CN105666287A - Robot grinding and polishing system based on CMP - Google Patents
Robot grinding and polishing system based on CMP Download PDFInfo
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- CN105666287A CN105666287A CN201610098377.4A CN201610098377A CN105666287A CN 105666287 A CN105666287 A CN 105666287A CN 201610098377 A CN201610098377 A CN 201610098377A CN 105666287 A CN105666287 A CN 105666287A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
- B24B19/14—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding turbine blades, propeller blades or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a robot grinding and polishing system based on CMP. The robot grinding and polishing system comprises a six-axis robot, a workpiece clamp used for placing workpieces, a contour detection unit used for detecting the workpieces needing to be polished and conducting three-dimensional reconstruction, a grinding wheel with a polishing pad, a base provided with the grinding wheel and a master controller. The free end of the six-axis robot is provided with an electric spindle provided with servo motors. A polishing liquid jetting device capable of jetting CMP polishing liquid to the workpieces is arranged above the workpiece clamp. The workpiece clamp is installed on the electric spindle. The master controller controls the contour detection unit, the six-axis robot, the electric spindle and all the servo motors. The workpiece clamp and the grinding wheel with the polishing pad can also be exchanged in position so as to adapt to polishing of different sizes of workpieces. The robot grinding and polishing system is high in efficiency and good in machining consistency, harmful effects such as mechanical damage and burns which may be caused by common grinding cannot be caused on the workpieces, damage to surfaces or sub surfaces cannot occur, and perfect surfaces can be machined.
Description
Technical field
The present invention relates to a kind of workpiece polishing system, be specifically related to a kind of based on CMP(chemically mechanical polishing) robot polishing system, for the ultraprecise rubbing down of complex curved surface parts such as blade of aviation engine, turbine blade. Having good surface quality after can guarantee that grinding, surface residual stress is low.
Background technology
The grinding of workpiece is the operation of one key, the tool marks that it can eliminate workpiece car, Milling Machining stays, eliminate the surface defect of workpiece, obtain the surface of the work that surface quality is higher, residual stress is little, and these are to improving the workpiece life-span, especially the part of the easy fatigue failures such as blade of aviation engine there is great raising effect.
The surface of blade of aviation engine, turbine blade etc. is free form surface, and difficulty of processing is big, and grinding technique domestic at present is mainly artificial grinding, cuts based on emery wheel, the robot grinding system in abrasive band and numerical control machine tool grinding. The inferior position of artificial grinding is obvious, and the surface quality of workpieces processed is poor, working (machining) efficiency is low, to the homogeneity of product processed it is difficult to ensure that, poor working environment, workers ' health is had impact. Digit Control Machine Tool grinding is expensive. Traditional grinding accuracy based on the robot grinding system of emery wheel is relatively low, and the surface quality of workpieces processed is poor, the blade to the aero-engine being operated under high temperature, high speed, it is easy to fatigue failure. Compared to digital control system, six-joint robot has higher motility (can be suitable for the processing of different size part), higher versatility and adaptability are (by updating software module, robot can be made to be efficiently completed grinding task at complicated working environment), therefore developing the superfine grinding system based on robot platform has very big meaning.
Publication number is that Chinese invention (the robot polishing system based on the complex surface machining) patent of CN103722474A proposes a kind of robot and carries out complex-curved robot polishing system concept, realizes high-precision grinding processing by force-feedback control. For improving the grinding accuracy of system, publication number is the Chinese invention patent (method and system that a kind of grinding process position-stance error adjusts automatically) of CN10246255A, by the automatic detection device on-line real-time measuremen location of workpiece and attitude information, feed back to control system, carry out pose correction by actuator.Publication number is the Chinese invention patent (a kind of robot grinding system based on sensor feedback) of CN103056759A, workpiece profile is detected by binocular camera, carry out three-dimensionalreconstruction, and outline data is passed to control system carry out error correction, also have emery wheel detection unit detection abrasion of grinding wheel simultaneously, carry out error compensation.
