions, Estimate of Resistance for DC Low Resistance tester monitoring blind hole change in resistance in welding process, after completing once test, it is cooled to room temperature and again reads off resistance.Blind hole reliability is judged according to resistance varying-ratio.
Table 1 blind hole reliability testing and monitoring method
As shown in table 2, the test case of six samples is described:
Sample 1 its resistance after performing twice at Reflow Soldering is 63.7m Ω, afterwards it is carried out 10 manual weldings, wherein first time and second time manual welding process are normal, in third time to the tenth manual welding process, there is ∞ in blind hole resistance, this situation shows that sample 1 blind via bottom thoroughly ruptures, poor reliability.
As shown in Table 2, sample 3 testing result is similar to sample 1, and it is similarly blind via bottom and thoroughly ruptures, poor reliability.
Sample 2 its resistance after performing twice at Reflow Soldering is 67.75m Ω, takes over its resistance of center all normally carrying out ten manual weldings, after the tenth manual welding, its resistance is 67.8m Ω, resistance varying-ratio is 0.08%, and this result shows that sample 2 blind via bottom does not have crackle, blind hole good reliability.
As shown in Table 2, sample 5,6 testing result is similar to sample 2, and it is similarly blind via bottom does not have crackle, blind hole good reliability.
Sample 4 occurred in detection process that resistance was infinitely great, and late detection resistance varying-ratio is 7.19% < 10%, and this result shows have micro-crack bottom sample 4, has security risk.
Table 2 blind hole manual welding process low resistance changes
Conclusion:
1) sample of numbering 2,5,6, blind hole good reliability；Blind via bottom does not have crackle；
2) sample of numbering 4, blind via bottom has micro-crack, has security risk；
3) sample of numbering 1,3, blind via bottom thoroughly ruptures, and reliability is worst.
In an embodiment of the present invention, blind hole 100 to be detected is the test sample being arranged on PCB imposite edge, and described test sample is identical with product unit structure in PCB imposite.Detect by arranging test sample, it is possible to avoid the destruction of product in PCB imposite.
In this present embodiment, described blind hole 100 to be detected is single blind hole.The blind hole chain that described blind hole to be detected 100 can also be formed for the series connection of two or more blind holes in other embodiments of the invention.
It is to be understood that; above-mentioned detailed description of the invention is only presently preferred embodiments of the present invention and institute's application technology principle; in technical scope disclosed in this invention, change that any those familiar with the art is readily apparent that or replacement, all should be encompassed in protection scope of the present invention.
Claims (10)
1. the method for testing performance of a PCB, it is characterised in that under soldering conditions the change in resistance situation of blind hole to be detected is detected, judge the reliability of blind hole to be detected according to testing result.
2. the method for testing performance of PCB according to claim 1, it is characterised in that described blind hole to be detected is be arranged on the test sample at PCB imposite edge, and described test sample is identical with product unit structure in PCB imposite.
3. the method for testing performance of PCB according to claim 1 and 2, it is characterised in that comprise the following steps:
Step S1, offer blind hole welding condition, carry out soldering to described blind hole to be detected；
Step S2, in described soldering process, the change in resistance situation of described blind hole to be detected is detected；
Step S3, testing result by described change in resistance situation, judge the reliability of described blind hole to be detected.
4. the method for testing performance of PCB according to claim 3, it is characterised in that offer blind hole welding condition described in step S1 is: blind hole to be detected is carried out manual welding operation by the welding condition of simulation actual product.
5. the method for testing performance of PCB according to claim 3, it is characterised in that described step S1 includes:
Step S11, in the welding of described blind hole two ends to be detected for the wire of connecting test instrument；
Blind hole to be detected is carried out soldering by step S12, employing lead-free tin cream and manual welding instrument.
6. the method for testing performance of PCB according to claim 3, it is characterised in that described step S2 includes:
Step S21, change in resistance situation detect, and adopt change in resistance detecting device that blind hole change in resistance to be detected is detected；
Step S22, testing result export, by outut device output detections result.
7. the method for testing performance of PCB according to claim 3, it is characterised in that by the testing result of described change in resistance situation described in step S3, the reliability of described blind hole to be detected is judged as:
If in welding process, blind hole resistance to be detected maintains certain numerical value after increasing, then blind hole good reliability；
If in welding process, increasing considerably occurs in blind hole resistance to be detected, and stops welding and recovers to room temperature state, has micro-crack to produce relative to resistance varying-ratio < 10% then blind via bottom in welding process；
If in welding process, blind hole resistance to be detected becomes infinity, then blind via bottom cracking, blind hole poor reliability.
8. the method for testing performance of PCB according to claim 1, it is characterised in that described blind hole to be detected is single blind hole.
9. the method for testing performance of PCB according to claim 1, it is characterised in that described blind hole to be detected is the blind hole chain that the series connection of two or more blind holes is formed.
10. the method for testing performance of PCB according to claim 3, it is characterized in that, described blind hole to be detected is carried out soldering by step S1 and repeats several times, monitoring change in resistance in each soldering process, the resistance of described blind hole to be detected is detected after completing and be down to room temperature by soldering.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108981962A (en) * | 2018-08-30 | 2018-12-11 | 上海炜绫测试技术有限公司 | A kind of PCB aperture chain temperature testing method and device |
| CN109031092A (en) * | 2018-07-16 | 2018-12-18 | 威太（苏州）智能科技有限公司 | A kind of PCB high current test method |
| CN111094958A (en) * | 2017-09-22 | 2020-05-01 | 日本电产理德股份有限公司 | Welding state detection method and welding state detection device |
| CN111142010A (en) * | 2020-01-24 | 2020-05-12 | 上海炜绫测试技术有限公司 | PCB interconnection reliability testing method and device |
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| US4477484A (en) * | 1982-12-10 | 1984-10-16 | International Business Machines Corporation | Electroless plating monitor |
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| DE3034175A1 (en) * | 1980-09-11 | 1982-04-15 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Chemical deposition of electrically conducting layers - where electrical properties of deposit are used to indicate end of deposition process, esp. in mfg. electronic components |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111094958A (en) * | 2017-09-22 | 2020-05-01 | 日本电产理德股份有限公司 | Welding state detection method and welding state detection device |
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| CN109031092B (en) * | 2018-07-16 | 2020-12-11 | 威太（苏州）智能科技有限公司 | PCB high current testing method |
| CN108981962A (en) * | 2018-08-30 | 2018-12-11 | 上海炜绫测试技术有限公司 | A kind of PCB aperture chain temperature testing method and device |
| CN111142010A (en) * | 2020-01-24 | 2020-05-12 | 上海炜绫测试技术有限公司 | PCB interconnection reliability testing method and device |
| CN111142010B (en) * | 2020-01-24 | 2022-03-29 | 上海炜绫测试技术有限公司 | PCB interconnection reliability testing method and device |
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