JP2000171512A - Continuity inspection apparatus for printed-wiring board - Google Patents
Continuity inspection apparatus for printed-wiring boardInfo
- Publication number
- JP2000171512A JP2000171512A JP10349499A JP34949998A JP2000171512A JP 2000171512 A JP2000171512 A JP 2000171512A JP 10349499 A JP10349499 A JP 10349499A JP 34949998 A JP34949998 A JP 34949998A JP 2000171512 A JP2000171512 A JP 2000171512A
- Authority
- JP
- Japan
- Prior art keywords
- resistance value
- contact
- judged
- wiring board
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板の
導通検査装置に関し、特に微細ピッチのスルーホールお
よび電極を有するプリント配線板のオープンチェックお
よびショートチェックを１段階の操作で確実に行えるプ
リント配線板の導通検査装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuity inspection apparatus for a printed wiring board, and more particularly to a printed wiring board capable of reliably performing an open check and a short check of a printed wiring board having through holes and electrodes with fine pitches in one operation. The present invention relates to a plate continuity inspection device.
【０００２】[0002]
【従来の技術】微細ピッチのスルーホールや電極を持つ
プリント配線板の電気導通検査では、導電性の弾性体
（導電性ゴムや導電性不織布）を用いてスルーホールの
断線（オープンチェック）や電極の接触（ショートチェ
ック）を検出する検査方法がとられている。この検査方
法の概要を図６，図７に示す。2. Description of the Related Art In an electrical continuity test of a printed wiring board having fine-pitch through holes and electrodes, a conductive elastic body (conductive rubber or conductive non-woven fabric) is used to cut through holes (open check) and electrodes. An inspection method for detecting a contact (short check) of the object has been adopted. The outline of this inspection method is shown in FIGS.
【０００３】図６，図７に示すように、プリント配線板
１０１にはメッキを施した微細ピッチのスルーホール１
０２が形成され、下面側にマザーボード（図示せず）に
接続する電極１０２ｂが形成され、上面側にＩＣチップ
（図示せず）に接続するパッド１０２ａが形成されてい
る。As shown in FIGS. 6 and 7, a printed wiring board 101 has plated-through holes 1 of fine pitch.
02 is formed, an electrode 102b connected to a motherboard (not shown) is formed on the lower surface side, and a pad 102a connected to an IC chip (not shown) is formed on the upper surface side.
【０００４】プリント配線板１０１に対する断線検査
（オープンチェック）では、図６に示すように、ＩＣチ
ップ実装面側（図の上面側）に導電性（抵抗値が殆ど０
Ω）の弾力性に富むゴム板１０３を配置し、マザーボー
ド側の電極１０２ｂに金属性のピン１０４を接触させ押
圧することにより、弾性変形で導電性ゴム板１０３とパ
ッド１０２ａを接触させ、全短絡状態を作りだす。１０
５は抵抗計である。この際、断線した回路があれば導通
の取れないピンが発生し、抵抗計１０５により断線箇所
が検出できる。これが第１段階のチェックである。[0006] In the disconnection inspection (open check) of the printed wiring board 101, as shown in FIG. 6, the conductivity (resistance value is almost 0) is provided on the IC chip mounting surface side (upper side in the figure).
Ω), and the metal pin 104 is brought into contact with the electrode 102b on the motherboard side and pressed, whereby the conductive rubber plate 103 and the pad 102a are brought into contact by elastic deformation, and a total short circuit is caused. Create a state. 10
5 is a resistance meter. At this time, if there is a broken circuit, a pin that cannot be conducted is generated, and the ohmmeter 105 can detect the broken portion. This is the first stage check.
【０００５】前記第１段階のチェック終了後の第２段階
のチェックでは、図７に示す如く、ゴム板１０３を取り
除き、抵抗計１０５により２個のピン１０４の間の抵抗
を測定する。若し電極１０２ｂ相互間が短絡していれ
ば、抵抗計１０５で検出することができる。これが電極
間ショートチェックである。In the second stage check after the completion of the first stage check, as shown in FIG. 7, the rubber plate 103 is removed, and the resistance between the two pins 104 is measured by the resistance meter 105. If the electrodes 102b are short-circuited, it can be detected by the resistance meter 105. This is the inter-electrode short check.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、前記図
７に示した電極間ショートチェック時に、若しピンと電
極との間に接触不良が発生すると、実際にはプリント配
線板が良品であるにも拘わらず、接触不良による見掛け
上のオープン（抵抗無限大）のために、不良品と判定さ
れてしまうおそれがある。また、前述の如く試験段階と
して第１，第２の２段階を必要とするので、生産効率を
向上させる面から好ましくない。However, if a contact failure occurs between the pins and the electrodes during the short-circuit check between the electrodes shown in FIG. 7, the printed wiring board is actually good. However, due to apparent openness (infinite resistance) due to poor contact, it may be determined as a defective product. In addition, since the first and second test steps are required as described above, it is not preferable from the viewpoint of improving production efficiency.
