CN105694745A - Wafer processing tape - Google Patents
Wafer processing tape Download PDFInfo
- Publication number
- CN105694745A CN105694745A CN201510870409.3A CN201510870409A CN105694745A CN 105694745 A CN105694745 A CN 105694745A CN 201510870409 A CN201510870409 A CN 201510870409A CN 105694745 A CN105694745 A CN 105694745A
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- China
- Prior art keywords
- adhesive layer
- film
- mold release
- tape
- release film
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention aims at providing a wafer processing tape which can reduce generation of tag traces, can select a supporting member no matter how thickness of an adhesive layer is, and can also prevent air from being involved between the adhesive layer and an adhesive film. The wafer processing tape is characterized in that the wafer processing tape comprises: a long demoulding film (11); an adhesive layer (12) arranged on a first surface of the demoulding film (11) and having a specified plane shape; an adhesive film (13) having a tag portion (13a) and a periphery portion (13b) surrounding the outside of the tag portion (13a), wherein the tag portion (13a) is arranged in a manner of covering the adhesive layer (12) and contacting with the demoulding film (11) at the periphery of the adhesive layer (12) and has a specified plane shape; and a supporting member (14) arranged on a second surface opposite to the first surface of the demoulding film (11) and arranged in a long side direction of the demoulding film (11) in an area including a portion corresponding to the adhesive layer (12) and not including a portion corresponding to an end portion of the tag portion (13a) in a short side direction of the demoulding film (11).
Description
Technical field
The present invention relates to tape for processing wafer, particularly relate to the tape for processing wafer with 2 functions of chip cutting band and chip junction film。
Background technology
Recently, developing a kind of chip cutting-chip and engaging band, its have concurrently semiconductor wafer is cut off when separating (chip cutting) for each chip for fix semiconductor wafer chip cutting band and for the semiconductor chip after cutting off being adhered to lead frame or base plate for packaging etc. or be used in stacked package semiconductor chip being laminated to each other, 2 functions of bonding chip junction film (also referred to as chip attachment film)。
Engage band as such chip cutting-chip, it is contemplated that the operability of the installation etc. to paster ring frame during to the attaching of wafer, chip cutting, sometimes implement precut processing。
Illustrate that the chip cutting-chip after precut processing engages the example of band in figures 4 and 5。Fig. 4 indicates that figure, Fig. 5 (a) that chip cutting-chip engages the state that tape wrapping is drum are the top views that chip cutting-chip engages band, and Fig. 5 (b) is based on the profile of the line B-B of Fig. 5 (a)。Chip cutting-chip engages band 50 and comprises mold release film 51, adhesive layer 52 and bonding film 53。Adhesive layer 52 is processed as the circle corresponding with the shape of wafer, has circular tag shape。Bonding film 53 eliminates the neighboring area of circular portion corresponding to the shape of paster ring frame with chip cutting, as it can be seen, there is circular tag portion 53a and surround the periphery 53b outside it。The circular tag portion 53a of adhesive layer 52 and bonding film 53 is with by its Centered mode stacking, it addition, the circular tag portion 53a rubber cover adhesive layer 52 of bonding film 53 and contacting with mold release film 51 about。
When wafer chip is cut, mold release film 51 is peeled off from the adhesive layer 52 of laminated arrangement and bonding film 53, as shown in Figure 6, attaching the back side of semiconductor wafer W on adhesive layer 52, the peripheral part at the circular tag portion 53a of bonding film 53 is adhesively fixed chip cutting paster ring frame R。In this condition by semiconductor wafer W chip cutting, afterwards, semiconductor chip is picked up after bonding film 53 is implemented the cured such as ultraviolet radiation。Now, due to cured, bonding force reduces bonding film 53, therefore easily peels off from adhesive layer 52, picks up semiconductor chip under the state being attached to adhesive layer 52 overleaf。It is attached to the adhesive layer 52 at the back side of semiconductor chip when later semiconductor chip being adhered to lead frame, base plate for packaging or other semiconductor chips, works as chip junction film。
It addition, just as chip cutting as described above-chip engages band 50, adhesive layer 52 is thick with the periphery 53b of the part specific adhesion film 53 of the circular tag portion 53a stacking of bonding film 53。Therefore, during tubular wound into a roll as goods, adhesive layer 52 is overlapped with the difference in height of the laminated portions of the circular tag portion 53a of bonding film 53 and the periphery 53a of bonding film 53, there is the phenomenon in soft adhesive layer 52 surface transfer difference in height, i.e. such transfer trace (also referred to as label vestige, wrinkle or winding vestige) shown in Fig. 7。The generation of such transfer trace is particularly at adhesive layer 52 by the many situation of the situation of soft resin formation, the situation that there is thickness and the band winding number of 50 etc. significantly。Then, if producing transfer trace, then exist and caused adding, at wafer, the probability producing unfavorable condition man-hour by the poor attachment of adhesive layer Yu semiconductor wafer。
In order to solve such problem, developing a kind of tape for processing wafer, what it was mold release film above and is provided with a bearing member (for example, referring to patent documentation 1) with the 1st contrary the 2nd being provided with adhesive layer and bonding film at the both ends of the short side direction of mold release film。Such tape for processing wafer is provided with a bearing member, therefore when tape for processing wafer is wound as drum, it is possible to is disperseed by the winding pressure that band is applied or concentrates on a bearing member, therefore, it can suppress the formation of the transfer to adhesive layer。
Prior art literature
Patent documentation
Patent documentation 1: No. 4360653 publications of Japanese Patent No.
