CN1056795C - Solid soldering agent used in soldering tin rod - Google Patents
Solid soldering agent used in soldering tin rod Download PDFInfo
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- CN1056795C CN1056795C CN97100754A CN97100754A CN1056795C CN 1056795 C CN1056795 C CN 1056795C CN 97100754 A CN97100754 A CN 97100754A CN 97100754 A CN97100754 A CN 97100754A CN 1056795 C CN1056795 C CN 1056795C
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- solid flux
- flux
- resin
- acid
- heat reactive
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Abstract
The present invention relates to cleaning-free solid welding flux for tin welding wires. The welding flux is prepared from derivants of resin, thermosetting resin, a firming agent, an activator, a disperser, etc. in certain proportion. The preparation technology comprises: thermosetting resin and a firming agent are proportionally mixed and heated to make the mixture evenly mixed; other ingredients are put in another container, heated and evenly mixed; after slightly cooling, both mixtures are put in the same container; the product of the present invention is prepared after the mixture is evenly mixed. By using the solid flux, a printed circuit board has high insulation resistance and no possibility of corrosion. After welding, soldering spots are clean and dispenses with cleaning.
Description
The present invention relates to a kind of be used for solder stick exempt to clean solid flux, be used for the electronic product welding.
In the past, in the welding of electronic product, all adopt the colophony type scaling powder.The used colophony type scaling powder that also mostly is in solder stick.In welding process, rely on the oxide-film on the activating agent removal substrate in the scaling powder, make firm welding reliable.The colophony type scaling powder mainly is made up of rosin and halide, and is many with this scaling powder welding back printed board plate face residue, is corrosive, and for demanding electronic product, postwelding must clean.Cleaning used solvent is fluorine Lyons, and a large amount of dischargings in fluorine Lyons can cause the destruction of ozone layer, thereby have destroyed existent environment of people.
The objective of the invention is to develop a kind of be used for solder stick exempt to clean solid flux, change the composition of scaling powder in the prior art, make its not halide and common rosin, postwelding is residual few, is not with corrosivity, and very high insulaion resistance is arranged, simultaneously, postwelding need not clean.
The present invention development be used for solder stick exempt to clean solid flux, its composition is:
Rosin derivative 80%
Heat reactive resin 10%
Curing agent 0.5%
Activating agent 8%
Dispersant 1.5%
Its preparation technology is: at first with heat reactive resin and curing agent Hybrid Heating in proportion, resin and curing agent are mixed, the control heating-up temperature is no more than 110 ℃; With rosin derivative, activating agent and dispersant Hybrid Heating in proportion, until miscible, heating-up temperature is no more than 130 ℃ in another container; After the cooling, the heat reactive resin that obtains with the first step mixes, and promptly obtains exempting to clean solid flux slightly.
The advantage of solid flux of the present invention is to adopt compound resin to replace rosin.Compound resin comprises rosin derivative and heat reactive resin.In welding process, owing to stand about 200 ℃ high temperature, resin can solidify fast, forms thin film and covers the solder joint surface, and this layer film has good insulating properties and protection solder joint to avoid moisture attack, and therefore, postwelding printed board insulaion resistance height does not corrode.This solder flux does not use common rosin, and rosin itself easily be full of cracks and insulaion resistance shortcoming such as varies with temperature and alleviates greatly, and again because compound resin is heated and is difficult for the carbonization blackening, therefore, the postwelding solder joint cleans.
Another advantage of the present invention is that activating agent is not halogen-containing, forms and be to use two or more organic acid suitably to cooperate.This activating agent can keep welding active in than large-temperature range, and the postwelding residue is few, does not corrode.
The used resin of the present invention is a compound resin; wherein a resinoid is a rosin derivative; Foral for example; hercolyn D, consumption are 80% of solder flux amount, and another kind of resin is a heat reactive resin; heat reactive resin can solidify in welding process fast; form hard solid film, this film has very high insulaion resistance, and can protect solder joint to avoid moisture attacks.In the present invention, heat reactive resin can adopt bisphenol-a epoxy acrylate, phenolic aldehyde epoxy acrylate, urethane acrylate etc.The heat reactive resin addition is 10% of a whole solder flux amount, and use amount does not have the cured film effect very little, and the excessive resin solidification of use amount is incomplete, and postwelding printed board aridity is poor.The used curing agent of resin can be the 2-EAQ, benzophenone, and benzoyl peroxide, benzoyl dimethyl ketone etc., hardener dose is 1.5% of a solder flux total amount.
The used activating agent of the present invention is the organic acid activating agent, and the dependence organic acid is removed the oxide-film on the substrate, makes solder joint solid and reliable.The used organic acid of the present invention can be glutaric acid, adipic acid, decanedioic acid, salicylic acid, citric acid, hippuric acid etc.These organic acids can be used.Suitably cooperate, can reduce the vapourizing temperature of activator, reduce the postwelding residue.Activator level is approximately the 5-20% of solder flux total amount, and consumption welds poor activity very little, and the rate of spread is low, and consumption is too much, and postwelding is residual many, and insulaion resistance descends.Add a small amount of organic acid esters in the activator as dispersant, can increase the dispersing uniformity of organic acid in solder flux.
Be embodiments of the invention below
Embodiment 1
Foral 60
Hercolyn D 20
Phenolic aldehyde epoxy acrylate 10
Adipic acid 6
Citric acid 2
Dibutyl phthalate 1.5
Benzoyl peroxide 0.5
With heat reactive resin and curing agent Hybrid Heating in proportion, resin and curing agent are mixed, the control heating-up temperature is no more than 105 ℃.Simultaneously, in another container, with all the other component additional mixing heating, until miscible, temperature is no more than 130 ℃, and back, cold slightly back mixes with curable resin, obtains product.According to the every performance of GB9491-88 standard test be: the rate of spread: greater than 80%, content of halogen: 0, insulaion resistance: 1 * 1012 Europe, corrosion test: qualified.