For making CMP(chemically mechanical polishing) technique better be suitable for blade grinding, it is necessary to control technological parameter. Paper (JianfengLuo, DavidA.Dornfeld, MaterialRemovalMechanisminChemicalMechanicalPolishing:Th eoryandModeling) point out, CMP(chemically mechanical polishing in semi-conductor industry), the factor of wafer rubbing down speed, surface uniformity and surface quality of affecting mainly has chemical composition of the size of nanoscale abrasive particle, polishing fluid etc. in the pressure in Grinding Contact district, polishing velocity, the flow velocity of polishing fluid, the macromolecular structure of polishing pad and polishing fluid relevant. Equally, the technological parameter of optimum selecting CMP planarization blade by experiment it is also required to when accurate grinding blade.
Research is placed on the precise controlling of grinding action focus, real time dynamic measurement carries out error compensation for these, does not change tradition wheel grinding in the limitation of Ultra-precision Turning, both cannot obtain the surface that surface microstructure is good, residual stress is low.
Summary of the invention
For solving superfine grinding surface quality of workpieces problem, the grinding field that the CMP grinding process of semi-conductor industry is incorporated into metal of the invention, and it is implemented in combination with the grinding of free form surface with six-joint robot platform, to complete the processing of blade of aviation engine.
CMP technique combines the advantage of chemistry grinding and polishing and Mechanical polishing, can be low in damage, and integrity is good, occurs without on the basis of surface/sub-surface damage, it is thus achieved that higher surface removal efficiency, revises the profile precision on surface, processes more perfect surface. CMP technique is incorporated into the grinding and polishing of aerial blade by the present invention, and devises corresponding mechanism with the operation principle of CMP technique.
In order to solve above-mentioned technical problem, the present invention, based on CMP principle design Liao Liangzhong mechanism implementation, is separately adapted to the polishing of small size blade and large-scale blades, and concrete scheme is:
Scheme one
A kind of robot polishing system based on CMP, including six-joint robot, place the workpiece clamp of workpiece, to the contour detecting unit needing polishing workpiece to carry out detection three-dimensionalreconstruction, emery wheel with polishing pad, the pedestal of emery wheel is installed, and master controller, described six-joint robot free end is provided with the electro spindle of servomotor, it is characterized in that: described workpiece clamp is arranged over to spray the polishing fluid injection apparatus of CMP planarization liquid to workpiece, described workpiece clamp is arranged on described electro spindle, described main controller controls contour detecting unit, six-joint robot, electro spindle, and all servomotors, described polishing pad and work piece contact zone constitute local polishing district, spray at polishing fluid injection apparatus and complete CMP planarization under the effect of polishing fluid, polished workpiece moves under six-joint robot drives, complete the polishing of whole workpiece.
As improvement, the shower nozzle of described polishing fluid injection apparatus is provided with the controller increasing by two direction of rotation degree of freedom, makes the tangential direction that injection direction is polishing contact area part workpiece of polishing fluid under the control of the controller, and controls the flow velocity of polishing fluid.
As improvement, adding magnetic components in the polishing fluid of described polishing fluid injection apparatus ejection, to become magnetic controlled, is provided with the magnetic control means of flow velocity and the flow direction controlling magnetic polishing liquid on polished workpiece in described workpiece clamp.
As improvement, described polishing pad is made up of poromerics, and it can store part polishing fluid, in order to chemical reaction can be sufficiently conducted, and when polishing free curve surface work pieces, described polishing pad curvature is more than free curve surface work pieces maximum curvature.
As improvement, also include polishing fluid retracting device, effectively filter the polishing residual particles of polished workpiece thus polishing fluid chemical redemption device after being sufficiently reserved the polishing fluid defecator of polishing particles and recovery.
As improvement, polishing fluid defecator is the magnetic polishing liquid defecator that may filter that polished material residues metallic particles.
As improvement, the outline surface of workpiece polished in described contour detecting unit dynamic monitoring workpiece clamp, and the outline data of workpiece being delivered to master controller, master controller controls six-joint robot again and carries out dynamic pose correction.