【０００７】そこで本発明の課題は、１段階の検査でオ
ープンチェックとショートチェックとを確実に行えるプ
リント配線板の導通検査装置を提供することである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a continuity inspection apparatus for a printed wiring board which can reliably perform an open check and a short check in a one-step inspection.
【０００８】[0008]
【課題を解決するための手段】前記課題を解決するため
に本発明は、複数のスルーホールと、該複数のスルーホ
ールの上下両面または周辺に電極を形成してなるプリン
ト配線板の導通検査を行うプリント配線板の導通検査装
置であって、前記プリント配線板の一方の面側に配置す
る固有抵抗値を持つ弾性部材と、前記プリント配線板の
他方の面側に配置するコンタクトピンと、該コンタクト
ピンを前記他方の面側の電極に接触させた際における、
少なくとも前記スルーホールの断線の場合の抵抗値と，
前記電極相互の接触の場合の抵抗値と，前記スルーホー
ル断線無し且つ電極相互が非接触の場合の抵抗値をそれ
ぞれ基準値として格納した基準値記憶手段と、前記コン
タクトピンを介して検出した抵抗値に応じて前記スルー
ホール断線、または電極相互間接触、またはスルーホー
ル断線無し且つ電極相互間接触無しを判定する判定手段
とを備えたことを特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a method for inspecting the continuity of a plurality of through holes and a printed wiring board having electrodes formed on both upper and lower surfaces or around the plurality of through holes. A printed wiring board continuity inspection device, comprising: an elastic member having a specific resistance value disposed on one surface side of the printed wiring board; a contact pin disposed on the other surface side of the printed wiring board; When a pin is brought into contact with the electrode on the other surface side,
At least the resistance value when the through hole is broken,
A reference value storage means for storing the resistance value when the electrodes are in contact with each other and the resistance value when the through-hole is not broken and the electrodes are not in contact with each other, and a resistance detected via the contact pin. A judgment means for judging the disconnection of the through-hole, the contact between the electrodes, or the absence of the disconnection of the through-hole and the absence of the contact between the electrodes according to the value is provided.
【０００９】このようにすれば、コンタクトピンを介し
て検出した抵抗値は、スルーホールの断線の場合の抵抗
値（抵抗・無限大）と、電極相互の接触の場合の抵抗値
（０Ω）と、電極相互が非接触の場合の抵抗値（弾性部
材の固有抵抗値）に応じて明確に別れるので、プリント
配線板の良否および不良の場合の原因を検出することが
可能となる。With this configuration, the resistance value detected through the contact pin is determined by the resistance value (resistance / infinity) when the through hole is broken and the resistance value (0Ω) when the electrodes are in contact with each other. Since it is possible to clearly separate the resistance according to the resistance value (the specific resistance value of the elastic member) when the electrodes are not in contact with each other, it is possible to detect the quality of the printed wiring board and the cause of the failure.
【００１０】[0010]
【発明の実施の形態】以下、本発明を図示の実施の形態
に基づいて説明する。図１は本実施の形態のプリント配
線板の導通検査装置の機構部の斜視図、図２は導通試験
の原理説明図、図３，図４は本実施の形態に検査対象と
して使用するインターポーザー基板を説明する側断面
図，実装状態を説明する斜視図、図５は導通検査装置の
測定部のブロック図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiments. FIG. 1 is a perspective view of a mechanism portion of a continuity inspection device for a printed wiring board according to the present embodiment, FIG. 2 is a diagram illustrating the principle of a continuity test, and FIGS. 3 and 4 are interposers used as inspection targets in the present embodiment. FIG. 5 is a side sectional view illustrating a substrate, a perspective view illustrating a mounted state, and FIG. 5 is a block diagram of a measuring unit of the continuity inspection device.
