CN105719953A - 一种去除石墨烯的方法 - Google Patents
一种去除石墨烯的方法 Download PDFInfo
- Publication number
- CN105719953A CN105719953A CN201610155520.9A CN201610155520A CN105719953A CN 105719953 A CN105719953 A CN 105719953A CN 201610155520 A CN201610155520 A CN 201610155520A CN 105719953 A CN105719953 A CN 105719953A
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- CN
- China
- Prior art keywords
- graphene
- specific environment
- method removing
- described specific
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610155520.9A CN105719953A (zh) | 2016-03-18 | 2016-03-18 | 一种去除石墨烯的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610155520.9A CN105719953A (zh) | 2016-03-18 | 2016-03-18 | 一种去除石墨烯的方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105719953A true CN105719953A (zh) | 2016-06-29 |
Family
ID=56157872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610155520.9A Pending CN105719953A (zh) | 2016-03-18 | 2016-03-18 | 一种去除石墨烯的方法 |
Country Status (1)
Country | Link |
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CN (1) | CN105719953A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110047851A (zh) * | 2019-04-22 | 2019-07-23 | 深圳市华星光电半导体显示技术有限公司 | Tft阵列基板及其制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110315655A1 (en) * | 2009-04-21 | 2011-12-29 | Fujitsu Limited | Method of processing graphene sheet material and method of manufacturing electronic device |
CN104051239A (zh) * | 2014-06-26 | 2014-09-17 | 重庆墨希科技有限公司 | 一种石墨烯薄膜的图形化方法 |
CN104465400A (zh) * | 2014-12-11 | 2015-03-25 | 中国科学院微电子研究所 | 无残留光学光刻胶石墨烯fet的制备及原位表征方法 |
CN105036105A (zh) * | 2015-06-26 | 2015-11-11 | 浙江大学 | 一种氟化石墨烯/石墨烯异质结的制备方法 |
-
2016
- 2016-03-18 CN CN201610155520.9A patent/CN105719953A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110315655A1 (en) * | 2009-04-21 | 2011-12-29 | Fujitsu Limited | Method of processing graphene sheet material and method of manufacturing electronic device |
CN104051239A (zh) * | 2014-06-26 | 2014-09-17 | 重庆墨希科技有限公司 | 一种石墨烯薄膜的图形化方法 |
CN104465400A (zh) * | 2014-12-11 | 2015-03-25 | 中国科学院微电子研究所 | 无残留光学光刻胶石墨烯fet的制备及原位表征方法 |
CN105036105A (zh) * | 2015-06-26 | 2015-11-11 | 浙江大学 | 一种氟化石墨烯/石墨烯异质结的制备方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110047851A (zh) * | 2019-04-22 | 2019-07-23 | 深圳市华星光电半导体显示技术有限公司 | Tft阵列基板及其制作方法 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20190327 Address after: No. 518-5 Zhonghui Road, Standard Factory Building of Chang'an Industrial Park, Huishan Economic Development Zone, Wuxi City, Jiangsu Province, 214000 Applicant after: Wuxi Gefei Electronic Film Technology Co.,Ltd. Applicant after: Wuxi Sixth Element Electronic Film Technology Co., Ltd. Address before: No. 518-5 Zhonghui Road, Standard Factory Building of Chang'an Industrial Park, Huishan Economic Development Zone, Wuxi City, Jiangsu Province, 214000 Applicant before: Wuxi Gefei Electronic Film Technology Co.,Ltd. |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160629 |