CN105733361A - Etching-resistant jet ink and application thereof - Google Patents
Etching-resistant jet ink and application thereof Download PDFInfo
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- CN105733361A CN105733361A CN201610286577.2A CN201610286577A CN105733361A CN 105733361 A CN105733361 A CN 105733361A CN 201610286577 A CN201610286577 A CN 201610286577A CN 105733361 A CN105733361 A CN 105733361A
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- acrylate
- ink
- etching
- methyl
- jet ink
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/40—Ink-sets specially adapted for multi-colour inkjet printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
Abstract
The invention provides etching-resistant jet ink and provides a method for preparing a conductive circuit by using the etching-resistant jet ink. The etching-resistant jet ink comprises a photocuring monomer, an oligomer, a pigment and a photoinitiator, wherein the photocuring monomer comprises at least one of monofunctional (methyl) acrylate, bidirectional (methyl) acrylate and tri-functional acrylate; the bidirectional (methyl) acrylate comprises at least one of bidirectional (methyl) acrylate with a glycol structure or propylene glycol structure in the molecular structure. The etching-resistant jet ink is good in flowability, applicable to jet ink technique and good in stable jet printing property, a temporary protecting layer formed after the jet ink is cured can meet the process requirements of the circuit board in the production process and is resistant to corrosion of an etching liquid without dropping, and rapid stripping can be achieved in an alkali liquid after the etching process is completed.
Description
Technical field
The present invention relates to a kind of anti-etching ink-jet ink, be mainly used in the etch phase of wiring board manufacture process, form temporary protective material to prepare circuit.
Background technology
The etch phase of wiring board (PCB) is formed into the process of conducting wire; the method generally adopted is first to make a plate; re-use ink and by the mode of silk screen printing, line pattern is printed in copper-clad plate; and then by exposing; the techniques such as development form temporary protective material, not protected naked copper part are etched away in etching solution.After having etched, in alkali liquor, ink protective layer need to be taken off thus forming conducting wire.But it is various that the mode adopting silk screen printing there is problems of plate-making, the numerous length of process, and can produce substantial amounts of discarded ink in use procedure, brings pressure to environment.
Digital ink-jet technology is non-contact type mode of printing, controls to print image on printed substrate by computer, What You See Is What You Get.If printing anti-etching shielding layer by digital ink-jet technology; then shorten technological process greatly: without plate-making; image is made by computer, more need not expose, develop, and ink can realize instant solidification in jet printing process; shorten greatly and make step; meanwhile, the use of ink-jet technology can also improve wiring density, and ink is nothing waste in printing process; decrease the discharge of garbage, play the purpose of environmental conservation.
But use ink-jetting style printing anti-etching shielding layer, still have technology to need to break through.Different from normally used ink-jet ink, anti-etching ink-jet ink not only needs spray printing fluency and the basic property with excellence, with greater need for the technical process requirement meeting wiring board production process, takes off film as etching resistant liquid does not fall off with easy alkali.Simultaneously, ink-jetting style is because ejecting ink by shower nozzle, require that ink need to have relatively low viscosity, its etching resisting ink viscosity adopted with screen printing mode differs very big, therefore, prepare the anti-etching ink being suitable for ink-jet and ensureing that also needing to take into account follow-up processing performance outside spray printing performance is problem demanding prompt solution.
Summary of the invention
The present invention is for making up the deficiencies in the prior art, it is provided that a kind of anti-etching ink-jet ink, and its mobility is good, is suitable for ink-jet technology；Having stable spray printing performance, the temporary protective material formed after solidification meets the technological requirement in wiring board production process, etching resistant liquid corrosion can not fall off, after etch phase completes, can quickly take off film in alkali liquor.
The present invention is for reaching its purpose, and the technical scheme of employing is as follows:
A kind of anti-etching ink-jet ink, including photo-curing monomer, oligomer, colorant, light trigger；Wherein said photo-curing monomer includes at least one in simple function (methyl) acrylate, difunctionality (methyl) acrylate, trifunctional acrylate；Described difunctionality (methyl) acrylate includes having at least one in difunctionality (methyl) acrylate of ethylene glycol structure or propylene glycol structure in molecular structure.