Summary of the invention
The problem that invention to solve
But, in the tape for processing wafer recorded in above-mentioned patent documentation 1, in order to fully suppress the formation of the transfer to adhesive layer, it is necessary to the thickness of a bearing member to be set to more than the thickness of adhesive layer, therefore there is the selected middle problem that there is restriction in a bearing member。It addition, bonding film rubber cover adhesive layer and contacting with mold release film about, but the thickness according to adhesive layer, between mold release film and bonding film, sometimes produce minimum space, residual air (air)。The tape for processing wafer recorded in above-mentioned patent documentation 1 is provided with a bearing member at the short side direction both ends of mold release film, therefore by the state of tubular wound into a roll for tape for processing wafer, become hollow structure between label portion and the mold release film wound thereon, therefore occur in that have that above-mentioned air (air) is mobile and the problem that invades probability between adhesive layer and bonding film。The air (air) invaded between adhesive layer and bonding film also referred to as hole (void), it exists makes the bad generation of laminating for semiconductor wafer W, cause after the chip cutting operation of semiconductor wafer W or the probability of reduction of yield rate of the pickup process of chip, bonding process。
Therefore, the problem of the present invention is in that to provide a kind of tape for processing wafer, it can reduce the generation of label vestige, no matter and can the thickness of adhesive layer as where selected a bearing member, can reduce simultaneously between adhesive layer and bonding film, be involved in air (air)。
The method solving problem
In order to solve above problem, tape for processing wafer involved in the present invention is characterized by: long mold release film；Adhesive layer, is arranged on the 1st of described mold release film and has the flat shape of regulation；Bonding film, has the periphery in the outside of label portion and the described label portion of encirclement, and described label portion is arranged in the way of covering described adhesive layer and contacting with described mold release film around described adhesive layer, and has the flat shape of regulation；And a bearing member, that be arranged on described mold release film with on the 1st contrary the 2nd that be that be provided with described adhesive layer and described bonding film, and within comprising the part corresponding with described adhesive layer and not comprising the region of the part corresponding with the end on the short side direction of described mold release film of described label portion, the long side direction along described mold release film is arranged。
It addition, above-mentioned semiconductor machining band preferably above-mentioned bearing member is arranged at the central part of the short side direction of above-mentioned mold release film。
It addition, above-mentioned semiconductor machining band is preferably: in above-mentioned bearing member, the width of the short side direction of above-mentioned mold release film is 10～50mm。
Invention effect
According to the present invention it is possible to reduce the generation of label vestige, no matter and can the thickness of adhesive layer as where selected a bearing member, can reduce simultaneously between adhesive layer and bonding film, be involved in air。
Accompanying drawing explanation
(a) of Fig. 1 is the top view of the tape for processing wafer involved by embodiments of the present invention, and (b) is the profile based on line A-A of (a)。
Fig. 2 is the profile of the tape for processing wafer involved by another embodiment of the present invention。
Fig. 3 is the profile of the tape for processing wafer involved by another embodiment further of the present invention。
The axonometric chart of the tape for processing wafer that Fig. 4 is those that have previously been。
(a) of Fig. 5 is the top view of conventional tape for processing wafer, and (b) is the profile based on line B-B of (a)。
Fig. 6 is the profile of display tape for processing wafer and the state of chip cutting paster ring frame laminating。
Fig. 7 is the schematic diagram of the unfavorable condition for conventional tape for processing wafer is described。
Detailed description of the invention
Below based on accompanying drawing, embodiments of the present invention are explained。Fig. 1 (a) is the top view of the tape for processing wafer (chip cutting-chip engages band) involved by embodiments of the present invention, and Fig. 1 (b) is the profile based on line A-A of Fig. 1 (a)。
As shown in Fig. 1 (a) and Fig. 1 (b), tape for processing wafer 10 has long mold release film 11, adhesive layer 12, bonding film 13 and props up bearing member 14。
