CN105702607B - 机械臂和检查*** - Google Patents
机械臂和检查*** Download PDFInfo
- Publication number
- CN105702607B CN105702607B CN201610153574.1A CN201610153574A CN105702607B CN 105702607 B CN105702607 B CN 105702607B CN 201610153574 A CN201610153574 A CN 201610153574A CN 105702607 B CN105702607 B CN 105702607B
- Authority
- CN
- China
- Prior art keywords
- pulley
- cable silk
- silicon chip
- cable
- mechanical arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007689 inspection Methods 0.000 title claims description 29
- 239000002245 particle Substances 0.000 claims abstract description 17
- 238000012545 processing Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 118
- 229910052710 silicon Inorganic materials 0.000 claims description 110
- 239000010703 silicon Substances 0.000 claims description 110
- 230000007246 mechanism Effects 0.000 claims description 53
- 230000007547 defect Effects 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 238000010894 electron beam technology Methods 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 238000011109 contamination Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 8
- 238000013461 design Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 239000003344 environmental pollutant Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000007514 turning Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/104—Programme-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
- B25J9/1045—Programme-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons comprising tensioning means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (16)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610153574.1A CN105702607B (zh) | 2016-03-17 | 2016-03-17 | 机械臂和检查*** |
PCT/CN2016/079641 WO2017156820A1 (en) | 2016-03-17 | 2016-04-19 | Cable drive robot mechanism for exchanging samples |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610153574.1A CN105702607B (zh) | 2016-03-17 | 2016-03-17 | 机械臂和检查*** |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105702607A CN105702607A (zh) | 2016-06-22 |
CN105702607B true CN105702607B (zh) | 2018-09-25 |
Family
ID=56221760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610153574.1A Active CN105702607B (zh) | 2016-03-17 | 2016-03-17 | 机械臂和检查*** |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN105702607B (zh) |
WO (1) | WO2017156820A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113035758B (zh) * | 2020-12-31 | 2022-06-24 | 中科晶源微电子技术(北京)有限公司 | 腔室装置、晶片输送设备和晶片处理方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5765444A (en) * | 1995-07-10 | 1998-06-16 | Kensington Laboratories, Inc. | Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities |
CN201913647U (zh) * | 2010-12-21 | 2011-08-03 | 沈阳新松机器人自动化股份有限公司 | 机器人手臂机构 |
CN104823272A (zh) * | 2012-11-30 | 2015-08-05 | 应用材料公司 | 具有非等长前臂的多轴机械手设备、电子装置制造***、及用于在电子装置制造中传送基板的方法 |
CN105164799A (zh) * | 2013-03-15 | 2015-12-16 | 应用材料公司 | 基板沉积***、机械手移送设备及用于电子装置制造的方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4000036B2 (ja) * | 2002-09-30 | 2007-10-31 | 東京エレクトロン株式会社 | 搬送装置 |
JP4980127B2 (ja) * | 2007-04-24 | 2012-07-18 | 川崎重工業株式会社 | 基板搬送ロボット |
JP2011119556A (ja) * | 2009-12-07 | 2011-06-16 | Yaskawa Electric Corp | 水平多関節ロボットおよびそれを備えた搬送装置 |
JP6113742B2 (ja) * | 2012-10-29 | 2017-04-12 | ローツェ株式会社 | 半導体基板の位置検出装置及び位置検出方法 |
JP3202171U (ja) * | 2014-11-07 | 2016-01-21 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | ロボット搭載型通過ビーム基板検出器 |
CN104948690B (zh) * | 2015-05-07 | 2019-02-01 | 东方晶源微电子科技(北京)有限公司 | 一种具有张力保持装置的滑轮 |
-
2016
- 2016-03-17 CN CN201610153574.1A patent/CN105702607B/zh active Active
- 2016-04-19 WO PCT/CN2016/079641 patent/WO2017156820A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5765444A (en) * | 1995-07-10 | 1998-06-16 | Kensington Laboratories, Inc. | Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities |
CN201913647U (zh) * | 2010-12-21 | 2011-08-03 | 沈阳新松机器人自动化股份有限公司 | 机器人手臂机构 |
CN104823272A (zh) * | 2012-11-30 | 2015-08-05 | 应用材料公司 | 具有非等长前臂的多轴机械手设备、电子装置制造***、及用于在电子装置制造中传送基板的方法 |
CN105164799A (zh) * | 2013-03-15 | 2015-12-16 | 应用材料公司 | 基板沉积***、机械手移送设备及用于电子装置制造的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105702607A (zh) | 2016-06-22 |
WO2017156820A1 (en) | 2017-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Mechanical arm and inspection system Effective date of registration: 20200108 Granted publication date: 20180925 Pledgee: Beijing Yizhuang International Financing Guarantee Co.,Ltd. Pledgor: DONGFANG JINGYUAN ELECTRON Ltd. Registration number: Y2019990000822 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210126 Granted publication date: 20180925 Pledgee: Beijing Yizhuang International Financing Guarantee Co.,Ltd. Pledgor: DONGFANG JINGYUAN ELECTRON Ltd. Registration number: Y2019990000822 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manipulator and inspection system Effective date of registration: 20210126 Granted publication date: 20180925 Pledgee: Beijing Yizhuang International Financing Guarantee Co.,Ltd. Pledgor: DONGFANG JINGYUAN ELECTRON Ltd. Registration number: Y2021990000108 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220419 Granted publication date: 20180925 Pledgee: Beijing Yizhuang International Financing Guarantee Co.,Ltd. Pledgor: DONGFANG JINGYUAN ELECTRON Ltd. Registration number: Y2021990000108 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manipulator and inspection system Effective date of registration: 20220419 Granted publication date: 20180925 Pledgee: Beijing Yizhuang International Financing Guarantee Co.,Ltd. Pledgor: DONGFANG JINGYUAN ELECTRON Ltd. Registration number: Y2022990000213 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230529 Granted publication date: 20180925 Pledgee: Beijing Yizhuang International Financing Guarantee Co.,Ltd. Pledgor: DONGFANG JINGYUAN ELECTRON Ltd. Registration number: Y2022990000213 |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100176 building 12, yard 156, Jinghai 4th Road, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee after: Dongfang Jingyuan Microelectronics Technology (Beijing) Co.,Ltd. Address before: 100176 building 12, yard 156, Jinghai 4th Road, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee before: DONGFANG JINGYUAN ELECTRON Ltd. |