Simple function (methyl) acrylate and monofunctional acrylate or mono-functional methacrylate；Difunctionality (methyl) acrylate and bifunctional acrylate or difunctional methacrylate.
Described difunctionality (methyl) acrylate includes difunctionality (methyl) acrylate in molecular structure with ethylene glycol or propylene glycol structure, the Sprouting resistance performance of ink can be improved, improve the degree of cross linking after ink cured, also ensure that ink meets the requirement quickly moving back film simultaneously.
Further, molecular structure has at least one that difunctionality (methyl) acrylate of ethylene glycol structure includes being structured with in the compound of formula (I)～(II)；Further, molecular structure has at least one that difunctionality (methyl) acrylate of propylene glycol structure includes being structured with in the compound of formula III～(IV):
N >=1 in above-mentioned general formula of molecular structure, round numbers.
Concrete, difunctionality (methyl) acrylate in molecular structure with ethylene glycol or propylene glycol structure can be specially following material but be not limited to following material: tripropylene glycol diacrylate, propylene glycol diacrylate, dimethacrylate, TEGDMA, Polyethylene Glycol (200) diacrylate, Polyethylene Glycol (300) diacrylate, Polyethylene Glycol (400) diacrylate, Polyethylene Glycol (500) diacrylate, Polyethylene Glycol (200) dimethylacrylate, Polyethylene Glycol (300) dimethylacrylate, Polyethylene Glycol (400) dimethylacrylate, one or more combination in the above-mentioned monomers such as Polyethylene Glycol (500) dimethylacrylate.This difunctionality (methyl) acrylate monomer addition in ink set by weight percentage, it is preferable that addition is 20-40%.
Preferably, described simple function (methyl) acrylate includes simple function (methyl) acrylate in molecular structure containing circulus；Preferably employ simple function (methyl) acrylate with circulus, it is possible to help to strengthen the Antacid effectiveness of anti-etching ink.Concrete but be not limited to following material: 2-phenoxyethyl acrylate, 2-phenoxyethyl methacrylate, 4-tert-butyl group ring ethyl propylene acid esters, ring trimethylolpropane dimethoxym ethane acrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, m-phenoxy benzyl acrylic ester, benzyl acrylate, benzyl methacrylate, acrylic acid cyclohexanol, cyclohexyl methacrylate, iso-bornyl acrylate, isobornyl methacrylate, dicyclo pentyl acrylate, one or more the combination of the above-mentioned monomers such as dicyclo pentyl methacrylate.This has simple function (methyl) the acrylate monomer addition of circulus in ink set by weight percentage, it is preferable that addition is 30-50%.
Preferably, described trifunctional acrylate includes the trifunctional acrylate in molecular structure containing hydroxyl.Preferably adding this trifunctional acrylate containing hydroxyl, can further improve the ink degree of cross linking to strengthen Sprouting resistance, ink does not affect while improving the degree of cross linking and takes off film properties simultaneously.The preferred pentaerythritol triacrylate of trifunctional acrylate monomer, but it is not limited to this.The addition of this trifunctional acrylate in ink set by weight percentage, it is preferable that addition is 5-10%.
As the more excellent embodiment of one, photo-curing monomer includes simple function (methyl) acrylate, difunctionality (methyl) acrylate and trifunctional acrylate, and three's percentage by weight in anti-etching ink-jet ink respectively is 30-50%, 20-40%, 5-10%.Adopting this preferred embodiment, the ink Sprouting resistance of preparation is strong, takes off film properties good, can quickly take off film in alkali liquor.
As a kind of specific embodiments, described oligomer percentage by weight in anti-etching ink-jet ink is 5～15%.
