CN105714293A - Composite material having both high magnetic conduction and high electric conduction and preparation method thereof - Google Patents
Composite material having both high magnetic conduction and high electric conduction and preparation method thereof Download PDFInfo
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Abstract
The invention provides a composite material having both high magnetic conduction and high electric conduction; the composite material includes a soft magnetic material layer and a metal plating layer located on one side or both sides of the soft magnetic material layer and having the thickness of 1-20 [mu]m, and the resistance of the composite material is 0.3-1 m[ohms], and the AC magnetic conductivity of the composite material at the frequency of 500 kHz is higher than 300; compared with a composite material which simultaneously has magnetic conduction and electric conduction functions in the prior art, is more than 300 [mu]m in thickness, has relatively poor magnetic conduction and electric conduction properties and difficultly meets the lightening, thinning and functionalization requirements, the composite material provided by the invention simultaneously has relatively high electric conduction and magnetic conduction properties, and conforms to the lightening, thinning and functionalization development requirements of electromagnetic composite materials; furthermore, a heating condition generated due to absorption of magnetic energy can be effectively avoided, and the heating problem is solved without increase of the thickness; and the composite material can meet further processing design requirements of touch screens, electronic printing and the like.
Description
Technical field
The present invention relates to a kind of composite having high magnetic conduction and high connductivity concurrently and preparation method thereof, belong to the technical field of magnetoelectric composites.
Background technology
Development along with modern science and technology, Internet of Things, cloud computing, mobile Internet, big data etc. are the fast development of the generation information technology indicated and equipment, with wireless radio frequency discrimination RFID, wireless payment NFC, wireless charging technology etc. for the electronic product supported and technology, it is attractive in appearance, novelty, portability are more and more accepted by the public and promotes, further having promoted electronic product device direction lightening, high-effect to develop, particularly high magnetic conduction, high connductivity type composite face the urgent market demand.
Existing electronic device many employings Copper Foil or aluminium foil etc., the interference shielding of wire rod, cable is controlled, such as high frequency wires such as electric wire, computer line, holding wire, coaxial cable, twisted wire, recombination line, PC plate precision components, wiring board, electric EMI, HDMI as many conductors.When actually used, how these Copper Foils or aluminium foil passed through double faced adhesive tape etc., be pasted onto at the bottom of insulator-base, cause that the anti-interference shielding layer thickness of final acquisition is all more than 100 μm, and continue thinning limited space, it is difficult to meet demand lightening, functionalization.
Meanwhile, existing permeability magnetic material mostly is ferrite, and its thickness is big, weight is big, it is impossible to meet the lightening demand of these electronic equipment.Such as Chinese patent application CN201320576601, CN201220030770, CN201210277219, CN200680024321 etc..These ferrite sheets mix frequently with binding agents such as ferrite powder and resins and are pressed into sheet material, sinter again through the method for curtain coating or calendering and form.In ferrite sheet preparation technology, sintering temperature is up to more than 800 DEG C, and sintering time is longer for 9-12 hour.In sintering procedure, ferrite sheet is prone to embrittlement deformation, fracture occurs.The ferrite sheet embrittlement finally given, flexible poor, this requires when carrying out technological operation, does not allow bending, once bending, internal sheet material fragmentation, magnetic conduction effect sharply declines.The saturation induction density Bs value of ferrite sheet is relatively low, only about 0.4T, therefore can only rely on the caloric value produced when increasing thickness to reduce magnetic conduction.As can be seen here, ferrite composite material exists that recovery rate is low, process costs is high, use scope is limited and the shortcoming such as thickness relatively big (more than 0.2mm).The mass production of the product such as wireless charging, NFC, RFID and technology is had considerable influence by this.
For covering day by day complicated frequency electromagnetic waves, and meet the development trend that device is lightening, it is necessary to there is high connductivity and the advanced composite material (ACM) of high magnetic conduction function simultaneously.But now widely used copper-foil conducting electricity and aluminum foil material, and magnetic conduction Ferrite Material, the function of the two is separate.Copper Foil or aluminium foil cannot realize magnetic conduction function, and Ferrite Material cannot realize conducting function.When actually used, by adopting double faced adhesive tape, insulating barrier etc. Copper Foil or aluminium foil etc. to be pasted together with Ferrite Material, to obtain the composite with magnetic conduction and conducting function, but the magnetic conduction of said method acquisition composite and electric conductivity are all poor, it is difficult to meet demand lightening, functionalization.Therefore, high magnetic conduction lightening, dynamical, high-conductivity composite material and technology of preparing are faced with great research and development demand.
Summary of the invention
The technical problem to be solved is in that magnetic conduction of the prior art and conducing composite material, magnetic conduction and electric conductivity are all poor, it is difficult to meet demand lightening, functionalization, thus proposing a kind of composite having high magnetic conduction and high connductivity concurrently and preparation method thereof.
For solving above-mentioned technical problem, technical scheme is as follows:
A kind of composite having high magnetic conduction and high connductivity concurrently, described composite includes layer of soft magnetic material and is positioned at the coat of metal of single or double of described layer of soft magnetic material,
The thickness of the described coat of metal is 1-20 μm；
The resistance of described composite is 0.3-1m Ω；
Described composite ac permeability under 500kHz frequency is higher than 300.
Described layer of soft magnetic material is the combination of one or more in permalloy, Fe-based amorphous alloy, iron-base nanometer crystal alloy, FeSi, FeNi, FeCo, electrical pure iron.
The described coat of metal is the combination of one or more in Sn layer, Cu layer, Ag layer, Ni layer.
The gross thickness of described composite is 3-450 μm.
A kind of method preparing the described composite having high magnetic conduction and high connductivity concurrently, it comprises the steps:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially passes through described rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder drawing described layer of soft magnetic material, obtain described composite.
Described abluent adopts N-acyl group sarcosine, two (pungent amino-ethyl) glycine, N-alkyl-aspartic acid β-Arrcostab, NβThe mixture of one or more in-acyl group-1B, lecithin, glycine betaine.
The concentration of described activator aqueous solution is 2-30wt%, and wherein, activator is H2SO3、H3PO4、HF、H2C2O4In the mixture of one or more.
Described activator aqueous solution is also added with the chelating agen that concentration is 5-30wt%.
Corresponding chemical plating pre-plating solution formula is selected in operation for the different coats of metal, particularly as follows:
When the described coat of metal is Cu layer, the formula of described chemical plating pre-plating solution includes: the main salt of preplating, 20-300 g/l；Chelating agent, 20-300 g/l；PH value regulator, 2-100 g/l；
When the described coat of metal is Sn layer, the formula of described chemical plating pre-plating solution includes: the main salt of preplating, 20-300 g/l；PH value regulator, 2-100 g/l；
When the described coat of metal is Ag layer, the formula of described chemical plating pre-plating solution includes: the main salt of preplating, 20-300 g/l；PH value regulator, 2-100 g/l；
When the described coat of metal is Ni layer, the formula of described chemical plating pre-plating solution includes: the main salt of preplating, 20-300 g/l；PH value regulator, 2-100 g/l.
