CN105657983B - The production method of wiring board - Google Patents
The production method of wiring board Download PDFInfo
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- CN105657983B CN105657983B CN201410647681.0A CN201410647681A CN105657983B CN 105657983 B CN105657983 B CN 105657983B CN 201410647681 A CN201410647681 A CN 201410647681A CN 105657983 B CN105657983 B CN 105657983B
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Abstract
The present invention provides a kind of production method of wiring board, is first to provide the passive device module including multiple passive devices and the dielectric core substrate including the first dielectric layer and conductive layer, wherein having the depression for exposing partial electroconductive layer in the first dielectric layer.Then, dielectric adhesive layers are formed on the bottom of depression.Then, passive device module is placed on dielectric adhesive layers in such a way that the stacking direction of passive device is parallel to the in-plane of conductive layer.Then, the second dielectric layer is formed in passive device module.Later, line layer is formed on the first dielectric layer and the second dielectric layer, wherein line layer is electrically connected via the electrode of each of via hole and passive device.
Description
Technical field
The invention relates to a kind of production methods of wiring board, and embedded member can be improved in particular to one kind
The production method of the wiring board of part density.
Background technique
In current wiring board processing, when being intended to the embedded components in core board, usually first formed in core board recessed
Element is then placed in depression by cave, then dielectric material is recycled to fill up depression, and carry out subsequent increasing layer (build-up)
Processing.
In general, the quantity of core board pocket is suitable with the quantity for the element to be embedded in, therefore limited core board
Area will limit the quantity of configured embedded element.In addition, if being intended to increase the element to be embedded in a depression
Quantity then needs the area for increasing depression.However, this mode is also limited by limited core plate suqare.
Summary of the invention
The present invention provides a kind of production method of wiring board, and embedded element is placed in the recessed of core board in a vertical manner
In cave.
The production method of wiring board of the invention is first to provide passive device module and dielectric core substrate.The passive member
Part module includes the multiple passive devices stacked in the stacking direction, and the multiple passive device is electrically isolated from one another, wherein
Each of the multiple passive device on the direction vertical with the stacking direction have relative configuration first electrode with
Second electrode.The dielectric core substrate includes the first dielectric layer and the first conductive layer, and first dielectric layer has phase each other
Pair first surface and second surface, first conductive layer is configured on the first surface, wherein first dielectric layer
In there is the first depression, first depression exposes part first conductive layer.Then, in the bottom of first depression
The first dielectric adhesive layers of upper formation.Then, in such a way that the stacking direction is parallel to the in-plane of first conductive layer
The passive device module is placed on first dielectric adhesive layers.Then, second is formed in the passive device module
Dielectric layer.Later, first line layer is formed on the second surface of first dielectric layer and second dielectric layer,
Described in first line layer be electrically connected via the second electrode of each of the first via hole and the passive device.
According to the production method of wiring board described in the embodiment of the present invention, the forming method example of above-mentioned passive device module
Third dielectric layer is first provided in this way, there are multiple through-holes in the third dielectric layer.Then, it is formed on the third dielectric layer
Second dielectric adhesive layers, and the multiple through-hole is made to form multiple second depressions.Then, the multiple passive device is set respectively
In on the second dielectric adhesive layers of the bottom of the multiple second depression.Then, to fill up the multiple second with dielectric material recessed
Cave, to form the core board with multiple passive devices.Then, cutting process is carried out to the core board, it is more to be formed
A passive device component, wherein each of the multiple passive device component includes one of the multiple passive device.It
Afterwards, the multiple passive device component is stacked, to form the passive device module.
According to the production method of wiring board described in the embodiment of the present invention, the forming method example of above-mentioned passive device module
Third dielectric layer is first provided in this way, there are multiple through-holes in the third dielectric layer.Then, it is formed on the third dielectric layer
Second dielectric adhesive layers, and the multiple through-hole is made to form multiple second depressions.Then, the multiple passive device is set respectively
In on the second dielectric adhesive layers of the bottom of the multiple second depression.Then, to fill up the multiple second with dielectric material recessed
Cave, to form the core board with multiple passive devices.Then, multiple core boards are stacked, to form core sheetpile
Stack structure.Later, cutting process is carried out to the core board stacked structure, to form multiple passive device modules.
According to the production method of wiring board described in the embodiment of the present invention, the second above-mentioned dielectric layer is, for example, third insulation
Adhesion coating.