As improvement, the sensor of described contour detecting unit can be three-dimensional laser diastimeter, three-dimensional range finder (having higher positional accuracy measurement) based on femtosecond laser, or binocular camera, it is provided with force transducer between described six-joint robot end and electro spindle, is indirectly controlled the pressure in Grinding Contact district by six-joint robot.
As improvement, when workpiece is carried out grinding and polishing by the described robot polishing system based on CMP, the chemical composition of described grinding and polishing polishing fluid and acid-base value select according to the high-temperature alloy material kind of polished workpiece material, the physical dimension D of polishing particles in described grinding and polishing polishing fluid, hardness and particle surface pattern select according to surface topography and the hardness mechanical property of polished workpiece material, to reach chemical attack reaction and the machine glazed finish effect of the best, reduce so that avoiding rubbing down granule for the secondary damage of polished surface.
Program design agents is that six-joint robot drives polished workpiece, and one layer of polishing pad of outsourcing and polishing fluid on the emery wheel of fixing rotation, three constitutes the polishing principles of CMP. Polishing pad and work piece contact zone constitute local polishing district, complete CMP planarization under the effect of polishing fluid. Polished workpiece moves under six-joint robot drives, and completes the polishing of whole workpiece. It is characterized in that being in that, in polishing process, emery wheel is motionless, and six-joint robot drives workpiece motion s, is suitable to the polishing of small size blade.
Scheme two
A kind of robot polishing system based on CMP, including six-joint robot, place the workpiece clamp of workpiece, to the contour detecting unit needing polishing workpiece to carry out detection three-dimensionalreconstruction, emery wheel with polishing pad, pedestal with servomotor, and master controller, described six-joint robot free end is provided with the electro spindle of servomotor, it is characterized in that: described workpiece clamp is connected with the servo motor shaft on pedestal, described workpiece clamp is arranged over to spray the polishing fluid injection apparatus of CMP planarization liquid to workpiece, the described emery wheel with polishing pad is arranged on described electro spindle, described main controller controls contour detecting unit, six-joint robot, electro spindle, and all servomotors, described polishing pad and work piece contact zone constitute local polishing district, spray at polishing fluid injection apparatus and complete CMP planarization under the effect of polishing fluid, polished workpiece moves under six-joint robot drives, complete the polishing of whole workpiece.
The design agents of scheme two is the rubbing head (by motor, emery wheel and ring set polishing pad on emery wheel) that six-joint robot drives, and pedestal is with polishing workpiece fixing on a rotating shaft and polishing fluid, and three constitutes the polishing principles of CMP. Polishing, from the localized contact zone that polishing pad becomes with absorption surface row, carries out under the corrosion of polishing fluid and the dual function of nanoscale abrasive particle grinding. Six-joint robot drives rubbing head, and workpiece self has the spinfunction of auxiliary, and two kinds of motions complete the polishing of whole workpiece under coordinating. It is characterized in that, in polishing process, six-joint robot drives rubbing head to move, and workpiece is fixed on an asessory shaft rotatable, both routing motions, knot and based on the polishing structural design of CMP principle, completes the polishing of free curve surface work pieces. The polishing of the blade that the program is suitable to large scale, weight is big.
CMP structural implementations is little on the process parameter control of CMP planarization metal material and the path planning impact of robot, therefore not separated detailed description.
The invention has the beneficial effects as follows: first robot polishing system, the efficiency of grinding is high, and the concordance of grinding work piece is good, compares the blade of hand grinding complicated shape, can significantly shorten man-hour; Next to that this rubbing down system, adopt CMP principle, under chemical attack and nano-scale particle dual function, grinding quality is high, and the surface of the work precision after grinding is high, has no mechanical damage, blade of aviation engine for work under bad environment, adopt this technique, can improve the fatigue life of blade, extend the working time of blade. In a word, based on the robot grinding system of CMP principle, efficiency is high, and processing concordance is good, and workpiece will not cause the unfavorable effect that the plain grinding such as mechanical damage, burn can produce, and occurs without the damage on surface/surface, Asia, can process more perfect surface.
