CN104148826A - Halogen-free solder tin wire and scaling powder thereof - Google Patents
Halogen-free solder tin wire and scaling powder thereof Download PDFInfo
- Publication number
- CN104148826A CN104148826A CN201410396770.2A CN201410396770A CN104148826A CN 104148826 A CN104148826 A CN 104148826A CN 201410396770 A CN201410396770 A CN 201410396770A CN 104148826 A CN104148826 A CN 104148826A
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- CN
- China
- Prior art keywords
- halogen
- scaling powder
- free solder
- solder stick
- tin wire
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a halogen-free solder tin wire and scaling powder thereof. Carboxylic acid polymer with the molecular formula represented in the description is added to the scaling powder and used as an active agent. The solder tin wire meets the requirement for zero halogen, and is suitable for wave-soldering and manual soldering in the electronic industry. The halogen-free solder tin wire is uniform and smooth in surface, high in purity, good in mobility after being fused, and excellent in wettability, formed welding spots are bright, and residues of oxidizing slag are few. The halogen-free solder tin wire has the excellent welding performance while adapting to the environmentally friendly development of the modern electronic industry, thereby being strong in market competitiveness.
Description
Technical field
The present invention relates to welding technology field, relate in particular to a kind of halogen-free solder stick and scaling powder thereof.
Background technology
Scolding tin is the important raw and processed materials of connecting electronic components and parts in welding circuit, is widely used in electronics industry.Solder stick is manual welding circuit board scolder the most easily.Solder stick can be divided into halogen-free solder stick and have halogen solder stick according to the difference of scaling powder.
In solder stick welding process, scaling powder is indispensable additive, and the electron trade based on existing is to environmental protection developing direction, and solder stick is inevitable to be developed to halogen-freeization.Halogen-free or the low halogen scaling powder that now most enterprises is used, its activating agent mostly be adipic acid (
), succinic acid (
), SA (
) etc. binary organic carboxyl acid, the shortcoming of this type of activating agent is that consumption is large, and in operating process, produces a large amount of smog.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of halogen-free solder stick and scaling powder thereof, be intended to solve current halogen-free solder stick and can not meet the problem of halogen-freeization of solder technology demand for development with scaling powder.
Technical scheme of the present invention is as follows:
A halogen-free solder stick scaling powder, wherein, adds molecular formula and is in described scaling powder
, the carboxylic acid polyalcohol that molecular weight is 484 is as activating agent.
Described halogen-free solder stick scaling powder, wherein, described carboxylic acid polyalcohol specifically comprises hexamethylene diamine and SA.
Described halogen-free solder stick scaling powder, wherein, the interpolation percentage by weight of described carboxylic acid polyalcohol in scaling powder is 10%
Described halogen-free solder stick scaling powder, wherein, also comprises curing agent and rosin in described scaling powder.
Described Halogen solder stick scaling powder, wherein, it is 10% that described curing agent adds percentage by weight in scaling powder, described rosin is 80% adding percentage by weight.
A halogen-free solder stick, wherein, described halogen-free solder stick is for being used scaling powder as above to realize the solder stick of halogen-freeization.
Beneficial effect: the invention provides a kind of halogen-free solder stick and scaling powder thereof, this solder stick reaches zero halogen requirement, and it is suitable for various wave-solderings and the manual welding of electronics industry.The halogen-free solder stick surface uniform of the present invention is smooth, and purity is high, good fluidity after fusing, and wetability is splendid, its formed solder joint light, oxidizing slag thing residue is few.Therefore halogen-free solder stick of the present invention has possessed splendid welding performance in the environmental protection development that adapts to hyundai electronics industry, thereby makes product possess the extremely strong market competitiveness.
Accompanying drawing explanation
Fig. 1 is the scolding tin design sketch of embodiment 1 in a kind of halogen-free solder stick of the present invention and scaling powder thereof.
Fig. 2 is the scolding tin design sketch of embodiment 2 in a kind of halogen-free solder stick of the present invention and scaling powder thereof.
The specific embodiment
The invention provides a kind of halogen-free solder stick and scaling powder thereof, for making object of the present invention, technical scheme and effect clearer, clear and definite, below the present invention is described in more detail.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The invention provides a kind of halogen-free solder stick scaling powder, wherein, in described scaling powder, add molecular formula and be
, the carboxylic acid polyalcohol that molecular weight is 484 is as activating agent.
Concrete, described carboxylic acid polyalcohol is the polymer of hexamethylene diamine and SA.The end group of described polymer is binary acid.
Preferably, the interpolation percentage by weight of described carboxylic acid polyalcohol in scaling powder is 10%.
The use amount of above-mentioned carboxylic acid polyalcohol is less than existing activating agent, and it produces the problem of a large amount of smog while there will not be existing Halogen activating agent to use, and compared to existing activating agent, has better performance.
Further, in described scaling powder, also comprise curing agent, rosin.The percentage by weight of described curing agent is 10%, and the percentage by weight of rosin is 80%.
The present invention also provides a kind of halogen-free solder stick, and wherein, described halogen-free solder stick is for being used scaling powder as above to realize the solder stick of halogen-freeization.The halogen-free solder stick of the present invention can meet the requirement of electron trade to zero halogen solder stick fully.
The present invention carries out examples comparative experiment by the zero halogen solder stick of novel activating agent and existing low halogen solder stick, carries out manual welding, observes its welding effect.
Embodiment 1
Adopt existing scolding tin technology, use copper coin as welding material, the alloying component of solder stick is: Sn0.7Cu, and wire diameter 1.0mm, chemical content 3.0% (existing low halogen medicament) also welds with 10cm solder.