For different coating, also select to add the mixture of one or more in reducing agent, stabilizer, accelerator, brightener, surfactant.
For different coating, the main salt of described preplating selects the mixture of one or more in the sulphuric acid Asia salt of corresponding coated metal, sulfate, metal chloride, subcarbonate, tartrate, acetate, borofluoride, sulfonate；Described chelating agent is the mixture of one or more in sodium potassium tartrate tetrahydrate, sodium citrate, sodium gluconate, EDTA, gelatin, Cyanogran.；Described pH value regulator is the mixture of one or more in sodium hydroxide, sodium carbonate, sulphuric acid, nitric acid, boric acid；Described reducing agent is the mixture of one or more in formaldehyde, sodium hypophosphite, sodium borohydride, dimethylamino borine, hydrazine；Described stabilizer is the mixture of one or more in methanol, Cyanogran., thio urea, alkyl hydrosulfide, dihydroxy pyridine, 2-2 bipyridyl；Described accelerator is the mixture of one or more in ammonium salt, nitrate, polyoxyethylene amino ethers；Described brightener is the mixture of one or more in organic sulfonic acid salt, ethylene thiourea, SPS (sodium polydithio-dipropyl sulfonate), BSP (phenyl dithiopropane sodium sulfonate), HP (alcohol mercapto propyl-sulfonate), TPS (poly dimethyl amidosulfonic acid sodium), benzylideneacetone, sodium benzoate, NPE, nicotinic acid.
The formula of described electroplate liquid includes:
Electroplating main salt, 20-300 g/l；
Chelating agent, 0.1-20 g/l；
PH value regulator, 0.001-30 g/l.
For different coating, also select to add the mixture of one or more in reducing agent, stabilizer, accelerator, brightener, surfactant.
For different coating, described electroplating main salt selects the mixture of one or more in the sulfate of corresponding coated metal, metal chloride, subcarbonate, and described chelating agent is the mixture of one or more in sodium potassium tartrate tetrahydrate, sodium citrate, sodium gluconate, EDTA；Described pH value regulator is sulphuric acid and/or boric acid；Described reducing agent is the mixture of one or more in formaldehyde, sodium hypophosphite, sodium borohydride, dimethylamino borine, hydrazine；Described stabilizer is the mixture of one or more in methanol, Cyanogran., thio urea, alkyl hydrosulfide, dihydroxy pyridine, 2-2 bipyridyl；Described accelerator is the mixture of one or more in ammonium salt, nitrate, polyoxyethylene amino ethers；Described brightener is the mixture of one or more in organic sulfonic acid salt, ethylene thiourea, SPS (sodium polydithio-dipropyl sulfonate), BSP (phenyl dithiopropane sodium sulfonate), HP (alcohol mercapto propyl-sulfonate), TPS (poly dimethyl amidosulfonic acid sodium), benzylideneacetone, sodium benzoate, NPE, nicotinic acid, and described surfactant is the mixture of one or more in isooctanol, stearic acid polyoxyethylene fat, Polyethylene Glycol.
When carrying out copper facing, the main salt of described preplating is the mixture of one or more in copper sulfate, copper sulphate pentahydrate, copper chloride, basic copper carbonate, cupric tartrate, Schweinfurt green；Described chelating agent is the mixture of one or more in sodium potassium tartrate tetrahydrate, sodium citrate, sodium gluconate, EDTA；Described reducing agent is the mixture of one or more in formaldehyde, sodium hypophosphite, sodium borohydride, dimethylamino borine, hydrazine；Described pH value regulator is sodium hydroxide and/or sodium carbonate；Described stabilizer is the mixture of one or more in methanol, Cyanogran., thio urea, alkyl hydrosulfide, dihydroxy pyridine, 2-2 bipyridyl；Described accelerator is the mixture of one or more in ammonium salt, nitrate, polyoxyethylene amino ethers.
The technique scheme of the present invention has the advantage that compared to existing technology
(1) composite having high magnetic conduction and high connductivity concurrently of the present invention, the coat of metal that thickness is 1-20 μm including layer of soft magnetic material and the single or double being positioned at described layer of soft magnetic material, and the resistance of described composite is 0.3-1m Ω, described composite ac permeability under 500kHz frequency is higher than 300；There is while in compared to prior art the composite of magnetic conduction and conducting function, magnetic conduction and electric conductivity are all poor, it is difficult to meet demand lightening, functionalization, composite of the present invention, there is higher electric conductivity and magnetic conductivity simultaneously, meet that magnetoelectric composites are lightening, the demand for development of functionalization；And there is good toughness, wide-angle bending can be carried out, when particularly Fe-based amorphous band does base material, it is possible to carry out 180 ° of doublings and do not rupture；The heat condition produced because absorbing magnetic energy can also be prevented effectively from further, solve heating problem without by increase thickness；Disclosure satisfy that touch screen, electronic printing etc. are processed further design requirement.
(2) present invention prepare described in have the method for composite of high magnetic conduction and high connductivity concurrently, adopt horizontal volume to volume preparation technology, not only base material can be carried out one side adhesion metal, also two-sided adhesion metal layer can be carried out, this is that traditional vertical electro-deposition method cannot be accomplished, it is thus possible to meet the fields such as electronic printing have particular design demand for magnetic conduction and conduction, for instance single-sided conductive, another side do not allow the occasion of conduction；
The method of the invention is utilized to prepare in the process of described composite coiled strip, according to application demand, it is possible to paste last layer double faced adhesive tape and protecting film, centrifugal paper etc. again at material surface easily；Just can conveniently realize for example with mechanical film-overlying machine, but adopt vertical electric deposition process to accomplish；
The efficiency of described horizontal volume to volume preparation method is higher than the efficiency of vertical electric deposition preparation tens times even tens times；
Described horizontal volume to volume preparation method, by stretch base material, thus maintain base material flowing electroplate liquid in uniform and stable, the composite of more than 100mm wide cut can be prepared；But the substrate width of vertical electric deposition process depends on the degree of depth of electrolysis bath, and width is more big, because of electrolyte, to circulate the interference brought also more big, and developed width is often limited within 100mm；
By the coiled strip that horizontal volume to volume preparation method obtains, performance is uniform and stable, it is not necessary to any following process, and being directly cut into reservation size can use；But adopt vertical electric sedimentation, due to the plating inhomogeneities that inevitable fixture produces, it is necessary to fixture place edge being cut, this reduces preparation efficiency undoubtedly, adds process costs；
In actual applications, different according to the occasion used, the thickness of each metal level is also different；Use described composite, be conveniently cut into desired size, directly dispose or be pasted onto the relevant position of the devices such as electronic equipment, communication apparatus, antenna modules, play the effect of magnetic conduction and conduction.