Claims (6)
1, a kind of be used for solder stick exempt to clean solid flux, it is characterized in that the composition of this solid flux is:
Rosin derivative 80%
Heat reactive resin 10%
Curing agent 0.5%
Activating agent 8%
Dispersant 1.5%
2, a kind ofly prepare the method for exempting to clean solid flux that is used for solder stick as claimed in claim 1, it is characterized in that this method is: at first with heat reactive resin and curing agent Hybrid Heating in proportion, resin and curing agent are mixed, and the control heating intensity is no more than 110 ℃; With rosin derivative, activating agent and dispersant Hybrid Heating in proportion, until miscible, heating intensity is no more than 130 ℃ in another container; After the cooling, the heat reactive resin that obtains with the first step mixes, and promptly obtains exempting to clean solid flux slightly.
3, solid flux as claimed in claim 1 is characterized in that wherein said rosin derivative is any in Foral, maleic rosin, ester gum or the hercolyn D.
4, solid flux as claimed in claim 1 is characterized in that wherein said heat reactive resin is any in bisphenol-a epoxy acrylate, phenolic aldehyde epoxy acrylate or the urethane acrylate.
5, solid flux as claimed in claim 1 is characterized in that wherein said curing agent is any in 2-EAQ, benzophenone, benzoyl peroxide or the benzoyl dimethyl ketone.
6, solid flux as claimed in claim 1 is characterized in that wherein said activating agent is any in glutaric acid, ethanedioic acid, decanedioic acid, salicylic acid or the hippuric acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97100754A CN1056795C (en) | 1997-02-21 | 1997-02-21 | Solid soldering agent used in soldering tin rod |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97100754A CN1056795C (en) | 1997-02-21 | 1997-02-21 | Solid soldering agent used in soldering tin rod |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1161266A CN1161266A (en) | 1997-10-08 |
| CN1056795C true CN1056795C (en) | 2000-09-27 |
Family
ID=5165293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97100754A Expired - Fee Related CN1056795C (en) | 1997-02-21 | 1997-02-21 | Solid soldering agent used in soldering tin rod |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1056795C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100415435C (en) * | 2000-12-04 | 2008-09-03 | 富士电机株式会社 | Welding flux and brazing filler metal composition for brass solder |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3797990B2 (en) | 2003-08-08 | 2006-07-19 | 株式会社東芝 | Thermosetting flux and solder paste |
| WO2007086433A1 (en) * | 2006-01-26 | 2007-08-02 | Toeikasei Co., Ltd. | Water-dispersed flux composition, electronic circuit board with electronic component, and their production methods |
| CN100455400C (en) * | 2007-01-16 | 2009-01-28 | 大连理工大学 | Soldering flux in use for SnZn series solder with no lead, and preparation method |
| CN103008920A (en) * | 2012-12-13 | 2013-04-03 | 郴州金箭焊料有限公司 | Leadless rosin core no-clean scaling powder |
| CN104148826A (en) * | 2014-08-13 | 2014-11-19 | 东莞市宝拓来金属有限公司 | Halogen-free solder tin wire and scaling powder thereof |
| US10369086B2 (en) * | 2015-03-05 | 2019-08-06 | 3M Innovative Properties Company | Composite material having ceramic fibers |
| CN105081600B (en) * | 2015-07-24 | 2017-07-07 | 深圳市福英达工业技术有限公司 | Tinbase brazing solder of LED chip and preparation method thereof is inverted in encapsulation |
| CN108262577A (en) * | 2018-01-26 | 2018-07-10 | 东莞市固晶电子科技有限公司 | A kind of powder particle scaling powder and preparation method thereof |
| CN113001060A (en) * | 2021-03-10 | 2021-06-22 | 安徽禾炬电子材料有限公司 | Formula of efficient soldering flux |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85102604A (en) * | 1985-04-06 | 1985-12-20 | 福建师范大学 | Resina-type flux of brazing |
| CN1047238A (en) * | 1989-05-09 | 1990-11-28 | 化学工业部晨光化工研究院一分院 | A kind of flux assistant for tin soldering of printed circuit board |
| EP0443030A1 (en) * | 1989-08-08 | 1991-08-28 | Nippondenso Co., Ltd. | Soldering flux |
| EP0619162A2 (en) * | 1993-04-05 | 1994-10-12 | Takeda Chemical Industries, Ltd. | Soldering flux |
| CN1110205A (en) * | 1994-04-06 | 1995-10-18 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
-
1997
- 1997-02-21 CN CN97100754A patent/CN1056795C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85102604A (en) * | 1985-04-06 | 1985-12-20 | 福建师范大学 | Resina-type flux of brazing |
| CN1047238A (en) * | 1989-05-09 | 1990-11-28 | 化学工业部晨光化工研究院一分院 | A kind of flux assistant for tin soldering of printed circuit board |
| EP0443030A1 (en) * | 1989-08-08 | 1991-08-28 | Nippondenso Co., Ltd. | Soldering flux |
| EP0619162A2 (en) * | 1993-04-05 | 1994-10-12 | Takeda Chemical Industries, Ltd. | Soldering flux |
| CN1110205A (en) * | 1994-04-06 | 1995-10-18 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100415435C (en) * | 2000-12-04 | 2008-09-03 | 富士电机株式会社 | Welding flux and brazing filler metal composition for brass solder |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1161266A (en) | 1997-10-08 |
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