According to the production method of wiring board described in the embodiment of the present invention, the forming method of above-mentioned first line layer is for example
It is first to press the second conductive layer on the second surface of first dielectric layer and second dielectric layer.Then, from institute
It states the second conductive layer and carries out drilling processing, to form the blind hole of the exposure second electrode.Then, it is formed and is led in the blind hole
Electric material, to form first via hole.Then, by second conductive layer pattern.
According to the production method of wiring board described in the embodiment of the present invention, the second above-mentioned dielectric adhesive layers are, for example, to insulate
Adhesive tape.
It is the multiple in above-mentioned passive device module according to the production method of wiring board described in the embodiment of the present invention
Passive device is, for example, parallel to each other and is not in contact with each other.
According to the production method of wiring board described in the embodiment of the present invention, the second above-mentioned dielectric layer and first line layer
Forming method is, for example, that dielectric materials layer and the second conductive layer are first placed sequentially first dielectric layer and the passive device
In module.Then, second conductive layer, the dielectric materials layer and the dielectric core substrate are pressed, so that the dielectric
Material layer fills up first depression.Then, drilling processing is carried out from second conductive layer, to form exposure second electricity
The blind hole of pole.Then, conductive material is formed in the blind hole, to form first via hole.Then, described second is led
Electric layer patterning.
It further include drilling from first conductive layer according to the production method of wiring board described in the embodiment of the present invention
Processing, to form the blind hole of the exposure first electrode.Then, conductive material is formed in the blind hole, is led with forming second
Through-hole.Then, by first conductive layer pattern.
According to the production method of wiring board described in the embodiment of the present invention, above-mentioned multiple passive devices are respectively, for example, more
Layer ceramic capacitor (multi-layer ceramic capacitor, referred to as: MLCC).
Based on above-mentioned, in the manufacturing process of wiring board of the invention, passive device module is the stacking with passive device
The mode for being oriented parallel to the in-plane of conductive layer is placed in the hole of dielectric core substrate, therefore can be mentioned in hole
The configuration quantity of high passive device and promote the efficiency for being formed by wiring board.In addition, being intended to configure the feelings of more passive device
Under shape, the quantity in hole in dielectric core substrate can also be efficiently reduced.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to cooperate attached drawing to make
Carefully it is described as follows.
Detailed description of the invention
Figure 1A to Fig. 1 G is the production process diagrammatic cross-section of wiring board shown by the first embodiment of the present invention；
Fig. 2 is the production process diagrammatic cross-section of passive device module shown by the second embodiment of the present invention；
Fig. 3 A to Fig. 3 E is the production process diagrammatic cross-section of wiring board shown by the third embodiment of the present invention.
Description of symbols:
20: dielectric core substrate；
30: first line plate；
40: the second wiring boards；
100: third dielectric layer；
200: the first dielectric layers；
208: the second dielectric layers；
102: the second dielectric adhesive layers；
206: the first dielectric adhesive layers；
104: the second depressions；
204: the first depressions；
106: passive device；
106a: main body；
106b: first electrode；
106c: second electrode；
108: dielectric material；
110: core board；
110a: core board stacked structure；
112: the first cutting process；
312: the second cutting process；
114: passive device component；
116: the first passive device modules；
300: the second passive device modules；
200a: second surface；
200b: first surface；
202: the first conductive layers；
210: the second conductive layers；
212: the first via holes；
216: the second via holes；
214: first line layer；
218: the second line layers；
302: dielectric materials layer；
H1: the height of passive device；
The height of H2: the first passive device module；
W1: the width of passive device；
The width of W2: the first passive device module.
Specific embodiment
Figure 1A to Fig. 1 G is the production process diagrammatic cross-section of wiring board shown by the first embodiment of the present invention.It is first
First, passive device module and dielectric core substrate are provided.It will be detailed below passive device module and dielectric core substrate
Production method.
Figure 1A is please referred to, the third dielectric layer 100 with multiple through-holes is provided.The forming method example of third dielectric layer 100
Through-hole is formed in dielectric material in the way of Laser drill or machine drilling in this way.Above-mentioned dielectric material is, for example, resin
Fiber, but not limited to this.Then, the second dielectric adhesive layers 102 are formed on third dielectric layer 100, and through-hole is made to form the
Two depressions 104.Second dielectric adhesive layers 102 be, for example, Kapton Tape, thickness be, for example, between 20um to 30um it
Between.