(3) method of the composite having high magnetic conduction and high connductivity concurrently of the present invention, by adopting N-acyl group sarcosine, two (pungent amino-ethyl) glycine, N-alkyl-aspartic acid β-Arrcostab, N β-acyl group-1B, lecithin, the mixture of one or more in glycine betaine is as abluent, the pickling used than tradition and alkali cleaning two step ablution, the present invention is carried out by adopting described abluent, can in decontamination, the activation to soft magnetic materials surface is realized while remove impurity, thus soft magnetic materials surface dry defecates clean after cleaning, and the concave convex texture in unit are substantially increases, and inventor finds through research, the concave convex texture of above-mentioned increase, it is advantageous to the tight of subsequent metal coating, uniformly attachment.
(4) method of the composite having high magnetic conduction and high connductivity concurrently of the present invention, the concentration of described activator aqueous solution is 2-30wt%, and wherein, activator is H2SO3、H3PO4、HF、H2C2O4In the mixture of one or more so that the significantly increasing of soft magnetic materials surface roughness after activation, so be conducive to subsequent metal coating tight, uniformly adhere to.
(5) method of the composite having high magnetic conduction and high connductivity concurrently of the present invention, described activator aqueous solution is also added with the chelating agen that concentration is 5-30wt%, described chelating agen is prone to the iron ion of electrolysis generation, manganese ion, zinc ion, calcium ion, magnesium ion etc. and reacts, thus being removed in time by above-mentioned foreign ion, and then the attachment for the coat of metal provides the condition optimized.
Accompanying drawing explanation
In order to make present disclosure be more likely to be clearly understood, below according to specific embodiments of the invention and in conjunction with accompanying drawing, the present invention is further detailed explanation, wherein
Fig. 1 is the structural representation of the composite having high magnetic conduction and high connductivity concurrently described in the embodiment of the present invention 1；
The layer of soft magnetic material that Fig. 2 is after comparative example 1 of the present invention is cleaned is surface observation figure when 300 times at enlargement ratio.
Fig. 3 is that after the embodiment of the present invention 1 is cleaned, layer of soft magnetic material is surface observation figure when 300 times at enlargement ratio.
Detailed description of the invention
Embodiment 1
The present embodiment provides a kind of composite having high magnetic conduction and high connductivity concurrently, as it is shown in figure 1, include layer of soft magnetic material 1 and lay respectively at the double-side copper coating 2 on the upper and lower surface of described layer of soft magnetic material, the gross thickness of described composite is 46 μm；
Described layer of soft magnetic material is width to be 280mm, thickness the be Fe-based amorphous band (the commercially available trade mark is 1k101) of 26 μm；
The thickness of the copper coating of described upper and lower surface is 10 μm.
The preparation method of the described composite having high magnetic conduction and high connductivity concurrently, comprises the steps:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the ultrasonic degreasing tank of electrolysis, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially pass through the ultrasonic degreasing tank of described electrolysis, rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder with layer of soft magnetic material described in the speed drawing of 0.05m/min, obtain described composite.
Described abluent adopts two (pungent amino-ethyl) glycine (TEGO), and described activator aqueous solution is containing 30wt%H2C2O4, 30wt% copper chelator aqueous solution, the electric current of electrolysis is 1.5A/dm2.By the soft magnetic materials after cleaning at the basis of microscopic observation of 300 times, as shown in Figure 3, it can be seen that the surface neat and tidy of soft magnetic materials, convex-concave lines showed increased in unit are, and it have been investigated that, the convex-concave lines of this increase, it is beneficial to the plating attachment of subsequent metal ion.
Described chemical plating copper pre-plating solution formula is: the main salt of preplating of 300 g/l, chelating agent 20 g/l, the reducing agent of 100 g/l, the pH value regulator of 2 g/l, the accelerator of the stabilizer of 40 g/l and 40 g/l, other are pure water, add a small amount of surfactant.
Copper chloride that the main salt of described preplating selects mass ratio to be 1:1 and the mixture of Schweinfurt green；Sodium potassium tartrate tetrahydrate selected by described chelating agent；Sodium borohydride selected by described reducing agent；Described pH value regulator is sodium carbonate, and is controlled within the scope of 9-10 by pH value；Alkyl hydrosulfide selected by described stabilizer；Described accelerator selects nitrate；Polyethylene Glycol selected by surfactant.
The formula of described electroplate liquid is: electroplating main salt 300 g/l, chelating agent 20 g/l, pH value regulator 30 g/l, and additive 50 g/l.Described electroplating main salt selects mass ratio to be 1:1 copper chloride and copper sulfate；Described chelating agent is sodium potassium tartrate tetrahydrate；Described pH value regulator is sulphuric acid, to be controlled between 2-2.3 by pH value.Electroplating current is 8A/dm2。
Embodiment 2
The present embodiment provides a kind of composite having high magnetic conduction and high connductivity concurrently, and including layer of soft magnetic material and the double-side copper coating laying respectively at described layer of soft magnetic material upper and lower surface, the gross thickness of described composite is 15 μm；
Described layer of soft magnetic material is width to be 80mm, thickness the be permalloy band (the commercially available trade mark is 1J85) of 5 μm；
The thickness of the copper coating of described upper and lower surface is 5 μm.
The preparation method of the described composite having high magnetic conduction and high connductivity concurrently, comprises the steps:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially pass through described rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder with layer of soft magnetic material described in the speed drawing of 0.15m/min, obtain described composite.
Described abluent adopts N-acyl group sarcosine and N-alkyl-aspartic acid β-Arrcostab to form according to mass ratio 1:1 configuration, and described activator aqueous solution adopts containing 5wt%H2SO3Aqueous solution with 5wt% copper chelator.The electric current of electrolysis is 0.8A/dm2。
Described chemical plating copper pre-plating solution formula is: the main salt of preplating of 100 g/l, chelating agent 50 g/l, the reducing agent of 10 g/l, the pH value regulator of 30 g/l, and the accelerator of the stabilizer of 5 g/l and 2 g/l, other are pure water, add a small amount of surfactant.
Copper sulphate pentahydrate selected by the main salt of described preplating；Sodium gluconate selected by described chelating agent；Dimethylamino borine (DMAB) selected by described reducing agent；Described pH value regulator is sodium hydroxide, and is controlled within the scope of 9-10 by pH value；Thio urea selected by described stabilizer；Described accelerator selects polyoxyethylene amino ethers, and isooctanol selected by described surfactant.