【００１１】先ず、図３，図４に基づいて検査対象基板
となるインターポーザー基板を説明する。図３，図４に
示すように、インターポーザー基板１０はガラスエポキ
シ材等からなる基板本体１１にメッキを施したスルーホ
ール１２が形成され、ＩＣチップ１５との接触側（図中
の上面側）にパッド１２ａが形成され、マザーボード
（図示せず）との接触側（図中の下面側）に電極１２ｂ
が形成されている。First, an interposer substrate to be inspected will be described with reference to FIGS. As shown in FIGS. 3 and 4, the interposer substrate 10 has a through hole 12 formed by plating a substrate body 11 made of a glass epoxy material or the like, and is in contact with the IC chip 15 (the upper surface side in the drawings). A pad 12a is formed on the surface of the substrate, and an electrode 12b is formed on a side (lower side in the figure) in contact with a motherboard (not shown).
Are formed.
【００１２】次に、本実施の形態の導通検査装置を、機
構部と判定部に分けて説明する。機構部は、図１，図２
に示すように、台座２１の上に固有抵抗値（体積抵抗で
１０〜１００Ω）を持つゴム板２２を配置し、ゴム板２
２の上方に複数のコンタクトピン２３ａ，２３ｂ・・・
を備えたコンタクト治具２３を配置する。ゴム板２２と
コンタクト治具２３との間に、検査対象のインターポー
ザー基板１０を、パッド１２ａ側をゴム板２２側にして
配置する。Next, the continuity inspection apparatus according to the present embodiment will be described by dividing it into a mechanism section and a determination section. 1 and 2
As shown in FIG. 2, a rubber plate 22 having a specific resistance value (volume resistance of 10 to 100 Ω) is arranged on a pedestal 21.
A plurality of contact pins 23a, 23b,.
Is disposed. The interposer substrate 10 to be inspected is placed between the rubber plate 22 and the contact jig 23 with the pad 12a side facing the rubber plate 22 side.
【００１３】また、判定部は、図５に示すように、良品
基板での抵抗値Ｒ（例えば１５Ω）と、スルーホールが
オープン（断線）しているときの抵抗値Ｒ0 （例えば無
限大）と、電極間ショートまたはＩＣ接続面パターンが
ショートしている等の場合の抵抗値ＲS （例えば０Ω）
等の基準値を記憶したＲＯＭ３１と、測定結果の演算等
を行うＲＡＭ３２と、測定結果や良否判定を表示するデ
ィスプレイ３３と、ピン２３ａ，２３ｂの検出結果に基
づいて以上の演算，表示等を行うＣＰＵ３４とを備えて
いる。Further, as shown in FIG. 5, the judging section determines a resistance value R (for example, 15Ω) on a good substrate and a resistance value R0 (for example, infinity) when a through hole is open (disconnected). , Resistance value RS (for example, 0Ω) in case of short circuit between electrodes or short circuit of IC connection surface
ROM 31 for storing reference values such as the above, a RAM 32 for calculating the measurement results and the like, a display 33 for displaying the measurement results and pass / fail judgment, and performing the above calculations and display based on the detection results of the pins 23a and 23b. And a CPU 34.
【００１４】前記良品基板の抵抗値Ｒ（例えば１５Ω）
と、オープン（断線）の抵抗値Ｒ0（例えば無限大）
と、ショートの抵抗値ＲS （例えば０Ω）との間には、
次の関係が成り立ち、明確な差異が現れる。 ＲS ≪Ｒ≪Ｒ0The resistance value R of the non-defective substrate (for example, 15Ω)
And open (disconnected) resistance value R0 (for example, infinity)
And the short-circuit resistance value RS (for example, 0Ω).
The following relationship holds, and a clear difference appears. RS ≪R≪R0
【００１５】そして、図２に示した状態でピン２３ａ，
２３ｂ間の抵抗値を検出すると、ＣＰＵ３４はＲＯＭ３
１に格納した各種基準値と比較し、Ｒ0 であればオープ
ンと判定し、ＲS であればショートと判定し、Ｒであれ
ば良品と判定する。即ち、オープンとショートを同時に
判定することができ、この判定結果はディスプレイ３３
に表示する。The pins 23a, 23a in the state shown in FIG.
When the resistance value between the terminals 23b is detected, the CPU 34
Compared with the various reference values stored in 1, if R0, it is determined to be open, if RS, it is determined to be short, and if R, it is determined to be good. That is, open and short can be determined at the same time.