As a kind of preferred embodiment, described oligomer includes simple function (methyl) acrylate containing carboxyl of acid number >=100mgKOH/g.The performance of film is taken off in order to better realize quick alkali, oligomer preferably at least comprises a kind of simple function (methyl) acrylate containing carboxyl, its acid number >=100mgKOH/g, if the acid number of this oligomer is lower than 100mgKOH/g, the alkali that can affect ink takes off film properties.Addition in ink set by weight percentage, it is preferable that addition is 5-15%, when the consumption of this oligomer is less than 5%, what can affect ink quickly takes off film properties, when the consumption of oligomer is higher than 15%, therefore the viscosity of ink can increase, thus affecting the spray printing fluency of ink.Oligomer is specifically as follows but is not limited to epoxy acrylate, urethane acrylate and one or more in polyester acrylate.Commercial goods such as section is peaceful: Photomer4703, Photomer4173；Changxing 648-1,649；Double bond chemical industry: Doublemer270,272,275 etc..
As a kind of detailed description of the invention, also include functional aid.Preferably, described functional aid includes in anti-etching ink-jet ink the surface modifier of stabilizer that shared percentage by weight is 0.1-0.5% and 0.01-1%.Ink set system of the present invention adds stabilizer further, the storage stability of ink can be further ensured that, can be selected for commercial goods such as Tinuvin460,479,171 (Ciba)；Genorad16、18、20(RahnAG)；AdditolS5110,5120 (Cytec) etc..Addition is 0.1-0.5% by weight percentage in ink set.Adding surface modifier in the present invention further and can regulate ink surface tension and wettability further, strengthen ink spray printing fluency, commercial goods is BYK307 such as, and 310,330,345,377,3510,353,354,361N etc., the preferred 0.01-1% of addition.
Preferably, described light trigger is free radical photo-initiation.Selectable commercial goods such as Irgacure184,651,819,2959,907,369,1700 (Ciba)；QuantacureCTX, DETX, ITX (Acetochemical)；LucirinTPO(BASF)；GENOPOLAB-1, BP-1, TX-1 (RAHN) etc., addition is preferably 5-15% by weight percentage in ink set.
Colorant in the present invention can be selected for colorant conventional in ultraviolet light solidified ink, it is possible to selects dyestuff, it is also possible to selects pigment, is not particularly limited, and colorant addition in ink set is preferably 1-10% by weight percentage.When the colorant used in the present invention is pigment, preferred pigments is the one in phthalocyanine blue series, as C.I. pigment blue 1,15,15:1,15:2,15:3,15:4,15:6,16,24,, 60 etc., the commercial goods of this type of pigment such as BASFK6850, K6902, K6907, K6911D, K7090, K7104LW, Clariant A4R, AV, BG etc..Pigment generally in the presence of dispersants, prepares stable dispersible pigment color paste by grinding together with after the mixing dispersion of one or more acrylate monomers.The preferred dispersant of institute is polyamine, specifically can be selected for the amount ratio of commercial goods Solsperse and BYK associated dispersion agent, dispersant and pigment and generally changes in 50%-100% (quality).When the colorant used in the present invention is dyestuff, it is preferable that dyestuff is the one in solvent blue, as C.I. solvent blue 7,14,18,22,24,25,26,45,59:1 etc., this kind of dyestuff commercial goods such as BASF:SudanBlue670；BlueAPFW；ROSE；Rosaplast:BlueE2G, M5G, B95, Blue635,636 etc..
The anti-etching ink-jet ink of the present invention is ultraviolet curing type ink-jet ink, is mainly used in the etch phase of wiring board.
Second aspect present invention provide a kind of method utilizing anti-etching ink-jet ink mentioned above to prepare conducting wire, comprise the steps: 1) by anti-etching ink-jet ink spray printing in copper-clad plate with in copper-clad plate formed line pattern；2) ultra-violet curing, makes anti-etching ink-jet ink be solidified on copper-clad plate surface；3) copper-clad plate is placed in etching solution, makes the non-spray printing of copper-clad plate have the naked copper part of anti-etching ink-jet ink etched；4) copper-clad plate etched is immersed in alkali liquor, make the cured ink coating on copper-clad plate surface depart from copper-clad plate sheet material.