Adhesive layer 12 is arranged on the 1st of mold release film, has the circular tag shape corresponding with the shape of wafer。Bonding film 13 has the periphery 13b, described circular tag portion 13a in circular tag portion 13a and the outside that surrounds this circular tag portion 13a and arranges by rubber cover adhesive layer 12 and in the way of contacting with mold release film around adhesive layer 12。Periphery 13b include form that the outside of circular tag portion 13a is surrounded completely and as depicted halfway around form。Circular tag portion 13a has the shape corresponding with incisory paster ring frame。And, bearing member 14 be arranged on mold release film 11 with on the 1st contrary for 11a the 2nd 11b being provided with adhesive 12 and bonding film 13, and be arranged on and comprise the part corresponding with adhesive layer 12 and do not comprise the region r of the part corresponding with the end on the short side direction of described mold release film 11 of label portion 13a。
Hereinafter, each element of the tape for processing wafer 10 of present embodiment is explained。
(mold release film)
As the mold release film 11 used in the tape for processing wafer 10 of the present invention, it is possible to use polyester (PET, PBT, PEN, PBN, PTT) is, polyolefin (PP, PE) is, copolymer (EVA, EEA, EBA) is or by the displacement of these material parts thus the film that further cementability, mechanical strength improve。Furthermore it is possible to be the duplexer of these films。
The thickness of mold release film is not particularly limited, it is possible to suitably set, but preferably 25～50 μm。
(adhesive layer)
The adhesive layer 12 of the present invention is as it has been described above, have the circular tag shape that formation is corresponding with the shape of wafer on the 1st 11a of mold release film 11。
Adhesive layer 12, after laminating chip cutting semiconductor wafer etc., when picking up chip, is attached to chip back, uses as adhesive when chip is fixed on substrate, lead frame。As adhesive layer 12, it may be preferred to use the viscose glue stick etc. containing at least one in epoxy system resin, acrylic resin, phenolic aldehyde system resin。In addition, it is possible to use polyimides system resin, silicone-based resin。Its thickness can suitably set, but preferably about 5～100 μm。
(bonding film)
The bonding film 13 of the present invention is as it has been described above, circular tag portion 13a corresponding to the shape with paster ring frame with chip cutting and surround the periphery 13b outside it。Can being processed by precut, the neighboring area removing circular tag portion 13a from film adhesive forms such bonding film。
As bonding film 13, it does not have limit especially, as long as having the sufficient bonding force that wafer when wafer chip being cut is not peeled off, when picking up chip after chip cutting, show the low bonding force that can easily peel off from adhesive layer。For example, it is possible to be used in base material film to be aptly provided with the bonding film of adhesive phase。
As the base material film of bonding film 13, as long as just can using without particular limitation for known base material film, but use radiation-curable material as adhesive phase described later time, it is preferred to use there is the radioparent base material film of lonizing radiation。
Such as, as its material, the homopolymer of the alpha-olefins such as polyethylene, polypropylene, ethylene-propylene copolymer, PB Polybutene-1, poly-4-methylpentene-1, vinyl-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-acrylic acid copolymer, ionomer or copolymer or their mixture, polyurethane, styrene-ethylene-butadiene or thermoplastic elastomer (TPE) and their mixture such as amylene based copolymer, polyamide-polyol copolymer can be enumerated。It addition, base material film can be the base material film of the material mixing of more than two kinds in their group, it is also possible to be by the base material film of they single or multiple lifts。
The thickness of base material film is not particularly limited, it is possible to suitably set, but preferably 50～200 μm。
As the resin used in the adhesive phase of bonding film 13, it does not have limit especially, it is possible to use the known chlorinated polypropylene resin of use, acrylic resin, polyester resin, polyurethane resin, epoxy resin etc. in binding agent。
Binding agent is prepared preferably in the resin of adhesive phase 13 suitably coordinates acrylic adhesive, lonizing radiation polymerizable compound, Photoepolymerizationinitiater initiater, firming agent etc.。The thickness of adhesive phase 13 is not particularly limited and can suitably set, but preferably 5～30 μm。
Can within the adhesive layer Combined with Radiotherapy ray polymerization compound and made it easy to by radiation-curing from adhesive layer peel off。This lonizing radiation polymerizable compound can be used and such as can be irradiated and the harmonic component compound in molecule with more than at least 2 optical polymerism carbon-to-carbon double bonds of three-dimensional nettedization by light。
Specifically, can apply trimethylolpropane trimethacrylate, pentaerythritol triacrylate, tetramethylol methane tetraacrylate, dipentaerythritol monohydroxypentaacryande, dipentaerythritol acrylate, 1,4-butanediol diacrylate, 1,6-hexanediyl ester, polyethyleneglycol diacrylate or oligoester acrylate etc.。