To be displayed.
【００１６】また、コンタクトピンが非接触の場合に
は、必ず抵抗値は無限大となるので、不良品と判定され
る。即ち、不良品が良品と誤判定されることがない。ま
た、不良品と判定されるケースが多発する場合には、本
実施の形態のプリント配線板の導通検査装置の現場担当
者（作業員）が、コンタクトピンと基板との非接触が発
生しているか否かを確認すればよい。When the contact pin is not in contact, the resistance value is always infinite, so that it is determined to be defective. That is, a defective product is not erroneously determined as a good product. In addition, in the case where the number of cases determined to be defective is frequent, the person in charge of the site (operator) of the continuity inspection device for the printed wiring board according to the present embodiment checks whether or not the contact pins and the board are out of contact. It is sufficient to confirm whether or not.
【００１７】なお、コンタクト治具２３をＸ−Ｙロボッ
トにて移動可能にしておけば、パッドや電極を多数備え
た同種の集合基板に対しても、本実施の形態と同様に一
回の検査でオープンとショートとの検査を実施すること
が可能となる。If the contact jig 23 is made movable by an XY robot, a single inspection can be performed on the same type of collective substrate having a large number of pads and electrodes as in the present embodiment. It is possible to carry out an open and short inspection.
【００１８】また、本実施の形態ではインターポーザー
基板の場合について説明したが、将来、ゴムの固有抵抗
値が高精度で製作できるようになると、ＩＣ接続面の電
極面積が測定できるようになる。このようにすれば、Ｍ
ＣＭ（multi-chip module ）基板等のチェックにも有効
である。In this embodiment, the case of an interposer substrate has been described. However, if the specific resistance of rubber can be manufactured with high precision in the future, the electrode area of the IC connection surface can be measured. In this way, M
It is also effective for checking a CM (multi-chip module) substrate and the like.
【００１９】[0019]
【発明の効果】以上説明したように本発明によれば、ピ
ンをプリント配線板に押圧接触した際に、スルーホール
の断線の場合の抵抗値（不良品）と、電極相互の接触の
場合の抵抗値（不良品）と、スルーホール断線無し且つ
電極相互が非接触の場合の抵抗値（良品）とが、それぞ
れ明確に異なるので、１段階の導通試験でオープンおよ
びショートの両者が判明し、信頼性の高いプリント配線
板の導通試験結果を得ることができる。As described above, according to the present invention, when a pin is pressed into contact with a printed wiring board, the resistance value (defective product) in the case of disconnection of the through-hole and the resistance value in the case of contact between the electrodes are reduced. The resistance value (defective product) and the resistance value in the case where the through-hole is not broken and the electrodes are not in contact with each other (non-defective product) are clearly different from each other. A highly reliable continuity test result of the printed wiring board can be obtained.
【図１】本発明の実施の形態の斜視図である。FIG. 1 is a perspective view of an embodiment of the present invention.
【図２】同実施の形態の原理を説明する図である。FIG. 2 is a diagram illustrating the principle of the embodiment.
【図３】同実施の形態で検査対象として使用したインタ
ーポーザー基板の断面図である。FIG. 3 is a cross-sectional view of an interposer substrate used as an inspection target in the embodiment.
【図４】同インターポーザー基板にＩＣチップを実装し
た場合の斜視図である。FIG. 4 is a perspective view when an IC chip is mounted on the interposer substrate.
【図５】同実施の形態の判定部のブロック図である。FIG. 5 is a block diagram of a determination unit according to the embodiment.
【図６】従来のプリント配線板の検査方法を説明する図
である。FIG. 6 is a diagram illustrating a conventional method for inspecting a printed wiring board.
【図７】従来のプリント配線板の検査方法を説明する図
６の続きの図である。FIG. 7 is a continuation of FIG. 6 for explaining a conventional method for inspecting a printed wiring board.
１０…インターポーザー基板、１１…基板本体、１２…
スルーホール、１２ａ…パッド、１２ｂ…電極、１５…
ＩＣチップ、２１…台座、２２…ゴム板、２３…コンタ
クト治具、２３ａ，２３ｂ…コンタクトピン、３１…基
準値を格納したＲＯＭ、３３…ディスプレイ、３４…Ｃ
ＰＵ10 ... interposer board, 11 ... board body, 12 ...