The formula of described electroplate liquid is: electroplating main salt 50 g/l, chelating agent 2 g/l, pH value regulator 10 g/l, and additive 7 g/l.Described electroplating main salt selects mass ratio to be 5:1 anhydrous cupric sulfate and copper chloride；Described chelating agent is sodium gluconate；Described pH value regulator is sulphuric acid, to be controlled between 2.7-2.9 by pH value.Electroplating current is 2A/dm2。
Embodiment 3
The present embodiment provides a kind of composite having high magnetic conduction and high connductivity concurrently, and including layer of soft magnetic material and the one side copper plate laying respectively at described layer of soft magnetic material upper surface, the gross thickness of described composite is 47 μm；
Described layer of soft magnetic material is width to be 280mm, thickness be FeSiB band (the commercially available composition Fe of 28 μm80Si9B11)；
The thickness of the copper coating of described upper surface is 19 μm.
The preparation method of the described composite having high magnetic conduction and high connductivity concurrently, comprises the steps:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the ultrasonic degreasing tank of electrolysis, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially pass through the ultrasonic degreasing tank of described electrolysis, rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder with layer of soft magnetic material described in the speed drawing of 1m/min, obtain described composite.
Described abluent adopts two (pungent amino-ethyl) glycine (TEGO), and described activator aqueous solution adopts containing 5wt%H3PO4With the aqueous solution of 10wt% copper chelator, the electric current of electrolysis is 0.8A/dm2。
Described chemical plating copper pre-plating solution formula is: the main salt of preplating of 300 g/l, chelating agent 20 g/l, the reducing agent of 100 g/l, the pH value regulator of 2 g/l, the accelerator of the stabilizer of 2 g/l and 40 g/l, other are pure water, add a small amount of surfactant.
Basic copper carbonate selected by the main salt of described preplating；Sodium potassium tartrate tetrahydrate selected by described chelating agent；Sodium borohydride selected by described reducing agent；Described pH value regulator is sodium carbonate, and is controlled within the scope of 9-10 by pH value；Methanol selected by described stabilizer；Described accelerator selects polyoxyethylene amino ethers；Isooctanol selected by described surfactant.
The formula of described electroplate liquid is: electroplating main salt 300 g/l, chelating agent 20 g/l, pH value regulator 30 g/l, and additive 50 g/l.Described electroplating main salt selects copper chloride；Described chelating agent is sodium potassium tartrate tetrahydrate；Described pH value regulator is sulphuric acid, to be controlled between 2-2.3 by pH value.Electroplating current is 5A/dm2。
Embodiment 4
The present embodiment provides a kind of composite having high magnetic conduction and high connductivity concurrently, and including layer of soft magnetic material and the one side tin coating laying respectively at described layer of soft magnetic material upper surface, the gross thickness of described composite is 28 μm；
Described layer of soft magnetic material is width to be 50mm, thickness be iron-base nanometer crystal alloy band (the commercially available Fe of 20 μm84Si7B15.5Cu1Nb3)；
The thickness of the tin coating of described upper surface is 8 μm.
The preparation method of the described composite having high magnetic conduction and high connductivity concurrently, comprises the steps:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the ultrasonic degreasing tank of electrolysis, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially pass through the ultrasonic degreasing tank of described electrolysis, rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder with layer of soft magnetic material described in the speed drawing of 0.2m/min, obtain described composite.
Described abluent adopts lecithin, and described activator aqueous solution adopts containing 5wt%H2SO3With the aqueous solution of 8wt% stannum chelating agen, the electric current of electrolysis is 1.5A/dm2。
Described chemical plating pre-plating tin solution formula is: the main salt of preplating of 30 g/l, the pH value regulator of 20 g/l, other are pure water, add a small amount of surfactant.
Stannous sulfate selected by the main salt of described preplating；Described pH value regulator is sulphuric acid, and is controlled within the scope of 2.5-2.7 by pH value.
The formula of described electroplate liquid is: electroplating main salt 60 g/l, chelating agent 20 g/l, pH value regulator 200 g/l, and reducing agent is 10 g/l, and brightener is 2 g/l.Described electroplating main salt selects stannous sulfate；Described chelating agent is gelatin；Described pH value regulator is sulphuric acid, and to control between 2-2.3 by pH value, formaldehyde selected by described reducing agent.Electroplating current is 3A/dm2。
Embodiment 5
The present embodiment provides a kind of composite having high magnetic conduction and high connductivity concurrently, and including layer of soft magnetic material and the one side silvering laying respectively at described layer of soft magnetic material upper surface, the gross thickness of described composite is 29 μm；
Described layer of soft magnetic material is width to be 100mm, thickness be FeCo alloy (the commercially available Fe of 28 μm65Co35)；
The thickness of the silvering of described upper surface is 1 μm.
The preparation method of the described composite having high magnetic conduction and high connductivity concurrently, comprises the steps:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the ultrasonic degreasing tank of electrolysis, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially pass through the ultrasonic degreasing tank of described electrolysis, rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder with layer of soft magnetic material described in the speed drawing of 20m/min, obtain described composite.
Described abluent adopts N-alkyl-aspartic acid β-Arrcostab and Nβ-acyl group-1B, described activator aqueous solution adopts containing 2wt%H2C2O4, 28wt%H2SO3Aqueous solution with 30wt% silver chelating agen.The electric current of electrolysis is 0.8A/dm2。
The pre-silver-plated solution formula of described chemical plating is: the main salt of preplating of 20 g/l, the pH value regulator of 20 g/l, other are pure water, add a small amount of surfactant.
Silver nitrate selected by the main salt of described preplating, and described pH value regulator is nitric acid, and isooctanol selected by described surfactant.
The formula of described electroplate liquid is: electroplating main salt 200 g/l, chelating agent 20 g/l, and brightener 20 g/l.Described electroplating main salt selects silver nitrate；Described chelating agent is Cyanogran.；Described pH value regulator is nitric acid, to be controlled between 2-2.3 by pH value.Electroplating current is 6A/dm2。
Embodiment 6
The present embodiment provides a kind of composite having high magnetic conduction and high connductivity concurrently, and including layer of soft magnetic material and the single-side nickel-plating layer laying respectively at described layer of soft magnetic material upper surface, the gross thickness of described composite is 320 μm；
Described layer of soft magnetic material is width to be 400mm, thickness the be FeSi band (the commercially available trade mark is DQ133-30) of 300 μm；
The thickness of the nickel coating of described upper surface is 20 μm.