It addition, except acrylate based compound as described above, it is possible to use urethane acrylate system oligomer。The polyol compound of polyester-type or polyether-type etc. can be made with polyhydric isocyanate compound (such as, 2, 4-toluene di-isocyanate(TDI), 2, 6-toluene di-isocyanate(TDI), 1, 3-eylylene diisocyanate, 1, 4-eylylene diisocyanate, diphenyl methane 4, 4-diisocyanate etc.) reaction and the terminal isocyanate carbamate prepolymer that obtains with there is the acrylate of hydroxyl or methacrylate (such as, 2-Hydroxy ethyl acrylate, methacrylic acid-2-hydroxy methacrylate, 2-hydroxypropyl acrylate, methacrylic acid-2-hydroxy propyl ester, polyethylene glycol acrylate, polyethylene glycol methacrylate-styrene polymer etc.) reaction obtain urethane acrylate system oligomer。
Within the adhesive layer, it is possible to for two or more mixture mixed in above-mentioned resin。
When using Photoepolymerizationinitiater initiater, it is possible to use such as benzoin iso-propylether, benzoin isobutyl ether, benzophenone, Michler's keton, clopenthixal ketone, dodecyl thiaxanthone, dimethyl thioxanthone, diethyl thioxanthone, benzil dimethyl ketal, Alpha-hydroxy cyclohexyl-phenyl ketone, 2-hyd roxymethyl phenyl propane etc.。The use level of these Photoepolymerizationinitiater initiaters is relative to acrylic acid series copolymer 100 mass parts preferably 0.01～5 mass parts。
(bearing member)
Bearing member 14 be arranged on mold release film 11 with on the 1st contrary for 11a the 2nd 11b being provided with adhesive 12 and bonding film 13, and long side direction along mold release film 11 is arranged within comprising the part corresponding with adhesive layer 12 and not comprising the region r of the part corresponding with the end on the short side direction of described mold release film 11 of label portion 13a。By arranging such bearing member 14, when tape for processing wafer 10 is wound as drum, the part that there is bearing member 14 is applied pressure, thus without following situation occurs: adhesive layer 12 is overlapped with the difference in height of the laminated portions of the circular tag portion 13a of bonding film 13 and the periphery 13a of bonding film 13 thus as label vestige in adhesive layer 12 surface transfer difference in height。Additionally, tape for processing wafer 10 is being wound as in the state of drum, the part that there is a bearing member 14 is applied pressure, the end on the short side direction of mold release film 11 of circular tag portion 13a is unfettered, therefore by the thickness of adhesive layer 12, in the gap produced between mold release film 11 and circular tag portion 13a, the air (air) of residual is discharged by the outside to circular tag portion 13a。
As long as the position arranging a bearing member 14 is in the r of region, as shown in Figure 1, it is possible to arrange in the whole region of region r, it is also possible to arrange in the arbitrary position of a part of region r。When a part of region r is arranged, as shown in Figure 2,3, it is preferable that the central part at the short side direction of mold release film arrange a bearing member 14', 14 "。In addition, a part at region r is arranged when propping up bearing member 14, sometimes the transfer trace of a bearing member 14 is produced at adhesive layer 12, but transfer trace now produces with linearity at the long side direction of mold release film 11, even if therefore also smoothed out with the fingers flat by doubling roller when being involved in hole when wafer is fitted, thus space is discharged to outside label, therefore different from the label vestige randomly generated, problem will not be become。
In addition, can more more outward than shown in Fig. 1, namely until inclusion region r near the part corresponding with the end on the short side direction of mold release film 11 of circular tag portion 13a, but in order to allow to easily be discharged more quickly to the outside of circular tag portion 13a by the air (air) of residual in the gap produced between mold release film 11 and circular tag portion 13a by the thickness of adhesive layer 12, it is preferable that unduly away from adhesive layer 12。
As long as the width of the short side direction of mold release film is the size suitable with in the r of region, it does not have limit especially, but it is preferably 10～50mm。
The thickness of bearing member 14 is without the thickness suitable with the difference in height of the laminated portions of the circular tag portion 13a of bonding film 13 and the periphery 13b of bonding film 13 with adhesive layer 12, namely adhesive layer 12 is identical bigger, it is possible to suitably select。When tape for processing wafer 10 is wound as drum, the part that there is a bearing member 14 is applied pressure, therefore the label segment not contacted with bearing member 14 is not applied pressure, becomes hollow state, and though therefore can adhesive layer 12 thickness prevent label vestige。It is however also possible to be set to thickness identical with adhesive layer 12 or above。It addition, as shown in Figure 3, it is also possible to a bearing member 14 of the thin adhesive tape of stacking is set "。
Prop up bearing member 14 intermittently or continuously to arrange along the long side direction of mold release film 11, but from the viewpoint of more effectively suppress the generation of transfer trace, it is preferable that the long side direction along base material film 11 is continuously provided。