Result: existing low halogen medicament produces a large amount of rosin and splashes when scolding tin.As shown in Figure 1, can find out and produce a large amount of splashing (stain in Fig. 1, as the stain of A indication), amount to 20.
Embodiment 2
Adopt the scolding tin technology in the present invention, use copper coin as welding material, the alloying component of solder stick is: Sn0.7Cu, and wire diameter 1.0mm, chemical content 3.0% (wherein carboxylic acid polyalcohol accounts for 10%), and weld with 10cm solder.
Result: halogen-free solder stick of the present invention, when scolding tin, can not spatter rosin by bullet.As shown in Figure 2, can find out and only have 3 and splash (stain in Fig. 2, as the stain of A indication).
While adopting halogen-free solder stick scolding tin of the present invention, there is not dry joint, tin sweat(ing), connect tin, the residual problems such as many of many tin, few tin, postwelding, and can not spatter bullet rosin when scolding tin, no foul smell, smog is few and not containing the volatilization gas of toxic health, meet the environmental requirement of existing electron trade.
The invention provides a kind of halogen-free solder stick and scaling powder thereof, this solder stick reaches zero halogen requirement, and it is suitable for various wave-solderings and the manual welding of electronics industry.The halogen-free solder stick surface uniform of the present invention is smooth, and purity is high, good fluidity after fusing, and wetability is splendid, its formed solder joint light, oxidizing slag thing residue is few.Therefore halogen-free solder stick of the present invention has possessed splendid welding performance in the environmental protection development that adapts to hyundai electronics industry, thereby makes product possess the extremely strong market competitiveness.
Should be understood that, application of the present invention is not limited to above-mentioned giving an example, and for those of ordinary skills, can be improved according to the above description or convert, and all these improvement and conversion all should belong to the protection domain of claims of the present invention.
Claims (6)
1. a halogen-free solder stick scaling powder, is characterized in that, adds molecular formula to be in described scaling powder
, carboxylic acid polyalcohol is as activating agent;
The molecular weight of described carboxylic acid polyalcohol is 484.
2. halogen-free solder stick scaling powder according to claim 1, is characterized in that, described carboxylic acid polyalcohol specifically comprises hexamethylene diamine and SA.
3. halogen-free solder stick scaling powder according to claim 2, is characterized in that, the interpolation percentage by weight of described carboxylic acid polyalcohol in scaling powder is 10%.
4. halogen-free solder stick scaling powder according to claim 3, is characterized in that, also comprises curing agent and rosin in described scaling powder.
5. according to halogen-free solder stick scaling powder claimed in claim 4, it is characterized in that, it is 10% that described curing agent adds percentage by weight in scaling powder, and it is 80% that described rosin adds percentage by weight.
6. a halogen-free solder stick, is characterized in that, described halogen-free solder stick is the solder stick that the scaling powder of use as described in claim 1-5 any one realized halogen-freeization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410396770.2A CN104148826A (en) | 2014-08-13 | 2014-08-13 | Halogen-free solder tin wire and scaling powder thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410396770.2A CN104148826A (en) | 2014-08-13 | 2014-08-13 | Halogen-free solder tin wire and scaling powder thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104148826A true CN104148826A (en) | 2014-11-19 |
Family
ID=51874543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410396770.2A Pending CN104148826A (en) | 2014-08-13 | 2014-08-13 | Halogen-free solder tin wire and scaling powder thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104148826A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111618482A (en) * | 2020-06-15 | 2020-09-04 | 曾宪平 | Rosin active agent and method for coating rosin active agent outside tin wire |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5211763A (en) * | 1990-11-30 | 1993-05-18 | Nippondenso Co., Ltd. | Soldering flux composition |
| CN1161266A (en) * | 1997-02-21 | 1997-10-08 | 清华大学 | Solid soldering agent used in soldering tin rod |
| CN1210772A (en) * | 1997-09-08 | 1999-03-17 | 富士通坦株式会社 | Flux composition |
| CN101569966A (en) * | 2009-06-10 | 2009-11-04 | 上海华庆焊材技术有限公司 | Method for preparing lead-free tin cream and soldering flux thereof |
| CN101733589A (en) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | Halogen-free and cleaning-free soldering flux for lead-free solder |
| CN102941415A (en) * | 2012-12-11 | 2013-02-27 | 北京达博长城锡焊料有限公司 | Halogen-free no-clean type lead-free solder wire and preparation method thereof |
-
2014
- 2014-08-13 CN CN201410396770.2A patent/CN104148826A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5211763A (en) * | 1990-11-30 | 1993-05-18 | Nippondenso Co., Ltd. | Soldering flux composition |
| CN1161266A (en) * | 1997-02-21 | 1997-10-08 | 清华大学 | Solid soldering agent used in soldering tin rod |
| CN1210772A (en) * | 1997-09-08 | 1999-03-17 | 富士通坦株式会社 | Flux composition |
| CN101569966A (en) * | 2009-06-10 | 2009-11-04 | 上海华庆焊材技术有限公司 | Method for preparing lead-free tin cream and soldering flux thereof |
| CN101733589A (en) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | Halogen-free and cleaning-free soldering flux for lead-free solder |
| CN102941415A (en) * | 2012-12-11 | 2013-02-27 | 北京达博长城锡焊料有限公司 | Halogen-free no-clean type lead-free solder wire and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 王成安 等: "《电子技能培训》", 31 October 2010, 人民邮电出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111618482A (en) * | 2020-06-15 | 2020-09-04 | 曾宪平 | Rosin active agent and method for coating rosin active agent outside tin wire |
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Application publication date: 20141119 |
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