Accompanying drawing explanation
Fig. 1 is based on robot polishing system structure one schematic diagram of CMP;
Fig. 2 is based on robot polishing system structure two schematic diagram of CMP;
The grinding and polishing process of Fig. 3 CMP;
Fig. 4 robot path planning's process.
Accompanying drawing labelling, wherein, 1 six-joint robot, 2 electro spindle, 3 workpiece clamp, 4 contour detecting unit, 5 polishing fluid injection apparatus, 6 polishing pads, 7 emery wheels, 8 pedestals.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention will be further described.
Technical scheme one embodiment
Fig. 1 is present invention structural design scheme one schematic diagram based on the robot polishing system of CMP. As it is shown in figure 1, this system is by the emery wheel 7 with polishing pad 6, the workpiece clamp 3 of polishing fluid injection apparatus 5 and installation workpiece constitutes the grinding and polishing principle of CMP; Emery wheel 7 high speed rotating under the drive of electro spindle 2, six-joint robot 1 drives workpiece clamp 3 to move, and carries out the grinding and polishing of surface of the work free form surface in workpiece clamp 3. CMP grinding and polishing is characterized by polishing pad 6 and the rubbing down region of surface of the work formation, and polishing fluid with workpiece generation chemical reaction, can reach the purpose of chemical attack, and there is nanoscale abrasive particle in polishing fluid, therefore there is also mechanical grinding effect. The existence of polishing pad 6, can store and transport polishing fluid, makes polishing fluid contact fully with surface of the work, is beneficial to the generation of chemical attack, additionally can take away the workpiece debris ground away, serve cleaning action. Other some auxiliary device, as polishing fluid reclaim defecator, polishing fluid regulation device etc. help out, it is possible to save polishing fluid, make polishing fluid at the appropriate speed, direction injection rubbing down region.Six-joint robot 1 drives workpiece to move, and under the feedback of contour detecting unit, grinds away workpiece redundance, completes the rubbing down of whole workpiece.
Fig. 3 is the canonical process of CMP in the present invention. Before the CMP planarization carrying out blade, need to carry out corase grind and remove most of material wanting grinding, then carry out fine grinding and remove subsurface defect and Crack Damage etc., final step technique is CMP planarization, under the chemical attack effect of polishing fluid and the dual function of nanoscale abrasive particle, it is thus achieved that the surface that surface quality is good, microdefect is few and the uniformity is high. Blade after this processes, microstructure is good, has good anti-fatigue performance, and its potential application is the service life improving blade of aviation engine.
Workpiece profile detection unit 4 is for detecting the surface profile of blade, and generation outline data is delivered to control system and is controlled. Workpiece profile detection unit 4 can be three-dimensional laser diastimeter, three-dimensional range finder (having higher positional accuracy measurement) based on femtosecond laser, or binocular camera, the present invention preferentially selects three-dimensional laser diastimeter, directly obtain the three-D profile data of workpiece, and based on these data, carry out dynamic error correction.
The shower nozzle of described polishing fluid injection apparatus 5 is provided with the controller increasing by two direction of rotation degree of freedom, makes the tangential direction that injection direction is polishing contact area part workpiece of polishing fluid under the control of the controller, and controls the flow velocity of polishing fluid.
Adding magnetic components in the polishing fluid of described polishing fluid injection apparatus 5 ejection, to become magnetic controlled, is provided with the magnetic control means of flow velocity and the flow direction controlling magnetic polishing liquid on polished workpiece in described workpiece clamp 3.
Described polishing pad 6 is made up of poromerics, and it can store part polishing fluid, in order to chemical reaction can be sufficiently conducted, and when polishing free curve surface work pieces, described polishing pad 6 curvature is more than free curve surface work pieces maximum curvature.
Described a kind of robot polishing system based on CMP also includes polishing fluid retracting device, effectively filter the polishing residual particles of polished workpiece thus polishing fluid chemical redemption device after being sufficiently reserved the polishing fluid defecator of polishing particles and recovery.
Polishing fluid defecator is the magnetic polishing liquid defecator that may filter that polished material residues metallic particles.
