CN105702385A - Production method of laminated busbar - Google Patents
Production method of laminated busbar Download PDFInfo
- Publication number
- CN105702385A CN105702385A CN201610200976.2A CN201610200976A CN105702385A CN 105702385 A CN105702385 A CN 105702385A CN 201610200976 A CN201610200976 A CN 201610200976A CN 105702385 A CN105702385 A CN 105702385A
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- China
- Prior art keywords
- conductive plate
- dielectric film
- bus bar
- production method
- hot pressing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a production method of a laminated busbar. The production method of the laminated busbar comprises the following steps of (1) removing burrs from a conductive plate; (2) welding padding poles at the conductive plate, to be specific, firstly, tinning the padding pole, then carrying out heated tin soldering for a joint of the padding pole and the conductive plate, grinding a welding seam until the welding seam is neat and smooth, then correcting and finally tinning the whole conductive plate; (3) producing an adhesive-carrying insulating film, to be specific, regarding a two-way stretched polyester film (PET) as a base material, cutting the base material into a needed shape and a needed size, then correspondingly cutting a hot melt film with release paper and carrying out heat pressing by using a hot press; and (4) pressing the adhesive-carrying insulating film and the conductive plate by adopting a hot pressing mold, wherein the adhesive-carrying insulating film and the conductive plate can be well stuck with each other as rapid cooling can be done through a liquid circulation system in the hot pressing process. The production method of the laminated busbar can reduce the stray inductance value of the busbar efficiently; the busbar is molded for one time through the process above; the whole structure is compact; and the product quality and the production efficiency are greatly improved.
Description
[technical field]
The present invention relates to distribution system electric conductor technical field, particularly to the production method of a kind of laminated bus bar。
[background technology]
Electric current in distribution system is all conducted by electric conductor, and such as copper, aluminum conductor, copper bar etc., in powerful electrical equipment, electric current is generally relatively larger, and the conductor of logical super-high-current all can produce the loss of energy under the effect of various factors。
Tradition utilizes wire to carry out distribution, and when equipment is complicated, wire can compare many, thus adds the weight of system and the assembling of wire also relatively time-consuming effort on the whole；Use copper bar to carry out conduction electric current and can there is bigger reactance and surge current。When the power frequency of conduction is bigger, due to the existence of kelvin effect, electric current all can be concentrated to conductor surface, and the conduction current utilization rate so actually causing electric conductor is very low；Traditional busbar needs repeatedly to install when making, it is easy to make mistakes, and structure is not compact, equipment cost value is higher, and stray electrical inductance value is big, and the life-span is also short, use that traditional electric conductor is not only too much takies the device space, and reliability and safety aspect there is also certain problem。
Current laminated bus bars obtains relatively broad application at industry fields such as track traffic, electric power, new forms of energy, boats and ships, communication, industry frequency conversions, but with regard to domestic whole industry form, technology and process aspect are all not mature enough, after the conductive plate of conventional laminated bus bar simply removes burr after generally adopting the punching of copper plate general NC, the tin plating process of external coordination is just made directly laminated bus bar compacting, conductive plate burrs on edges is more, and processing dimension error is bigger。The processing technology of bus bar and the selection of making material also there is bigger difference, service life, production chains etc. are different, there is bigger difference in technical sophistication degree, produce and still inconvenient on care and maintenance, particularly in the production of the trial-production large-scale laminate of research and development single-piece, there is very big difficulty。
[summary of the invention]
In view of this, for overcoming the deficiencies in the prior art, the present invention provides the production method of a kind of laminated bus bar conductive plate, the processing technology of the laminated bus bar by improving is made by oneself in conjunction with hot melt adhesive film with the insulant that selection flexibly meets technological requirement, greatly reduce production cost and production cycle, improve the globality of laminated bus bar, decrease the installation difficulty of bus bar, thus improve the service life of bus bar and adding the reliability of system。
For achieving the above object, technical scheme is as follows:
A kind of production method of laminated bus bar, described laminated bus bar is made up of conductive plate and dielectric film pressing, comprises the following steps:
(1) described conductive plate is carried out deburring: adopt special flash trimmer that conductive plate entirety outer surface is removed burr formation wire-drawing effect；