It addition, bearing member 14 is from the viewpoint of prevent the winding skew of tape for processing wafer 10, it is preferable that bonding film 13 to be had the material of coefficient of friction to a certain degree。Thus, it is possible to prevent the winding of tape for processing wafer 10 from offseting, obtaining can high-speed winding, the effect that makes winding number increase。
The confficient of static friction propped up between bearing member 14 and the base material film of bonding film 13 is preferably 0.2～2.0, more preferably 0.6～1.6。If tape for processing wafer is wound as drum, the bearing member 14 that the circular tag portion 13a of the bonding film 13 then arranged in the 1st 11a side of mold release film 11 is arranged with the 2nd the 11b side in mold release film 11 contacts, therefore prop up the confficient of static friction between the base material film of bearing member 14 and bonding film 13 little of during lower than 0.2, during fabrication, become to be susceptible to winding skew when using and operability worsens。On the other hand, during more than 2.0, the resistance between the base material film of bonding film 13 and a bearing member 14 is excessive, becomes the reason that the operability of manufacturing process worsens or bending is advanced during high-speed winding etc.。Therefore, by confficient of static friction between the two is set to above-mentioned scope, it is possible to prevent the winding of tape for processing wafer 10 from offseting, obtain the effect making it possible to high-speed winding, winding number can being made to increase。
In the present invention, it is possible to according to JISK7125, obtain propping up the confficient of static friction between bearing member 14 and the base material film of bonding film 13 by following such assay method。
The base material film being respectively cut the bonding film 13 into 25mm (width) × 100mm (length) is made to overlap with two membrane samples of a bearing member 14, the film of fixing downside。Then, the film of stacking loads the weight of weight 200g as load W, by the film of the upside speed tensile with 200mm/min, measure the power Fd (g) when skidding off, obtain confficient of static friction (μ d) by below formula。
μ d=Fd/W
As a bearing member 14, for instance resin molding base material can be used in aptly and be coated with the gluing tape splicing of viscose glue stick。Such gluing tape splicing is attached, it is possible to form the tape for processing wafer 10 of present embodiment by the assigned position of the 2nd 11b in mold release film 11。
Substrate resin as gluing tape splicing, as long as meeting the scope of above-mentioned linear expansion coefficient and being just not particularly limited resistant to winding pressure, but from the viewpoint of thermostability, flatness with obtain easness, it is preferable that select from polyethylene terephthalate (PET), polypropylene and high density polyethylene (HDPE)。
The composition of binding agent and physical property about gluing tape splicing, it does not have be particularly limited to, as long as not peeling off from mold release film 11 in the rolling step and keeping operation of tape for processing wafer 10。
It addition, as bearing member 14, can use painted after a bearing member。By using such painted bearing member, when tape for processing wafer is wound as drum, it is possible to positively identify the kind of band。Such as, the color by making painted bearing member 14 according to the kind of tape for processing wafer, thickness is different, it is possible to easily identify the kind of band, thickness, it is possible to suppress, prevent the generation of artificial mistake。
Embodiment
Then, embodiments of the invention are illustrated, but the invention is not restricted to these embodiments。
(1) making of bonding film
(bonding film 1A)
Solvent toluene 400g suitably adjusts infusion volume and instills n-butyl acrylate 128g, acrylic acid-2-ethyl caproite 307g, methyl methacrylate 67g, methacrylic acid 1.5g, the mixed liquor of benzoyl peroxide as polymerization initiator, adjust reaction temperature and response time, obtain the solution with the compound (1) of functional group。
Then in this polymer solution, suitably adjust infusion volume and add as the compound (2) with radiation-curable carbon-to-carbon double bond and functional group, the methacrylic acid-2-hydroxy methacrylate 2.5g that synthesized by methacrylic acid and ethylene glycol separately, as the hydroquinone of polymerization inhibitor and adjust reaction temperature and response time, obtain the solution with the compound (A) of radiation-curable carbon-to-carbon double bond。Then, compound (A) solution adds as the Japanese polyurethane company system of polyisocyanates (B) relative to compound (A) 100 mass parts in compound (A) solution in compound (A) solution: coronateL1 mass parts, Japanese Ciba-Geigy company system as Photoepolymerizationinitiater initiater: Irgacure-1840.5 mass parts, as ethyl acetate 150 mass parts of solvent and mix, be prepared for the adhesive composition of radiation-curable。
Then, apply the adhesive phase compositions of preparation in the mode that dry film thickness is 20 μm at the vinyl-vinyl acetate copolymer base material film of thickness 100 μm, 110 DEG C dry 3 minutes, made bonding film 1A。
(2) mold release film
Employ mold release film 2A shown below。
Mold release film 2A: the polyethylene terephthalate film after the demoulding process that thickness is 38 μm