Then, Figure 1B is please referred to, passive device 106 is placed in the second dielectric adhesive layers 102 of the bottom of the second depression 104
On, so that passive device 106 is fixed in the second depression 104.The size of each the second depression 104 is suitable for accommodating one passively
Element 106.For example, corresponding to the width W1 of passive device 106, the width of the second depression 104 is according to passive device size
Depending on, such as passive device width is 200um, then the width of the second depression 104 at least needs as 300um.In addition, corresponding to passively
The height H1 of element 106, the height (i.e. the thickness of third dielectric layer 100) of the second depression 104 need to according to passive device thickness and
It is fixed, such as passive device with a thickness of 100um, then 100 thickness of third dielectric layer is at least 100um.In addition, in the present embodiment,
Passive device 106 is the passive device being generally known, and it is, for example, multilayer ceramic capacitor that the present invention limits not to this.
Passive device 106 generally with main body 106a and be respectively arranged in the opposite sides of main body 106a first electrode 106b,
Second electrode 106c.The detailed construction of passive device 106 is well known to those skilled in the art, in this not otherwise stated.It connects
, the second depression 104 is filled up with dielectric material 108, to form the core board 110 with multiple passive devices 106.Dielectric material
108 be, for example, ABF film (Ajinomoto build-up film), and but not limited to this.In the present embodiment, in core board 110
It inside buries there are three passive device 106, but invention is not limited thereto, visual actual demand is by the passive device 106 of other quantity
It is inside embedded in core board 110.
Please continue to refer to Figure 1B, the first cutting process 112 is carried out to core board 110, core board 110 is divided into more
A passive device component.
Then, Fig. 1 C is please referred to, after carrying out the first cutting process 112 to core board 110, forms multiple passive devices
Component 114.Passive device component 114 includes cut third dielectric layer 100, cut second dielectric adhesive layers 102, one
A passive device 106 being located in the second depression 104 and the dielectric material 108 for filling up the second depression 104.
Then, Fig. 1 D is please referred to, multiple passive device components 114 are stacked, to form the first passive device module 116,
With width W2 and height H2, wherein width W2 is the width of passive device component 114.In the present embodiment, first is passive
Component module 116 is to be stacked by three passive device components 114, but invention is not limited thereto, the first passive device
Module 116 can also be stacked by the passive device component 114 of other quantity.In Fig. 1 D, three passive device components 114 exist
Stacked in stacking direction from lower to upper, at this time the first electrode 106b of each passive device 106, second electrode 106c be
It is configured on the direction vertical with above-mentioned stacking direction in the opposite sides of main body 106a.Further, since in each passive member
Passive device 106 is configured on the second dielectric adhesive layers 102 in part component 114 and dielectric material 108 fills up the second depression 104 simultaneously
Passive device 106 is covered, therefore these passive devices 106 in passive device component 114 are electrically isolated from one another.
Then, Fig. 1 E is please referred to, dielectric core substrate 20 is provided.Dielectric core substrate 20 include the first dielectric layer 200 with
First conductive layer 202.First dielectric layer 200 has second surface 200a and first surface 200b relative to each other.First is conductive
Layer 202 is configured on first surface 200b.In addition, there is the first depression 204, and the first depression 204 is sudden and violent in the first dielectric layer 200
The first conductive layer of exposed portion 202.The production method of dielectric core substrate 20 is, for example, first the first table in the first dielectric layer 200
The first conductive layer 202 is pressed on the 200b of face.The material of first dielectric layer 200 is, for example, resin fibre, and but not limited to this.First
Conductive layer 202 is, for example, layers of copper.Then, such as using the mode of Laser drill formed in the first dielectric layer 200 and expose portion
Divide the first depression 204 of the first conductive layer 202.Then, the first dielectric adhesive layers 206 are formed on the bottom of the first depression 204.
The material of first dielectric adhesive layers 206 is, for example, polyimides.First dielectric adhesive layers 206 are to be embedded in the subsequent desire of fixation
Element in one depression 204.