(2) welded gasket post on described conductive plate: first pad post is carried out tin plating process, with high frequency fibre welding machine, described pad post and conductive plate junction are heated soldering again, adopt circular fiber wheel that weld grinding is smooth, then described conductive plate entirety is put in hot pressing die and be corrected, finally whole conductive plate assembly is carried out tin plating；
(3) band glue dielectric film is made: using biaxially oriented polyester film (PET) as base material, it is cut to required form size, then corresponding cutting is with the hot melt adhesive film of release paper, hot pressing is added with hot press, after overall cooling, taking out dielectric film, release paper of tearing, band glue dielectric film makes complete；
(4) adopt hot pressing die to described band glue dielectric film and conductive plate pressing: described hot pressing die bolster is embedded runner, can pass through fluid circulation system in hot pressing by mould and is pressed laminated bus bar to cool down rapidly, reduce the contractility of dielectric film, make described band glue dielectric film and conductive plate good bonding。
Above-mentioned steps (1) adopts special flash trimmer that conductive plate entirety outer surface is removed burr formation wire-drawing effect, improve described conductive plate integral smoothness, increase the cementitiousness of dielectric film further, reduce stray inductance influence factor, reduce overall laminate and puncture risk。
Further, in described step (2) to pad post tin plating time, the thickness requirement according to tin coating, adopt centerless grinder conservative control pad post outside diameter, make described pad post and conductive plate mating holes just interference fits。
High frequency fibre welding machine described in described step (2) utilizes kelvin effect to make pad post and conductive plate junction form local heating, controls the power of described high frequency brazing machine so that till solder stick just melts。
Adopting in described step (3) mechanical contact numerical control film to cut machine to base material cutting stock, compared with the cutting mode such as tradition cutting die, its blank size precision is high, and machine universal strong, edge quality is good。
The integrated shape chamber of hot pressing die in described step (4), bolster is all integral type, greatly reduces the quantity of scattered part, simple to operation, simultaneously at each self-embedding runner of bolster, can pass through fluid circulation system in hot pressing by mould and is pressed laminated bus bar to cool down rapidly, reduces the contractility of dielectric film, it is to avoid dielectric film deformation and foaming, it is greatly improved production efficiency, mold-break operations is convenient simultaneously, will not be burned, and safety is high。
The invention has the beneficial effects as follows, depth optimization is carried out in the selection that laminated bus bar makes material and in processing technology, technical process is carried out Deepen Design, reduce the stray electrical inductance value of bus bar as much as possible, the molding of technique last time, on the whole compact conformation, by independently making integral heat pressure after band glue dielectric film and connection gasket post soldering, reduce the manufacture difficulty of stack bus bar dramatically, shorten the production cycle simultaneously。
[accompanying drawing explanation]
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings。
Fig. 1 is the structural representation that the present invention adopts high frequency fibre welder pad post。
Fig. 2 is the structural representation that the present invention makes with glue dielectric film。
In figure, 1, mould on hot press, 2, hot press counterdie, 3, top board, 4, lower platen, 5, dielectric film, 6, hot melt adhesive film, 7, high frequency fibre welding machine, 8, conductive plate, 9, pad post。
[detailed description of the invention]
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments。Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention。
Embodiment:
A kind of production method of laminated bus bar, described laminated bus bar is made up of conductive plate and dielectric film pressing, comprises the following steps:
(1) described conductive plate is carried out deburring: adopt special flash trimmer that conductive plate entirety outer surface is removed burr formation wire-drawing effect；
(2) welded gasket post on described conductive plate: first pad post is carried out tin plating process, with high frequency fibre welding machine, described pad post and conductive plate junction are heated soldering again, adopt circular fiber wheel that weld grinding is smooth, then described conductive plate entirety is put in hot pressing die and be corrected, finally whole conductive plate assembly is carried out tin plating；
(3) band glue dielectric film is made: using biaxially oriented polyester film (PET) as base material, it is cut to required form size, then corresponding cutting is with the hot melt adhesive film of release paper, hot pressing is added with hot press, after overall cooling, taking out dielectric film, release paper of tearing, band glue dielectric film makes complete；