(3) formation of adhesive layer
(adhesive layer 3A)
Comprising the cresol novalac type epoxy resin (epoxide equivalent 197 as epoxy resin, molecular weight 1200, softening point 70 DEG C) 50 mass parts, as γ mercaptopropyitrimethoxy silane 1.5 mass parts of silane coupler, γ-uride propyl-triethoxysilicane 3 mass parts, mean diameter 16nm silica filler 30 mass parts compositions in add Ketohexamethylene stir mixing, use ball mill mixing 90 minutes further。
Add acrylic resin (matter average molecular weight: 800,000 wherein, glass transition temperature-17 DEG C) 100 mass parts, dipentaerythritol acrylate 5 mass parts as 6 functional acrylate monomers, the hexamethylene diisocyanate as firming agent add fit 0.5 mass parts, Curezol2PZ (four countries chemical conversion (strain) trade name processed, 2-phenylimidazole) 2.5 mass parts, stirring mixing, vacuum outgas, obtains adhesive。
Mold release film 2A is coated with above-mentioned adhesive, 110 DEG C of heat dryings 1 minute, forms the film of the B-stage state (the solidification intermediateness of thermosetting resin) that thickness is 20 μm, mold release film 2A is formed adhesive layer 3A, cold preservation keeping。
(adhesive layer 3B)
Mold release film 2A is coated with above-mentioned adhesive, 110 DEG C of heat dryings 1 minute, forms the film of the B-stage state (the solidification intermediateness of thermosetting resin) that thickness is 60 μm, mold release film 2A is formed adhesive layer 3B, cold preservation keeping。
(adhesive layer 3C)
Mold release film 2A is coated with above-mentioned adhesive, 110 DEG C of heat dryings 1 minute, forms the film of the B-stage state (the solidification intermediateness of thermosetting resin) that thickness is 120 μm, mold release film 2A is formed adhesive layer 3C, cold preservation keeping。
(4) making of bearing member is propped up
(a bearing member 4A)
By acrylic resin (matter average molecular weight: 600,000, glass transition temperature-20 DEG C) 100 mass parts, polyisocyanate compound (Japanese polyurethane (strain) make, trade name: coronateL) 10 mass parts as firming agent are obtained by mixing adhesive composition。
Above-mentioned adhesive composition is coated in the mode that dry film thickness is 20 μm the low density polyethylene films of thickness 40 μm, dries 3 minutes at 110 DEG C, the gluing tape splicing obtained is cut to width 10mm, has made a bearing member 4A。
(a bearing member 4B)
Above-mentioned adhesive composition is coated in the mode that dry film thickness is 30 μm the polyethylene terephthalate film of thickness 100 μm, dries 3 minutes at 110 DEG C, the gluing tape splicing obtained is cut to width 25mm, has made a bearing member 4B。
(a bearing member 4C)
Except the gluing tape splicing obtained is cut to width 25mm, in the same manner as a bearing member 4A, make a bearing member 4C。
(a bearing member 4D)
Except the gluing tape splicing obtained is cut to width 50mm, in the same manner as a bearing member 4A, make a bearing member 4D。
(embodiment 1)
Make the mold release film 2A being formed with adhesive layer 3A after cold preservation keeping recover to room temperature, for adhesive layer, be less than 10 μm to the penetraction depth of mold release film mode adjust and carried out the circular precut of diameter 220mm and processed。Afterwards, what remove adhesive layer does not need part, in the way of making the adhesive phase of bonding film 1A contact with adhesive layer, at room temperature lamination mold release film 2A。Then, for bonding film 1A, be less than 10 μm to the penetraction depth of mold release film mode regulate and circular precut to have carried out diameter 290mm with adhesive layer concentric circles is processed。Then, fitting a bearing member 4A with the 1st contrary the 2nd being provided with adhesive layer and bonding film and at the short side direction central part of mold release film 2A for mold release film 2A, the tape for processing wafer of the embodiment 1 with the structure shown in Fig. 2 has been made。
(embodiment 2) replaces, beyond a bearing member 4A, similarly to Example 1, having made the tape for processing wafer of embodiment 2 except with a bearing member 4B。
(embodiment 3)
Replace beyond adhesive layer 3A except with adhesive layer 3B, similarly to Example 1, made the tape for processing wafer of embodiment 3。
(embodiment 4)
Replace beyond adhesive layer 3A except with adhesive layer 3B, similarly to Example 2, made the tape for processing wafer of embodiment 4。
(embodiment 5)
Replace beyond adhesive layer 3A except with adhesive layer 3C, similarly to Example 1, made the tape for processing wafer of embodiment 5。
(embodiment 6)
Replace beyond adhesive layer 3A except with adhesive layer 3C, similarly to Example 2, made the tape for processing wafer of embodiment 6。
(embodiment 7)
Replace, beyond a bearing member 4A, similarly to Example 3, having made the tape for processing wafer of embodiment 7 except with a bearing member 4C。
(embodiment 8)
Replace, beyond a bearing member 4C, similarly to Example 7, having made the tape for processing wafer of embodiment 8 except with a bearing member 4D。
(comparative example 1)