Technical scheme provided by the invention has the advantages that
The anti-etching ink-jet ink of the present invention, mobility is good, is suitable for ink-jet technology；Having stable spray printing performance, the temporary protective material formed after solidification meets the technological requirement in wiring board production process, etching resistant liquid corrosion can not fall off, after etch phase completes, can quickly take off film in alkali liquor.
Detailed description of the invention
Below in conjunction with embodiment, technical scheme is described further.
Embodiment 1～6
1) each component of embodiment 1-6 is weighed according to formula corresponding in table 1 below；
2) by monomer, oligomer, light trigger, coloring material for mixing, stirring is to fully dissolving；
3) add surface modifier and stabilizer, stir, under ultraviolet light conditions is kept away in indoor, with the membrane filtration in 1 μm of aperture, complete ink and prepare.
Table 1
Oligomer 648-1 (Changxing) in table 1 is containing carboxy acrylic ester；EM214 used is tetrahydrofurfuryl acrylate, and EM75 is benzyl acrylate, and EM211 is ethoxyethoxyethyl acrylate, EM221 is 1,6-hexanediyl ester, EM235 is pentaerythritol triacrylate, and SR508 is propylene glycol diacrylate.The specifically chosen SudanBlue670 of colorant, those skilled in the art select other colorants existing also dependent on needs.Each raw material in table 1 is marketable material, and wherein, EM214, EM75, EM211, EM221, EM235 are all purchased from Changxing company, and SR508 is purchased from Sartomer.
Comparative example 1～12
Preparing ink according to the step essentially identical with embodiment 1～6, institute's difference is in that, comparative example 1～12 weighs each component according to the corresponding formula in such as table 2 below.
Table 2
Performance detects
(1) spray printing fluency:
The ink of each embodiment and comparative example is passed through ink-jet printer spray printing in copper-clad plate, by following criterion evaluation ink spray printing fluency:
A: continuously after spray printing color lump 10, test mesh, without broken string phenomenon；
B: continuously after spray printing color lump 10, test mesh, has 1 to 2 mesh broken string phenomenon occur；
C: continuously after spray printing color lump 10, test mesh, has more than 3 mesh broken string phenomenon occur.
(2) adhesive force:
The ink of each embodiment and comparative example is passed through ink-jet printer spray printing in copper-clad plate, and with ultraviolet light polymerization, by hundred lattice method testing coating adhesive force.Clinging solidification coating with 3M600# adhesive tape, firmly pull with 45 degree of angle directions, same place pulls 3 times repeatedly.By following criterion evaluation adhesive force:
A: coating is without coming off；
B: hundred cases of coating put edge to be had and come off；
C: hundred cases are equipped with full wafer and drop.
(3) Sprouting resistance performance:
The coating solidified in copper-clad plate being immersed until exposed copper is etched liquid corrosion and carves completely in the copper chloride etching solution of 50-60 DEG C, taking-up rag directly pulls test with 3M600# adhesive tape after wiping clean, and judges by following standard:
A: coating is without coming off；
B: coating edge has and slightly comes off；
C: the position coating pullled has full wafer to drop.
(4) alkali takes off film properties:
Copper-clad plate after overetch completes is immersed 50-60 DEG C, and concentration is in the sodium hydroxide solution of 5%, observes coating shedding situation, judges by following standard:
A: coating completely fell off in 5 minutes；
B: coating completely fell off in 5-10 minute；
C: coating after more than 10 minutes, still can not drop completely.
Testing result is referring to shown in table 3～table 4.
Table 3
Table 4
From the test result of table 3～4, anti-etching ink-jet ink prepared by the present invention, while ensureing to stablize spray printing performance, there is etching resistant liquid and in alkali liquor, quickly take off the performance of film, meeting wiring board production technology instructions for use.