The preparation method of the described composite having high magnetic conduction and high connductivity concurrently, comprises the steps:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the ultrasonic degreasing tank of electrolysis, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially pass through the ultrasonic degreasing tank of described electrolysis, rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder with layer of soft magnetic material described in the speed drawing of 0.01m/min, obtain described composite.
Described abluent adopts glycine betaine, and described activator aqueous solution adopts containing 5wt%, 6wt%H2SO3With the aqueous solution of 10wt% nickel chelating agen, the electric current of electrolysis is 1.0A/dm2。
Described chemical plating pre-nickel plating solution formula is: the main salt of preplating of 120 g/l, chelating agent 15 g/l, the pH value regulator of 10 g/l, and adds a small amount of stabilizer, brightener and surfactant, and other are pure water.
The main salt of described preplating selects 100 g/l of nickel sulfate and 20 g/l of sodium chloride, and sodium citrate selected by described chelating agent；Described pH adjusting agent selects boric acid, and is controlled within the scope of 5-6 by pH value；2-2 bipyridyl selected by described stabilizer；Sodium lauryl sulphate selected by described brightener, and stearic acid polyoxyethylene fat selected by described surfactant.
The formula of described electroplate liquid is: electroplating main salt 220 g/l, chelating agent 20 g/l, pH value regulator 20 g/l, and stabilizer 20 g/l and brightener 5 g/l.Described electroplating main salt selects mass ratio to be 10:1 nickel sulfate and Nickel dichloride.；Described chelating agent is sodium citrate；Described pH value regulator is boric acid, to be controlled between 5-6 by pH value.Electroplating current is 4A/dm2。
Embodiment 7
The present embodiment provides a kind of composite having high magnetic conduction and high connductivity concurrently, and including layer of soft magnetic material and lay respectively at the copper coating of described layer of soft magnetic material upper surface and the tin coating of lower surface, the gross thickness of described composite is 430 μm；
Described layer of soft magnetic material is width to be 500mm, thickness the be electrical pure iron (the commercially available trade mark is DT4E) of 400 μm；
The thickness of described copper coating is 10 μm, and the thickness of nickel coating is 5 μm.
The preparation method of the described composite having high magnetic conduction and high connductivity concurrently, including nickel plating and two steps of copper facing, specific as follows:
First carrying out nickel plating, technique is as follows:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the ultrasonic degreasing tank of electrolysis, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially pass through the ultrasonic degreasing tank of described electrolysis, rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder with layer of soft magnetic material described in the speed drawing of 1.2m/min, obtain described composite.
Described abluent adopts glycine betaine and lecithin, and described activator aqueous solution adopts containing 10wt%H3PO4, 6wt%H2SO3With the aqueous solution of 10wt% nickel chelating agen, the electric current of electrolysis is 0.8A/dm2。
Described chemical plating pre-nickel plating solution formula is: the main salt of preplating of 120 g/l, chelating agent 15 g/l, the pH value regulator of 10 g/l, and adds a small amount of stabilizer, brightener and surfactant, and other are pure water.
The main salt of described preplating selects 100 g/l of nickel sulfate and 20 g/l of sodium chloride, and EDTA selected by described chelating agent；Described pH adjusting agent selects boric acid, and is controlled within the scope of 5-6 by pH value；Dihydroxy pyridine and the 2-2 bipyridyl of mass ratio 1:1 selected by described stabilizer；Sodium lauryl sulphate selected by described brightener, and stearic acid polyoxyethylene fat selected by described surfactant.
The formula of described electroplate liquid is: electroplating main salt 220 g/l, chelating agent 20 g/l, pH value regulator 20 g/l, and stabilizer 20 g/l and brightener 5 g/l.Described electroplating main salt selects mass ratio to be 10:1 nickel sulfate and Nickel dichloride.；Described chelating agent is EDTA；Described pH value regulator is boric acid, to be controlled between 5-6 by pH value.Electroplating current is 2A/dm2。
Carrying out copper facing again, technique is as follows:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the ultrasonic degreasing tank of electrolysis, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially pass through the ultrasonic degreasing tank of described electrolysis, rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder with layer of soft magnetic material described in the speed drawing of 0.9m/min, obtain described composite.
Described abluent adopts glycine betaine and lecithin, and described activator aqueous solution adopts the aqueous solution containing 5wt%HF and 10wt% copper chelator, and the electric current of electrolysis is 0.8A/dm2。
Described chemical plating copper pre-plating solution formula is: the main salt of preplating of 300 g/l, chelating agent 20 g/l, the reducing agent of 100 g/l, and the accelerator of the stabilizer of 2 g/l and 3 g/l, other are pure water, add a small amount of surfactant.
Basic copper carbonate selected by the main salt of described preplating；Sodium potassium tartrate tetrahydrate selected by described chelating agent；Sodium borohydride selected by described reducing agent；Methanol selected by described stabilizer；Described accelerator selects polyoxyethylene amino ethers.
The formula of described electroplate liquid is: electroplating main salt 300 g/l, chelating agent 20 g/l, pH value regulator 30 g/l, and additive 50 g/l.Described electroplating main salt selects copper chloride；Described chelating agent is sodium potassium tartrate tetrahydrate；Described pH value regulator is sulphuric acid, to be controlled between 2-2.4 by pH value；Described accelerator is ammonium salt and nitrate, mass ratio 1:1.Electroplating current is 1.5A/dm2。
Comparative example 1
This comparative example provides a kind of composite having magnetic conduction and conduction concurrently, and including layer of soft magnetic material and the double-side copper coating laying respectively at described layer of soft magnetic material upper and lower surface, the gross thickness of described composite is 46 μm；
Described layer of soft magnetic material is width to be 280mm, thickness the be Fe-based amorphous band (the commercially available trade mark is 1k101) of 26 μm；
The thickness of the copper coating of described upper and lower surface is 10 μm.
The preparation method of the described composite having high magnetic conduction and high connductivity concurrently, comprises the steps:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the ultrasonic degreasing tank of electrolysis, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially pass through the ultrasonic degreasing tank of described electrolysis, rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder with layer of soft magnetic material described in the speed drawing of 0.05m/min, obtain described composite.
Described abluent adopts hot acid and thermokalite, and described activator aqueous solution adopts weak acid.
Described chemical plating copper pre-plating solution formula is: the main salt of preplating of 300 g/l, chelating agent 20 g/l, the reducing agent of 100 g/l, the pH value regulator of 2 g/l, the accelerator of the stabilizer of 40 g/l and 40 g/l, other are pure water, add a small amount of surfactant.