(4) adopt hot pressing die to described band glue dielectric film and conductive plate pressing: described hot pressing die bolster is embedded runner, can pass through fluid circulation system in hot pressing by mould and is pressed laminated bus bar to cool down rapidly, reduce the contractility of dielectric film, make described band glue dielectric film and conductive plate good bonding。
Above-mentioned steps (1) adopts special flash trimmer that conductive plate entirety outer surface is removed burr formation wire-drawing effect, improve described conductive plate integral smoothness, increase the cementitiousness of dielectric film further, reduce stray inductance influence factor, reduce overall laminate and puncture risk。
Referring to Fig. 1, the present invention adopt in above-mentioned steps (2) high frequency fibre welding machine 7 to pad post 9 tin plating time, the thickness requirement according to tin coating, adopt centerless grinder conservative control pad post outside diameter, make described pad post 9 and conductive plate 8 mating holes just interference fits。Adopt high frequency fibre welding machine 7 to utilize kelvin effect to make pad post 9 and conductive plate 8 junction form local heating again, control the power of described high frequency brazing machine 7 so that till solder stick just melts。After pad post 9 has welded, with circular fiber wheel, weld grinding is smooth, after having polished, conductive plate 8 entirety is put in hot pressing die and be corrected, it is ensured that the flatness error of whole conductive plate assembly。After having corrected, whole conductive plate assembly is carried out external coordination tin plating, optimize the surface quality of conductive plate 8 further, and consolidate weld seam welding quality。
Referring to Fig. 2, the present invention is when above-mentioned steps (3) makes band glue dielectric film, and the hot press of employing includes mould 1 and hot press counterdie 2 on hot press, and concrete grammar is:
Using biaxially oriented polyester film (PET) as base material, (mainly heatproof condition) is required in conjunction with different use conditions, from main separation hot melt adhesive film 6, hot-pressing strip glue dielectric film voluntarily, concrete grammar is: base material cuts into required geomery, then corresponding cutting is with the hot melt adhesive film 6 of release paper, then by the two split, with glue one facing to dielectric film 5, glued membrane profile needs to offset certain surplus slightly outwards in principle, then the two is put between top board 3 and the lower platen 4 that the heat-transfer matcrial of surfacing is made, hot pressing is added with hot press, concrete temperature and pressure of hot pressing, the time characteristic adjustment according to selected glued membrane, after to be laminated, take out overall to top board 3 and lower platen 4, do not take out at once, prevent dielectric film 5 from deforming, band pressure cools down, after overall cooling, take out dielectric film 5, tear release paper, band glue dielectric film makes complete。
The advantage of above-mentioned steps (3) technique is: base material biaxially oriented polyester film (PET) and hot melt adhesive film 6 that the present invention selects are purchased then homemade holistic cost respectively and bought band glue dielectric film far below direct。Motility is strong, according to different insulative and mechanical property requirements, base material and hot melt adhesive film can be selected flexibly to mate, producing different band glue dielectric film, namely a kind of base material can be suppressed one-side band glued membrane and can also suppress double-sided belt glued membrane, it is adaptable to different number of plies laminated bus bars produce, motility is strong, selectivity is many, be unlikely to due to certain insulant is inapplicable or scarce material and interrupt suddenly laminating bus bar and produce, it is possible to well ensure manufacturing schedule；
Stock utilization is higher, can first being cut into by base material after required shape according to compact dimensions blanking hot melt adhesive film, it is possible to the consumption of a degree of saving hot melt adhesive film, the use of hot melt adhesive film is more flexible simultaneously, use can be pieced together, be substantially not present tailing。
The integrated shape chamber of hot pressing die in described step (4), bolster is all integral type, greatly reduces the quantity of scattered part, simple to operation, simultaneously at each self-embedding runner of bolster, can pass through fluid circulation system in hot pressing by mould and is pressed laminated bus bar to cool down rapidly, reduces the contractility of dielectric film, it is to avoid dielectric film deformation and foaming, it is greatly improved production efficiency, mold-break operations is convenient simultaneously, will not be burned, and safety is high。
The present invention makes in the selection of material at laminated bus bar and carries out depth optimization in processing technology, technical process is carried out Deepen Design, reduces the stray electrical inductance value of bus bar, the molding of technique last time, on the whole compact conformation as much as possible。Improve the globality of laminated bus bar, decrease the installation difficulty of bus bar, thus improve the service life of bus bar and adding the reliability of system。
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention。