Make the mold release film 2A being formed with adhesive layer 3A after cold preservation keeping recover to room temperature, for adhesive layer, be less than 10 μm to the penetraction depth of mold release film mode adjust and carried out the circular precut of diameter 220mm and processed。Afterwards, what remove adhesive layer does not need part, in the way of making the adhesive phase of bonding film 1A contact with adhesive layer, at room temperature lamination mold release film 2A。Then, for bonding film 1A, be less than 10 μm to the penetraction depth of mold release film mode regulate and circular precut to carry out diameter 290mm with adhesive layer concentric circles is processed, leave circular tag portion and periphery, eliminate other and do not need part。Then, for mold release film 2A with the 1st contrary the 2nd being provided with adhesive layer and bonding film and at the short side direction both ends of a mold release film 2A laminating bearing member 4A, made the tape for processing wafer of the comparative example 1 with the structure shown in Fig. 1 of existing patent documentation 1。
(comparative example 2)
Replace, beyond a bearing member 4A, in the same manner as comparative example 1, having made the tape for processing wafer of comparative example 2 except with a bearing member 4B。
(comparative example 3)
Replace beyond adhesive layer 3A except with adhesive layer 3B, in the same manner as comparative example 1, made the tape for processing wafer of comparative example 3。
(comparative example 4)
Replace, beyond a bearing member 4A, in the same manner as comparative example 3, having made the tape for processing wafer of comparative example 4 except with a bearing member 4B。
(comparative example 5)
Replace beyond adhesive layer 3A except with adhesive layer 3C, in the same manner as comparative example 2, made the tape for processing wafer of comparative example 5。
(comparative example 6)
Except being not provided with a bearing member, in the same manner as comparative example 3, it is made for the tape for processing wafer of comparative example 6。
(comparative example 7)
Except being not provided with a bearing member, in the same manner as comparative example 5, it is made for the tape for processing wafer of comparative example 7。
[evaluation of the inhibition of label vestige]
Mode with the number of round-shaped bonding film for 300, is wound as drum by the tape for processing wafer of embodiment and comparative example, has made tape for processing wafer reel。The tape for processing wafer reel that (5 DEG C) keeping obtains in refrigerator 1 month。Afterwards, make tape for processing wafer reel recover to untie reel to room temperature, the presence or absence of visualization label vestige, based on following metewand, with zero, △, × the inhibition of transfer trace of 3 grade evaluations tape for processing wafer。Result shown in table 1 and table 2。
Zero (non-defective unit): also cannot confirm label vestige from various angle visualizations
△ (allows product): can confirm that label vestige but is less than the degree that the manufacturing procedure to semiconductor device impacts
× (defective products): can confirm that the manufacturing procedure on semiconductor device brings the label vestige of impact
[evaluation of the inhibition being involved in of air]
Mode with the number of round-shaped bonding film for 200, is wound as drum by the tape for processing wafer of embodiment and comparative example, has made tape for processing wafer reel。The tape for processing wafer reel obtained is put into packaging bag, after in refrigerator, (5 DEG C) are taken care of 1 month, keeping 3 days under the dry ice atmosphere that belt surface becomes-50 DEG C。Afterwards, tape for processing wafer reel is made to recover to room temperature to break a seal packaging bag, untie reel, whether visualization has being involved in of air between the circular tag portion of adhesive layer and bonding film, by do not have air be involved in be evaluated as zero (non-defective unit), by have air be involved in be evaluated as × (defective products), carried out the evaluation of the inhibition being involved in of the air of tape for processing wafer。Result shown in table 1 and table 2。
[table 1]
[table 2]
As shown in table 1, tape for processing wafer involved by embodiment 1～8, on 2nd contrary with the 1st of mold release film and comprising the part corresponding with adhesive layer, do not comprise in the region of the part corresponding with the end on the short side direction of mold release film of label portion, long side direction along mold release film is provided with a bearing member, therefore becomes the result of the inhibition being involved in all excellences of the inhibition of label vestige, air。
On the other hand, the tape for processing wafer being provided with involved by the comparative example 1～4 propping up bearing member at the both ends of mold release film is as shown in table 2, becomes the result of the inhibition the being involved in difference of air。The inhibition being involved in being not provided with the air of the tape for processing wafer involved by comparative example 6,7 of a bearing member becomes the result of excellence, but becomes poor result in the inhibition of label vestige。
Additionally, in the adhesive layer tape for processing wafer involved by comparative example 3 identical with the thickness of bearing member, confirming will not to the label vestige of the degree that the manufacturing procedure of semiconductor device impacts。On the other hand, in the tape for processing wafer involved by embodiment 3, even if adhesive layer is identical with the thickness of a bearing member, do not produce label vestige yet。