Then, Fig. 1 F is please referred to, the first passive device module 116 is placed in the first depression 204, and passes through the first insulation
Adhesion coating 206 and be fixed in the first depression 204.In detail, the first passive device module 116 is being placed in the first depression
It is that the first conductive layer is parallel to the stacking direction of passive device 106 in the first passive device module 116 during in 204
First passive device module 116 is placed on the first dielectric adhesive layers 206 by the mode of 202 in-plane.That is, first will
First passive device module 116 shown in Fig. 1 D is rotated by 90 °, then is placed it in the first depression 204.Then, in the first quilt
The second dielectric layer 208 is formed on dynamic component module 116.Later, it is situated between in the second surface 200a of the first dielectric layer 200 and second
The second conductive layer 210 is formed in electric layer 208.In the present embodiment, the second dielectric layer 208 is, for example, dielectric adhesive layers, to
It is fixed on the second conductive layer 210 in first passive device module 116, and can be further assured that the second conductive layer 210 and first
Passive device module 116 is electrically insulated.Is formed on the second surface 200a and the second dielectric layer 208 of the first dielectric layer 200
The method of two conductive layers 210 is, for example, to be pressed together.
After carrying out step described in Fig. 1 F, that is, form the interior dielectric core substrate for being embedded with multiple passive devices 106
20.Since current wiring board all develops towards slimming, the thickness of each mold layer also reduces as much as possible in wiring board.It is right
For dielectric core substrate 20, the thickness of the first dielectric layer 200 need to be depending on passive device width, such as extremely between 300um
Between 400um namely the depth of the first depression 204 between 300um between 400um.Therefore, the first passive device module 116
Size must be corresponding with the first depression 204 so that the first passive device module 116 can fully in be embedded in the first depression
In 204.In detail, in the first passive device module 116, the height H2 of the first passive device module 116 depends on institute's heap
The quantity of folded passive device component 114, and height H2 also must be with the first depression that can be formed in the first dielectric layer 200
204 width fits.In addition, the width for being formed by passive device component 114 after the first cutting process 112 is equal to
The width W2 of one passive device module 116, and width W2 must cooperate with the depth of the first depression 204.That is, first
Institute's heap in the size and the first passive device module 116 for the passive device component 114 to be formed is cut in cutting process 112
The quantity of folded passive device component 114 all needs the size of the first depression 204 of cooperation to control.In the present embodiment, width W2
Such as between 300um between 500um, and height H2 is for example between 300um to the passive device between 400um, that is, stacked
The quantity of component 114 is for example between 2 to 4, and but not limited to this.
Later, Fig. 1 G is please referred to, carries out drilling processing from the second conductive layer 210, to form the electricity of exposure passive device 106
The blind hole of pole (such as first electrode 106b).Then, conductive material is formed, in blind hole to form the first via hole 212.It is conductive
Material is, for example, copper, and forming method is, for example, to carry out electroplating processes.Then, the second conductive layer 210 is patterned, to form
One line layer 214.First line layer 214 via the first via hole 212 and passive device 106 electrode (such as first electrode
106b) it is electrically connected.In addition, drilling processing is carried out from the first conductive layer 202, to form the electrode of exposure passive device 106
The blind hole of (such as second electrode 106c).Then, conductive material is formed, in blind hole to form the second via hole 216.Conduction material
Material for example, copper, forming method are, for example, to carry out electroplating processes.Then, the first conductive layer 202 is patterned, to form second
Line layer 218.Second line layer 218 via the second via hole 216 and passive device 106 electrode (such as second electrode
106c) it is electrically connected.In this way, which the first line plate with multiple embedded passive elements of the present embodiment can be formed
30。
Special one is mentioned that, after the first line plate 30 formed in Fig. 1 G, also visual actual demand carries out increasing layer
Processing, to form the line pattern of more layers on first line plate 30.Above-mentioned increasing layer processing is those skilled in the art institute
It is known, in this not otherwise stated.
In the first embodiment, the generation type of the first passive device module 116 is to be initially formed multiple passive device components
114, these passive device components 114 are then stacked again.However, the present invention is not limited thereto.
Fig. 2 is the production process diagrammatic cross-section of passive device module shown by the second embodiment of the present invention.It please join
According to Fig. 2, after the core board 110 formed in Figure 1B, multiple cores plate 110 is stacked, to form core board stacked structure 110a.
Then, the second cutting process 312 is carried out to core board stacked structure 110a, to cut out multiple first passive device modules 116.
Fig. 3 A to Fig. 3 E is the production process diagrammatic cross-section of wiring board shown by the third embodiment of the present invention.At this
In embodiment, it will be indicated with element identical in Figure 1A to Fig. 1 G with identical label.
Firstly, A referring to figure 3., to form dielectric core substrate 20 with identical method described in Fig. 1 E and be located at first
The first dielectric adhesive layers 206 on the bottom of depression 204.