The above, it it is only presently preferred embodiments of the present invention, not the present invention is done any pro forma restriction, therefore all contents without departing from technical solution of the present invention, the technical spirit of the foundation present invention, to any simple modification made for any of the above embodiments, equivalent variations and modification, all still falls within the scope of technical solution of the present invention.
Claims (10)
1. an anti-etching ink-jet ink, including photo-curing monomer, oligomer, colorant, light trigger, it is characterized in that, described photo-curing monomer includes at least one in simple function (methyl) acrylate, difunctionality (methyl) acrylate, trifunctional acrylate；Described difunctionality (methyl) acrylate includes having at least one in difunctionality (methyl) acrylate of ethylene glycol structure or propylene glycol structure in molecular structure.
2. anti-etching ink-jet ink according to claim 1, it is characterized in that, molecular structure has difunctionality (methyl) acrylate of ethylene glycol structure and includes at least one in the compound of the formula that is structured with (I)～(II), molecular structure has at least one that difunctionality (methyl) acrylate of propylene glycol structure includes being structured with in the compound of formula III～(IV):
Wherein, n is the integer be more than or equal to 1.
3. anti-etching ink-jet ink according to claim 1, it is characterised in that described simple function (methyl) acrylate includes simple function (methyl) acrylate in molecular structure containing circulus；And/or, described trifunctional acrylate includes the trifunctional acrylate in molecular structure containing hydroxyl.
4. anti-etching ink-jet ink according to claim 1, it is characterised in that described difunctionality (methyl) acrylate percentage by weight in anti-etching ink-jet ink is 20-40%.
5. anti-etching ink-jet ink according to claim 1, it is characterised in that described simple function (methyl) acrylate percentage by weight in anti-etching ink-jet ink is 30-50%.
6. anti-etching ink-jet ink according to claim 1, it is characterised in that described trifunctional acrylate percentage by weight in anti-etching ink-jet ink is 5-10%.
7. anti-etching ink-jet ink according to claim 1, it is characterized in that, described simple function (methyl) acrylate includes 2-phenoxyethyl acrylate, 2-phenoxyethyl methacrylate, 4-tert-butyl group ring ethyl propylene acid esters, ring trimethylolpropane dimethoxym ethane acrylate, tetrahydrofurfuryl acrylate, tetrahydrofurfuryl methacrylate, m-phenoxy benzyl acrylic ester, benzyl acrylate, benzyl methacrylate, acrylic acid cyclohexanol, cyclohexyl methacrylate, iso-bornyl acrylate, isobornyl methacrylate, dicyclo pentyl acrylate, one or more in dicyclo pentyl methacrylate；
And/or, described difunctionality (methyl) acrylate includes tripropylene glycol diacrylate, propylene glycol diacrylate, dimethacrylate, TEGDMA, Polyethylene Glycol (200) diacrylate, Polyethylene Glycol (300) diacrylate, Polyethylene Glycol (400) diacrylate, Polyethylene Glycol (500) diacrylate, Polyethylene Glycol (200) dimethylacrylate, Polyethylene Glycol (300) dimethylacrylate, Polyethylene Glycol (400) dimethylacrylate, one or more in Polyethylene Glycol (500) dimethylacrylate；
And/or, described trifunctional acrylate includes pentaerythritol triacrylate.
8. anti-etching ink-jet ink according to claim 1, it is characterised in that described oligomer percentage by weight in anti-etching ink-jet ink is 5～15%.
9. anti-etching ink-jet ink according to claim 1, it is characterised in that described oligomer includes simple function (methyl) acrylate containing carboxyl of acid number >=100mgKOH/g.
10. utilize the method that the anti-etching ink-jet ink described in any one of claim 1～9 prepares conducting wire, it is characterised in that comprise the steps: 1) by anti-etching ink-jet ink spray printing in copper-clad plate with in copper-clad plate formed line pattern；2) ultra-violet curing, makes anti-etching ink-jet ink be solidified on copper-clad plate surface；3) copper-clad plate is placed in etching solution, makes the non-spray printing of copper-clad plate have the naked copper part of anti-etching ink-jet ink etched；4) copper-clad plate etched is immersed in alkali liquor, make the cured ink coating on copper-clad plate surface depart from copper-clad plate sheet material.