The main salt of described preplating selects the copper chloride of mass ratio 1:1 and the mixture of Schweinfurt green；Sodium potassium tartrate tetrahydrate selected by described chelating agent；Sodium borohydride selected by described reducing agent；Described pH value regulator is sodium carbonate, and is controlled within the scope of 9-10 by pH value；Alkyl hydrosulfide selected by described stabilizer；Described accelerator selects nitrate；Polyethylene Glycol selected by surfactant.
The formula of described electroplate liquid is: electroplating main salt 300 g/l, chelating agent 20 g/l, pH value regulator 30 g/l, and additive 50 g/l.Described electroplating main salt selects mass ratio to be 1:1 copper chloride and copper sulfate；Described chelating agent is sodium potassium tartrate tetrahydrate；Described pH value regulator is sulphuric acid, to be controlled between 2-2.3 by pH value.
Described hot acid adopts dilute sulfuric acid, and described thermokalite adopts sodium bicarbonate, and described activator aqueous solution adopts dilute sulfuric acid.
By the soft magnetic materials after cleaning at the basis of microscopic observation of 300 times, as shown in Figure 2, it can be seen that surface ratio is relatively clean and tidy, but the convex-concave lines in unit are is limited, and the plating tack of subsequent metal ion is poor.
Comparative example 2
This comparative example provides a kind of composite having magnetic conduction and conduction concurrently, and including layer of soft magnetic material and the double-side copper coating laying respectively at the upper and lower surface of described layer of soft magnetic material, the gross thickness of described composite is 15 μm；
Described layer of soft magnetic material is width to be 80mm, thickness the be permalloy band (the commercially available trade mark is 1J85) of 5 μm；
The thickness of the copper coating of described upper and lower surface is 5 μm.
The preparation method of the described composite having high magnetic conduction and high connductivity concurrently, comprises the steps:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the descaling bath equipped with hot acid, the alkaline bath equipped with thermokalite, the activated bath equipped with activator aqueous solution, the pre-coating bath equipped with chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially pass through described descaling bath, alkaline bath, activated bath, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder with layer of soft magnetic material described in the speed drawing of 0.15m/min, obtain described composite.
Described hot acid adopts dilute sulfuric acid, and described thermokalite adopts sodium hydroxide, and described activator aqueous solution adopts containing 5wt%H2SO3Aqueous solution with 5wt% copper chelator.
Described chemical plating copper pre-plating solution formula is: the main salt of preplating of 100 g/l, chelating agent 50 g/l, the reducing agent of 10 g/l, the pH value regulator of 30 g/l, and the accelerator of the stabilizer of 5 g/l and 2 g/l, other are pure water, add a small amount of surfactant.
Copper sulphate pentahydrate selected by the main salt of described preplating；Sodium gluconate selected by described chelating agent；Dimethylamino borine (DMAB) selected by described reducing agent；Described pH value regulator is sodium hydroxide, and is controlled within the scope of 9-10 by pH value；Thio urea selected by described stabilizer；Described accelerator selects polyoxyethylene amino ethers；Isooctanol selected by surfactant.
The formula of described electroplate liquid is: electroplating main salt 50 g/l, chelating agent 2 g/l, pH value regulator 10 g/l, and additive 7 g/l.Described electroplating main salt selects mass ratio to be 5:1 anhydrous cupric sulfate and copper chloride；Described chelating agent is sodium gluconate；Described pH value regulator is sulphuric acid, to be controlled between 2.7-2.9 by pH value.
Comparative example 3
This comparative example provides a kind of composite having magnetic conduction and conduction concurrently, and including layer of soft magnetic material and the double-side copper coating laying respectively at described layer of soft magnetic material upper and lower surface, the gross thickness of described composite is 46 μm；
Described layer of soft magnetic material is width to be 142mm, thickness the be Fe-based amorphous band (the commercially available trade mark is 1k101) of 26 μm；
The thickness of the copper coating of described upper and lower surface is 10 μm.
The preparation method of the described composite having magnetic conduction and conduction concurrently, comprises the steps:
(1) vertical electric depositing operation line is prepared, equipped with the rinse bath of hot acid, equipped with the rinse bath of thermokalite, rinsing bowl, equipped with the pre-coating bath of alkaline electroless plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker；
(2) corrosion-resistant gloves is worn, carry out manual operations, monolithic amorphous band is inserted successively hot acid, thermokalite and three rinse baths of pure water, carry out surface clean, again monolithic amorphous band is inserted and chemical pre-plating groove carries out copper pre-plating, pH value is 8.7-9, and electroless plating time 5min obtains described composite.
Described chemical plating copper pre-plating solution formula is: the main salt of preplating of 300 g/l, chelating agent 20 g/l, the reducing agent of 100 g/l, the pH value regulator of 2 g/l, the accelerator of the stabilizer of 40 g/l and 40 g/l, other are pure water, add a small amount of surfactant.
Copper chloride that the main salt of described preplating selects mass ratio to be 1:1 and the mixture of Schweinfurt green；Sodium potassium tartrate tetrahydrate selected by described chelating agent；Sodium borohydride selected by described reducing agent；Described pH value regulator is sodium carbonate, and is controlled within the scope of 9-10 by pH value；Alkyl hydrosulfide selected by described stabilizer；Described accelerator selects nitrate；Polyethylene Glycol selected by surfactant.
The formula of described electroplate liquid is: electroplating main salt 300 g/l, chelating agent 20 g/l, pH value regulator 30 g/l, and additive 50 g/l.Described electroplating main salt selects mass ratio to be 1:1 copper chloride and copper sulfate；Described chelating agent is sodium potassium tartrate tetrahydrate；Described pH value regulator is sulphuric acid, to be controlled between 2-2.3 by pH value.Electrodeposition time 10min.
Comparative example 4
This comparative example provides a kind of composite having magnetic conduction and conduction concurrently, and including layer of soft magnetic material and the double-side copper coating laying respectively at the upper and lower surface of described layer of soft magnetic material, the gross thickness of described composite is 15 μm；
Described layer of soft magnetic material is width to be 80mm, thickness the be permalloy band (the commercially available trade mark is 1J85) of 5 μm；
The thickness of the copper coating of described upper and lower surface is 5 μm.
The preparation method of the described composite having magnetic conduction and conduction concurrently, comprises the steps:
(1) prepare chemical plating, include the ultrasonic degreasing tank of electrolysis, the rinse bath equipped with abluent, the activated bath equipped with activator aqueous solution, the coating bath equipped with chemical plating pre-plating solution, the coating bath equipped with chemical plating fluid, rinsing bowl, drying baker along processing step successively；
(2) corrosion-resistant gloves is worn, carry out manual operations, monolithic amorphous band is sequentially carried out the ultrasonic oil removing of electrolysis, and immerse rinse bath and be carried out, activated bath activates, and the pre-coating bath of chemical plating carries out preplating, electroless plating tank carries out chemical plating, and rinsing bowl is carried out, drying baker is dried, and obtains described composite.