Then, B referring to figure 3., provides the second passive device module 300.Second passive device module 300 by putting down each other
Row configures and non-touching multiple passive devices 106 are constituted.In the present embodiment, passive device 106 is, for example, along dampening
Square to stacked arrangement, but invention is not limited thereto.Then, by the second passive device module 300 with the second passive device mould
The stacking direction of passive device 106 is parallel to the mode of the in-plane of the first conductive layer 202 for the second passive member in block 300
Part module 300 is placed on the first dielectric adhesive layers 206, to be fixed in the first depression 204.
Then, C referring to figure 3., by dielectric materials layer 302 and the second conductive layer 210 be placed sequentially the first dielectric layer 200 with
In second passive device module 300.The material of dielectric materials layer 302 is, for example, ABF film (Ajinomoto build-up
Film), but not limited to this.
Then, D referring to figure 3., is pressed together, the second conductive layer 210 of pressing, dielectric materials layer 302 and dielectric core
Heart substrate 20, so that dielectric materials layer 302 fills up the first depression 204.In this way, form with the second passive device module
Dielectric core substrate 20 therein is embedded in 300.
Later, E referring to figure 3., carries out drilling processing from the second conductive layer 210, to form the electricity of exposure passive device 106
The blind hole of pole (such as first electrode 106b).Then, conductive material is formed, in blind hole to form the first via hole 212.It connects
, the second conductive layer 210 is patterned, to form first line layer 214.First line layer 214 via the first via hole 212 with
The electrode (such as first electrode 106b) of passive device 106 is electrically connected.In addition, drilling processing is carried out from the first conductive layer 202,
To form the blind hole of the electrode (such as second electrode 106c) of exposure passive device 106.Then, conduction material is formed in blind hole
Material, to form the second via hole 216.Then, the first conductive layer 202 is patterned, to form the second line layer 218.Second line
Road floor 218 is electrically connected via the electrode (such as second electrode 106c) of the second via hole 216 and passive device 106.Such one
Come, second wiring board 40 with multiple embedded passive elements of the present embodiment can be formed.
After the second wiring board 40 formed in Fig. 3 E, also visual actual demand carries out increasing layer processing, second
The line pattern of more layers is formed on wiring board 40.Above-mentioned increasing layer processing is well known to those skilled in the art, not another herein
Row explanation.
In conclusion the present invention will be passive in such a way that the stacking direction of passive device is parallel to the in-plane of conductive layer
Component module is placed in the hole of dielectric core substrate, therefore can be the case where not increasing considerably or not increasing cavity width
The lower configuration quantity for improving passive device, and then promote the efficiency for being formed by wiring board.On the other hand, it is being intended to configure more quilt
In the case of dynamic element, the quantity in hole in dielectric core substrate can also be efficiently reduced.
Further, since passive device is configured in hole by the present invention in the above described manner, so that being formed by conducting
Hole can have biggish contact area with the electrode of passive device, and then can reduce and aligning mistake occurs when forming via hole
Chance so that be formed by wiring board reliability improve.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of production method of wiring board characterized by comprising
Passive device module is provided, the passive device module includes the multiple passive devices stacked in the stacking direction, and institute
State that multiple passive devices are electrically isolated from one another, wherein each of the multiple passive device is vertical with the stacking direction
There is the first electrode and second electrode of relative configuration on direction；
Dielectric core substrate is provided, the dielectric core substrate includes the first dielectric layer and the first conductive layer, first dielectric
Layer has each other relative first surface and second surface, and first conductive layer is configured on the first surface, wherein institute
Stating has the first depression in the first dielectric layer, first depression exposes part first conductive layer；
The first dielectric adhesive layers are formed on the bottom of first depression；
The passive device module is placed in such a way that the stacking direction is parallel to the in-plane of first conductive layer
On first dielectric adhesive layers；
At least the second dielectric layer is formed in the passive device module；And
First line layer is formed on the second surface and second dielectric layer of first dielectric layer, wherein described the
One line layer is electrically connected via each of the first via hole and the passive device second electrode.
2. the production method of wiring board according to claim 1, which is characterized in that the formation side of the passive device module
Method includes:
Third dielectric layer is provided, there are multiple through-holes in the third dielectric layer；
The second dielectric adhesive layers are formed on the third dielectric layer, and the multiple through-hole is made to form multiple second depressions；
The multiple passive device is respectively placed on the second dielectric adhesive layers of the bottom of the multiple second depression；
The multiple second depression is filled up with dielectric material, to form the core board with multiple passive devices；
Cutting process is carried out to the core board, to form multiple passive device components, wherein the multiple passive device component
Each include one of the multiple passive device；And
The multiple passive device component is stacked, to form the passive device module.