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106488660A (en) * | 2016-11-12 | 2017-03-08 | 广东科翔电子科技有限公司 | A kind of pcb board layout layer manufacturing method thereof based on magnetron sputtering technique |
| CN106566301A (en) * | 2016-11-13 | 2017-04-19 | 惠州市大亚湾科翔科技电路板有限公司 | Cured type composition for flexible circuit board |
| CN106658998A (en) * | 2016-11-12 | 2017-05-10 | 广东科翔电子科技有限公司 | Method for processing dielectric layer of multilayer impedance flexible circuit board |
| CN106752175A (en) * | 2016-11-13 | 2017-05-31 | 惠州市大亚湾科翔科技电路板有限公司 | A kind of wiring board cured film and printed wiring board |
| CN106793481A (en) * | 2016-11-12 | 2017-05-31 | 广东科翔电子科技有限公司 | A kind of multilayer impedance FPC of high evenness and preparation method thereof |
| CN106752176A (en) * | 2016-11-13 | 2017-05-31 | 惠州市大亚湾科翔科技电路板有限公司 | Solidification composition filling, cured film and pcb board |
| CN107619624A (en) * | 2017-10-09 | 2018-01-23 | 广东高仕电研科技有限公司 | A kind of UV solidifications solder mask and preparation method thereof |
| CN108289383A (en) * | 2018-03-05 | 2018-07-17 | 东莞市龙谊电子科技有限公司 | The selective electroplating technique of printed circuit board |
| CN112625504A (en) * | 2020-12-29 | 2021-04-09 | 江苏海田电子材料有限公司 | Anti-etching ink for ink-jet printing |
| CN113103776A (en) * | 2021-04-09 | 2021-07-13 | 福建省铭兴激光科技有限公司 | Spray printing roller manufacturing device and roller manufacturing method |
| CN113480892A (en) * | 2021-07-06 | 2021-10-08 | 广州亦盛环保科技有限公司 | Etching-resistant ink-jet ink and preparation method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106488660A (en) * | 2016-11-12 | 2017-03-08 | 广东科翔电子科技有限公司 | A kind of pcb board layout layer manufacturing method thereof based on magnetron sputtering technique |
| CN106658998A (en) * | 2016-11-12 | 2017-05-10 | 广东科翔电子科技有限公司 | Method for processing dielectric layer of multilayer impedance flexible circuit board |
| CN106793481A (en) * | 2016-11-12 | 2017-05-31 | 广东科翔电子科技有限公司 | A kind of multilayer impedance FPC of high evenness and preparation method thereof |
| CN106566301A (en) * | 2016-11-13 | 2017-04-19 | 惠州市大亚湾科翔科技电路板有限公司 | Cured type composition for flexible circuit board |
| CN106752175A (en) * | 2016-11-13 | 2017-05-31 | 惠州市大亚湾科翔科技电路板有限公司 | A kind of wiring board cured film and printed wiring board |
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| CN107619624A (en) * | 2017-10-09 | 2018-01-23 | 广东高仕电研科技有限公司 | A kind of UV solidifications solder mask and preparation method thereof |
| CN108289383A (en) * | 2018-03-05 | 2018-07-17 | 东莞市龙谊电子科技有限公司 | The selective electroplating technique of printed circuit board |
| CN112625504A (en) * | 2020-12-29 | 2021-04-09 | 江苏海田电子材料有限公司 | Anti-etching ink for ink-jet printing |
| CN113103776A (en) * | 2021-04-09 | 2021-07-13 | 福建省铭兴激光科技有限公司 | Spray printing roller manufacturing device and roller manufacturing method |
| CN113480892A (en) * | 2021-07-06 | 2021-10-08 | 广州亦盛环保科技有限公司 | Etching-resistant ink-jet ink and preparation method thereof |
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| CN105733361B (en) | 2019-05-03 |
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