The outline surface of workpiece polished in described contour detecting unit 4 dynamic monitoring workpiece clamp 3, and the outline data of workpiece is delivered to master controller, master controller controls six-joint robot again and carries out dynamic pose correction.
It is provided with force transducer between described six-joint robot 1 end and electro spindle, is indirectly controlled the pressure in Grinding Contact district by six-joint robot 1.
The described chemical composition based on CMP chemistry grinding and polishing polishing fluid, acid-base value, polishing particles thing physical dimension and pattern, be optimized according to polished workpiece material, reaches chemical machinery grinding and polishing efficiency and the surface quality of optimum; Scheme one, according to polished workpiece material be high-temperature alloy material (be usually used in the material category of turbo blade have wrought superalloy, axialite cast superalloy, to solidification high temperature alloy, single crystal super alloy etc.), titanium alloy etc., select the chemical composition polishing fluid adapted to; Scheme two, surface topography according to polished workpiece material, hardness etc. mechanical property, select the physical dimension D of polishing particles in chemical mechanical polishing liquid, hardness and particle surface pattern etc., to reach chemical attack reaction and the machine glazed finish effect of the best, reduce so that avoiding rubbing down granule for the secondary damage of polished surface.
The grinding and polishing process of workpiece (mainly blade of aviation engine) is generally, and first sets up the threedimensional model of workpiece blade in off-line programming software and plans machining path;Secondly, three-dimensional laser diastimeter is utilized to be processed the correction of front vane position; Finally control six-joint robot 1 according to machining path to move, and carry out dynamic error compensation under the measurement in real time of three-dimensional laser diastimeter, complete the polishing processing of blade part. The process of the path planning that six-joint robot 1 moves as shown in Figure 4, the outline data according to workpiece, utilize the path of off-line programming software planning six-joint robot 1, and generate corresponding six-joint robot 1 movement directive; In the process of CMP planarization processing, the profile of real-time detection workpiece, calculating processing deviation, generate the correction value in six-joint robot 1 path according to deviation, and six-joint robot 1 path generated with off-line superposes six-joint robot 1 path as next step. The course of processing carries out dynamic position and attitude updating, to ensure the precision of CMP planarization process.
Technical scheme two embodiment
Fig. 2 is structural design scheme two schematic diagram of the robot polishing system based on CMP of the present invention. As in figure 2 it is shown, this system is constituted the grinding and polishing principle of CMP by the emery wheel 7 with polishing pad 6, polishing fluid injection apparatus 5 and workpiece clamp 3; Emery wheel 7 is high speed rotating under the drive of electro spindle, and emery wheel is fixed on the end electro spindle of six-joint robot 1, six-joint robot 1 drive; And workpiece clamp 3 is fixed on a servo motor shaft (not shown in Fig. 2), can rotating, both motions combine, and carry out the polishing of blade surface free form surface.
CMP process in the present embodiment, polishing process of workpiece etc. and technical scheme one embodiment are close, no longer describe in detail.
Particular embodiments described above; be only and technical scheme be described in further details, be not limiting as the present invention, all within the spirit and principles in the present invention; any amendment of being made, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (10)
1. the robot polishing system based on CMP, including six-joint robot (1), place the workpiece clamp (3) of workpiece, to the contour detecting unit (4) needing polishing workpiece to carry out detection three-dimensionalreconstruction, emery wheel (7) with polishing pad (6), the pedestal (8) of emery wheel (7) is installed, and master controller, described six-joint robot (1) free end is provided with the electro spindle (2) of servomotor, it is characterized in that: described workpiece clamp (3) is arranged over to spray the polishing fluid injection apparatus (5) of CMP planarization liquid to workpiece, described workpiece clamp (3) is arranged on described electro spindle (2), described main controller controls contour detecting unit (4), six-joint robot (1), electro spindle (2), and all servomotors, described polishing pad (6) and work piece contact zone constitute local polishing district, spray at polishing fluid injection apparatus (5) and complete CMP planarization under the effect of polishing fluid, polished workpiece is mobile under six-joint robot (1) drives, complete the polishing of whole workpiece.