3. the production method of wiring board according to claim 1, which is characterized in that the formation side of the passive device module
Method includes:
Third dielectric layer is provided, there are multiple through-holes in the third dielectric layer；
The second dielectric adhesive layers are formed on the third dielectric layer, and the multiple through-hole is made to form multiple second depressions；
The multiple passive device is respectively placed on the second dielectric adhesive layers of the bottom of the multiple second depression；
The multiple second depression is filled up with dielectric material, to form the core board with multiple passive devices；
Multiple core boards are stacked, to form core board stacked structure；And
Cutting process is carried out to the core board stacked structure, to form multiple passive device modules.
4. the production method of wiring board according to claim 2 or 3, which is characterized in that second dielectric layer is third
Dielectric adhesive layers.
5. the production method of wiring board according to claim 4, which is characterized in that the forming method of the first line layer
Include:
The second conductive layer is pressed on the second surface and second dielectric layer of first dielectric layer；
Drilling processing is carried out from second conductive layer, to form the blind hole of the exposure second electrode；
Conductive material is formed in the blind hole, to form first via hole；And
By second conductive layer pattern.
6. the production method of wiring board according to claim 2 or 3, which is characterized in that the second dielectric adhesive layers packet
Include insulating tape.
7. the production method of wiring board according to claim 1, which is characterized in that described in the passive device module
Multiple passive devices are parallel to each other and are not in contact with each other.
8. the production method of wiring board according to claim 7, which is characterized in that second dielectric layer and described first
The forming method of line layer includes:
Dielectric materials layer and the second conductive layer are placed sequentially on first dielectric layer and the passive device module；
Second conductive layer, the dielectric materials layer and the dielectric core substrate are pressed, so that the dielectric materials layer is filled out
Full first depression；
Drilling processing is carried out from second conductive layer, to form the blind hole of the exposure second electrode；
Conductive material is formed in the blind hole, to form first via hole；And
By second conductive layer pattern.
9. the production method of wiring board according to claim 1, which is characterized in that further include:
Drilling processing is carried out from first conductive layer, to form the blind hole of the exposure first electrode；
Conductive material is formed in the blind hole, to form the second via hole；And
By first conductive layer pattern.
10. the production method of wiring board according to claim 1, which is characterized in that the multiple passive device is respectively
Multilayer ceramic capacitor.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410647681.0A CN105657983B (en) | 2014-11-14 | 2014-11-14 | The production method of wiring board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410647681.0A CN105657983B (en) | 2014-11-14 | 2014-11-14 | The production method of wiring board |
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| Publication Number | Publication Date |
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| CN105657983A CN105657983A (en) | 2016-06-08 |
| CN105657983B true CN105657983B (en) | 2018-12-07 |
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| TW200605742A (en) * | 2004-07-28 | 2006-02-01 | Wus Printed Circuit Co Ltd | Embedded passive components of a printed circuit board and manufacturing method therefor |
| US7011988B2 (en) * | 2002-11-08 | 2006-03-14 | Flipchip International, Llc | Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing |
| CN2785312Y (en) * | 2004-12-13 | 2006-05-31 | 威盛电子股份有限公司 | Assembling structure of embedded passive components |
| CN101038885A (en) * | 2006-03-15 | 2007-09-19 | 日月光半导体制造股份有限公司 | Method for manufacturing substrate of embedded element |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5561683B2 (en) * | 2012-06-26 | 2014-07-30 | 株式会社フジクラ | Component built-in board |
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2014
- 2014-11-14 CN CN201410647681.0A patent/CN105657983B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7011988B2 (en) * | 2002-11-08 | 2006-03-14 | Flipchip International, Llc | Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing |
| TW200605742A (en) * | 2004-07-28 | 2006-02-01 | Wus Printed Circuit Co Ltd | Embedded passive components of a printed circuit board and manufacturing method therefor |
| CN2785312Y (en) * | 2004-12-13 | 2006-05-31 | 威盛电子股份有限公司 | Assembling structure of embedded passive components |
| CN101038885A (en) * | 2006-03-15 | 2007-09-19 | 日月光半导体制造股份有限公司 | Method for manufacturing substrate of embedded element |
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| CN105657983A (en) | 2016-06-08 |
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