Claims (5)
1. a production method for laminated bus bar, described laminated bus bar is made up of conductive plate and dielectric film pressing, it is characterised in that comprise the following steps:
(1) described conductive plate is carried out deburring: adopt special flash trimmer that conductive plate entirety outer surface is removed burr formation wire-drawing effect；
(2) welded gasket post on described conductive plate: first pad post is carried out tin plating process, with high frequency fibre welding machine, described pad post and conductive plate junction are heated soldering again, adopt circular fiber wheel that weld grinding is smooth, then described conductive plate entirety is put in hot pressing die and be corrected, finally whole conductive plate assembly is carried out tin plating；
(3) band glue dielectric film is made: using biaxially oriented polyester film (PET) as base material, it is cut to required form size, then corresponding cutting is with the hot melt adhesive film of release paper, hot pressing is added with hot press, after overall cooling, taking out dielectric film, release paper of tearing, band glue dielectric film makes complete；
(4) adopt hot pressing die to described band glue dielectric film and conductive plate pressing: described hot pressing die bolster is embedded runner, can pass through fluid circulation system in hot pressing by mould and is pressed laminated bus bar to cool down rapidly, reduce the contractility of dielectric film, make described band glue dielectric film and conductive plate good bonding。
2. the production method of a kind of laminated bus bar according to claim 1, it is characterised in that in described step (2) to pad post tin plating time, make described pad post and conductive plate mating holes just interference fits。
3. the production method of a kind of laminated bus bar according to claim 1, it is characterized in that, high frequency fibre welding machine described in described step (2) utilizes kelvin effect to make pad post and conductive plate junction form local heating, control the power of described high frequency brazing machine so that till solder stick just melts。
4. the production method of a kind of laminated bus bar according to claim 1, it is characterised in that adopt mechanical contact numerical control film to cut machine to base material cutting stock in described step (3)。
5. the production method of a kind of laminated bus bar according to claim 1, it is characterised in that the integrated shape chamber of hot pressing die in described step (4), bolster is all integral type, and each self-embedding runner。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610200976.2A CN105702385B (en) | 2016-04-01 | 2016-04-01 | A kind of production method of laminated bus bar |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610200976.2A CN105702385B (en) | 2016-04-01 | 2016-04-01 | A kind of production method of laminated bus bar |
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| CN105702385A true CN105702385A (en) | 2016-06-22 |
| CN105702385B CN105702385B (en) | 2017-11-24 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107767991A (en) * | 2017-09-22 | 2018-03-06 | 稳利达电源技术有限公司 | PET busbars and its production technology |
| CN108580675A (en) * | 2018-02-13 | 2018-09-28 | 湖南南车电器有限公司 | A kind of general cold pressing assembly mold of busbar and cold pressing assemble method |
| CN110753622A (en) * | 2017-04-14 | 2020-02-04 | 迪乐公司 | Integrated electrical component within a laminate |
| CN111775453A (en) * | 2020-06-01 | 2020-10-16 | 苏州杜伦复合新材料有限公司 | Production process of composite sponge and adhesive film |
| CN112562917A (en) * | 2020-11-16 | 2021-03-26 | 苏州西典机电有限公司 | Power battery integrated busbar pressing method |
| CN114454514A (en) * | 2022-01-28 | 2022-05-10 | 株洲博雅科技股份有限公司 | Busbar hot-pressing process and hot-pressing equipment |
| CN114828389A (en) * | 2022-05-07 | 2022-07-29 | 深圳市易迅达电子科技有限责任公司 | OIS motor rigid-flex board |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110753622A (en) * | 2017-04-14 | 2020-02-04 | 迪乐公司 | Integrated electrical component within a laminate |
| CN110753622B (en) * | 2017-04-14 | 2022-06-07 | 迪乐公司 | Integrated electrical component within a laminate |
| CN107767991A (en) * | 2017-09-22 | 2018-03-06 | 稳利达电源技术有限公司 | PET busbars and its production technology |
| CN108580675A (en) * | 2018-02-13 | 2018-09-28 | 湖南南车电器有限公司 | A kind of general cold pressing assembly mold of busbar and cold pressing assemble method |
| CN108580675B (en) * | 2018-02-13 | 2023-10-03 | 株洲维通利电气有限公司 | Cold-pressing assembly mold and cold-pressing assembly method for busbar |
| CN111775453A (en) * | 2020-06-01 | 2020-10-16 | 苏州杜伦复合新材料有限公司 | Production process of composite sponge and adhesive film |
| CN112562917A (en) * | 2020-11-16 | 2021-03-26 | 苏州西典机电有限公司 | Power battery integrated busbar pressing method |
| CN112562917B (en) * | 2020-11-16 | 2022-09-16 | 苏州西典机电有限公司 | Power battery integrated busbar pressing method |
| CN114454514A (en) * | 2022-01-28 | 2022-05-10 | 株洲博雅科技股份有限公司 | Busbar hot-pressing process and hot-pressing equipment |
| CN114828389A (en) * | 2022-05-07 | 2022-07-29 | 深圳市易迅达电子科技有限责任公司 | OIS motor rigid-flex board |
| CN114828389B (en) * | 2022-05-07 | 2023-07-28 | 深圳市易迅达电子科技有限责任公司 | OIS motor soft and hard combination board |
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|---|---|
| CN105702385B (en) | 2017-11-24 |
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