Symbol description
10: tape for processing wafer
11: mold release film
12: adhesive layer
13: bonding film
13a: circular tag portion
13b: periphery
14,14', 14 ": bearing member
Claims (3)
1. a tape for processing wafer, it is characterised in that have:
Long mold release film,
Adhesive layer, is arranged on the 1st of described mold release film and has the flat shape of regulation,
Bonding film, has the periphery in the outside of label portion and the described label portion of encirclement, and described label portion is arranged in the way of covering described adhesive layer and contacting with described mold release film around described adhesive layer, and has the flat shape of regulation, and
Prop up bearing member, that be arranged on described mold release film with on the 1st contrary the 2nd that be that be provided with described adhesive layer and bonding film, and within comprising the part corresponding with described adhesive layer and not comprising the region of the part corresponding with the end on the short side direction of described mold release film of described label portion, the long side direction along described mold release film is arranged。
2. tape for processing wafer according to claim 1, it is characterised in that
Described bearing member is arranged at the central part of the short side direction of described mold release film。
3. tape for processing wafer according to claim 1 and 2, it is characterised in that
In described bearing member, the width of the short side direction of described mold release film is 10～50mm。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-246313 | 2014-12-04 | ||
| JP2014246313A JP6410582B2 (en) | 2014-12-04 | 2014-12-04 | Wafer processing tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105694745A true CN105694745A (en) | 2016-06-22 |
| CN105694745B CN105694745B (en) | 2018-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510870409.3A Active CN105694745B (en) | 2014-12-04 | 2015-12-02 | Tape for processing wafer |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6410582B2 (en) |
| KR (1) | KR101809331B1 (en) |
| CN (1) | CN105694745B (en) |
| TW (1) | TWI615890B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114729234A (en) * | 2019-12-03 | 2022-07-08 | 迪睿合株式会社 | Method for producing film-wound body and connected body |
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| CN101569002A (en) * | 2007-09-14 | 2009-10-28 | 古河电气工业株式会社 | Wafer processing tape |
| CN102687257A (en) * | 2009-11-13 | 2012-09-19 | 日立化成工业株式会社 | Semiconductor device, method for manufacturing semiconductor device, and semiconductor wafer provided with adhesive layer |
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| JPH04360653A (en) | 1991-06-06 | 1992-12-14 | Tochigi Pref Gov | Production of egg highly containing polybasic unsaturated fatty acid of hemp seed |
| JP4087169B2 (en) * | 2002-07-05 | 2008-05-21 | リンテック株式会社 | Laminated sheet and method for producing the same |
| JP4540299B2 (en) | 2003-05-09 | 2010-09-08 | リンテック株式会社 | Laminated sheet winding body and method for manufacturing the same |
| JP4970863B2 (en) * | 2006-07-13 | 2012-07-11 | 日東電工株式会社 | Workpiece processing method |
| JP4879702B2 (en) * | 2006-10-20 | 2012-02-22 | リンテック株式会社 | Die sort sheet and chip transfer method having adhesive layer |
| JP4360653B2 (en) * | 2007-09-14 | 2009-11-11 | 古河電気工業株式会社 | Wafer processing tape |
| JP2011174042A (en) * | 2010-02-01 | 2011-09-08 | Nitto Denko Corp | Film for producing semiconductor device and method for producing semiconductor device |
| JP5716322B2 (en) * | 2010-08-30 | 2015-05-13 | 日立化成株式会社 | Wafer processing tape |
| JP2012082285A (en) * | 2010-10-08 | 2012-04-26 | Hitachi Chemical Co Ltd | Adhesive sheet |
| JP5733049B2 (en) * | 2011-06-23 | 2015-06-10 | 日立化成株式会社 | Adhesive sheet, adhesive sheet manufacturing method, adhesive sheet roll, semiconductor device manufacturing method, and semiconductor device |
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2014
- 2014-12-04 JP JP2014246313A patent/JP6410582B2/en active Active
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2015
- 2015-12-01 TW TW104140171A patent/TWI615890B/en active
- 2015-12-02 KR KR1020150170550A patent/KR101809331B1/en active IP Right Grant
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101569002A (en) * | 2007-09-14 | 2009-10-28 | 古河电气工业株式会社 | Wafer processing tape |
| CN102093828A (en) * | 2007-09-14 | 2011-06-15 | 古河电气工业株式会社 | Wafer processing tape |
| CN102687257A (en) * | 2009-11-13 | 2012-09-19 | 日立化成工业株式会社 | Semiconductor device, method for manufacturing semiconductor device, and semiconductor wafer provided with adhesive layer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114729234A (en) * | 2019-12-03 | 2022-07-08 | 迪睿合株式会社 | Method for producing film-wound body and connected body |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6410582B2 (en) | 2018-10-24 |
| KR101809331B1 (en) | 2017-12-14 |
| TW201633388A (en) | 2016-09-16 |
| JP2016111162A (en) | 2016-06-20 |
| KR20160067755A (en) | 2016-06-14 |
| CN105694745B (en) | 2018-10-09 |
| TWI615890B (en) | 2018-02-21 |
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