2. a kind of robot polishing system based on CMP as claimed in claim 1, it is characterized in that: the shower nozzle of described polishing fluid injection apparatus (5) is provided with the controller increasing by two direction of rotation degree of freedom, make the tangential direction that injection direction is polishing contact area part workpiece of polishing fluid under the control of the controller, and control the flow velocity of polishing fluid.
3. a kind of robot polishing system based on CMP as claimed in claim 1, it is characterized in that: adding magnetic components in the polishing fluid that described polishing fluid injection apparatus (5) sprays, to become magnetic controlled, described workpiece clamp (3) is provided with the magnetic control means of flow velocity and the flow direction controlling magnetic polishing liquid on polished workpiece.
4. a kind of robot polishing system based on CMP as claimed in claim 1, it is characterized in that: described polishing pad (6) is made up of poromerics, it can store part polishing fluid, so that chemical reaction can be sufficiently conducted, when polishing free curve surface work pieces, described polishing pad (6) curvature is more than free curve surface work pieces maximum curvature.
5. a kind of robot polishing system based on CMP as claimed in claim 1, it is characterised in that: also include polishing fluid retracting device, effectively filter the polishing residual particles of polished workpiece thus polishing fluid chemical redemption device after being sufficiently reserved the polishing fluid defecator of polishing particles and recovery.
6. a kind of robot polishing system based on CMP as claimed in claim 5, it is characterised in that: polishing fluid defecator is the magnetic polishing liquid defecator that may filter that polished material residues metallic particles.
7. a kind of robot polishing system based on CMP as claimed in claim 1, it is characterized in that: the outline surface of the upper polished workpiece of described contour detecting unit (4) dynamic monitoring workpiece clamp (3), and the outline data of workpiece is delivered to master controller, main controller controls six-joint robot (1) carries out dynamic pose correction.
8. a kind of robot polishing system based on CMP as claimed in claim 1, it is characterized in that: the sensor of described contour detecting unit (4) can be three-dimensional laser diastimeter, three-dimensional range finder based on femtosecond laser, or binocular camera, it is provided with force transducer between described six-joint robot (1) end and electro spindle (2).
9. a kind of robot polishing system based on CMP as claimed in claim 1, it is characterized in that: when workpiece is carried out grinding and polishing by the described robot polishing system based on CMP, the chemical composition of described grinding and polishing polishing fluid and acid-base value select according to the high-temperature alloy material kind of polished workpiece material, in described grinding and polishing polishing fluid, the physical dimension D of polishing particles, hardness and particle surface pattern select according to surface topography and the hardness mechanical property of polished workpiece material.
10. the robot polishing system based on CMP, including six-joint robot (1), place the workpiece clamp (3) of workpiece, to the contour detecting unit (4) needing polishing workpiece to carry out detection three-dimensionalreconstruction, emery wheel (7) with polishing pad (6), pedestal (8) with servomotor, and master controller, described six-joint robot (1) free end is provided with the electro spindle (2) of servomotor, it is characterized in that: described workpiece clamp (3) is connected with the servo motor shaft on pedestal (8), described workpiece clamp (3) is arranged over to spray the polishing fluid injection apparatus (5) of CMP planarization liquid to workpiece, the described emery wheel (7) with polishing pad (6) is arranged on described electro spindle (2), described main controller controls contour detecting unit (4), six-joint robot (1), electro spindle (2), and all servomotors, described polishing pad (6) and work piece contact zone constitute local polishing district, spray at polishing fluid injection apparatus (5) and complete CMP planarization under the effect of polishing fluid, polished workpiece is mobile under six-joint robot (1) drives, complete the polishing of whole workpiece.
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| CN201610098377.4A CN105666287B (en) | 2016-02-23 | 2016-02-23 | Robot grinding and polishing system based on CMP and used for machining metal components in aviation field |
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| CN201610098377.4A CN105666287B (en) | 2016-02-23 | 2016-02-23 | Robot grinding and polishing system based on CMP and used for machining metal components in aviation field |
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