Through-hole, 12a ... pad, 12b ... electrode, 15 ...
IC chip, 21 pedestal, 22 rubber plate, 23 contact jig, 23a, 23b contact pin, 31 ROM containing reference values, 33 display, 34 C
PU
Claims (1)
ホールの上下両面または周辺に電極を形成してなるプリ
ント配線板の導通検査を行うプリント配線板の導通検査
装置であって、 前記プリント配線板の一方の面側に配置する固有抵抗値
を持つ弾性部材と、 前記プリント配線板の他方の面側に配置するコンタクト
ピンと、 該コンタクトピンを前記他方の面側の電極に接触させた
際における、少なくとも前記スルーホールの断線の場合
の抵抗値と，前記電極相互の接触の場合の抵抗値と，前
記スルーホール断線無し且つ電極相互が非接触の場合の
抵抗値をそれぞれ基準値として格納した基準値記憶手段
と、 前記コンタクトピンを介して検出した抵抗値に応じて前
記スルーホール断線、または電極相互間接触、またはス
ルーホール断線無し且つ電極相互間接触無しを判定する
判定手段とを備えたことを特徴とするプリント配線板の
導通検査装置。1. A continuity inspection device for a printed wiring board for conducting continuity inspection of a printed wiring board comprising a plurality of through holes and electrodes formed on both upper and lower surfaces or around the plurality of through holes. An elastic member having a specific resistance value disposed on one side of the board; a contact pin disposed on the other side of the printed wiring board; and a contact pin when the contact pin is brought into contact with the electrode on the other side. A reference storing at least a resistance value when the through-hole is disconnected, a resistance value when the electrodes are in contact with each other, and a resistance value when the through-hole is not disconnected and the electrodes are not in contact with each other. Value storage means, and there is no through-hole disconnection, contact between electrodes, or no through-hole disconnection according to the resistance value detected through the contact pin. Continuity testing apparatus of a printed wiring board characterized by comprising a determination means for determining no contact between the electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10349499A JP2000171512A (en) | 1998-12-09 | 1998-12-09 | Continuity inspection apparatus for printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10349499A JP2000171512A (en) | 1998-12-09 | 1998-12-09 | Continuity inspection apparatus for printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000171512A true JP2000171512A (en) | 2000-06-23 |
Family
ID=18404167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10349499A Pending JP2000171512A (en) | 1998-12-09 | 1998-12-09 | Continuity inspection apparatus for printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000171512A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004069447A (en) * | 2002-08-06 | 2004-03-04 | Ibiden Engineering Kk | Inspection device for conduction inspection jig for printed wiring board |
| WO2004072665A1 (en) * | 2003-02-13 | 2004-08-26 | Oht Inc. | Circuit check device, circuit check method, resistance measurement device, and resistance measurement method |
| US8836362B2 (en) | 2010-05-31 | 2014-09-16 | Ricoh Company, Ltd. | Switch probe and device and system for substrate inspection |
| WO2017168530A1 (en) * | 2016-03-28 | 2017-10-05 | 堺ディスプレイプロダクト株式会社 | Inspection method and inspection system for wiring path of substrate |
| US11592468B2 (en) | 2019-02-04 | 2023-02-28 | Ford Global Technologies, Llc | System and method for circuit testing using remote cooperative devices |
-
1998
- 1998-12-09 JP JP10349499A patent/JP2000171512A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004069447A (en) * | 2002-08-06 | 2004-03-04 | Ibiden Engineering Kk | Inspection device for conduction inspection jig for printed wiring board |
| WO2004072665A1 (en) * | 2003-02-13 | 2004-08-26 | Oht Inc. | Circuit check device, circuit check method, resistance measurement device, and resistance measurement method |
| US8836362B2 (en) | 2010-05-31 | 2014-09-16 | Ricoh Company, Ltd. | Switch probe and device and system for substrate inspection |
| WO2017168530A1 (en) * | 2016-03-28 | 2017-10-05 | 堺ディスプレイプロダクト株式会社 | Inspection method and inspection system for wiring path of substrate |
| JPWO2017168530A1 (en) * | 2016-03-28 | 2018-12-20 | 堺ディスプレイプロダクト株式会社 | Inspection method and inspection system for wiring path of substrate |
| US11592468B2 (en) | 2019-02-04 | 2023-02-28 | Ford Global Technologies, Llc | System and method for circuit testing using remote cooperative devices |
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