Described abluent adopts N-acyl group sarcosine and N-alkyl-aspartic acid β-Arrcostab to form according to mass ratio 1:1 configuration, and described activator aqueous solution adopts containing 5wt%H2SO3Aqueous solution with 5wt% copper chelator.
Described chemical plating copper pre-plating solution formula is: the main salt of preplating of 100 g/l, chelating agent 50 g/l, the reducing agent of 10 g/l, the pH value regulator of 30 g/l, and the accelerator of the stabilizer of 5 g/l and 2 g/l, other are pure water, add a small amount of surfactant.
Copper sulphate pentahydrate selected by the main salt of described preplating；Sodium gluconate selected by described chelating agent；Dimethylamino borine (DMAB) selected by described reducing agent；Described pH value regulator is sodium hydroxide, and is controlled within the scope of 9-10 by pH value；Thio urea selected by described stabilizer；Described accelerator selects polyoxyethylene amino ethers；Isooctanol selected by surfactant.
The formula of described chemical plating fluid is: the main salt of chemical plating 50 g/l, chelating agent 2 g/l, pH value regulator 10 g/l, and additive 7 g/l.The main salt of described chemical plating selects quality to be 5:1 anhydrous cupric sulfate and copper chloride than ratio；Described chelating agent is sodium gluconate；Described pH value regulator is sulphuric acid, to be controlled between 2.7-2.9 by pH value.
Experimental example
Being sequentially carried out by the composite that above-described embodiment 1-7 and comparative example 1-4 prepares and be numbered A-G and H-K, and adopt exchange soft magnetism measuring instrument that described composite carries out permeability measurement, the ac permeability measured under 500KHz is μ '；Adopting the resistance that four probe method measurement obtains is R, as shown in table 1.
The measurement result of table 1-different composite material sample
| Sample number into spectrum | Magnetic property (μ ', 500kHz) | Electric conductivity (R, m Ω) |
| A | 370 | 0.8 |
| B | 470 | 0.5 |
| C | 800 | 0.7 |
| D | 500 | 0.4 |
| E | 350 | 1 |
| F | 310 | 0.6 |
| G | 320 | 0.9 |
| H | 190 | 1.5 |
| I | 280 | 1.2 |
| J | 230 | 1.3 |
| K | 200 | 1.4 |
Result shows, the composite (sample A-G) that the inventive method prepares, and closely, the coat of metal is 1-20 μm in coating attachment, it can be ensured that its resistance is less of 0.3-1m Ω, and the ac permeability under 500kHz frequency is higher than 300；Adopting the composite (sample H-J) that in comparative example 1-4, method prepares, the coat of metal is difficult to close attachment, and coating resistance is relatively big, and magnetic conduction and electric conductivity are all poor, it is difficult to meet demand lightening, functionalization simultaneously.
Obviously, above-described embodiment is only for clearly demonstrating example, and is not the restriction to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here without also cannot all of embodiment be given exhaustive.And the apparent change thus extended out or variation are still among the protection domain of the invention.
Claims (14)
1. the composite having high magnetic conduction and high connductivity concurrently, it is characterised in that described composite includes layer of soft magnetic material and is positioned at the coat of metal of single or double of described layer of soft magnetic material,
The thickness of the described coat of metal is 1-20 μm；
The resistance of described composite is 0.3-1m Ω；
Described composite ac permeability under 500kHz frequency is higher than 300.
2. the composite having high magnetic conduction and high connductivity concurrently according to claim 1, it is characterized in that, described layer of soft magnetic material is the combination of one or more in permalloy, Fe-based amorphous alloy, iron-base nanometer crystal alloy, FeSi, FeNi, FeCo, electrical pure iron.
3. the composite having high magnetic conduction and high connductivity concurrently according to claim 1 and 2, it is characterised in that the described coat of metal is the combination of one or more in Sn layer, Cu layer, Ag layer, Ni layer.
4. according to the arbitrary described composite having high magnetic conduction and high connductivity concurrently of claim 1-3, it is characterised in that the gross thickness of described composite is 3-450 μm.
5. the method for the composite having high magnetic conduction and high connductivity concurrently prepared described in claim 1-4, it is characterised in that comprise the steps:
(1) prepare volume to volume electroplating technology line, include successively along process route coiled strip cylinder, the rinse bath equipped with abluent, the electrolytic activation slot equipped with activator aqueous solution, equipped with the pre-coating bath of chemical plating pre-plating solution, equipped with the electroplating bath of electroplate liquid, rinsing bowl, drying baker and winder；
(2) layer of soft magnetic material of rolling is arranged on described coiled strip cylinder, sequentially passes through described rinse bath, electrolytic activation slot, pre-coating bath, electroplating bath, rinsing bowl, drying baker and winder drawing described layer of soft magnetic material, obtain described composite.
6. the method for the composite having high magnetic conduction and high connductivity concurrently according to claim 5, it is characterised in that described abluent adopts N-acyl group sarcosine, two (pungent amino-ethyl) glycine, N-alkyl-aspartic acid β-Arrcostab, NβThe mixture of one or more in-acyl group-1B, lecithin, glycine betaine.
7. the method for the composite having high magnetic conduction and high connductivity concurrently according to claim 5 or 6, it is characterised in that the concentration of described activator aqueous solution is 2-30wt%, wherein, activator is H2SO3、H3PO4、HF、H2C2O4In the mixture of one or more.
8. the method for the composite having high magnetic conduction and high connductivity concurrently according to claim 7, it is characterised in that be also added with the chelating agen that concentration is 5-30wt% in described activator aqueous solution.
9. the method according to the arbitrary described composite having high magnetic conduction and high connductivity concurrently of claim 5-8, it is characterised in that select corresponding chemical plating pre-plating solution formula for the different coats of metal in operation, particularly as follows:
When the described coat of metal is Cu layer, the formula of described chemical plating pre-plating solution includes: the main salt of preplating, 20-300 g/l；Chelating agent, 20-300 g/l；PH value regulator, 2-100 g/l；
When the described coat of metal is Sn layer, the formula of described chemical plating pre-plating solution includes: the main salt of preplating, 20-300 g/l；PH value regulator, 2-100 g/l；
When the described coat of metal is Ag layer, the formula of described chemical plating pre-plating solution includes: the main salt of preplating, 20-300 g/l；PH value regulator, 2-100 g/l；
When the described coat of metal is Ni layer, the formula of described chemical plating pre-plating solution includes: the main salt of preplating, 20-300 g/l；PH value regulator, 2-100 g/l.
10. the method for the composite having high magnetic conduction and high connductivity concurrently according to claim 9, it is characterised in that for different coating, also selects to add the mixture of one or more in reducing agent, stabilizer, accelerator, brightener, surfactant.
11. the method for the composite having high magnetic conduction and high connductivity concurrently according to claim 10, it is characterized in that, for different coating, the main salt of described preplating selects the mixture of one or more in the sulphuric acid Asia salt of corresponding coated metal, sulfate, metal chloride, subcarbonate, tartrate, acetate, borofluoride, sulfonate；Described chelating agent is the mixture of one or more in sodium potassium tartrate tetrahydrate, sodium citrate, sodium gluconate, EDTA, gelatin, Cyanogran.；Described pH value regulator is the mixture of one or more in sodium hydroxide, sodium carbonate, sulphuric acid, nitric acid, boric acid；Described reducing agent is the mixture of one or more in formaldehyde, sodium hypophosphite, sodium borohydride, dimethylamino borine, hydrazine；Described stabilizer is the mixture of one or more in methanol, Cyanogran., thio urea, alkyl hydrosulfide, dihydroxy pyridine, 2-2 bipyridyl；Described accelerator is the mixture of one or more in ammonium salt, nitrate, polyoxyethylene amino ethers；Described brightener is the mixture of one or more in organic sulfonic acid salt, ethylene thiourea, SPS (sodium polydithio-dipropyl sulfonate), BSP (phenyl dithiopropane sodium sulfonate), HP (alcohol mercapto propyl-sulfonate), TPS (poly dimethyl amidosulfonic acid sodium), benzylideneacetone, sodium benzoate, NPE, nicotinic acid.
12. the method according to the arbitrary described composite having high magnetic conduction and high connductivity concurrently of claim 9-11, it is characterised in that the formula of described electroplate liquid includes:
Electroplating main salt, 20-300 g/l；
Chelating agent, 0.1-20 g/l；
PH value regulator, 0.001-30 g/l.
13. the method for the composite having high magnetic conduction and high connductivity concurrently according to claim 12, it is characterised in that for different coating, also select to add the mixture of one or more in reducing agent, stabilizer, accelerator, brightener, surfactant.
14. the method for the composite having high magnetic conduction and high connductivity concurrently according to claim 13, it is characterized in that, for different coating, described electroplating main salt selects the mixture of one or more in the sulfate of corresponding coated metal, metal chloride, subcarbonate, and described chelating agent is the mixture of one or more in sodium potassium tartrate tetrahydrate, sodium citrate, sodium gluconate, EDTA；Described pH value regulator is sulphuric acid and/or boric acid；Described reducing agent is the mixture of one or more in formaldehyde, sodium hypophosphite, sodium borohydride, dimethylamino borine, hydrazine；Described stabilizer is the mixture of one or more in methanol, Cyanogran., thio urea, alkyl hydrosulfide, dihydroxy pyridine, 2-2 bipyridyl；Described accelerator is the mixture of one or more in ammonium salt, nitrate, polyoxyethylene amino ethers；Described brightener is the mixture of one or more in organic sulfonic acid salt, ethylene thiourea, SPS (sodium polydithio-dipropyl sulfonate), BSP (phenyl dithiopropane sodium sulfonate), HP (alcohol mercapto propyl-sulfonate), TPS (poly dimethyl amidosulfonic acid sodium), benzylideneacetone, sodium benzoate, NPE, nicotinic acid, and described surfactant is the mixture of one or more in isooctanol, stearic acid polyoxyethylene fat, Polyethylene Glycol.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106495674A (en) * | 2016-10-31 | 2017-03-15 | 嘉善弘欣化工厂（普通合伙） | A kind of composition of raw materials of new ceramics polymer composites and preparation technology |
| CN111321408A (en) * | 2020-03-02 | 2020-06-23 | 中国科学院宁波材料技术与工程研究所 | Multi-interface amorphous nanocrystalline electromagnetic shielding composite material |
| WO2021092711A1 (en) * | 2019-11-11 | 2021-05-20 | 常德鑫睿新材料有限公司 | Electromagnetic shielding composite material and preparation method therefor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101462173A (en) * | 2009-01-16 | 2009-06-24 | 武汉理工大学 | Method for preparing nano complex particle for highly conductive and magnetic electro-magnetic screen |
| CN103796497A (en) * | 2014-01-22 | 2014-05-14 | 昆山海普过滤分离科技有限公司 | Electromagnetic wave shielding material with high-conductivity metal layer |
| CN104120469A (en) * | 2014-06-13 | 2014-10-29 | 宁波韵升股份有限公司 | Method for carrying out electronickelling on neodymium-iron-boron magnet |
| CN104178789A (en) * | 2014-08-10 | 2014-12-03 | 无棣向上机械设计服务有限公司 | Process for depositing nickel-copper alloy on electromagnetic pure iron |
-
2014
- 2014-12-04 CN CN201410729984.7A patent/CN105714293B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101462173A (en) * | 2009-01-16 | 2009-06-24 | 武汉理工大学 | Method for preparing nano complex particle for highly conductive and magnetic electro-magnetic screen |
| CN103796497A (en) * | 2014-01-22 | 2014-05-14 | 昆山海普过滤分离科技有限公司 | Electromagnetic wave shielding material with high-conductivity metal layer |
| CN104120469A (en) * | 2014-06-13 | 2014-10-29 | 宁波韵升股份有限公司 | Method for carrying out electronickelling on neodymium-iron-boron magnet |
| CN104178789A (en) * | 2014-08-10 | 2014-12-03 | 无棣向上机械设计服务有限公司 | Process for depositing nickel-copper alloy on electromagnetic pure iron |
Non-Patent Citations (2)
| Title |
|---|
| 张三元，张磊: "《电镀自动线生产技术问答》", 31 July 2008, 北京：化学工业出版社 * |
| 张允诚，胡如南，向荣: "《电镀手册》", 31 December 2011, 北京：国防工业出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106495674A (en) * | 2016-10-31 | 2017-03-15 | 嘉善弘欣化工厂（普通合伙） | A kind of composition of raw materials of new ceramics polymer composites and preparation technology |
| CN106495674B (en) * | 2016-10-31 | 2019-06-04 | 德化县后井窑瓷业有限责任公司 | A kind of composition of raw materials and preparation process of ceramics polymer composite material |
| WO2021092711A1 (en) * | 2019-11-11 | 2021-05-20 | 常德鑫睿新材料有限公司 | Electromagnetic shielding composite material and preparation method therefor |
| CN111321408A (en) * | 2020-03-02 | 2020-06-23 | 中国科学院宁波材料技术与工程研究所 | Multi-interface amorphous nanocrystalline electromagnetic shielding composite material |
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| CN105714293B (en) | 2018-12-21 |
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